Heat dissipation device

Abstract

The utility model discloses a heat dissipation device, and belongs to the technical field of component heat dissipation, the heat dissipation device is used for carrying out heat dissipation on a component, and the heat dissipation device comprises a cooling part which comprises a heat exchange part, and the heat exchange part is provided with a mounting groove and a placing groove; and the thermoelectric refrigeration part is located in the mounting groove and comprises a heating part and a refrigeration part which are connected with each other. The thermoelectric refrigeration part is additionally arranged between the heat exchange part of the cooling part and the component, the thermoelectric refrigeration part enables the refrigeration part to dissipate heat of the component through the Pelleil effect, heat exchange is conducted between the heating part and the heat exchange part, and when the heat generated by the component is low, the voltage and current of the thermoelectric refrigeration part can be adjusted, so that the cooling effect is improved. The temperature of the heating part of the thermoelectric refrigeration part is increased, the heating part transmits heat to the heat exchange part, and the heat exchange medium reaches the evaporation temperature, so that the cooling part can dissipate heat of the component, and the heat dissipation efficiency is improved.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of component heat dissipation, and particularly relates to a heat dissipation device. BACKGROUND

[0002] With the increasing integration of electronic and electrical components, the heat flux density of the components is also increasing, and the components need to be cooled by a heat dissipation device. At present, the components are cooled by a thermosyphon heat sink, which utilizes the heat absorption characteristics of the evaporation of the heat exchange medium in the heat sink to cool the components. However, when the heat generation of the components is low, the thermosyphon heat sink cannot cool the components. CONTENT OF THE INVENTION

[0003] The application aims to overcome the technical problem that the components cannot be cooled by a thermosyphon heat sink when the heat generation of the components is low.

[0004] TECHNICAL SOLUTION The heat dissipation device provided by the application comprises:

[0005] a cooling member comprising a heat exchange part, wherein the heat exchange part has a mounting groove and a placing groove;

[0006] a thermoelectric refrigeration member located in the mounting groove, wherein the thermoelectric refrigeration member comprises a heating part and a refrigeration part connected to each other, the heating part is connected to the heat exchange part, and the refrigeration part is connected to a component.

[0007] In some embodiments, the heat dissipation device comprises:

[0008] a sensing member located in the placing groove and connected to the heat exchange part, and used for sensing the temperature of the heat exchange part;

[0009] a control member electrically connected to the thermoelectric refrigeration member and the sensing member, and used for adjusting the temperature of the heating part.

[0010] In some embodiments, the heat dissipation device comprises:

[0011] a heat transfer member connected to the heat exchange part and covering the mounting groove;

[0012] The heat transfer member is located between the refrigeration part and the component, and is connected to the refrigeration part and the component, respectively.

[0013] In some embodiments, the heat exchange part has a containing cavity and a converging cavity connected to each other, and the containing cavity is provided with a heat exchange medium; the cooling member comprises:

[0014] An evaporation portion is located on the side of the heat exchange portion away from the thermoelectric refrigeration element and is connected to the heat exchange portion. The evaporation portion has an evaporation channel, and an inlet of the evaporation channel is in communication with the containing cavity.

[0015] A condensation portion is located on the side of the heat exchange portion away from the thermoelectric refrigeration element and is connected to the heat exchange portion and the evaporation portion respectively. The condensation portion has a condensation channel, an inlet of the condensation channel is in communication with an outlet of the evaporation channel, and an outlet of the condensation channel is in communication with the converging cavity.

[0016] In some embodiments, the heat exchange portion has a plurality of the converging cavities, and each of the converging cavities is in communication with the containing cavity.

[0017] The cooling element includes a plurality of the condensation portions, and an outlet of the condensation channel of each of the condensation portions is in communication with one of the converging cavities respectively.

[0018] In some embodiments, the maximum dimension of the containing cavity in the thickness direction of the heat exchange portion is H, and the maximum dimension of the converging cavity in the thickness direction is h, and H > h is satisfied.

[0019] In some embodiments, the cooling element includes:

[0020] A connecting portion is located on the side of the evaporation portion away from the heat exchange portion and is connected to the evaporation portion and the condensation portion respectively. The connecting portion has a connecting groove, and an outlet of the evaporation channel is in communication with an inlet of the condensation channel through the connecting groove.

[0021] In some embodiments, the cooling element includes:

[0022] At least one heat conduction portion is located in the evaporation channel and is connected to the evaporation portion. The heat conduction portion extends in the direction from the inlet of the evaporation channel to the outlet of the evaporation channel.

[0023] In some embodiments, the cooling element includes:

[0024] A separation portion is located in the evaporation channel and is connected to the evaporation portion. The separation portion extends in the direction from the inlet of the evaporation channel to the outlet of the evaporation channel, and separates the evaporation channel into a plurality of branch channels. Each of the branch channels is internally provided with at least one of the heat conduction portions.

[0025] In some embodiments, the cooling element includes:

[0026] A heat dissipation portion is located on the side of the condensation portion away from the evaporation portion and is connected to the condensation portion, for dissipating heat from the condensation portion.

[0027] In some embodiments, the heat dissipation portion includes:

[0028] a substrate located on the side of the condensing part away from the evaporating part and connected to the condensing part;

[0029] a plurality of fins located on the side of the substrate away from the condensing part and connected to the substrate, the plurality of fins being arranged at intervals;

[0030] a fan located on the side of the substrate away from the condensing part and connected to the plurality of fins.

[0031] Beneficial effects: The heat dissipation device of the embodiment of the present application is used for dissipating heat of a component, and the heat dissipation device comprises a cooling member, a thermoelectric refrigeration member, a sensing member and a control member. The cooling member comprises a heat exchange part, and the heat exchange part has a mounting groove and a placing groove. The thermoelectric refrigeration member is located in the mounting groove, and the thermoelectric refrigeration member comprises a heating part and a refrigeration part connected to each other. The heating part is connected to the heat exchange part, and the refrigeration part is connected to the component. The sensing member is located in the placing groove and connected to the heat exchange part, and is used for sensing the temperature of the heat exchange part. The control member is electrically connected to the thermoelectric refrigeration member and the sensing member respectively, and is used for adjusting the temperature of the heating part. By adding the thermoelectric refrigeration member between the heat exchange part of the cooling member and the component, the thermoelectric refrigeration member uses the Peltier effect to realize heat dissipation of the component by the refrigeration part, and the heating part exchanges heat with the heat exchange part. When the heat production of the component is low, the voltage and the current of the thermoelectric refrigeration member can be adjusted to increase the temperature of the heating part, and the heating part transmits heat to the heat exchange part, so that the heat exchange medium reaches the evaporation temperature, thereby enabling the cooling member to dissipate heat of the component and improving the heat dissipation efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0033] Figure 1 The overall structure schematic diagram of the heat dissipation device provided by the embodiment of the present application;

[0034] Figure 2 The explosion schematic diagram of the cooling member, the thermoelectric refrigeration member and the sensing member provided by the embodiment of the present application;

[0035] Figure 3 The explosion structure schematic diagram of the heat dissipation device provided by the embodiment of the present application;

[0036] Figure 4 The front view sectional view of the heat dissipation device provided by the embodiment of the present application;

[0037] Figure 5A side view of the heat exchange portion according to an embodiment of the present application is provided.

[0038] Figure 6 A bottom structure of the heat exchange portion according to an embodiment of the present application is provided.

[0039] Figure 7 A top structure of the heat exchange portion according to an embodiment of the present application is provided.

[0040] Figure 8 A structure of the evaporation portion according to an embodiment of the present application is provided.

[0041] Figure 9 A structure of the evaporation portion with a separation portion according to an embodiment of the present application is provided.

[0042] In the drawings: 10 - cooling member; 11 - heat exchange portion; 111 - mounting groove; 112 - placing groove; 113 - containing cavity; 114 - converging cavity; 12 - evaporation portion; 121 - evaporation passage; 1211 - diverging passage; 13 - condensation portion; 131 - condensation passage; 14 - connecting portion; 141 - connecting groove; 15 - heat conduction portion; 16 - separation portion; 17 - heat dissipation portion; 171 - base plate; 172 - fin; 173 - fan; 20 - thermoelectric refrigeration member; 21 - heat generating portion; 22 - refrigeration portion; 30 - inductive member; 40 - controller; 50 - heat transfer member; X - thickness direction. DETAILED DESCRIPTION

[0043] The technical solutions in the embodiments of the present application will be clearly and completely described in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person skilled in the art without creative work fall within the protection scope of the present application.

[0044] In the description of the present application, it should be understood that the terms "first", "second" are used only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more features. In the description of the present application, the meaning of "multiple" is two or more, at least one of which can be one, two or more, unless otherwise specifically limited.

[0045] As an introduction to the embodiments of the present application, a heat dissipation device is introduced. With the increasing integration of electronic and electrical components, especially the heat flux density of components such as CPU, network chip, IGBT module, inductance, etc. is also increasing, which needs to be effectively cooled to keep it within the normal operating temperature range. Common cooling methods such as sheet metal heat conduction and air cooling cannot meet the cooling demand; the liquid cooling system is too complex and has limited application scenarios; with the development of technology, phase change heat sinks emerge as the times require, which can realize the mutual conversion of phase change medium through the heat absorption and heat release of phase change medium, especially the heat siphon heat sink, which realizes the mutual conversion of phase change medium through the gravity of the condensed liquid itself as the driving force. However, in the actual application process of electronic and electrical components, the actual power will change according to different operating conditions, and the heat siphon heat sink is generally filled with phase change medium according to the maximum full power of electronic and electrical components at the beginning of design, so when electronic and electrical components are running in the operating condition with small demand power, the heat dissipation is small, which cannot reach the temperature required for the evaporation of phase change medium in the heat siphon heat sink, and thus the heat sink fails to dissipate heat from the components.

[0046] TEC is a thermoelectric refrigeration technology, which is a solid-state refrigeration technology that realizes refrigeration by using the Peltier effect of semiconductor materials. When working, direct current is used, and by adjusting the working voltage and current size, continuous and precise control of cooling capacity and temperature can be realized. The thermoelectric refrigeration structure cooperates with a suitable closed-loop temperature control circuit to control the temperature to within 0.1℃ precision, and can also dissipate heat from the components. The combination of TEC thermoelectric refrigeration structure and heat siphon heat sink can improve the refrigeration capacity and efficiency of TEC, but the power of electronic and electrical components will change according to different operating conditions in the actual application process, and the heat generation will also change. When the heat generation of the components is low, the heat generated by the heat generating end of the thermoelectric refrigeration structure is also small, which cannot make the heat exchange medium in the heat sink reach the evaporation temperature, and thus the heat sink cannot dissipate heat from the components.

[0047] Therefore, the embodiments of the present application provide a heat dissipation device to overcome at least one of the above technical problems.

[0048] Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 6 In the embodiments of the present application, the heat dissipation device is used to dissipate heat from the components, and the heat dissipation device comprises a cooling component 10, a thermoelectric refrigeration component 20, a sensing component 30 and a control component 40.

[0049] The cooling device 10 comprises a heat exchange part 11, which has a mounting groove 111 and a placing groove 112. The thermoelectric refrigeration device 20 is located in the mounting groove 111, and comprises a heating part 21 and a refrigeration part 22 connected with each other, the heating part 21 is connected with the heat exchange part 11, and the refrigeration part 22 is connected with the component. It can be understood that the cooling device 10 can be a phase change radiator, such as a thermosyphon radiator. The thermoelectric refrigeration device 20 can be a TEC thermoelectric cooler, which is a semiconductor material. The cooling device 10 can be connected with the thermoelectric refrigeration device 20, and the two are used in cooperation. The thermoelectric refrigeration device 20 is placed in the mounting groove 111 of the heat exchange part 11, so that the heating part 21 of the thermoelectric refrigeration device 20 is connected with the heat exchange part 11, and the refrigeration part 22 of the thermoelectric refrigeration device 20 is connected with the component which needs to be cooled. The heating part 21 and the refrigeration part 22 are connected through a connecting structure. When the device works, the thermoelectric refrigeration device 20 utilizes the Peltier effect to reduce the temperature on the refrigeration part 22 (the Peltier effect is a thermoelectric effect. When there is a temperature difference at the contact of two different materials, a voltage difference will be generated, thereby generating an electric current. Conversely, when the electric current passes through the two materials, a temperature difference will also be generated), so that the refrigeration part 22 can cool the component; at the same time, the temperature of the heating part 21 will rise, and the heating part 21 is connected with the heat exchange part 11, so that the heat is transferred to the heat exchange part 11. The heat exchange medium in the heat exchange part 11 needs to absorb heat, that is, the heat on the heat exchange part 11 and the heating part 21 will be absorbed. The temperature on the heating part 21 is reduced, so that the heat on the refrigeration part 22 is easily transferred to the heating part 21, which improves the refrigeration effect of the refrigeration part 22, thereby improving the cooling effect on the component.

[0050] When the device is used, if the temperature on the heat exchange part 11 does not reach the evaporation temperature of the heat exchange medium (the temperature on the heat exchange part 11 is outside the evaporation temperature range of the heat exchange medium), the power supply on the thermoelectric refrigeration device 20 can be controlled through the corresponding control structure (the power supply is used to provide electric energy for the work of the thermoelectric refrigeration device 20), and the output voltage and current of the power supply are adjusted until the temperature of the heating part 21 reaches the preset temperature. After reaching the preset temperature, the heat exchange medium in the heating part 21 can evaporate, so that the cooling device 10 can continue to work, absorb the temperature on the heat exchange part 11 and the heating part 21, reduce the temperature on the heating part 21, and easily transfer the heat on the refrigeration part 22 to the heating part 21, thereby improving the refrigeration effect of the refrigeration part 22 and improving the cooling effect on the component. Through this setting mode, the temperature on the heat exchange part 11 and the heating part 21 can be adjusted, so that the temperature reaches the evaporation temperature of the heat exchange medium, and the cooling device 10 can also work normally under the working condition that the component generates a small amount of heat, thereby improving the refrigeration effect of the refrigeration part 22 and rapidly cooling the component.

[0051] Please refer to Figure 2In some embodiments, the heat dissipation device comprises the sensing element 30 and the control element 40. The sensing element 30 is located in the placement groove 112 and connected with the heat exchange part 11, for sensing the temperature of the heat exchange part 11. The control element 40 is electrically connected with the thermoelectric refrigeration element 20 and the sensing element 30, for adjusting the temperature of the heat generating part 21. It can be understood that the sensing element 30 can be a temperature sensor, such as a thermistor. The control element 40 is a control structure that can control the power supply on the thermoelectric refrigeration element 20, which can be a main controller. The sensing element 30 is arranged in the placement groove 112 of the heat exchange part 11, can collect and monitor the temperature on the heat exchange part 11, and transmit data to the control element 40 (the control element 40 can be pre-set with the evaporation temperature of the heat exchange medium in the heat exchange part 11 of the cooling device 10). The temperature on the heat exchange part 11 is monitored to see if it reaches the evaporation temperature of the heat exchange medium. If the sensing element 30 monitors that the temperature on the heat exchange part 11 does not reach the evaporation temperature of the heat exchange medium (is outside the evaporation temperature range of the heat exchange medium), it will transmit a corresponding electrical signal to the control element 40. After the control element 40 processes the electrical signal, it will transmit a corresponding electrical signal to the thermoelectric refrigeration element 20 to control the power supply on the thermoelectric refrigeration element 20 (the power supply is used to provide power for the operation of the thermoelectric refrigeration element 20), and adjust the output voltage and current of the power supply, until the temperature of the heat generating part 21 reaches the pre-set temperature.

[0052] Please refer to Figure 1 , Figure 2 and Figure 3 In some embodiments, the heat dissipation device comprises the heat transfer element 50. The heat transfer element 50 is connected with the heat exchange part 11 and covers the installation groove 111. The heat transfer element 50 is located between the refrigeration part 22 and the components and is connected with them. It can be understood that after the thermoelectric refrigeration element 20 is installed in the installation groove 111 (multiple thermoelectric refrigeration elements 20 can be installed in the installation groove 111 to improve the heat dissipation efficiency of the components), in order to further isolate it from the outside world and avoid the refrigeration part 22 of the thermoelectric refrigeration element 20 from being in contact with the air to cause frosting, the opening of the installation groove 111 is covered by the heat transfer element 50, which is connected with the heat exchange part 11, to achieve the isolation of the refrigeration part 22 from the outside air, avoid frosting on its surface, and ensure the normal use and refrigeration efficiency of the refrigeration part 22. The heat transfer element 50 can be a metal component, which can more evenly transfer the heat on the components to the refrigeration part 22. At the same time, interface materials with good thermal conductivity can be arranged between the heat transfer element 50 and the components to reduce the thermal resistance between them and improve the efficiency of heat conduction. Similarly, interface materials with good thermal conductivity can also be arranged between the heat transfer element 50 and the refrigeration part 22, and between the heat generating part 21 and the heat exchange part 11.

[0053] Please refer to Figure 3 ,Figure 4 、 Figure 5 and Figure 7 , in combination with the above embodiments, in some embodiments, the heat exchange part 11 has a containing cavity 113 and a converging cavity 114 connected with each other, and the containing cavity 113 is provided with a heat exchange medium; the cooling part 10 includes an evaporation part 12 and a condensation part 13. The evaporation part 12 is located on the side of the heat exchange part 11 away from the thermoelectric refrigeration part 20, and is connected with the heat exchange part 11, and the evaporation part 12 has an evaporation passage 121, and the inlet of the evaporation passage 121 is connected with the containing cavity 113. The condensation part 13 is located on the side of the heat exchange part 11 away from the thermoelectric refrigeration part 20, and is connected with the heat exchange part 11 and the evaporation part 12 respectively, and the condensation part 13 has a condensation passage 131, and the inlet of the condensation passage 131 is connected with the outlet of the evaporation passage 121, and the outlet of the condensation passage 131 is connected with the converging cavity 114. It can be understood that the heat exchange medium is placed in the containing cavity 113 of the heat exchange part 11, and at the same time, the containing cavity 113 is connected with the converging cavity 114. When the heat dissipation device dissipates heat of the components, the heating part 21 of the thermoelectric refrigeration part 20 transmits heat to the heat exchange part 11, so that the temperature of the heat exchange part 11 rises until it rises to the evaporation temperature of the heat exchange medium, causing the heat exchange medium to absorb heat and change from liquid state to gaseous state. The gaseous heat exchange medium enters the inside of the evaporation passage 121 from the inlet of the evaporation passage 121, and then flows upwards and is discharged from the outlet of the evaporation passage 121. Since the outlet of the evaporation passage 121 is connected with the inlet of the condensation passage 131, the gaseous heat exchange medium discharged from the outlet of the evaporation passage 121 can enter the condensation passage 131 through the inlet of the condensation passage 131. During the flow of the gaseous heat exchange medium in the inside of the condensation passage 131, the gaseous heat exchange medium releases heat and changes from gaseous state to liquid state, and then is discharged from the outlet of the condensation passage 131 and enters the converging cavity 114 connected with the outlet of the condensation passage 131, and then enters the containing cavity 113 from the converging cavity 114, continues to absorb heat on the heat exchange part 11 and changes to gaseous state, forming a cycle, and continuously cooling the heat exchange part 11 and the heating part 21, thereby improving the heat dissipation efficiency of the thermoelectric refrigeration part 20 on the components.

[0054] Please refer to Figure 3 、 Figure 4 、 Figure 5 and Figure 7In some embodiments, the heat exchange portion 11 has a plurality of converging cavities 114, each of which is in communication with the containing cavity 113. The cooling member 10 includes a plurality of condensing portions 13, and the outlet of the condensing channel 131 of each condensing portion 13 is in communication with one converging cavity 114, respectively. It can be understood that a plurality of converging cavities 114 can be provided on the heat exchange portion 11, and a plurality of condensing portions 13 are also provided, so that the condensing channel 131 on each condensing portion 13 is in communication with one converging cavity 114. Since the volume of the heat exchange medium changes when it changes from a liquid state to a gaseous state, in order to accommodate more gaseous heat exchange medium and facilitate the flow of more gaseous heat exchange medium, a plurality of condensing channels 131 can be provided, which is conducive to the rapid cooling of more gaseous heat exchange medium into a liquid state, and timely replenishment of the liquid heat exchange medium in the containing cavity 113, which is equivalent to improving the conversion efficiency of the gaseous heat exchange medium into a liquid state.

[0055] Referring to Figure 5 In some embodiments, the maximum size of the containing cavity 113 in the thickness direction X of the heat exchange portion 11 is H, and the maximum size of the converging cavity 114 in the thickness direction X is h, and H > h is satisfied. It can be understood that the depth of the containing cavity 113 needs to be greater than the depth of the converging cavity 114, so that the liquid heat exchange medium placed inside the containing cavity 113 will not flow into the converging cavity 114, and at the same time, the heat exchange medium condensed from a gaseous state to a liquid state in the converging cavity 114 can flow smoothly into the inside of the containing cavity 113, and will not accumulate in the converging cavity 114.

[0056] Referring to Figure 3 and Figure 4 In some embodiments, the cooling member 10 includes a connecting portion 14. The connecting portion 14 is located on the side of the evaporation portion 12 away from the heat exchange portion 11, and is connected to the evaporation portion 12 and the condensing portion 13, respectively. The connecting portion 14 has a connecting groove 141, and the outlet of the evaporation channel 121 is connected to the inlet of the condensing channel 131 through the connecting groove 141. It can be understood that the connecting portion 14 covers the outlet of the evaporation channel 121 and the inlet of the condensing channel 131, and the outlet of the evaporation channel 121 and the inlet of the condensing channel 131 are connected through the connecting groove 141 of the connecting portion 14. This can prevent the gaseous heat exchange medium from diffusing into the air when flowing from the outlet of the evaporation channel 121 to the inlet of the condensing channel 131, ensuring that the quality of the heat exchange medium does not change, and also preventing external factors from affecting the gaseous heat exchange medium.

[0057] Referring to Figure 8 and Figure 9In some embodiments, the cooling member 10 comprises at least one heat-conducting portion 15. The at least one heat-conducting portion 15 is located in the evaporation channel 121 and is connected with the evaporation portion 12. The heat-conducting portion 15 extends in the direction from the inlet of the evaporation channel 121 to the outlet of the evaporation channel 121. It can be understood that the heat-conducting portion 15 is a structure of a metal material with good heat conductivity. By arranging one or more heat-conducting portions 15 in the evaporation channel 121 and extending in the direction from the inlet of the evaporation channel 121 to the outlet of the evaporation channel 121, the gaseous heat exchange medium in the evaporation channel 121 can flow in an orderly manner, and the heat-conducting portion 15 can guide the flow of the gaseous heat exchange medium. Meanwhile, the heat-conducting portion 15 is connected with the evaporation portion 12, and the evaporation portion 12 is connected with the condensation portion 13. By arranging the at least one heat-conducting portion 15, the heat conduction between the evaporation channel 121 and the condensation channel 131 can be facilitated, the heat exchange between the evaporation channel 121 and the condensation channel 131 can be enhanced, and the gaseous heat exchange medium can be prevented from being supercooled or overheated. The heat-conducting portion 15 can be a straight fin or a corrugated fin.

[0058] Referring to Figure 8 and Figure 9 In some embodiments, the cooling member 10 comprises a partition portion 16. The partition portion 16 is located in the evaporation channel 121 and is connected with the evaporation portion 12. The partition portion 16 extends in the direction from the inlet of the evaporation channel 121 to the outlet of the evaporation channel 121 (i.e., the flow direction of the gaseous heat exchange medium in the evaporation channel 121), and divides the evaporation channel 121 into a plurality of sub-flow channels 1211. Each sub-flow channel 1211 is internally provided with at least one heat-conducting portion 15. It can be understood that the evaporation channel 121 can be divided into a plurality of sub-flow channels 1211 by the partition portion 16, so that the gaseous heat exchange medium can flow through the plurality of sub-flow channels 1211, thereby reducing the disturbance of the airflow and ensuring that the gaseous heat exchange medium can smoothly and quickly flow through each sub-flow channel 1211. Meanwhile, each sub-flow channel 1211 is internally provided with at least one heat-conducting portion 15, and the heat-conducting portion 15 can further make the gaseous heat exchange medium flow in an orderly manner and ensure the stability of the flow.

[0059] Referring to Figure 2 and Figure 3In some embodiments, the cooling member 10 comprises a heat dissipation part 17. The heat dissipation part 17 is located on the side of the condensing part 13 away from the evaporating part 12 and is connected to the condensing part 13 for dissipating heat from the condensing part 13. It can be understood that the heat dissipation part 17 can be arranged on the side of the condensing part 13 to dissipate heat from the condensing part 13, so that the temperature in the condensing channel 131 is reduced. When the gaseous heat exchange medium flows in the condensing channel 131, it can be quickly condensed into liquid state, improving the condensing efficiency of the gaseous heat exchange medium in the condensing channel 131, and facilitating more liquid heat exchange medium to be supplemented into the containing cavity 113 in a short time, to a certain extent, improving the circulation efficiency of the heat exchange medium, and improving the cooling efficiency of the cooling member 10.

[0060] Please refer to Figure 2 and Figure 3 Please refer to Figure 2 and Figure 3 In some embodiments, the heat dissipation part 17 comprises a base plate 171, a plurality of fins 172 and a fan 173.

[0061] The base plate 171 is located on the side of the condensing part 13 away from the evaporating part 12 and is connected to the condensing part 13. The plurality of fins 172 are located on the side of the base plate 171 away from the condensing part 13 and are connected to the base plate 171, and the plurality of fins 172 are arranged at intervals. The fan 173 is located on the side of the base plate 171 away from the condensing part 13 and is connected to the plurality of fins 172. It can be understood that the plurality of fins 172 dissipate heat from the condensing part 13, and the heat on the condensing part 13 can be transferred to the plurality of fins 172, which have a large heat dissipation area and can quickly dissipate heat, thereby reducing the temperature on the condensing part 13, i.e. cooling the gaseous heat exchange medium in the condensing channel 131. The plurality of fins 172 and the condensing part 13 are connected by the base plate 171, which can be made of a material with good thermal conductivity, which can reduce the contact thermal resistance between the plurality of fins 172 and the condensing part 13 and improve the efficiency of heat transfer. At the same time, the fan 173 is arranged to blow air on the plurality of fins 172, and under the action of forced convection of the fan 173, the heat on the plurality of fins 172 is quickly dissipated, further improving the efficiency of heat dissipation of the fins 172 and the condensing part 13.

[0062] In the above embodiments, the description of each embodiment focuses on different aspects, and the parts not described in detail in a certain embodiment can be referred to the relevant description of other embodiments.

[0063] The heat dissipation device provided by the embodiments of the present application is described in detail above, and the principles and implementation manners of the present application are described by using specific examples. The above embodiment descriptions are only used to help understand the technical solutions of the present application and the core ideas thereof. It should be understood by those skilled in the art that the technical solutions recorded in the foregoing embodiments can still be modified, or some technical features thereof can be replaced equivalently; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A heat dissipating device, characterized by, The heat dissipation device comprises: a cooling member (10) comprising a heat exchange portion (11) having a mounting groove (111) and a placing groove (112); a thermoelectric refrigeration member (20) located in the mounting groove (111), the thermoelectric refrigeration member (20) comprising a heat generating portion (21) and a refrigeration portion (22) connected to each other, the heat generating portion (21) being connected to the heat exchange portion (11), and the refrigeration portion (22) being connected to a component.

2. The heat dissipating device according to claim 1, wherein The heat dissipation device comprises: a sensing member (30) located in the placing groove (112) and connected to the heat exchange portion (11) for sensing the temperature of the heat exchange portion (11); a control member (40) electrically connected to the thermoelectric refrigeration member (20) and the sensing member (30) respectively for adjusting the temperature of the heat generating portion (21).

3. The heat dissipating device of claim 1, wherein The heat dissipation device comprises: a heat transfer member (50) connected to the heat exchange portion (11) and covering the mounting groove (111).

4. The heat dissipating device of claim 1, wherein The heat exchange portion (11) has a containing cavity (113) and a converging cavity (114) connected to each other, and a heat exchange medium is arranged in the containing cavity (113); the cooling member (10) comprises: an evaporation portion (12) located on a side of the heat exchange portion (11) away from the thermoelectric refrigeration member (20) and connected to the heat exchange portion (11), the evaporation portion (12) having an evaporation passage (121), an inlet of the evaporation passage (121) being connected to the containing cavity (113); a condensation portion (13) located on a side of the heat exchange portion (11) away from the thermoelectric refrigeration member (20) and connected to the heat exchange portion (11) and the evaporation portion (12) respectively, the condensation portion (13) having a condensation passage (131), an inlet of the condensation passage (131) being connected to an outlet of the evaporation passage (121), and an outlet of the condensation passage (131) being connected to the converging cavity (114).

5. The heat dissipating device of claim 4, wherein The heat exchange portion (11) has a plurality of the converging cavities (114), each of which is connected to the containing cavity (113); The cooling member (10) comprises a plurality of the condensation portions (13), and the outlet of the condensation passage (131) of each of the condensation portions (13) is connected to one of the converging cavities (114) respectively.

6. The heat dissipating device of claim 4, wherein The maximum dimension of the containing cavity (113) in the thickness direction (X) of the heat exchange portion (11) is H, and the maximum dimension of the converging cavity (114) in the thickness direction (X) is h, and H>h is satisfied.

7. The heat dissipating device of claim 4, wherein The cooling member (10) comprises: a connecting portion (14) located on a side of the evaporation portion (12) away from the heat exchange portion (11) and connected to the evaporation portion (12) and the condensation portion (13) respectively, the connecting portion (14) having a connecting groove (141), and the outlet of the evaporation passage (121) being connected to the inlet of the condensation passage (131) through the connecting groove (141).

8. The heat dissipating device of claim 4, wherein, The cooling member (10) comprises: At least one heat-conducting part (15) is located in the evaporation channel (121) and connected with the evaporation part (12), and extends from the inlet of the evaporation channel (121) to the outlet of the evaporation channel (121).

9. The heat dissipating device of claim 8, wherein, The cooling member (10) comprises: A partition part (16) is located in the evaporation channel (121) and connected with the evaporation part (12), and extends from the inlet of the evaporation channel (121) to the outlet of the evaporation channel (121), and divides the evaporation channel (121) into multiple sub-flow channels (1211), and each sub-flow channel (1211) is internally provided with at least one heat-conducting part (15).

10. The heat dissipating device of claim 4, wherein, The cooling member (10) comprises: A heat-dissipating part (17) is located on the side of the condensation part (13) away from the evaporation part (12) and connected with the condensation part (13) for dissipating heat of the condensation part (13).

11. The heat dissipating device of claim 10, wherein, The heat-dissipating part (17) comprises: A base plate (171) is located on the side of the condensation part (13) away from the evaporation part (12) and connected with the condensation part (13); Multiple fins (172) are located on the side of the base plate (171) away from the condensation part (13) and connected with the base plate (171), and multiple fins (172) are arranged at intervals; A fan (173) is located on the side of the base plate (171) away from the condensation part (13) and connected with multiple fins (172).

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