Microscope adjustable base for appearance detection of semiconductor module

Abstract

The utility model relates to the technical field of appearance detection, in particular to a microscope adjustable base for appearance detection of a semiconductor module, which comprises a base, first connecting frames, first guide rods, a first slide rail and a first clamping bead, the first connecting frames are symmetrically connected to the base, the first guide rods are connected to the interiors of the first connecting frames, and the first guide rods are connected to the interiors of the first sliding rail. A plurality of positioning clamping grooves are formed in any first guide rod at equal intervals, the first guide rods are jointly connected with the first sliding rail in a sliding mode, and any end of the first sliding rail is connected with the first clamping bead in a sliding mode. According to the utility model, the first clamping beads and the first elastic pieces are staggered, so that the device can realize accurate adjustment of the placing plate in the horizontal vertical direction and the plane transverse direction, and the detection accuracy and efficiency are improved; and a stable supporting point can be provided in the adjusting process by utilizing a matching mechanism of the clamping beads and the positioning clamping grooves, so that the placement plate is prevented from accidentally deviating or shaking in the moving process, and the stability in the detection process is ensured.

Description

TECHNICAL FIELD

[0001] The utility model relates to appearance detection technical field, specifically, relate to a microscope adjustable base for semiconductor module appearance detection. BACKGROUND

[0002] The appearance detection of semiconductor module is one of important steps to ensure product quality and reliability, and appearance detection mainly checks whether visible defects or damages exist in the manufacturing process of module to ensure that it meets the specification requirements.

[0003] At present, the process of semiconductor module appearance detection is as follows: first, the semiconductor module is placed on a special mold, and then the worker uses a microscope to check the appearance of the module in detail, if different parts of the module need to be observed, the position of the mold needs to be manually moved to complete the inspection, however, this way has obvious accuracy and efficiency problems, it is difficult to be in place at one time when manually moving the position of the mold, and often needs to be adjusted repeatedly to find the correct detection position, which not only affects the accuracy of detection, but also greatly reduces the detection efficiency, in addition, each manual movement and adjustment of the microscope consumes a lot of time and physical strength, especially when facing multiple semiconductor modules or needing to check multiple parts, the whole detection process becomes extremely time-consuming and labor-intensive, which significantly reduces the work efficiency.

[0004] Therefore, it is necessary to design a microscope adjustable base for semiconductor module appearance detection. CONTENT OF THE UTILITY MODEL

[0005] In order to overcome the shortcomings of the prior art, the utility model provides a microscope adjustable base for semiconductor module appearance detection.

[0006] The technical scheme is: a microscope adjustable base for semiconductor module appearance detection, including base, first connecting frame, first guide rod, first sliding rail, second connecting frame, second guide rod, second sliding rail, sliding rod, mounting plate, placing plate, first ball and first elastic piece, the first connecting frame is connected symmetrically on the base, the first guide rod is connected in the first connecting frame, a plurality of positioning clamping grooves are equally provided on any one first guide rod, the first sliding rail is connected in common sliding mode on the first guide rod, the first ball is connected in sliding mode on any one end of the first sliding rail, the first ball is connected with the positioning clamping groove, the first elastic piece is connected between the first ball and the first sliding rail, the second connecting frame is connected symmetrically on the upper portion of the first connecting frame, the second guide rod is connected on the second connecting frame, the second sliding rail is connected in common sliding mode on the second guide rod, the first sliding rail and the second sliding rail are arranged in cross interlaced mode, the sliding rod is inserted in the interlaced place of the first sliding rail and the second sliding rail, the sliding rod is connected in sliding mode with the first sliding rail and the second sliding rail, the mounting plate is connected on the sliding rod, and the placing plate is connected on the mounting plate.

[0007] Further, a plurality of positioning clamping grooves are equidistantly formed on the second guide rod, a second clamping bead is slidably connected to any end of the second slide rail, the second clamping bead is clamped with the positioning clamping groove, and a second elastic member is connected between the second clamping bead and the second slide rail.

[0008] Further, the mobile rod is symmetrically connected to the placing plate.

[0009] Further, the protective ring is wrapped around the periphery of the base.

[0010] Further, the rubber pad is connected to the bottom of the base.

[0011] Further, the placing plate is detachable.

[0012] The beneficial effects of the utility model are as follows:

[0013] The first clamping bead and the first elastic member are staggered, so that the device can realize accurate adjustment of the placing plate in the horizontal vertical direction and the plane horizontal direction, improve the accuracy and efficiency of detection, and provide a stable support point in the adjustment process through the cooperation mechanism of the clamping bead and the positioning clamping groove, prevent the placing plate from deviating or shaking accidentally in the movement process, and ensure the stability of the detection process. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is a three-dimensional structure schematic view of the utility model.

[0015] Figure 2 It is a sectional view of the mounting plate and the placing plate of the utility model.

[0016] Figure 3 It is a three-dimensional structure schematic view of the first slide rail, the second slide rail and the slide rod of the utility model.

[0017] Figure 4 It is a three-dimensional structure schematic view of the first slide rail, the first clamping bead and the first elastic member of the utility model.

[0018] Figure 5 It is a three-dimensional structure schematic view of the protective ring and the rubber pad of the utility model.

[0019] Names and serial numbers of parts in the figure: 1, base, 2, first connecting frame, 21, first guide rod, 22, positioning clamping groove, 3, first slide rail, 4, second connecting frame, 41, second guide rod, 5, second slide rail, 6, slide rod, 7, mounting plate, 8, placing plate, 9, first clamping bead, 10, first elastic member, 11, second clamping bead, 12, second elastic member, 13, mobile rod, 14, protective ring, 15, rubber pad. DETAILED DESCRIPTION

[0020] The present invention will now be described more fully below with reference to the accompanying drawings, in which presently preferred embodiments of the invention are shown. However, the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided for thoroughness and completeness and to fully convey the scope of the invention to those skilled in the art.

[0021] Example: An adjustable base for a microscope used for the appearance inspection of semiconductor modules, such as... Figures 1-4 As shown, the system includes a base 1, a first connecting frame 2, a first guide rod 21, a first slide rail 3, a second connecting frame 4, a second guide rod 41, a second slide rail 5, a slide rod 6, a mounting plate 7, a placement plate 8, a first retaining bead 9, and a first elastic element 10. The base 1 is symmetrically welded with the first connecting frame 2. Each first connecting frame 2 has a first guide rod 21 connected internally. Each first guide rod 21 has multiple equidistant positioning slots 22. The first guide rod 21 is slidably connected to the first slide rail 3. Each end of the first slide rail 3 is slidably connected to the first retaining bead 9, which engages with the positioning slot 22. The first retaining bead 9 and the first slide rail 3 are connected by a spring seat and a first elastic element 10. The upper part of the first connecting frame 2 is symmetrically welded with the second connecting frame 4. Each second connecting frame 4 has a second guide rod 41 fixedly connected to it. The second guide rod 41 is slidably connected to the second slide rail 5. The first slide rail 3 and the second slide rail 5 are arranged in a cross pattern. A slide rod 6 is inserted at the intersection of the first slide rail 3 and the second slide rail 5. The slide rod 6 is slidably connected to the first slide rail 3 and the second slide rail 5. A mounting plate 7 is welded onto the slide rod 6, and a placement plate 8 is connected to the mounting plate 7. The placement plate 8 is detachable. The corresponding placement plate 8 is selected and fixed on the mounting plate 7 according to the semiconductor module to be tested. This allows the device to replace different placement plates 8 according to the testing requirements, effectively improving the utilization rate of the device. Pulling the moving rod 13 back and forth will move the slide rod 6 between the first slide rail 3 and the second slide rail 5, and at the same time move the placement plate 8 together. When the slide rod 6 moves between the first slide rail 3 and the second slide rail 5, the second locking bead 11 will disengage from the initial positioning slot 22 as the slide rod 6 moves, and the second elastic element 12 will be compressed. During the movement of the slide rod 6, the second locking bead 11 will repeatedly disengage from and engage with the positioning slot 22 until the placement plate 8 is adjusted to the required position. After the second locking bead 11 engages with the positioning slot 22, the pulling of the moving rod 13 is stopped.

[0022] like Figures 1-4As shown, a plurality of positioning clamping grooves 22 are equidistantly arranged on any one of the second guide rods 41, and a second clamping bead 11 is slidably connected to any one end of the second sliding rail 5, the second clamping bead 11 is clamped with the positioning clamping groove 22, and the second clamping bead 11 is connected with the second sliding rail 5 through a spring seat and a second elastic member 12.

[0023] As shown in Figure 1 , Figure 2 and Figure 5 , it further comprises a moving rod 13, a protective ring 14 and a rubber pad 15, the moving rod 13 is symmetrically connected to the placing plate 8; the periphery of the base 1 is wrapped with the protective ring 14; the bottom of the base 1 is connected with the rubber pad 15, the rubber pad 15 can increase the friction between the base 1 and the placing ground, so that the device can be stably placed and is not easy to displace; when the base 1 is carried, the protective ring 14 can prevent the periphery of the base 1 from being damaged by knocking.

[0024] When the device is to be used, first, the microscope is installed at the rear of the base 1, then according to the semiconductor module to be detected, the corresponding placement plate 8 is fixed on the mounting plate 7, which enables the device to replace different placement plates 8 according to the detection requirements, effectively improving the utilization rate of the device; then, the semiconductor module to be detected is placed on the placement plate 8, the angle of the microscope is adjusted to start detecting the appearance of the semiconductor module, if other parts of the semiconductor module need to be detected, the moving rod 13 is pulled forward and backward, the slide rod 6 will move between the first slide rail 3 and the second slide rail 5, while driving the placement plate 8 to move together, when the slide rod 6 moves between the first slide rail 3 and the second slide rail 5, the second clamping ball 11 will be separated from the original positioning clamping groove 22 with the movement of the slide rod 6, the second elastic member 12 will be compressed, during the movement of the slide rod 6, the second clamping ball 11 will repeatedly separate and engage with the positioning clamping groove 22 until the placement plate 8 is adjusted to the required position, after the second clamping ball 11 engages with the positioning clamping groove 22, stop pulling the moving rod 13, during this process, the placement plate 8 moves horizontally and vertically; when horizontal lateral movement is required, the left and right moving rods 13 can achieve it, the slide rod 6 will move with the first slide rail 3 on the second slide rail 5, except that the movement direction is different, the working principle of the first clamping ball and the first elastic member 10 is the same as that of the second clamping ball and the second elastic member 12, so that the device can realize accurate adjustment of the placement plate 8 in horizontal and vertical directions and plane lateral directions, this multi-dimensional adjustment capability ensures that even the detection of the subtle parts of the semiconductor module can be easily completed, improving the accuracy and efficiency of the detection; the cooperation mechanism of the clamping ball and the positioning clamping groove 22 can provide a stable support point during adjustment, preventing the placement plate 8 from accidentally deviating or shaking during movement, ensuring the stability of the detection process, at the same time, the design of the elastic member can automatically reset after each movement, ensuring that the placement plate 8 can accurately stay at the required detection position; the rubber pad 15 can increase the friction between the base 1 and the placement ground, so that the device can be placed stably and is not easy to displace; when the base 1 is transported, the protective ring 14 can prevent the base 1 from being damaged by knocking around the periphery.

[0025] The above merely describes the embodiments of the present application and is not intended to limit the present application. Any equivalent replacement made within the principles of the present application shall be included in the protection scope of the present application. The contents not described in detail in the present application belong to the existing technology known to the technical personnel in the field.

Claims

1. A microscope adjustable base for semiconductor module appearance detection, comprising: a base (1); a first connecting frame (2) symmetrically connected to the base (1); a first guide rod (21) connected to the inside of the first connecting frame (2), respectively; a plurality of positioning clamping grooves (22) equidistantly formed on any one of the first guide rods (21); a first sliding rail (3) jointly and slidably connected to the first guide rods (21); characterized in that it further comprises: a first clamping bead (9) slidably connected to any one end of the first sliding rail (3), and the first clamping bead (9) is clamped with the positioning clamping groove (22); a first elastic member (10) connected between the first clamping bead (9) and the first sliding rail (3); a second connecting frame (4) symmetrically connected to the upper part of the first connecting frame (2); a second guide rod (41) connected to the second connecting frame (4), respectively; a second sliding rail (5) jointly and slidably connected to the second guide rods (41), and the first sliding rail (3) and the second sliding rail (5) are cross staggered; a sliding rod (6) inserted into the intersection of the first sliding rail (3) and the second sliding rail (5), and the sliding rod (6) is slidably connected with the first sliding rail (3) and the second sliding rail (5); a mounting plate (7) connected to the sliding rod (6); 2. The microscope stand for semiconductor module appearance inspection according to claim 1, wherein a placement plate (8) connected to the mounting plate (7).

3. The microscope stand for semiconductor module appearance inspection according to claim 2, wherein A plurality of positioning clamping grooves (22) are equidistantly formed on any one of the second guide rods (41), a second clamping bead (11) is slidably connected to any one end of the second sliding rail (5), the second clamping bead (11) is clamped with the positioning clamping groove (22), and a second elastic member (12) is connected between the second clamping bead (11) and the second sliding rail (5). Further comprising:

4. The microscope stand for semiconductor module appearance inspection according to claim 3, wherein a moving rod (13) symmetrically connected to the placement plate (8). Further comprising:

5. The microscope stand for semiconductor module appearance inspection according to claim 4, wherein a protective ring (14) wrapped around the periphery of the base (1). Further comprising:

6. The microscope stand for semiconductor module appearance inspection according to claim 5, wherein a rubber pad (15) connected to the bottom of the base (1). The placement plate (8) is detachable.

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