Photoelectric sensor

Abstract

The utility model discloses a photoelectric sensor. The photoelectric sensor comprises a shell, a light emitting module, a light receiving module and two adhesion pieces, the shell comprises a first vertical part, a second vertical part and a base. The first upright part is provided with a first concave structure and a first opening; the first concave structure comprises a first side wall and a first peripheral wall. The second upright part is provided with a second concave structure and a second opening; the second concave structure comprises a second side wall and a second peripheral wall. The light emitting module and the light receiving module are respectively bonded in the first concave structure and the second concave structure by the two bonding pieces. A first distance exists between the top end of the first peripheral wall and the top end of the second peripheral wall, and a second distance exists between the bottom end of the first peripheral wall and the bottom end of the second peripheral wall. The ratio of the difference between the second distance and the first distance to the second distance is less than 28%. Therefore, the technical problem that plastic shrinks unevenly and inclines inwards in the injection molding process of the shell is solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a photoelectric sensor, especially a photoelectric sensor of opposite radiation type. BACKGROUND

[0002] The existing photoelectric sensor of opposite radiation type comprises a plastic shell, a light emitting assembly and a light receiving assembly. The light emitting assembly and the light receiving assembly are respectively attached to the two sides of the plastic shell. The existing photoelectric sensor can be made in the form of multiple components or a single component. Compared with the photoelectric sensor made in the form of multiple components, the photoelectric sensor made in the form of a single component can shorten the production time and reduce the production cost. However, when the U-shaped shell of the photoelectric sensor made in the form of a single component is injection molded, the plastic will shrink unevenly and tilt inward. When the inward tilt angle is too large, not only the appearance of the molded shell is poor, but also the adhesion strength between the circuit board and the shell is affected.

[0003] Therefore, how to overcome the above-mentioned defects through structural design improvement has become one of the important topics to be solved in this field. CONTENT OF THE UTILITY MODEL

[0004] The utility model mainly provides a photoelectric sensor of opposite radiation type to solve the problem that the shell of the photoelectric sensor of the prior art will shrink unevenly and tilt inward during molding.

[0005] In order to solve the above technical problems, one of the technical solutions adopted by the utility model is to provide a photoelectric sensor, which comprises a shell, a light emitting module, a light receiving module and two adhesive pieces. The shell comprises a first upright part, a second upright part and a base. The base connects the first upright part and the second upright part. The first upright part has a first concave structure and a first opening. The first concave structure comprises a first side wall and a first peripheral wall. The first peripheral wall surrounds the first side wall. The second upright part has a second concave structure and a second opening. The second concave structure comprises a second side wall and a second peripheral wall. The second peripheral wall surrounds the second side wall. The light emitting module comprises a first circuit board and a light emitting assembly. The light emitting module is embedded in the first concave structure, and the light emitting assembly corresponds to the first opening. The light receiving module comprises a second circuit board and a light receiving assembly. The light receiving module is embedded in the second concave structure, and the light receiving assembly corresponds to the second opening. The two adhesive pieces are respectively arranged on the first side wall and the second side wall and adhere the light emitting module and the light receiving module in the first concave structure and the second concave structure respectively. The top end of the first peripheral wall and the top end of the second peripheral wall have a first distance, the bottom end of the first peripheral wall and the bottom end of the second peripheral wall have a second distance, and the difference between the second distance and the first distance is less than 28% of the second distance.

[0006] Optionally, the shell further comprises a reinforcing rib.

[0007] Optionally, the first upright portion has a width along the extension direction of the interface between the first upright portion and the base, the reinforcing rib has a length along the extension direction of the interface, and the length is at least 2 / 3 of the width.

[0008] Optionally, the surface of the reinforcing rib is a plane, a convex curved surface, or a concave curved surface.

[0009] Optionally, the housing further comprises at least one groove formed in the bottom of the base.

[0010] Optionally, the base has two opposite surfaces, and the at least one groove penetrates the two surfaces.

[0011] Optionally, the base has a height, the at least one groove has a depth and a width, and the depth is 0.3 to 0.6 times the height.

[0012] Optionally, the width is 1.2 to 1.7 times the height.

[0013] Optionally, each of the first edge wall of the first upright portion and the bottom of the base, and the second edge wall of the second upright portion and the bottom of the base forms a step structure.

[0014] Optionally, the step structure has a step surface, and the step surface has a height difference with the second edge wall, and the height difference is not greater than 20 μm.

[0015] Optionally, the surface of each of the first circuit board and the second circuit board forms an annular groove, and the annular groove comprises an inner ring portion and an outer ring portion, and one side of the inner ring portion forms a straight line edge.

[0016] Optionally, the two ends of the straight line edge and the center of the inner ring portion form an included angle of 60 degrees.

[0017] Optionally, the distance between the outer ring portion and the inner ring portion is between 50 μm and 200 μm.

[0018] Optionally, each of the light receiving module and the light emitting module comprises a light-transmitting piece, the light-transmitting piece is limited in the area surrounded by the annular groove, and the surface of the light-transmitting piece forms an asymmetric spherical surface.

[0019] The photoelectric sensor can reduce the difference between the first distance between the top ends of the two peripheral walls of the shell and the second distance between the bottom ends of the two peripheral walls, so that the difference between the second distance and the first distance is less than 28%, thereby overcoming the technical problem of uneven shrinkage of the plastic in the injection molding process.

[0020] To further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are for reference and illustration only and are not intended to limit the present invention. Attached Figure Description

[0021] Figure 1 This is a three-dimensional schematic diagram of the photoelectric sensor according to the first embodiment of the present invention.

[0022] Figure 2 This is an exploded view of the photoelectric sensor according to the first embodiment of this utility model.

[0023] Figure 3 This is a three-dimensional schematic diagram of the housing according to the first embodiment of the present utility model.

[0024] Figure 4 for Figure 1 A schematic diagram of the cross-section IV-IV.

[0025] Figure 5 This is another perspective view of the photoelectric sensor according to the first embodiment of the present invention.

[0026] Figure 6 This is a side view of the photoelectric sensor according to the first embodiment of the present invention.

[0027] Figure 7 This is a side view of the housing according to the first embodiment of the present invention.

[0028] Figure 8 This is a partial schematic diagram of the housing of the first embodiment of the present invention.

[0029] Figure 9 This is a schematic diagram of another part of the housing of the first embodiment of the present invention.

[0030] Figure 10 This is a first schematic diagram of the optical emitting module of this utility model.

[0031] Figure 11 This is a schematic diagram of the optical emission measurement module of this utility model after the leads have been removed.

[0032] Figure 12 This is a second schematic diagram of the optical emitting module of this utility model.

[0033] Figure 13 This is a third schematic diagram of the optical emitting module of this utility model.

[0034] Figure 14 This is the fourth schematic diagram of the optical emitting module of this utility model.

[0035] Figure 15The utility model discloses a schematic diagram of the light receiving module.

[0036] Figure 16 The utility model discloses a schematic diagram of the photoelectric sensor of the second embodiment.

[0037] Figure 17 The utility model discloses a schematic diagram of the photoelectric sensor of the second embodiment.

[0038] Figure 18 The utility model discloses a schematic diagram of the photoelectric sensor of the third embodiment.

[0039] Figure 19 The utility model discloses a schematic diagram of the photoelectric sensor of the third embodiment.

[0040] Figure 20 The utility model discloses a first schematic diagram of the photoelectric sensor of the fourth embodiment.

[0041] Figure 21 The utility model discloses a second schematic diagram of the photoelectric sensor of the fourth embodiment. DETAILED DESCRIPTION

[0042] The following is to illustrate the embodiment of the application disclosed about "photoelectric sensor" through specific embodiment, and the person skilled in the art can understand the advantages and effects of the application from the content disclosed in the specification. The application can be implemented or applied through other different embodiments, and each detail in the specification can be modified and changed based on different viewpoints and applications without departing from the concept of the application. In addition, the drawings of the application are only simple schematic illustrations, not the depiction of actual size, and the prior declaration is declared. The following embodiment will further illustrate the related technical content of the application, but the disclosed content is not used to limit the protection scope of the application.

[0043] It should be understood that although the terms "first", "second", "third" and the like can be used herein to describe various elements, these elements should not be limited by these terms. These terms are mainly used to distinguish one element from another. In addition, the term "or" used herein can include any one or a combination of the associated listed items.

[0044] First embodiment

[0045] Reference Figure 1 , Figure 2 and Figure 3As shown, the utility model first embodiment provides a kind of photoelectric sensor P1, it includes shell 1, light emitting module 2, light receiving module 3 and two adhesive pieces 4.Shell 1 includes first upright part 11, second upright part 12 and base 13.Base 13 connects first upright part 11 and second upright part 12, so that shell 1 forms U-shaped structure.First upright part 11 has first recessed structure 111 and first opening 110.Second upright part 12 has second recessed structure 121 and second opening 120.In this embodiment, the size of first opening 110 is greater than the size of second opening 120.Except that the size of first opening 110 is different from the size of second opening 120, the internal structure of first upright part 11 is basically identical with the structure of second upright part 12.Light emitting module 2 and light receiving module 3 are respectively arranged in first recessed structure 111 and second recessed structure 121.

[0046] It is worth mentioning that the shell 1 of the utility model is assembled with light emitting module 2 and light receiving module 3 in single piece form.Alternatively, the shell 1 of the utility model is formed by injection molding, but not limited to this, and can also be made by any commonly used method in the industry.

[0047] First recessed structure 111 includes first side wall 1111 and first peripheral wall 1112, and first peripheral wall 1112 surrounds first side wall 1111.Second recessed structure 121 includes second side wall 1211 and second peripheral wall 1212, and second peripheral wall 1212 surrounds second side wall 1211.Two adhesive pieces 4 are respectively arranged on first side wall 1111 and second side wall 1211, and light emitting module 2 and light receiving module 3 are respectively adhered in first recessed structure 111 and second recessed structure 121.

[0048] In detail, two adhesive pieces 4 are respectively adhered between first side wall 1111 of first recessed structure 111 and first circuit board 21, and adhered between second side wall 1211 of second recessed structure 121 and second circuit board 31.Photoelectric sensors made of multiple pieces in the prior art have shell provided in a continuous sheet form, which has recessed structure, but the circuit board is adhered to the outer edge of the side wall of the shell in a flat manner and then cut, so that the adhesive pieces are distributed in the limited bonding area between the shell and the circuit board.The utility model forms recessed structure in the shell and then embeds the circuit board in it, so that the adhesive pieces can expand the bonding area between the shell and the circuit board, thereby improving the bonding strength.

[0049] Furthermore, the first sidewall 1111 of the first concave structure 111 also has two first grooves 111C, and the second sidewall 1211 of the second concave structure 121 also has two second grooves 121C. Since the adhesive 4 is adhered between the first sidewall 1111 and the first circuit board 21, and between the second sidewall 1211 and the second circuit board 31, the amount of adhesive on the adhesive 4 is difficult to control accurately during assembly. Therefore, the design of the first groove 111C and the second groove 121C can accommodate excess adhesive 4, preventing adhesive overflow.

[0050] This utility model provides several methods to improve the inward tilting mechanism, such as Figure 2 and Figure 3 As shown, the housing 1 includes two reinforcing ribs 14. One reinforcing rib 14 is connected to the junction of the first upright portion 11 and the base 13, and the other reinforcing rib 14 is connected to the junction of the second upright portion 12 and the base 13. In this invention, the reinforcing ribs 14 are mainly used to generate a reaction force to resist the inward contraction of the top of the U-shaped structure of the housing 1, so as to improve the situation of inward contraction deformation of the plastic housing 1 during the injection molding stage.

[0051] like Figure 1 , Figure 3 and Figure 4 As shown, a boundary line BL exists between the first upright portion 11 and the base 13. Similarly, a boundary line BL also exists between the second upright portion 12 and the base 13. Taking the first upright portion 11 as an example, the first upright portion 11 has a width W along the extending direction of the boundary line BL, and the reinforcing rib 14 has a length L along the extending direction of the boundary line BL. Optionally, the length L of the reinforcing rib 14 is at least 2 / 3 of the width W of the first upright portion 11. Similarly, the length L of the other reinforcing rib 14 is reserved to be at least 2 / 3 of the width W of the second upright portion 12.

[0052] For example, the surface of the reinforcing rib 14 can be a plane, a convex curved surface, or a concave curved surface; this invention is not limited to this. In this embodiment, the surface of the reinforcing rib 14 is exemplified as a plane, such as... Figure 1 and Figure 6 As shown, the first upright portion 11 and the second upright portion 12 are arranged along one direction (X-axis direction). Viewed from a perspective perpendicular to this direction (i.e., along the Y-axis direction), the side profile of the reinforcing rib 14 is exemplified as a triangle. The connection between this triangle and the base 13 has a width WR, and the connection between the triangle and the first upright portion 11 has a height HR. The ratio of the width WR to the height HR is between 1 / 3 and 1 / 2, preferably 1 / 2.

[0053] See Figure 5As shown, the shell 1 also exemplarily comprises at least one groove 15. The groove 15 is formed at the bottom of the base 13, and the extending direction (Y-axis direction) of the groove 15 is perpendicular to the arrangement direction (X-axis direction) of the first upright part 11 and the second upright part 12. Further, the base 13 has two opposite side surfaces 131, 132, and the groove 15 penetrates through the two side surfaces 131, 132. In a preferred embodiment of the present application, the number of the grooves 15 is exemplarily two. As shown in Figure 5 and Figure 6 As shown, the positions of the two grooves 15 correspond to the positions of the two reinforcing ribs 14 respectively. However, the present application does not limit the number of the grooves 15. In other embodiments, the number of the grooves 15 can be only one, which can be located at the central position of the base 13.

[0054] As shown in Figure 6 , the base 13 has a height H, specifically, the height H refers to the distance between the upper surface 133 and the lower surface 134 of the base 13. The groove 15 has a depth D. The depth D is exemplarily 0.3 to 0.6 times, preferably 0.5 times of the height H. In addition, the spacing G between the two grooves 15 is 1.2 to 1.7 times, preferably 1.5 times of the height H. Through the design of the groove 15, the shell 1 can be thick and thin material shrinkage average during the stage of plastic forming, thereby improving the inward shrinkage deformation of the shell 1 during forming.

[0055] In detail, the shell 1 is processed by injection molding with plastic. The plastic is injected into the mold in a high-temperature molten state and then cooled and solidified to form. In this process, residual stress, also known as internal stress, exists in the shell 1 to varying degrees. When the internal stress is too large, it will cause the shell 1 to crack and warp, thereby affecting the mechanical properties and appearance quality of the shell 1. Therefore, the present application exemplarily utilizes two grooves 15 designed on the base 13 of the shell 1 to greatly reduce the stress inside the shell 1. The groove 15 can make the shell 1 thick and thin material shrinkage average during the stage of plastic forming, as evenly as possible to distribute and reduce the internal stress of the shell 1, avoiding excessive concentration of internal stress and causing cracking and warping. Further, the present application can also generate a counterforce resisting the inward bending and shrinking of the U-shaped structure of the shell 1 during the forming of the shell 1 by the reinforcing rib 14, so as to improve the inward shrinkage deformation of the plastic shell 1 during the injection molding stage.

[0056] Further, as shown in Figure 1 , Figure 3 and Figure 6As shown, the first peripheral wall 1112 includes two long sides 1112A and two short sides 1112B, which are located at the side edges of the top of the housing 1. Similarly, the second peripheral wall 1212 includes two long sides 1212A and two short sides 1212B, which are located at the side edges of the top of the housing 1. Please continue to refer to Figure 1 , Figure 3 and Figure 6 , Figure 6 the top end T1 of the first peripheral wall 1112 (corresponding to the position of the short side 1112B in Figure 3 ) and the top end T2 of the second peripheral wall 1212 (corresponding to the position of the short side 1212B in Figure 1 ) have a first distance L1 therebetween. Figure 6 the bottom end B1 of the first peripheral wall 1112 (corresponding to the bottom position of the long side 1112A in Figure 3 ) and the bottom end B2 of the second peripheral wall 1212 (corresponding to the bottom position of the long side 1212A in Figure 1 ) have a second distance L2 therebetween. The present utility model exemplifies that through the structural design of the groove 15 and the reinforcing rib 14, the difference (L2-L1) between the first distance L1 and the second distance L2 can be reduced.

[0057] In order to clearly show the state of the housing 1 before and after improvement, please further refer to Table 1 below, and view it together with Figure 6 . Table 1 presents the actual measurement results of the deformation amount (the difference between the first distance L1 and the second distance L2: L2-L1) of the overall concave deformation of the housing 1 before and after improvement.

[0058]

[0059] Table 1

[0060] The deformation amount of the overall concave deformation of the housing 1 is the ratio between the difference (L2-L1) between the first distance L1 and the second distance L2 and the second distance L2. For example, the second distance L2 is measured to be 600 μm. As can be known from Table 1, before improvement (the housing does not have a reinforcing rib and a groove), the ratio is between 28% and 40% (as shown in Table 1, it is 37%). After the housing 1 is provided with the reinforcing rib 14 (but does not have the groove), through the design of the reinforcing rib 14, the ratio can be reduced to 25% to 28%. After the housing 1 is provided with the reinforcing rib 14 and the groove 15 at the same time, through the design of the reinforcing rib 14 and the groove 15, the ratio can be further reduced to 11% to 15%. Therefore, as can be known from the measurement results, the design of the groove 15 and the reinforcing rib 14 and other structures on the housing 1 can effectively improve the concave deformation of the housing 1.

[0061] As shown in Figure 1 , Figure 3 and Figure 6As shown, each of the two short edges 1112B, and the two short edges 1212B is exemplified with a notch N. During the assembly of the photoelectric sensor P1, a jig is needed to fine-tune the position of the circuit board in the inner recess structure, and the design of the notch N can facilitate the extension of the jig therein. In other words, through the design of the notch N, the first circuit board 21 and the second circuit board 31 can be facilitated to be assembled in the first inner recess structure 111 and the second inner recess structure 121.

[0062] Referring to Figure 3 and Figure 7 As shown, the first inner recess structure 111 has a receiving cavity 1110 corresponding to the first opening 110, and the second inner recess structure 121 has a receiving cavity 1210 corresponding to the second opening 120. In addition, the housing 1 also exemplifies a plurality of semicircular rib structures 16 arranged in different corners of the receiving cavities 1110, 1210. Specifically, the receiving cavity 1110 of the first inner recess structure 111 is exemplified as a square cavity, and four semicircular rib structures 16 are arranged inside the square cavity, with the four semicircular rib structures 16 respectively located at the four corners of the receiving cavity 1110. Similarly, the receiving cavity 1210 of the second inner recess structure 121 is exemplified as a square cavity, and four semicircular rib structures 16 are arranged inside the square cavity, with the four semicircular rib structures 16 respectively located at the four corners of the receiving cavity 1210.

[0063] As Figure 3 shown, in the first inner recess structure 111 and the second inner recess structure 121, the wall thickness of the cavity wall of the receiving cavities 1110, 1210 (i.e., the cavity wall forming the first opening 110 and the second opening 120) is exemplified as thin. Therefore, the cavity wall part is prone to cause the molten plastic to cool before completely filling the mold cavity during the injection molding process, resulting in incomplete filling of the later part, which cannot achieve full mold, and thus causing the lack of material damage. The utility model increases the local thickness by arranging the semicircular rib structure 16 at the four corner positions of the receiving cavities 1110, 1210 to improve the smoothness of the molten plastic flow, and solves the problem of lack of material damage caused by incomplete mold after product molding.

[0064] Referring to Figure 7 and Figure 8 As shown, a stepped structure 17 is formed between the second edge wall 1211 of the second upright portion 12 and the lower surface 134 of the base 13 Figure 3The first upright part 11 in the shell 1 also has a stepped structure 17. The stepped structure 17 has a stepped surface 171. There is a height difference (or step difference) between the stepped surface 171 and the first side wall 1111, and between the stepped surface 171 and the second side wall 1211, and the height difference is not greater than 20 μm. Specifically, the height difference is mainly designed to prevent the generation of burrs at the positions between the first side wall 1111 and the lower surface 134 of the base 13, and between the second side wall 1211 and the lower surface 134 of the base 13. During the molding of the shell 1, if the positioning accuracy of the male mold and the female mold is different when the mold is closed, the mold surface will be misaligned, which will cause the product to have burrs of different sizes at the position of the mold surface. Therefore, the stepped structure 17 is formed between the first side wall 1111 of the first upright part 11 and the lower surface 134 of the base 13, and between the second side wall 1211 of the second upright part 12 and the lower surface 134 of the base 13, so that when the burrs are generated on the stepped surface 171, they will not protrude excessively from the first side wall 1111 and the second side wall 1211, thereby preventing the burrs from affecting the stability of the first circuit board 21 and the second circuit board 31 attached to the first side wall 1111 and the second side wall 1211.

[0065] The first upright part 11 and the second upright part 12 each further include two clamping ribs 18. Taking the second upright part 12 as an example (the first upright part 11 also has the same structure, which will not be described again), referring to Figure 9 As shown in FIG. 6, the two clamping ribs 18 are respectively arranged on the two short sides 1212B and are located inside the second peripheral wall 1212, and the notch N is located between the two clamping ribs 18. In addition, the inner edge of the second peripheral wall 1212 has an inclined surface 1212S, and one end of each clamping rib 18 is adjacent to the inclined surface 1212S and forms an inclined structure 18S. By combining the inclined structure 18S with the inclined surface 1212S of the inner edge of the second peripheral wall 1212, the second circuit board 31 can be smoothly loaded into the second inner recess structure 121, and further clamped to the second circuit board 31 by the two clamping ribs 18, facilitating adhesion and fixation.

[0066] Continuing to refer to Figure 3 As shown in FIG. 6, the first peripheral wall 1112 also includes two first limiting parts 1113, and the two first limiting parts 1113 are respectively arranged at the connection between the long side 1112A and the short side 1112B. Similarly, referring to Figure 9 As shown in FIG. 6, the second peripheral wall 1212 also includes two first limiting parts 1213, and the two first limiting parts 1213 are respectively arranged at the connection between the long side 1212A and the short side 1212B.

[0067] Referring to Figure 10As shown, the light emitting module 2 comprises a first circuit board 21, a light emitting component 22, and a first light-transmissive member 23. The light emitting component 22 and the first light-transmissive member 23 are disposed on the first circuit board 21, and the first light-transmissive member 23 covers the light emitting component 22. As shown, Figure 3 As shown, Figure 10 As shown, when the light emitting module 2 is disposed in the first concave structure 111, the first circuit board 21 is embedded in the first concave structure 111, and the first light-transmissive member 23 is disposed in the accommodating cavity 1110, so that the light emitting component 22 corresponds to the first opening 110.

[0068] As shown, Figure 15 As shown, the light receiving module 3 comprises a second circuit board 31, a light receiving component 32, and a second light-transmissive member 33. The light receiving component 32 and the second light-transmissive member 33 are disposed on the second circuit board 31, and the second light-transmissive member 33 covers the light receiving component 32. As shown, Figure 2 As shown, Figure 15 As shown, when the light receiving module 3 is disposed in the second concave structure 121, the second circuit board 31 is embedded in the second concave structure 121, and the second light-transmissive member 33 is disposed in the accommodating cavity 1210, so that the light receiving component 32 corresponds to the second opening 120.

[0069] As shown, Figure 2 , Figure 10 and Figure 15 As shown, for example, the light emitting component 22 can be a light emitting diode, and the light emitted can be infrared light, ultraviolet light, or visible light, preferably infrared light. The light receiving component 32 can be a photodetector. The first light-transmissive member 23 and the second light-transmissive member 33 can be made by dispensing transparent adhesive, and the surface profile of the first light-transmissive member 23 and the second light-transmissive member 33 is spherical. The light emitted by the light emitting component 22 passes through the first light-transmissive member 23, then passes through the first opening 110 and the second opening 120 and enters the second light-transmissive member 33, and finally is received by the light receiving component 32. Therefore, when an object to be detected is disposed between the light emitting component 22 and the light receiving component 32, the light emitted by the light emitting component 22 will be blocked by the object to be detected, causing the amount of light received by the light receiving component 32 to change, thereby detecting the presence or absence of the object.

[0070] As shown, Figure 10 As shown, the surface of the first circuit board 21 forms an annular groove C. The annular groove C comprises an inner ring portion C1 and an outer ring portion C2, and the distance HC between the outer ring portion C2 and the inner ring portion C1 is between 50 μm and 200 μm, preferably 100 μm. The annular groove C surrounds the light emitting component 22, and the first light-transmissive member 23 is limited to the area surrounded by the annular groove C.

[0071] As shown, Figure 2 As shown, Figure 10As shown, one side of the inner ring portion C1 forms a straight edge C3, and the outer ring portion C2 forms another straight edge on the same side as the straight edge. By designing the straight edge C3, the spherical surface of the first light-transmitting member 23 forms an asymmetric spherical surface. Next, referring to Figure 11 As shown, for the sake of clarity, Figure 11 The metal lead Q (compared with Figure 10 ) is omitted. Figure 11 In the embodiment, the two ends of the straight edge C3 and the center J of the inner ring portion C1 form two connecting lines VL, and the two angles between the straight edge C3 and the two connecting lines VL are 60 degrees, but the present application is not limited thereto. That is, the two connecting lines VL and the straight edge C3 form an equilateral triangle. The distance between the center J of the inner ring portion C1 and the two ends of the straight edge C3 is equal to the length of the straight edge C3. In addition, the center of the light-emitting assembly 22 is 0.2 mm away from the center J of the inner ring portion C1, that is, the light-emitting assembly 22 is offset from the center J of the inner ring portion C1 by a distance of about 0.2 mm. By the offset design of the light-emitting assembly 22, in combination with the asymmetric spherical surface of the first light-transmitting member 23, the view angle of the light can be maintained at about 95 to 100 degrees, that is, the offset range of the view angle is maintained at about 5 degrees, and the luminous efficiency of the light-emitting assembly 22 can be improved.

[0072] Similarly, the structure of the second circuit board 31 is the same as that of the first circuit board 21. As shown, Figure 15 The light-receiving assembly 32 is arranged on the second circuit board 31 and surrounded by the annular groove C on the second circuit board 31, and the second light-transmitting member 33 is limited within the area surrounded by the annular groove C (the specific shape of the second light-transmitting member 33 can be viewed together). Figure 2 By designing the straight edge C3, the surface of the second light-transmitting member 33 forms an asymmetric spherical surface, which has the same structure design as the first light-transmitting member 23, and will not be described again. Further, the center of the light-receiving assembly 32 is 0.2 mm away from the center of the inner ring portion C1. Since the structure design of the second circuit board 31 is the same as that of the first circuit board 21, the first circuit board 21 will be mainly exemplarily described below.

[0073] Referring to Figure 10 , Figure 12 and Figure 13As shown, the first circuit board 21 has a first surface S1, a second surface S2, a first side S3, a second side S4, a third side S5 and a fourth side S6. The first surface S1 and the second surface S2 are located on opposite sides of the first circuit board 21 respectively. The first side S3 is connected between the first surface S1 and the second surface S2. The second side S4 and the first side S3 are located on opposite sides of the first circuit board 21 respectively. The third side S5 and the fourth side S6 are located on opposite sides of the first circuit board 21 respectively. The second side S4 is connected between the third side S5 and the fourth side S6.

[0074] The first surface S1 and the second surface S2 of the first circuit board 21 are each coated with a solder mask S8, and the annular groove C is a groove formed by the solder mask S8 on the first surface S1. The annular groove C can concentrate the transparent gel forming the first light-transmitting member 23 in the area of the annular groove C without overflowing to other places of the first circuit board 21. Similarly, the second light-transmitting member 33 provided on the second circuit board 31 is also the same (see Figure 15 ), which will not be described here.

[0075] As shown in Figure 10 , Figure 12 and Figure 13 , the first circuit board 21 also exemplifies a positioning hole S7, which penetrates the first surface S1 and the second surface S2. In addition, between the second side S4 and the third side S5, and between the second side S4 and the fourth side S6, two second limiting portions S41 are respectively exemplified. In addition, as shown in Figure 3 , the first inner recess structure 111 also exemplifies a limiting column 19, which is provided on the first side wall 1111 and located between the two first grooves 111C. The limiting column 19 is exemplified as an elliptical column, and the major axis of the elliptical surface of the elliptical column is parallel to the Z axis. As shown in Figure 3 and Figure 10 , when the first circuit board 21 is embedded in the first inner recess structure 111, the limiting column 19 is inserted into the positioning hole S7 of the first circuit board 21, and the two second limiting portions S41 of the first circuit board 21 are respectively engaged with the two first limiting portions 1113 of the first inner recess structure 111. Similarly, as shown in Figure 2 , the second inner recess structure 121 also exemplifies a limiting column 19 and a first limiting portion 1213, and the second circuit board 31 also exemplifies a positioning hole S7 and a second limiting portion S41 (see Figure 15 ), which will not be described here.

[0076] The utility model discloses a limiting column and a limiting portion are formed in the inner recess structure, and the circuit board engaged in the inner recess structure is positioned. As shown in Figure 2 and Figure 3As shown, two first limiting portions 1113 are capable of limiting the displacement of the first circuit board 21 in the Y-axis direction. The limiting post 19 is capable of limiting the displacement of the first circuit board 21 in the Z-axis direction by the structure design of the elliptical cylinder and the long axis of the elliptical surface parallel to the Z-axis. Further, the limiting post 19 is capable of forming three fixing points of the fixed circuit board (the first circuit board 21 and the second circuit board 31) with the two clamping ribs 18, so that the circuit board can be stably fixed in the inner recess structure (the first inner recess structure 111 and the second inner recess structure 121) for adhesive fixing.

[0077] Referring to Figure 10 and Figure 14 As shown, the first circuit board 21 is taken as an example for illustration. The first side surface S3 of the first circuit board 21 is provided with a first notch S31 and a second notch S32. The first circuit board 21 further includes a first metal pattern structure M1 and a second metal pattern structure M2. The first metal pattern structure M1 and the second metal pattern structure M2 are arranged on the first surface S1 of the first circuit board 21. The first metal pattern structure M1 surrounds the positioning hole S7. One end of the first metal pattern structure M1 passes through the first notch S31 and further extends to the second surface S2 to form a first soldering portion M11, and the other end of the first metal pattern structure M1 forms a first metal pad M12. One end of the second metal pattern structure M2 passes through the second notch S32 and further extends to the second surface S2 to form a second soldering portion M21, and the other end of the second metal pattern structure M2 forms a second metal pad M22.

[0078] When the photoelectric sensor of the utility model is soldered to an external circuit board, the first circuit board 21 is soldered to the external circuit board by the bottom (the first side surface S3). The tin filler can be filled in the first notch S31 and the second notch S32, and extends to the first soldering portion M11 and the second soldering portion M21 on the back side (the second surface S2) of the first circuit board 21 to increase the soldering area. In an optional embodiment, the part of the tin filler extending to the first soldering portion M11 and the second soldering portion M21 accounts for about half of the area of the first soldering portion M11 and the second soldering portion M21. This is because the structure design of the groove 15 and the reinforcing rib 14 improves the inner recess deformation of the shell, so that the area of the tin filler distributed on the first soldering portion M11 and the second soldering portion M21 accounts for about half of the area of the first soldering portion M11 and the second soldering portion M21.

[0079] Therefore, one electrode of the light emitting component 22 is electrically connected to the first metal pad M12 by wire bonding through a metal lead Q, and the other electrode of the light emitting component 22 is electrically connected to the second metal pad M22. Similarly, the configuration of the light receiving component 32 and the second circuit board 31 is also the same, which can be referred to Figure 12 and Figure 15As shown (since the first circuit board 21 and the second circuit board 31 have the same structure, thus Figure 12 The back surface of the first circuit board 21 shown also applies to the second circuit board 31, and is not described here.

[0080] As shown Figure 12 The first circuit board 21 and the second circuit board 31 each further include a third metal pattern structure M3, a fourth metal pattern structure M4, and a fifth metal pattern structure M5. The third metal pattern structure M3 and the fourth metal pattern structure M4 are arranged on the second surface S2 of the first circuit board 21 and the second circuit board 31, the third metal pattern structure M3 is connected to the first soldering portion M11, and the fourth metal pattern structure M4 is connected to the second soldering portion M21. The fifth metal pattern structure M5 is arranged on the second surface S2 and is located between the third metal pattern structure M3 and the fourth metal pattern structure M4, and the positioning hole S7 is located between the fifth metal pattern structure M5 and the first notch S31 and the second notch S32. For example, the first to fifth metal pattern structures M1-M5 are exemplified by being made of copper material. The present application matches the first metal pattern structure M1 and the second metal pattern structure M2 arranged on the first surface S1 with the third metal pattern structure M3, the fourth metal pattern structure M4, and the fifth metal pattern structure M5 arranged on the second surface S2, so as to avoid uneven distribution of copper material on both sides of the circuit board and stress imbalance caused by thermal expansion, thereby preventing the circuit board from warping.

[0081] As shown Figure 14 In the first circuit board 21 and the second circuit board 31, the solder resist S8 applied on the first surface S1 is exemplified as further extending to the first notch S31 and the second notch S32 and filling part of the space of the first notch S31 and the second notch S32. For example, the first notch S31 and the second notch S32 have a depth (X-axis direction), and the solder resist S8 extending to the first notch S31 and the second notch S32 has a thickness (X-axis direction) in the part of the first notch S31 and the second notch S32, which is optionally about half of the depth. In other words, the solder resist S8 fills about half of the depth of the first notch S31 and the second notch S32, thereby forming a half-blind hole structure of the first notch S31 and the second notch S32.

[0082] Referring back to Figure 1 and Figure 2 , and referring to Figure 14 , the second circuit board 31 is taken as an example for description. When the second circuit board 31 is adhered to the second inner recess structure 121 by the adhesive 4, the solder resist S8 is located between the half-blind hole structure (the first notch S31 and the second notch S32) and the adhesive 4. Therefore, the solder resist S8 can prevent the adhesive 4 from overflowing from the first notch S31 and the second notch S32 to the first soldering portion M11 and the second soldering portion M21.

[0083] Second Embodiment

[0084] See Figure 16 and Figure 17 As shown, the second embodiment of this utility model provides a photoelectric sensor P2, which includes a housing 1, a light emitting module 2, a light receiving module 3, and two adhesive members 4. The photoelectric sensor P2 of the second embodiment has a similar structure to the photoelectric sensor P1 of the first embodiment, and the similarities will not be described again. The main difference between the photoelectric sensor P2 of the second embodiment and the photoelectric sensor P1 of the first embodiment is that the shape of the reinforcing ribs 14 of the housing 1 is different.

[0085] Specifically, in the second embodiment, the surface of the reinforcing rib 14 is exemplified as a convex curved surface, which differs from the planar surface of the reinforcing rib 14 in the first embodiment.

[0086] Third Embodiment

[0087] See Figure 18 and Figure 19 As shown, the third embodiment of this utility model provides a photoelectric sensor P3, which includes a housing 1, a light emitting module 2, a light receiving module 3, and two adhesive members 4. The photoelectric sensor P3 of the third embodiment has a similar structure to the photoelectric sensor P1 of the first embodiment, and the similarities will not be described again. The main difference between the photoelectric sensor P2 of the second embodiment and the photoelectric sensor P1 of the first embodiment is that the shape of the reinforcing ribs 14 of the housing 1 is different.

[0088] Specifically, in the third embodiment, the surface of the reinforcing rib 14 is exemplified as a concave curved surface, which differs from the planar surface of the reinforcing rib 14 in the first embodiment.

[0089] Fourth embodiment

[0090] See Figure 20 and Figure 21 As shown, the fourth embodiment of this utility model provides a photoelectric sensor P4, which includes a housing 1, a light emitting module 2, a light receiving module 3, and two adhesive members 4. The photoelectric sensor P4 of the fourth embodiment has a similar structure to the photoelectric sensor P1 of the first embodiment, and the similarities will not be described again. The main difference between the photoelectric sensor P4 of the fourth embodiment and the photoelectric sensor P1 of the first embodiment is that the size of the groove 15 in the housing 1 is different.

[0091] Compared with the first embodiment Figure 5 In contrast, in the fourth embodiment, the two grooves 15 do not penetrate the two side surfaces 131, 132 of the base 13, that is, the size of the grooves 15 is smaller.

[0092] It should be noted that the feasible embodiments of the present application are not limited to the above examples. For example, the grooves 15 not penetrating through the two side surfaces 131, 132 of the base 13 in the fourth embodiment can also be applied to the housings 1 of the first to third embodiments; or the reinforcing ribs 14 with the convex curved surface profile in the second embodiment, or the reinforcing ribs 14 with the concave curved surface profile in the third embodiment can also be applied to the housing 1 of the fourth embodiment.

[0093] Advantages of the embodiments

[0094] The photoelectric sensor provided by the present application can reduce the difference between the first distance L1 between the top ends of the two peripheral walls of the housing 1 and the second distance L2 between the bottom ends of the two peripheral walls, so that the difference between the second distance L2 and the first distance L1 is less than 28%, thereby overcoming the technical problem of the inward inclination of the housing 1 due to the uneven shrinkage of the plastic during the injection molding process.

[0095] The above disclosure is only the preferred feasible embodiments of the present application, and does not limit the protection scope of the claims of the present application, so any equivalent technical changes made according to the content of the specification and drawings of the present application are included in the protection scope of the claims of the present application.

Claims

1. A photosensor, characterized by, The photoelectric sensor comprises: a housing including a first upright portion, a second upright portion, and a base connecting the first upright portion and the second upright portion, the first upright portion having a first recessed structure including a first side wall and a first peripheral wall surrounding the first side wall, and a first opening, the second upright portion having a second recessed structure including a second side wall and a second peripheral wall surrounding the second side wall, and a second opening; a light emitting module including a first circuit board and a light emitting component, the light emitting module being embedded in the first recessed structure, the light emitting component corresponding to the first opening; a light receiving module including a second circuit board and a light receiving component, the light receiving module being embedded in the second recessed structure, the light receiving component corresponding to the second opening; and two adhesive members respectively disposed on the first side wall and the second side wall and respectively bonding the light emitting module and the light receiving module in the first recessed structure and the second recessed structure; wherein a first distance is present between a top end of the first peripheral wall and a top end of the second peripheral wall, a second distance is present between a bottom end of the first peripheral wall and a bottom end of the second peripheral wall, and a ratio of a difference between the first distance and the second distance to the second distance is less than 28%.

2. The photosensor according to claim 1, characterized in that, The housing further comprises a reinforcing rib.

3. The photosensor according to claim 2, wherein The first upright portion and the base have an interface line, the first upright portion has a width along an extension direction of the interface line, the reinforcing rib has a length along the extension direction of the interface line, and the length is at least 2 / 3 of the width.

4. The photosensor of claim 2, wherein, A surface of the reinforcing rib is a flat surface, a convex curved surface, or a concave curved surface.

5. The photosensor of claim 1, wherein, The housing further comprises at least one groove formed at a bottom of the base.

6. The photosensor according to claim 5, wherein The base has two opposite surfaces, and the at least one groove penetrates through the two surfaces.

7. The photosensor of claim 5, wherein, The base has a height, the at least one groove has a depth and a width, and the depth is 0.3 to 0.6 times the height.

8. The photosensor according to claim 7, wherein The width is 1.2 to 1.7 times the height.

9. The photosensor of claim 1, wherein, The first side wall of the first upright portion and the bottom of the base, and the second side wall of the second upright portion and the bottom of the base each form a stepped structure.

10. The photosensor according to claim 9, wherein The stepped structure has a stepped surface, and a height difference between the stepped surface and the second side wall is not greater than 20 μm.

11. The photosensor of claim 1, wherein, A surface of the first circuit board and a surface of the second circuit board each form an annular groove including an inner ring portion and an outer ring portion, and one side of the inner ring portion forms a straight line edge.

12. The photosensor according to claim 11, wherein, An included angle between two ends of the straight line edge and a center of the inner ring portion is 60 degrees.

13. The photosensor according to claim 12, wherein, A distance between the outer ring portion and the inner ring portion is 50 to 200 μm.

14. The photosensor of claim 11, wherein, The light receiving module and the light emitting module each include a light-transmitting member, the light-transmitting member is limited to a region surrounded by the annular groove, and a surface of the light-transmitting member forms an asymmetric spherical surface.

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