Electronic equipment protective film and electronic equipment

Abstract

The utility model relates to the technical field of electronic equipment accessories, in particular to an electronic equipment protective film and electronic equipment. The electronic equipment protective film comprises an adhesive layer, a first transparent base material layer, a semi-solid adhesive layer and a second transparent base material layer which are arranged in a stacked mode, the semi-solid adhesive layer can be extruded to flow and cured to form a final state, and the thickness of the edge portion of the semi-solid adhesive layer is larger than that of the middle portion when the semi-solid adhesive layer is in the final state. The semi-solid adhesive layer can be extruded to flow and can be cured to form a final state, the fluidity of extrusion flowing and the stability of immobilization after curing are achieved, and by means of the semi-solid characteristic, when the semi-solid adhesive layer is extruded in the film pasting process, adhesive of the semi-solid adhesive layer flows from the middle position to the edge, and the film pasting quality is improved. The colloid in the middle is reduced while the colloid in the edge is stacked, and a structure with the thickness of the edge part larger than that of the middle part is formed after curing, matched with the shape of the curved screen and capable of being tightly attached to the edge of the curved screen, and the film pasting effect and stability are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic equipment accessory technical field, especially electronic equipment protection film and electronic equipment.

BACKGROUND

[0002] The curved screen has the characteristics that the screen edge is curved, the edge arc hides the left and right frames in vision, the screen ratio is obviously improved compared with the straight screen, and more excellent vision and touch experience can be provided, but the special structure of the curved screen also increases the difficulty of film pasting, the ordinary protection film is difficult to closely adhere to the screen edge, and once the adhesion is poor, white edge, edge lifting, bubble or dust entering and other problems will occur, and the user urgently needs the protection film that can adapt to the shape of the curved screen to ensure the film pasting effect.

UTILITY MODEL CONTENTS

[0003] To solve the above problems, the utility model provides an electronic equipment protection film and electronic equipment.

[0004] The utility model discloses to solve the above technical problem, and provide an electronic equipment protection film in an embodiment, the electronic equipment protection film includes laminatedly arranged adhesive layer, first transparent substrate layer, semi-solid adhesive layer and second transparent substrate layer, the semi-solid adhesive layer can be extruded and flow and solidify and form the final state, the thickness of the edge portion is greater than the thickness of the middle portion when the semi-solid adhesive layer is in the final state.

[0005] Preferably, the semi-solid adhesive layer is an OCA adhesive layer.

[0006] Preferably, the thickness of the semi-solid adhesive layer is uniformly distributed in the initial state.

[0007] Preferably, the thickness of the semi-solid adhesive layer in the initial state is between 0.1mm and 0.3mm.

[0008] Preferably, the adhesive layer is a silica gel layer, and / or the first transparent substrate layer is a first PET substrate layer, and / or the second transparent substrate layer is a second PET substrate layer.

[0009] Preferably, the adhesive layer is provided with a release bottom layer away from the side of the first transparent substrate layer, and the second transparent substrate layer is provided with a release top layer away from the side of the semi-solid adhesive layer.

[0010] Preferably, the release bottom layer is a release film, and the release top layer includes a second OCA adhesive layer and a release film arranged in turn away from the second transparent substrate layer.

[0011] Preferably, a tempered glass layer is further arranged between the release top layer and the second transparent substrate layer.

[0012] Preferably, the release film is any one of a PET film, a PE film, a PP film, and a PVC film.

[0013] The utility model discloses to solve above-mentioned technical problem, and provide an electronic device in another embodiment, the electronic device includes main part and above-mentioned electronic device protective film, be provided with screen on the main part, and the electronic device protective film is attached with screen.

[0014] Compared with the prior art, the electronic device protective film and the electronic device have the following advantages:

[0015] 1、the electronic device protective film in an embodiment of the utility model includes the glue layer, first transparent substrate layer, semi-solid adhesive layer and second transparent substrate layer of laminated setting, semi-solid adhesive layer can be extruded and solidify and form the final state when the thickness of the edge part is greater than the thickness of the middle part in the final state of semi-solid adhesive layer. The glue layer is used for realizing the adhesion of the electronic device protective film and the electronic device, and the first transparent substrate layer and the second transparent substrate layer have excellent light transmittance and smoothness, play the screen protection and light transmission effect, and also play the role of containing and restricting the semi-solid adhesive layer between the first transparent substrate layer and the second transparent substrate layer. Since semi-solid adhesive layer can be extruded to flow, and can solidify and form the final state, semi-solid adhesive layer has the flowability of extrusion flow and the stability of solidification immobility, and by utilizing the semi-solid characteristics of semi-solid adhesive layer, the glue of semi-solid adhesive layer flows from the middle position to the edge when extruding semi-solid adhesive layer during film pasting, the glue of the middle position reduces, and the glue of the edge position accumulates, and after solidification, the structure that the thickness of the edge part is greater than the thickness of the middle part is formed, which matches the shape of the curved screen, can tightly fit the edge position of the curved screen, and improves the film pasting effect and stability of the curved screen.

[0016] 2、the semi-solid adhesive layer in an embodiment of the utility model is OCA adhesive layer. OCA adhesive layer has certain flowability due to general cohesion, is easy to deform after extrusion, and OCA adhesive layer has the characteristics of solidification, can flow and deform after extrusion, and can maintain the structure form after deformation, and has the characteristics of semi-solid. After extruding the structure that the thickness of the edge part is greater than the thickness of the middle part, OCA adhesive layer can solidify and maintain the structure, so that the electronic device protective film matches the shape of the curved screen, and OCA adhesive layer has high light transmittance, can maintain the clear display effect of the screen, so that OCA adhesive layer as semi-solid adhesive layer helps to improve the fitting quality and display effect.

[0017] 3、the thickness of the semi-solid adhesive layer in an embodiment of the utility model is uniformly distributed in the initial state. Since the thickness of semi-solid adhesive layer is uniformly distributed in the initial state, the influence of uneven thickness of semi-solid adhesive layer in the initial state on the thickness distribution of the final state is avoided.

[0018] 4、The thickness of the semi-solid adhesive layer in the initial state in an embodiment of the utility model is between 0.1mm and 0.3mm. The thickness of the semi-solid adhesive layer in the initial state is set between 0.1mm and 0.3mm, so as to ensure that the semi-solid adhesive layer has sufficient initial thickness to form a structure with a thin middle and thick edges.

[0019] 5、The adhesive layer in an embodiment of the utility model is a silica gel layer, and / or the first transparent substrate layer is a first PET substrate layer, and / or the second transparent substrate layer is a second PET substrate layer. The silica gel layer has good adsorbability, so as to ensure that the electronic device protective film is firmly adhered to the screen, and at the same time, residual glue is not easily left when being peeled off, so as to protect the screen of the electronic device from being corroded and polluted; the silica gel layer also has high light transmittance, so as not to affect the display effect of the screen. The PET material has excellent light transmittance and smoothness, so as to select the PET material as the transparent substrate, so as to ensure that the display effect of the screen is not affected, and at the same time, the PET material has very strong wear resistance, and the strength ensures that the electronic device protective film can maintain its protective performance for a long time.

[0020] 6、The adhesive layer in an embodiment of the utility model is provided with a peeling bottom layer on the side far from the first transparent substrate layer; and the second transparent substrate layer is provided with a peeling top layer on the side far from the semi-solid adhesive layer. The peeling bottom layer and the peeling top layer can not only play a protective role when the film is not pasted, but also can be easily torn off when the film is pasted, so as to ensure the cleanliness of the pasting process and the effectiveness of the film pasting.

[0021] 7、The peeling bottom layer in an embodiment of the utility model is a release film; and the peeling top layer comprises a second OCA adhesive layer and a release film which are sequentially arranged away from the second transparent substrate layer. Since the peeling bottom layer is arranged on the side of the adhesive layer far from the first transparent substrate layer, the adhesive layer itself has the function of pasting, so that only the peeling bottom layer needs to be a release film, and when the film is pasted, the release film is only torn off, so that the adhesive layer is exposed outside, which is convenient for pasting with the screen of the electronic device; since the peeling top layer is arranged on the side of the second transparent substrate layer far from the semi-solid adhesive layer, the second transparent substrate layer does not have the function of adhesion, so that the peeling top layer comprises a second OCA adhesive layer and a release film which are sequentially arranged away from the second transparent substrate layer, the second OCA adhesive layer is used for adhesion between the second transparent substrate layer and the release film, and when the release film is torn off, the second OCA adhesive layer falls off, so that the second transparent substrate layer is exposed.

[0022] 8、The peeling top layer in an embodiment of the utility model is further provided with a tempered glass layer between the peeling top layer and the second transparent substrate layer. The tempered glass layer can significantly improve the strength of the electronic device protective film, and further improve the safety and durability of the screen.

[0023] 9、The release film in an embodiment of the utility model is any one of PET film, PE film, PP film and PVC film. The above-mentioned film material is selected as the release film, has the characteristics of easy peeling, can be easily peeled without leaving residual glue in the process of pasting the film, and avoids negative influence on the pasting effect.

[0024] 10、The electronic equipment in an embodiment of the utility model has the same beneficial effects as the above-mentioned electronic equipment protective film, which will not be repeated here.

DRAWINGS EXPLANATION

[0025] In order to more clearly illustrate the technical scheme in the embodiments of the utility model, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the utility model, and other drawings can be obtained by those skilled in the art without creative labor under the premise of not paying the creative labor.

[0026] Figure 1 It is the cross-sectional structure diagram of the electronic equipment protective film provided by the first embodiment of the utility model Figure 1 .

[0027] Figure 2 It is the cross-sectional structure diagram of the electronic equipment protective film provided by the first embodiment of the utility model Figure 2 .

[0028] Figure 3 It is the cross-sectional structure diagram of the electronic equipment protective film provided by the first embodiment of the utility model Figure 3 .

[0029] Figure 4 It is the cross-sectional structure diagram of the electronic equipment protective film provided by the first embodiment of the utility model Figure 4 .

[0030] Figure 5 It is the three-dimensional structure diagram of the electronic equipment provided by the second embodiment of the utility model.

[0031] Figure 6 It is the cross-sectional structure diagram of the electronic equipment provided by the second embodiment of the utility model.

[0032] Drawing mark explanation:

[0033] 1、Electronic equipment protective film;

[0034] 20, adhesive layer; 21, silica gel layer; 30, first transparent substrate layer; 31, first PET substrate layer; 40, semi-solid adhesive layer; 41, OCA adhesive layer; 50, second transparent substrate layer; 51, second PET substrate layer; 61, release bottom layer; 62, release top layer; 63, second OCA adhesive layer; 70, tempered glass layer; 80, release film;

[0035] 100, electronic device; 110, main body; 111, screen.

DETAILED DESCRIPTION

[0036] In order to make the purpose, technical scheme and advantages of the present application more clear, the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and not to limit the present application.

[0037] It should be noted that when an element is referred to as being "on" another element, it can be directly on the other element or intervening elements can also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements can also be present. The terms "vertical", "horizontal", "left", "right", and similar expressions as used herein are for the purpose of illustration only.

[0038] In the present application, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not intended to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0039] In addition, in addition to being used to indicate the orientation or positional relationship, the above-mentioned terms can also be used to indicate other meanings, for example, the term "upper" can also be used to indicate a certain dependent relationship or connection relationship in some cases. For those skilled in the art, the specific meaning of these terms in the present application can be understood according to the specific circumstances.

[0040] In addition, the terms "mounting", "setting", "provided with", "connected", "connected" should be broadly understood. For example, it can be fixedly connected, detachably connected, or integrally constructed; it can be mechanically connected, or electrically connected; it can be directly connected, or indirectly connected through an intermediate medium, or internal communication between two devices, elements or components. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0041] Please combine Figure 1 and Figure 2 , the utility model discloses a kind of electronic equipment protective film 1, and electronic equipment protective film 1 includes laminated adhesive layer 20, first transparent substrate layer 30, semi-solid adhesive layer 40 and second transparent substrate layer 50, semi-solid adhesive layer 40 can be extruded and solidified to form final state and flow, the thickness of the edge portion is greater than the thickness of the middle portion when semi-solid adhesive layer 40 is in final state.

[0042] Understandably, adhesive layer 20 is used to realize the adhesion of electronic equipment protective film 1 and electronic equipment, first transparent substrate layer 30 and second transparent substrate layer 50 have excellent light transmittance and smoothness, play the role of screen protection and light transmission, and also play the role of containment constraint to semi-solid adhesive layer 40 between first transparent substrate layer 30 and second transparent substrate layer 50. Since semi-solid adhesive layer 40 can be extruded to flow, and can be solidified to form final state, semi-solid adhesive layer 40 has the flowability of extrusion flow and the stability of being fixed immovably after solidification, presents semi-solid characteristics, by utilizing the semi-solid characteristics of semi-solid adhesive layer 40, extruding semi-solid adhesive layer 40 when pasting film makes the colloid of semi-solid adhesive layer 40 flow from middle position to edge, the colloid of middle position reduces and the colloid of edge position accumulates, and after solidification, the structure that the thickness of edge portion is greater than the thickness of middle portion is formed, corresponding to the shape of curved screen, can be closely attached to the edge position of curved screen, improve curved screen pasting film effect and stability.

[0043] It should be noted that, Figure 1 for the initial state of electronic equipment protective film 1 not extruded when pasting film operation has not been carried out, cross-sectional structure schematic view of; Figure 2 for the cross-sectional structure schematic view corresponding to final state of semi-solid adhesive layer 40 forming edge portion thickness greater than middle portion thickness after electronic equipment protective film 1 is extruded. Initial state refers to the state of semi-solid adhesive layer 40 not being extruded, and final state refers to the state that semi-solid adhesive layer 40 is extruded, the colloid of semi-solid adhesive layer 40 flows from middle position to edge, and after solidification, the structure that the thickness of edge portion is greater than the thickness of middle portion is formed, corresponding to the shape of curved screen.

[0044] Please continue to combine Figure 1 and Figure 2 Further, semi-solid adhesive layer 40 is OCA adhesive layer 41.

[0045] It can be understood that the OCA adhesive layer 41 can be cured to maintain the structure after extruding the structure with the thickness of the edge part being greater than the thickness of the middle part, so that the electronic device protection film 1 matches the curved screen shape; at the same time, the OCA adhesive layer 41 has high light transmittance and can maintain the clear display effect of the screen, so that the OCA adhesive layer 41 as the semi-solid adhesive layer 40 helps to improve the bonding quality and display effect.

[0046] Optionally, the OCA adhesive layer 41 can be cured by ultraviolet curing or thermal curing.

[0047] Please refer to Figure 1 , further, the thickness of the semi-solid adhesive layer 40 in the initial state is uniformly distributed.

[0048] It can be understood that since the thickness of the semi-solid adhesive layer 40 in the initial state is uniformly distributed, the influence of the uneven thickness of the semi-solid adhesive layer 40 in the initial state on the thickness distribution in the final state is avoided.

[0049] Please continue to refer to Figure 1 , further, the thickness of the semi-solid adhesive layer 40 in the initial state is between 0.1mm and 0.3mm.

[0050] It can be understood that the thickness of the semi-solid adhesive layer 40 in the initial state is set to be between 0.1mm and 0.3mm, that is, 0.1mm≤the thickness of the semi-solid adhesive layer 40 in the initial state≤0.3mm, which ensures that the semi-solid adhesive layer 40 has sufficient initial thickness to form a structure with a thin middle and thick edges.

[0051] Please refer to Figure 1 and Figure 2 , further, the adhesive layer 20 is a silica gel layer 21 and / or the first transparent substrate layer 30 is a first PET substrate layer 31 and / or the second transparent substrate layer 50 is a second PET substrate layer 51.

[0052] It can be understood that the silica gel layer 21 has good adsorbability, which can ensure that the electronic device protection film 1 is firmly adhered to the screen, and at the same time, it is not easy to leave residual glue when peeling off, protecting the electronic device screen from corrosion and pollution; the silica gel layer 21 also has high light transmittance and will not affect the display effect of the screen. PET material has excellent light transmittance and smoothness, and the selection of PET material as transparent substrate ensures that the screen display effect is not affected, and at the same time, PET material has strong wear resistance, and its strength ensures that the electronic device protection film 1 can maintain its protection performance for a long time.

[0053] Please refer to Figure 3 , further, the adhesive layer 20 is provided with a peeling bottom layer 61 away from the first transparent substrate layer 30; the second transparent substrate layer 50 is provided with a peeling top layer 62 away from the semi-solid adhesive layer 40.

[0054] It can be understood that the peeling bottom layer 61 and the peeling top layer 62 can not only protect the film when it is not attached, but also facilitate tearing when the film is attached, ensuring the cleanliness of the film attachment process and the effectiveness of the film attachment.

[0055] Please continue to refer to Figure 3 , further, the peeling bottom layer 61 is a release film 80; the peeling top layer 62 comprises a second OCA glue layer 63 and a release film 80 arranged in turn away from the second transparent substrate layer 50.

[0056] It can be understood that since the peeling bottom layer 61 is arranged on the side of the adhesive layer 20 away from the first transparent substrate layer 30, the adhesive layer 20 itself has a pasting effect, so only the peeling bottom layer 61 needs to be set as a release film 80, which can be easily torn off when the film is attached, so that the adhesive layer 20 is exposed to the outside, facilitating pasting with the electronic device screen; since the peeling top layer 62 is arranged on the side of the second transparent substrate layer 50 away from the semi-solid adhesive layer 40, the second transparent substrate layer 50 does not have adhesion, so the peeling top layer 62 comprises a second OCA glue layer 63 and a release film 80 arranged in turn away from the second transparent substrate layer 50, the second OCA glue layer 63 is used to bond the second transparent substrate layer 50 and the release film 80, and the second OCA glue layer 63 falls off when the release film 80 is torn off, exposing the second transparent substrate layer 50.

[0057] Please refer to Figure 4 , further, the peeling top layer 62 and the second transparent substrate layer 50 are further provided with a tempered glass layer 70.

[0058] It can be understood that the tempered glass layer 70 can significantly improve the strength of the electronic device protection film 1, further improving the safety and durability of the screen.

[0059] Please combine Figure 3 and Figure 4 , further, the release film 80 is any one of a PET film, a PE film, a PP film and a PVC film.

[0060] It can be understood that the above-mentioned film material is selected as the release film 80, which has the characteristics of easy peeling, and can be easily peeled off without leaving residue during the film attachment process, avoiding negative effects on the film attachment effect of the electronic device protection film 1.

[0061] Please combine Figure 5 and Figure 6 , the second embodiment of the utility model provides an electronic device 100, the electronic device 100 includes the main body 110 and the electronic device protection film 1 of the first embodiment of the utility model, the main body 110 is provided with the screen 111, and the electronic device protection film 1 is attached with the screen 111.

[0062] It can be understood that the electronic device 100 has the same beneficial effects as the electronic device protective film 1 of the first embodiment of the present application, and will not be described here.

[0063] Compared with the prior art, the electronic device protective film and the electronic device have the following advantages:

[0064] 1、the electronic device protective film in an embodiment of the present application includes a glue layer, a first transparent substrate layer, a semi-solid adhesive layer and a second transparent substrate layer arranged in layers, the semi-solid adhesive layer can flow under pressure and solidify to form a final state, and the thickness of the edge portion is greater than that of the middle portion when the semi-solid adhesive layer is in the final state. The glue layer is used to realize the bonding of the electronic device protective film and the electronic device, the first transparent substrate layer and the second transparent substrate layer have excellent light transmittance and smoothness, and play the roles of screen protection and light transmission. At the same time, the semi-solid adhesive layer between the first transparent substrate layer and the second transparent substrate layer also plays the role of accommodation and constraint. Since the semi-solid adhesive layer can flow under pressure and solidify to form a final state, the semi-solid adhesive layer has both the fluidity of flowing under pressure and the stability of being fixed after solidification. By utilizing the semi-solid characteristics of the semi-solid adhesive layer, the glue of the semi-solid adhesive layer flows from the middle position to the edge when the film is pasted, the glue in the middle position is reduced and the glue in the edge position is accumulated, and after solidification, a structure with the thickness of the edge portion being greater than that of the middle portion is formed, which matches the shape of the curved screen and can tightly fit the edge position of the curved screen, thereby improving the pasting effect and stability of the curved screen.

[0065] 2、the semi-solid adhesive layer in an embodiment of the present application is an OCA adhesive layer. The OCA adhesive layer has a certain fluidity due to its general cohesion, is easy to deform after being pressed, and has the characteristics of being solidifiable, that is, it can flow and deform after being pressed, and can maintain the structure after deformation. The OCA adhesive layer has the characteristics of semi-solid. After being pressed to form a structure with the thickness of the edge portion being greater than that of the middle portion, the OCA adhesive layer can be solidified to maintain this structure, so that the electronic device protective film matches the shape of the curved screen. At the same time, the OCA adhesive layer has high light transmittance and can maintain the clear display effect of the screen, so the OCA adhesive layer as the semi-solid adhesive layer helps to improve the fitting quality and display effect.

[0066] 3、the thickness of the semi-solid adhesive layer in an embodiment of the present application is uniformly distributed in the initial state. Since the thickness of the semi-solid adhesive layer in the initial state is uniformly distributed, the influence of the uneven thickness of the semi-solid adhesive layer in the initial state on the thickness distribution in the final state is avoided.

[0067] 4. In one embodiment of this utility model, the initial thickness of the semi-solid adhesive layer is between 0.1 mm and 0.3 mm. Setting the initial thickness of the semi-solid adhesive layer to between 0.1 mm and 0.3 mm ensures that the semi-solid adhesive layer has sufficient initial thickness to form a structure that is thin in the middle and thick at the edges.

[0068] 5. In one embodiment of this utility model, the adhesive layer is a silicone layer and / or the first transparent substrate layer is a first PET substrate layer and / or the second transparent substrate layer is a second PET substrate layer. The silicone layer has good adsorption properties, ensuring the electronic device protective film adheres firmly to the screen, and it does not easily leave residue during peeling, protecting the electronic device screen from corrosion and contamination. The silicone layer also has high light transmittance, ensuring it does not affect the screen's display effect. PET material has excellent light transmittance and smoothness; using PET material as the transparent substrate ensures the screen display effect is not affected. Simultaneously, PET material has strong abrasion resistance, and its strength ensures the electronic device protective film can maintain its protective performance for a long time.

[0069] 6. In one embodiment of this utility model, a release liner is provided on the side of the adhesive layer away from the first transparent substrate layer; a release top layer is provided on the side of the second transparent substrate layer away from the semi-solid adhesive layer. The release liner and release top layer can provide protection when the film is not applied, and can also be easily peeled off when the film is applied, ensuring the cleanliness of the film application process and the effectiveness of the film adhesion.

[0070] 7. In one embodiment of this utility model, the release liner is a release film; the release top layer includes a second OCA adhesive layer and a release film arranged sequentially along the side away from the second transparent substrate layer. Since the release liner is located on the side of the adhesive layer away from the first transparent substrate layer, and the adhesive layer itself has an adhesive function, it is sufficient to set the release liner as a release film. When applying the film, simply peel off the release film to expose the adhesive layer, which is convenient for bonding with the screen of the electronic device. Since the release top layer is located on the side of the second transparent substrate layer away from the semi-solid adhesive layer, and the second transparent substrate layer does not have adhesive properties, the release top layer includes a second OCA adhesive layer and a release film arranged sequentially along the side away from the second transparent substrate layer. The second OCA adhesive layer is used to bond the second transparent substrate layer and the release film. When the release film is peeled off, the second OCA adhesive layer falls off, exposing the second transparent substrate layer.

[0071] 8. In one embodiment of this utility model, a tempered glass layer is further provided between the peelable top layer and the second transparent substrate layer. The tempered glass layer can significantly improve the strength of the protective film of electronic devices, further enhancing the safety and durability of the screen.

[0072] 9、The release film in one embodiment of the utility model is any one of PET film, PE film, PP film and PVC film. The film material is selected as the release film, has the characteristics of easy peeling, can be easily peeled without leaving residual glue in the process of pasting the film, and avoids negative effects on the pasting effect.

[0073] 10、The electronic device in one embodiment of the utility model has the same beneficial effects as the above-mentioned electronic device protective film, which will not be repeated here.

[0074] The above is only a preferred embodiment of the utility model, and is not used to limit the utility model, and any modification, equivalent replacement and improvement within the principle of the utility model should be included in the protection scope of the utility model.

Claims

1. An electronic device protection film, characterized by: The electronic device protection film comprises a glue layer, a first transparent substrate layer, a semi-solid adhesive layer and a second transparent substrate layer arranged in layers, the semi-solid adhesive layer can flow under pressure and solidify to form a final state, the thickness of the edge portion of the semi-solid adhesive layer is greater than the thickness of the middle portion in the final state.

2. The electronic device protection film of claim 1, wherein: The semi-solid adhesive layer is an OCA adhesive layer.

3. The electronic device protection film of claim 1, wherein: The thickness of the semi-solid adhesive layer is uniformly distributed in the initial state.

4. The electronic device protection film of claim 3, wherein: The thickness of the semi-solid adhesive layer in the initial state is between 0.1 mm and 0.3 mm.

5. The electronic device protection film of claim 1, wherein: The glue layer is a silica gel layer and / or the first transparent substrate layer is a first PET substrate layer and / or the second transparent substrate layer is a second PET substrate layer.

6. The electronic device protection film of claim 1, wherein: The glue layer is provided with a release bottom layer away from the first transparent substrate layer; the second transparent substrate layer is provided with a release top layer away from the semi-solid adhesive layer.

7. The electronic device protection film of claim 6, wherein: The release bottom layer is a release film; the release top layer comprises a second OCA adhesive layer and a release film arranged in order away from the second transparent substrate layer.

8. The electronic device protection film of claim 6, wherein: A tempered glass layer is further arranged between the release top layer and the second transparent substrate layer.

9. The electronic device protection film of claim 7, wherein: The release film is any one of a PET film, a PE film, a PP film and a PVC film.

10. An electronic device, comprising: The electronic device comprises a main body provided with a screen and an electronic device protection film according to any one of claims 1-9, the electronic device protection film is attached to the screen.

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