IV detection mechanism for 0BB silicon wafer
By employing an independent detection module and UVW alignment components in OBB silicon wafer inspection, precise alignment of gold and silver busbars is achieved, solving the problems of difficult inspection and high breakage rate, and improving inspection efficiency and yield.
Patent Information
- Application Number
- CN202422924326.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-28
- Publication Date
- 2025-11-07
- Estimated Expiration
- 2034-11-28
AI Technical Summary
Existing silicon wafer inspection technologies are difficult to effectively inspect OBB silicon wafers after the removal of the front main gate line, resulting in inspection difficulties and a decrease in yield. Furthermore, there is a high breakage rate during the production of bi-half wafers.
Using independent left and right detection modules, combined with UVW alignment components and linear modules, the gold wire and silver busbar test frames can be raised and lowered independently and aligned, ensuring that the gold wire and silver busbar are aligned with the half-piece grid line for accurate electrical performance testing.
This improved testing efficiency and yield, reduced breakage rate, and increased silicon wafer production capacity.
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Figure CN223528042U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of silicon wafer production especially relates to a IV detection mechanism for 0BB silicon wafer. BACKGROUND
[0002] Photovoltaic solar silicon wafer (hereinafter referred to as silicon wafer) is the core part in solar power generation system, and is also the highest value part in solar power generation system. The function of silicon wafer is to convert solar energy into electric energy, and the electric energy is stored by battery or directly loaded. In the existing silicon wafer, the front surface has main grid lines, the main grid lines will shield the surface of solar cell, affect the light absorption of the cell piece, and further affect the power generation efficiency. In the subsequent new type of silicon wafer, the front surface main grid line is cancelled, which leads to the difficulty in quality detection during the production process of silicon wafer, and affects the detection of yield rate. At the same time, in order to connect the production of double half pieces, IV detection of double half pieces is needed. UTILITARY MODEL
[0003] One purpose of the utility model is to provide a IV detection mechanism for 0BB silicon wafer, which can reduce cost and increase efficiency of OBB silicon wafer in the use process of silicon wafer, and realize electrical performance detection by adopting double half piece IV detection structure on both sides, thereby reducing the rate of broken pieces.
[0004] To achieve this purpose, the utility model adopts the following technical scheme:
[0005] A IV detection mechanism for 0BB silicon wafer, comprising a left detection module and a right detection module, the left detection module and the right detection module each comprise a UVW base, a gold wire row and a silver row test rack, a UVW deviation correction alignment assembly is installed at the lower end of the UVW base, the UVW deviation correction alignment assembly comprises two groups of X-axis modules and a group of Y-axis modules, the gold wire row and the silver row test rack are respectively movable on the UVW base along the vertical direction, a gold wire is installed on the gold wire row, a silver row is installed on the silver row test rack, and the left detection module and the right detection module move independently of each other.
[0006] As a preferred technical scheme, a lifting support is installed on the UVW base, an upper straight line module and a lower straight line module are arranged on the lifting support, a driving end of the upper straight line module is connected with an upper mounting frame, the gold wire row is fixed in the upper mounting frame, a driving end of the lower straight line module is connected with a lower mounting frame, and the silver row test rack is fixed in the lower mounting frame.
[0007] As a preferred technical scheme, the gold wire row has a tension spring on both sides, the two ends of the gold wire are fixed on the tension spring, and the gold wire is connected with an upper wire.
[0008] As a preferred technical scheme, the gold wire row is fixed with a circuit board on the outer side, and the upper wire is connected to the circuit board.
[0009] As a preferred technical scheme, the silver row test frame is provided with a mounting groove on both sides, the end of the silver row is inserted into the mounting groove, a pressing strip is arranged above the mounting groove and presses on the end of the silver row, the upper end of the silver row is in an upwardly bent arc shape, and the silver row is connected with a lower wire.
[0010] As a preferred technical scheme, the upper straight line module comprises an upper motor, an upper lead screw and an upper nut, the upper motor is connected with the lower end of the upper lead screw, the upper lead screw is in threaded connection with the upper nut, and the upper mounting frame is fixedly connected with the upper nut after penetrating through the lifting support.
[0011] As a preferred technical scheme, the lower straight line module comprises a lower motor, a lower lead screw and a lower nut, the lower motor is connected with the upper end of the lower lead screw, the lower lead screw is in threaded connection with the lower nut, and the lower mounting frame is fixedly connected with the lower nut after penetrating through the lifting support.
[0012] As a preferred technical scheme, the outer side of the upper mounting frame and the outer side of the lower mounting frame are connected with vertical sliding blocks, and vertical sliding rails are fixed on the lifting support along the vertical direction, and the vertical sliding blocks slide on the vertical sliding rails.
[0013] As a preferred technical scheme, the X-axis module and the Y-axis module each comprise a motor mounting seat, a module motor, an adjusting lead screw and an adjusting sliding table, the module motor is fixed on the motor mounting seat, the driving end of the module motor is in transmission connection with the adjusting lead screw, the adjusting lead screw is in threaded connection with the adjusting nut of the adjusting sliding table, the adjusting sliding table slides along the length direction of the adjusting lead screw, the adjusting sliding table is provided with a connecting bearing, the connecting bearing slides on the adjusting sliding table, the moving direction of the connecting bearing is perpendicular to the moving direction of the adjusting sliding table, the edge of the UVW base is locked in the connecting bearing, and two groups of the X-axis module and one group of the Y-axis module jointly control the T-axis steering of the UVW base on one side.
[0014] As a preferred technical scheme, linear guide rails and linear sliding blocks are adopted for sliding connection between the adjusting sliding table and the connecting bearing and between the adjusting sliding table and the motor mounting seat.
[0015] The utility model discloses an IV detection mechanism for 0BB silicon wafer, which can independently detect the IV of the 0BB silicon wafer, independently lift the two sides, and correct the alignment in the UVW direction, so that the gold wire and the silver row are aligned with the grid line on the half wafer, the detection efficiency is improved, and the production capacity is increased. BRIEF DESCRIPTION OF DRAWINGS
[0016] The utility model will be further explained in detail below according to the drawings and embodiments.
[0017] Figure 1 The utility model discloses an IV detection mechanism for 0BB silicon wafer, which can independently detect the IV of the 0BB silicon wafer, independently lift the two sides, and correct the alignment in the UVW direction, so that the gold wire and the silver row are aligned with the grid line on the half wafer, the detection efficiency is improved, and the production capacity is increased.
[0018] Figure 2 The utility model discloses an IV detection mechanism for 0BB silicon wafer, which can independently detect the IV of the 0BB silicon wafer, independently lift the two sides, and correct the alignment in the UVW direction, so that the gold wire and the silver row are aligned with the grid line on the half wafer, the detection efficiency is improved, and the production capacity is increased.
[0019] Figure 3 The utility model discloses an IV detection mechanism for 0BB silicon wafer, which can independently detect the IV of the 0BB silicon wafer, independently lift the two sides, and correct the alignment in the UVW direction, so that the gold wire and the silver row are aligned with the grid line on the half wafer, the detection efficiency is improved, and the production capacity is increased.
[0020] Figure 4 The utility model discloses an IV detection mechanism for 0BB silicon wafer, which can independently detect the IV of the 0BB silicon wafer, independently lift the two sides, and correct the alignment in the UVW direction, so that the gold wire and the silver row are aligned with the grid line on the half wafer, the detection efficiency is improved, and the production capacity is increased.
[0021] Figures 1 to 4 In the embodiment, the IV detection mechanism for 0BB silicon wafer can independently detect the IV of the 0BB silicon wafer, independently lift the two sides, and correct the alignment in the UVW direction, so that the gold wire and the silver row are aligned with the grid line on the half wafer, the detection efficiency is improved, and the production capacity is increased.
[0022] 1, left detection module;2, right detection module;3, UVW base;4, gold row;5, silver row test frame;6, X axis module;7, Y axis module;8, gold wire;9, silver row;10, lifting support;11, upper mounting frame;12, lower mounting frame;13, tension spring;14, upper wire;15, circuit board;16, pressing strip;17, lower wire;18, upper motor;19, upper nut;20, lower motor;21, lower nut;22, vertical sliding block;23, vertical sliding rail;24, motor mounting seat;25, module motor;26, adjusting screw;27, adjusting sliding table;28, connecting bearing. DETAILED DESCRIPTION
[0023] The technical scheme of the utility model will be further explained below in combination with the drawings and specific embodiments.
[0024] As Figures 1 to 4As shown, in the embodiment, a kind of IV detection mechanism for 0BB silicon wafer, including left detection module 1 and right detection module 2, left detection module 1 and right detection module 2 all include UVW base 3, gold wire row 4 and silver row test frame 5, the lower end of UVW base 3 is installed UVW rectification alignment component, UVW rectification alignment component includes two groups of X-axis module 6 and a group of Y-axis module 7, gold wire row 4 and silver row test frame 5 are respectively moved on UVW base 3 along vertical direction, gold wire row 4 is installed gold wire 8, silver row test frame 5 is installed silver row 9, left detection module 1 and right detection module 2 are independently moved between each other.
[0025] Two half pieces of 0BB silicon wafer respectively come to left detection module 1 and right detection module 2, under the action of UVW rectification alignment component, two groups of X-axis module 6 and a group of Y-axis module 7 work together, so that UVW base 3 can move in X-axis direction, Y-axis direction and T-axis rotation angle, in turn control gold wire row 4 and silver row test frame 5 align the position of half piece silicon wafer, then gold wire row 4 moves downward, silver row test frame 5 moves upward, gold wire 8 is pressed on auxiliary grid, silver row 9 is topped in the auxiliary grid of half piece 0BB silicon wafer, forms passage and can carry out the detection of electrical performance.
[0026] UVW base 3 is installed lifting support 10, lifting support 10 is provided with upper linear module and lower linear module, the driving end of upper linear module is connected with upper mounting frame 11, gold wire row 4 is fixed in upper mounting frame 11, the driving end of lower linear module is connected with lower mounting frame 12, silver row test frame 5 is fixed in lower mounting frame 12, when the lifting of gold wire row 4 is controlled, rely on upper linear module to move up and down, when the lifting of silver row test frame 5 is controlled, rely on lower linear module to move up and down, upper linear module and lower linear module are all installed in the middle of lifting support 10.
[0027] The two sides of gold wire row 4 have tension spring 13, the two ends of gold wire 8 are fixed on tension spring 13, gold wire 8 is connected with upper lead 14, the outside of gold wire row 4 is fixed with circuit board 15, upper lead 14 is connected to circuit board 15, under the action of tension spring 13, gold wire 8 presents elastic state, by screwing on gold wire row 4, prevent hard contact half piece, the docking of electrical signal relies on circuit board 15 receiving.
[0028] The two sides of silver row test frame 5 are provided with mounting groove, the end of silver row 9 is inserted into mounting groove, pressure bar 16 is arranged above mounting groove, pressure bar 16 is pressed on the end of silver row 9, the upper end of silver row 9 is in the shape of upward bending arc, silver row 9 is connected with lower lead 17, the structure of upward bending arc can make silver row 9 accurately top in the middle of auxiliary grid, when installing, silver row 9 is fixed by the pressure bar 16 of two sides.
[0029] The upper linear module comprises an upper motor 18, an upper screw rod and an upper nut 19, the upper motor 18 is connected with the lower end of the upper screw rod, the upper screw rod is threadedly connected with the upper nut 19, and the upper mounting frame 11 is fixedly connected with the upper nut 19 after penetrating through the lifting support 10; the lower linear module comprises a lower motor 20, a lower screw rod and a lower nut 21, the lower motor 20 is connected with the upper end of the lower screw rod, the lower screw rod is threadedly connected with the lower nut 21, and the lower mounting frame 12 is fixedly connected with the lower nut 21 after penetrating through the lifting support 10; the upper linear module and the lower linear module are just opposite and symmetrical in the upper and lower installation, are controlled by the motors to rotate the nuts through the screw rods, realize the lifting of the mounting frames, and the corresponding gold wire row 4 and silver row test rack 5 can be lifted.
[0030] The outer side of the upper mounting frame 11 and the outer side of the lower mounting frame 12 are both connected with vertical sliding blocks 22, and vertical sliding rails 23 are fixed on the lifting support 10 along the vertical direction, the vertical sliding blocks 22 slide on the vertical sliding rails 23, and the vertical sliding blocks 22 and the vertical sliding rails 23 guide and reduce friction in the vertical direction when the upper mounting frame 11 and the lower mounting frame 12 are lifted.
[0031] The X-axis module 6 and the Y-axis module 7 both comprise a motor mounting seat 24, a module motor 25, an adjusting screw rod 26 and an adjusting sliding table 27, the module motor 25 is fixed on the motor mounting seat 24, the driving end of the module motor 25 is in transmission connection with the adjusting screw rod 26, the adjusting screw rod 26 is threadedly connected with the adjusting nut of the adjusting sliding table 27, the adjusting sliding table 27 slides along the length direction of the adjusting screw rod 26, the adjusting sliding table 27 is provided with a connecting bearing 28, the connecting bearing 28 slides on the adjusting sliding table 27, the moving direction of the connecting bearing 28 is perpendicular to the moving direction of the adjusting sliding table 27, and the edge of the UVW base 3 is locked in the connecting bearing 28, and the two groups of X-axis modules 6 and the group of Y-axis modules 7 jointly control the T-axis steering of the UVW base 3 on one side, and the adjusting sliding table 27 and the connecting bearing 28 and the adjusting sliding table 27 and the motor mounting seat 24 are all in sliding connection through linear guide rails and linear sliding blocks.
[0032] The UVW deviation correction and alignment assembly is a high-precision moving structure, is specially designed for high-precision alignment equipment, is usually also called as an XXY platform, as a kind of three-axis parallel motion mechanism, rotation movement and translation along any direction (X, Y, θ three-axis movement in plane) can be realized by controlling the parallel movement of three linear moving structures, the UVW deviation correction and alignment assembly cooperates with a vision module, high-precision alignment function can be realized, and can be applied to the silicon wafer printing industry.
[0033] More specifically, the implementation process of the UVW deviation correction alignment assembly includes determining the conversion matrix from the camera coordinate system to the UVW platform coordinate system through a visual calibration method, and obtaining the x, y, theta offset between the marker template position and the marker to be corrected through the visual module based on the coordinate value of the origin coordinate system of the UVW deviation correction alignment assembly, then inputting the three-axis initial coordinates according to the formula, setting the rotation center as (0, 0), inputting the theta offset, and obtaining the new coordinate values of the UVW three-axis, the new coordinate of the object to be corrected, and the corresponding feed amount of the three motors. This series of operations disassembles the movement process into translation and rotation parts, respectively calculates the motor feed amount, so as to realize accurate automatic positioning, and the alignment accuracy can reach microns.
[0034] It should be noted that the above specific embodiments only serve as the preferred embodiments of the utility model and the applied technical principles, and any changes or replacements easily thought by those skilled in the art within the technical range disclosed by the utility model should be covered in the protection range of the utility model.
Claims
1. A mechanism for IV detection for 0BB silicon wafer, characterized in that, The application relates to a left detection module and a right detection module, wherein the left detection module and the right detection module each comprise a UVW base, a gold wire row and a silver row test rack, the lower end of the UVW base is provided with a UVW deviation rectifying and aligning assembly, the UVW deviation rectifying and aligning assembly comprises two groups of X-axis modules and one group of Y-axis modules, the gold wire row and the silver row test rack are movably arranged on the UVW base along the vertical direction, the gold wire row is provided with gold wires, the silver row test rack is provided with silver rows, and the left detection module and the right detection module are independently movable.
2. The IV detection mechanism for 0BB silicon wafer according to claim 1, wherein, The UVW base is provided with a lifting support, the lifting support is provided with an upper linear module and a lower linear module, the driving end of the upper linear module is connected with an upper mounting frame, the gold wire row is fixed in the upper mounting frame, the driving end of the lower linear module is connected with a lower mounting frame, and the silver row test rack is fixed in the lower mounting frame.
3. The IV detection mechanism for 0BB silicon wafer of claim 1, wherein, The gold wire row is provided with pull springs on the two sides, the two ends of the gold wire are fixed on the pull springs, and the gold wire is connected with an upper wire.
4. The IV detection mechanism for 0BB silicon wafer of claim 3, wherein, The outer side of the gold wire row is fixed with a circuit board, and the upper wire is connected to the circuit board.
5. The IV detection mechanism for 0BB silicon wafer of claim 1, wherein, The two sides of the silver row test rack are provided with mounting grooves, the ends of the silver rows are inserted into the mounting grooves, the mounting grooves are provided with pressing strips above, the pressing strips press on the ends of the silver rows, the upper end of the silver row is in an upwardly bent arc shape, and the silver row is connected with a lower wire.
6. The IV detection mechanism for 0BB silicon wafer of claim 2, wherein, The upper linear module comprises an upper motor, an upper screw rod and an upper nut, the upper motor is connected with the lower end of the upper screw rod, the upper screw rod is in threaded connection with the upper nut, and the upper mounting frame is fixedly connected with the upper nut after penetrating through the lifting support.
7. The IV detection mechanism for 0BB silicon wafer of claim 2, wherein, The lower linear module comprises a lower motor, a lower screw rod and a lower nut, the lower motor is connected with the upper end of the lower screw rod, the lower screw rod is in threaded connection with the lower nut, and the lower mounting frame is fixedly connected with the lower nut after penetrating through the lifting support.
8. The IV detection mechanism for 0BB silicon wafer of claim 2, wherein, The outer side of the upper mounting frame and the outer side of the lower mounting frame are both connected with vertical sliding blocks, and the lifting support is fixedly provided with vertical sliding rails along the vertical direction.
9. The IV detection mechanism for 0BB silicon wafer of claim 1, wherein, The X-axis module and the Y-axis module each comprise a motor mounting base, a module motor, an adjusting screw rod and an adjusting sliding table, the module motor is fixed on the motor mounting base, the driving end of the module motor is in transmission connection with the adjusting screw rod, the adjusting screw rod is in threaded connection with the adjusting nut of the adjusting sliding table, the adjusting sliding table slides along the length direction of the adjusting screw rod, the adjusting sliding table is provided with a connecting bearing, the connecting bearing slides on the adjusting sliding table, the moving direction of the connecting bearing is perpendicular to the moving direction of the adjusting sliding table, the edge of the UVW base is locked in the connecting bearing, and two groups of the X-axis modules and one group of the Y-axis modules jointly control the T-axis turning of one side of the UVW base.
10. The IV detection mechanism for 0BB silicon wafer of claim 9, wherein, Linear guides and linear sliding blocks are adopted to slidably connect the adjusting sliding table and the connecting bearing and the adjusting sliding table and the motor mounting base.