Atomizing core and atomizing device

Abstract

The utility model relates to an atomizing core and an atomizing device.The atomizing core comprises a base body and a heating part, and the base body is used for storing an aerosol generating substrate; the heating piece and the base body are arranged in the first direction, the heating piece is provided with a bottom face facing the base body in the first direction and a side face connected with the bottom face in a bent mode, a gap is formed between the bottom face and the base body, and the side face is connected with the base body in a heat conduction mode. The gap is formed between the bottom face of the heating piece and the base body, the side face of the heating piece is in heat conduction connection with the base body, direct conduction of heat from the bottom face to the shielding area of the atomization face is reduced, and the heat is concentrated to the non-shielding area of the atomization face through the side face. In this way, energy dissipation is reduced, and more heat is concentrated to the non-shielding area of the atomization face. Therefore, more heat can effectively act on the atomization surface, so that the heating efficiency is improved, and the atomization effect is improved.

Description

Technical Field

[0001] This application relates to the field of aerosol generation technology, and in particular to an atomizing core and atomizing device. Background Technology

[0002] Atomizing devices are instruments that convert aerosol-generating matrix into aerosols for users to inhale or consume. The atomizing coil, a key component of the device, typically stores a certain amount of aerosol-generating matrix within its substrate, while the heating element provides the necessary heat. When the heating element operates, the heat it generates is transferred to the aerosol-generating matrix within the substrate, causing it to heat up and form an aerosol on the substrate surface. The substrate has a specially designed surface that contacts the heating element; its purpose is to heat the aerosol-generating matrix stored within the substrate to a suitable temperature to generate an aerosol. This surface is called the atomizing surface.

[0003] However, in related technologies, the heating element is usually directly attached to the atomizing surface of the substrate. While this method can achieve basic heat transfer, it causes a large amount of heat to diffuse into the interior of the substrate rather than effectively act on the atomizing surface. This not only wastes thermal energy but also results in less effective heat reaching the atomizing surface, affecting the overall heating efficiency and leading to poor atomization. Utility Model Content

[0004] This application provides an atomizing core that improves heating efficiency and enhances atomization effect, thereby at least partially solving the above-mentioned technical problems.

[0005] To achieve the above objectives, according to a first aspect of this application, an atomizing core is provided, comprising:

[0006] The matrix, used to store the aerosol generation matrix; and,

[0007] A heating element is arranged along a first direction with the substrate. The heating element has a bottom surface facing the substrate along the first direction and a side surface that is bent and connected to the bottom surface. There is a gap between the bottom surface and the substrate, and the side surface is thermally connected to the substrate.

[0008] Optionally, the substrate has a groove on one side facing the bottom surface, the bottom surface and the bottom wall of the groove are spaced apart to form the gap, and the side wall of the groove is thermally connected to the side surface.

[0009] Optionally, along the first direction, the orthographic projection of the heating element on the substrate overlaps with the bottom wall of the groove.

[0010] Optionally, the heating element is at least partially disposed within the groove, and the side surface abuts against the side wall of the groove.

[0011] Optionally, the side surface is fully fitted to the sidewall of the groove so that the heating element is snapped onto the sidewall.

[0012] Optionally, along the first direction, the side surface of the heating element facing away from the substrate along the first direction is closer to the bottom wall of the groove than the groove opening end face.

[0013] Optionally, along the first direction, the side surface of the heating element facing away from the substrate is flush with the end face of the groove opening.

[0014] Optionally, along the first direction, the bottom surface is flush with the end face of the groove opening.

[0015] Optionally, the matrix comprises a porous body, wherein the dimension of the gap in the first direction is 3 to 15 times the pore diameter of the porous body.

[0016] According to a second aspect of this application, an atomizing device is provided, comprising an atomizing core as described in any of the above claims.

[0017] In the atomizing core of this application embodiment, by setting a gap between the bottom surface of the heating element and the substrate, and making the side surface of the heating element thermally connected to the substrate, the direct conduction of heat through the bottom surface to the shielded area of ​​the atomizing surface is reduced, allowing heat to be concentrated through the side surface to the unshielded area of ​​the atomizing surface. This method reduces energy dissipation and concentrates more heat in the unshielded area of ​​the atomizing surface. Thus, more heat can effectively act on the atomizing surface, thereby improving heating efficiency and enhancing the atomization effect.

[0018] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0021] Figure 1 This is a schematic diagram of the first connection method between the atomizer core and the heating element disclosed herein;

[0022] Figure 2 This is a schematic diagram of a second connection method between the atomizer core substrate and the heating element disclosed herein;

[0023] Figure 3 This is a perspective schematic diagram of the first structure of the atomizing core disclosed herein;

[0024] Figure 4 This is a three-dimensional schematic diagram of the second structure of the atomizing core disclosed herein;

[0025] Figure 5 yes Figure 4 A schematic diagram of the cross-section of the atomizing core;

[0026] Figure 6 This is a three-dimensional schematic diagram of the third structure of the atomizing core disclosed herein;

[0027] Figure 7 yes Figure 6 A schematic diagram of the cross-section of the atomizing core.

[0028] Explanation of reference numerals in the attached figures:

[0029] 100. Atomizing core; 1. Substrate; 11. Groove; 111. Bottom wall; 112. Side wall; 2. Heating element; 21. Bottom surface; 22. Side surface; 3. Gap. Detailed Implementation

[0030] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0031] This application provides an atomizing core; please refer to [link / reference]. Figure 1 and Figure 2 , Figures 1 to 7 This is a schematic diagram of the structure of the atomizing core provided in an embodiment of this application. The atomizing core 100 includes a substrate 1 and a heating element 2.

[0032] The substrate 1 is used to store the aerosol generation matrix, which can be a liquid matrix, a paste matrix, or a solid matrix. The substrate 1 is mainly used to house the heating element 2 and directly provide the aerosol generation matrix to the heating element 2. Specifically, the substrate 1 has an absorption surface and an atomizing surface. The absorption surface is used to accommodate the storage cavity of the atomizing device. The aerosol generation matrix in the storage cavity can be transferred to the absorption surface. The absorption surface absorbs the aerosol generation matrix and stores it within the substrate 1, allowing the heating element 2, which is thermally connected to the substrate 1, to heat it, thereby achieving atomization of the aerosol generation matrix at the atomizing surface.

[0033] The heating element 2 and the substrate 1 are arranged along a first direction. The heating element 2 has a bottom surface 21 facing the substrate 1 along the first direction and a side surface 22 bent and connected to the bottom surface 21. There is a gap 3 between the bottom surface 21 and the substrate 1. The side surface 22 is thermally connected to the substrate 1. It can be understood that the substrate 1 forms an atomizing surface on the side facing the heating element 2 along the first direction. Figure 1 and Figure 2 (The upper surface of the substrate 1) It can also be understood that the heating element 2 is set on the atomizing surface of the substrate 1. The atomizing surface of the substrate 1 has a shielding area corresponding to the heating element 2 and a non-shielding area that does not correspond to the heating element 2. If the heating element 2 is directly attached to the atomizing surface of the substrate 1, the shielding area of ​​the atomizing surface cannot release aerosol, while the non-shielding area of ​​the atomizing surface can release aerosol. The heat provided by the heating element 2 is conducted through the bottom surface 21 and thus concentrated in the shielding area of ​​the atomizing surface. Since the heat is concentrated in the shielding area, a large amount of heat is dissipated into the interior of the substrate 1 without being fully applied to the non-shielding area of ​​the atomizing surface, resulting in a reduction in the effective heat available in the non-shielding area of ​​the atomizing surface. In this embodiment, the heating element 2 and the substrate 1 are arranged in the first direction and there is a gap 3 between the bottom surface 21 and the substrate 1, which reduces the direct conduction of heat to the shielded area of ​​the atomizing surface and reduces the ineffective dissipation of heat. The side surface 22 is thermally connected to the substrate 1, so that the heat is concentrated in the unshielded area of ​​the atomizing surface, and the heat generated by the heating element 2 can be utilized more effectively, thereby improving the heating efficiency and enhancing the atomization effect.

[0034] That is, in the technical solution of this application, by setting a gap 3 between the bottom surface 21 of the heating element 2 and the substrate 1, and by making the side surface 22 of the heating element 2 thermally connected to the substrate 1, the direct conduction of heat through the bottom surface 21 to the shielded area of ​​the atomizing surface is reduced, so that the heat is concentrated in the unshielded area of ​​the atomizing surface through the side surface 22. This method reduces energy dissipation and concentrates more heat in the unshielded area of ​​the atomizing surface. In this way, more heat can be effectively applied to the atomizing surface, thereby improving the heating efficiency and enhancing the atomization effect.

[0035] Understandably, there are several ways to create a gap 3 between the bottom surface 21 and the substrate 1. For example, a thin layer of heat-insulating material can be placed between the bottom surface 21 of the heating element 2 and the substrate 1 to create a gap 3, reducing heat transfer. The heat-insulating material can effectively reduce the transfer of heat into the substrate 1, allowing more heat to concentrate on the side surface 22 of the heating element 2, thus improving thermal efficiency. Alternatively, a vacuum layer or air layer can be provided between the bottom surface 21 of the heating element 2 and the substrate 1 to create a gap 3.

[0036] In some embodiments, see Figure 1 and Figure 2A groove 11 is provided on the side of the substrate 1 facing the bottom surface 21. The bottom surface 21 and the bottom wall 111 of the groove 11 are spaced apart to form a gap 3. The side wall 112 of the groove 11 is thermally connected to the side surface 22. In these embodiments, by providing a groove 11 on the substrate 1 and utilizing the gap 3 formed by the interval between the bottom wall 111 of the groove 11 and the bottom surface 21 of the heating element 2, it is not necessary to add additional components such as gaskets or support structures to create the gap 3. This design feature simplifies the component management and assembly process in the manufacturing process, and reduces the complexity and cost of the manufacturing process. In terms of heat conduction, since there is a gap 3 between the bottom surface 21 of the heating element 2 and the bottom wall 111 of the groove 11, heat is mainly conducted through the side surface 22 to the side wall 112 of the groove 11 and then to the atomizing surface. This conduction path avoids heat diffusion directly into the interior of the substrate 1, reduces dissipation to the non-atomizing area, and allows more heat to act on the atomizing surface. This improves the heat utilization efficiency and helps to improve the atomization effect. The groove 11 forms a relatively closed structure in which heat accumulates and is conducted. This heat concentration effect can further reduce heat loss and increase heat concentration, thereby further improving heat utilization and atomization effect.

[0037] It is understandable that the sidewall 112 of the groove 11 and the side surface 22 are thermally connected. This can be either direct contact between the sidewall 112 of the groove 11 and the side surface 22, or indirect contact between the sidewall 112 of the groove 11 and the side surface 22. For example, a heat-conducting plate is provided between the sidewall 112 of the groove 11 and the side surface 22. The heat-conducting plate acts as a bridge to achieve the thermal connection between the sidewall 112 of the groove 11 and the side surface 22.

[0038] In some embodiments, see Figure 1 and Figure 2 Along the first direction, the orthographic projection of the heating element 2 on the substrate 1 overlaps with the bottom wall 111 of the groove 11. In these embodiments, the orthographic projection of the heating element 2 on the substrate 1 overlaps with the bottom wall 111 of the groove 11. This arrangement allows the side surface 22 of the heating element 2 to correspond to the side wall 112 of the groove 11 (i.e., the orthographic projection of the side surface 22 on the substrate 1 overlaps with the side wall 112, including the case where the side surface 22 and the side wall 112 abut against each other, and also the case where the side surface 22 and the side wall 112 are spaced apart in the first direction). This facilitates the thermally conductive connection between the side surface 22 and the side wall 112. Since the side surface 22 and the side wall 112 correspond, the thermally conductive distance between the side surface 22 and the side wall 112 is shortened (for example, when the side surface 22 and the side wall 112 are spaced apart in the first direction, and the two are connected by a thermally conductive element, the thermally conductive path is a straight line along the first direction, and the thermally conductive distance is shorter), reducing heat loss during the transfer process, thereby improving the heat conduction efficiency.

[0039] In some embodiments, see Figure 1The heating element 2 is at least partially disposed within the groove 11, with its side surface 22 abutting against the side wall 112 of the groove 11. In these embodiments, the side surface 22 abutting against the side wall 112 of the groove 11 allows heat energy to be directly transferred from the side surface 22 of the heating element 2 to the side wall 112 of the groove 11, reducing heat loss during the transfer process and thus improving heat conduction efficiency. The fact that the heating element 2 is at least partially disposed within the groove 11 also facilitates its installation and fixation.

[0040] In some embodiments, the side surface 22 is fully fitted to the side wall 112 of the groove 11, so that the heating element 2 is snapped into the side wall 112. In these embodiments, the full circumference fit between the side surface 22 and the side wall 112 of the groove 11 can further ensure the high efficiency of heat transfer. Compared with partial contact, the full circumference fit maximizes the contact area between the heating element 2 and the side wall 112 of the groove 11. In this way, the side wall 112 can be used more fully as a conduction path during heat conduction, reducing heat loss during conduction and improving heat conduction efficiency more effectively than partial contact. The snapping of the heating element 2 into the side wall 112 enhances the installation stability of the heating element 2. The snapping method achieved by the full circumference fit can more firmly fix the heating element 2 in the groove 11, which helps to prevent displacement of the heating element 2 during use and improves reliability.

[0041] It is understandable that the heating element 2 is at least partially disposed within the groove 11, including a portion of the heating element 2 being housed within the groove 11 and another portion of the heating element 2 being exposed outside the groove 11 (i.e., a slotted opening protruding from the groove 11), and also including the entire heating element 2 being housed within the groove 11 (i.e., a slotted opening not protruding from the groove 11).

[0042] In some embodiments, along the first direction, the surface of the heating element 2 facing away from the substrate 1 is closer to the bottom wall 111 of the groove 11 than the groove opening end face. In these embodiments, the surface of the heating element 2 facing away from the substrate 1 along the first direction is closer to the bottom wall 111 of the groove 11 than the groove opening end face, that is, the heating element 2 is recessed and lower than the groove opening end face, the heating element 2 is deeper into the groove 11, it is more surrounded by the side wall 112 of the groove 11, and is better protected. Since the side 22 of the heating element 2 is fully and stably supported by the side wall 112 of the groove 11, the heating element 2 can be more accurately positioned in the groove 11 during assembly. This avoids the problem of loose assembly due to the positional deviation of the heating element 2. From the perspective of heat conduction, the fully stable support ensures that the contact area between the heating element 2 and the side wall 112 of the groove 11 remains stable. In the process of heat being conducted from the side 22 of the heating element 2 to the side wall 112 of the groove 11, the stable contact area means a stable heat conduction path. There will be no fluctuation in heat conduction efficiency due to shaking or poor contact of the heating element 2, thus ensuring a stable heating effect.

[0043] In some embodiments, see Figure 1 Along the first direction, the side surface of the heating element 2 facing away from the substrate 1 is flush with the end face of the groove 11. In these embodiments, the surface of the heating element 2 facing away from the substrate 1 along the first direction is flush with the end face of the groove 11. That is, the heating element 2 is just accommodated in the groove 11. The heating element 2 does not protrude or retract, and the layout is very compact and the structure is very regular. Since the heating element 2 is flush with the end face of the groove 11, the heat distribution when it is conducted from the heating element 2 to the side wall 112 of the groove 11 and the substrate 1 is relatively more uniform. There will be no situation where the heat is too concentrated around the protruding part of the heating element 2 due to its protrusion, nor will the heat distribution near the end face of the groove be uneven due to its retraction. This helps to achieve a more uniform heating effect on the substrate 1. This setting ensures that the heat conduction path between the heating element 2 and the side wall 112 of the groove 11 is relatively stable. The relative position of the heating element 2 and the groove 11 is fixed, and its contact area with the side wall 112 of the groove 11 is also relatively stable. This ensures that the heat can be continuously and stably conducted from the heating element 2 to the side wall 112 of the groove 11 and then to the substrate 1, which is beneficial to improving the heat conduction efficiency. The heating element 2 is flush with the groove 11, which also makes it easy to install and disassemble, improving the convenience of assembly and maintenance.

[0044] In some embodiments, see Figure 2 Along the first direction, the bottom surface 21 is flush with the end face of the groove 11. In these embodiments, the bottom surface 21 is flush with the end face of the groove 11 along the first direction, that is, the bottom surface 21 and the side wall 112 of the groove 11 are connected by a line at the end face of the groove for heat conduction. This allows the heat from the heating element 2 to be directly transferred to the atomization surface of the substrate 1 via the shortest path. Compared with other structures that may have more conduction layers or distances, this reduces heat loss during the transfer process, thereby improving heat transfer efficiency. Specifically, the bottom surface 21 of the heating element 2 and the side wall 112 of the groove 11 can be connected at the end face of the groove using thermally conductive structural adhesive to achieve fixation and heat conduction between the heating element 2 and the substrate 1. The heating element 2 being exposed outside the groove 11 also facilitates the installation and removal of the heating element 2.

[0045] This application does not limit the specific structure of the matrix 1. The matrix 1 can be a fibrous material, such as cotton fiber, glass fiber, ceramic fiber, etc., to have good liquid absorption properties and effectively store and transport the aerosol generation matrix. The matrix 1 can also be a porous body, which refers to a material with a large number of micropores, which can be interconnected or non-interconnected. The main characteristics of porous bodies are high porosity and large specific surface area, giving them unique advantages in storing and transporting liquids and gases.

[0046] Understandably, the substrate 1 will form a certain amount of aerosol in the groove 11. The larger gap 3 allows the aerosol to be discharged smoothly, improving the atomization performance. The appropriate gap 3 size can enhance the capillary effect, increase the aerosol flow rate, and enable a stable supply of aerosol, improving the consistency of multiple inhalations, thereby improving the product user experience.

[0047] In some embodiments, the substrate 1 includes a porous body, and the ratio of the size of the gap 3 in the first direction to the pore diameter of the porous body is between 3 and 15 times. In these embodiments, controlling the ratio of the size of the gap 3 in the first direction to the pore diameter of the porous body within this range ensures that the gap 3 is large enough to allow aerosols to flow smoothly within it, preventing aerosol blockage or slow flow due to an excessively small gap 3. This 3 to 15-fold ratio range limits the upper limit of the gap 3 size, avoiding the impact of an excessively large gap 3 on capillary effect formation. The 3 to 15-fold ratio range is a comprehensive balance, considering both the requirement for smooth aerosol flow in terms of gap 3 size and the limitation of maintaining a capillary effect without making the gap 3 too large. This range ensures aerosol flow within the gap 3 while guaranteeing a stable aerosol output from the substrate 1 through capillary action, thereby improving atomization performance, ensuring a stable aerosol supply, and enhancing the consistency of multiple inhalations.

[0048] In some embodiments, the size of the gap 3 in the first direction is positively correlated with the pore size of the porous body. In these embodiments, as the pore size of the porous body increases, the size of the gap 3 in the first direction also increases. This positive correlation ensures that the external gap 3 adjusts accordingly as the internal structure of the porous body changes. A larger pore size means that more aerosol may need to be transported; in this case, the increased gap 3 provides a wider channel for the aerosol, ensuring smooth flow of the aerosol within the gap 3 and avoiding blockage or slow flow caused by a gap that is too small. This positive correlation plays an important role in maintaining the capillary effect. The capillary effect depends on the proportional relationship between the gap 3 and the pore size of the porous body. As the pore size increases, the gap 3 increases proportionally, keeping this ratio within a reasonable range. If it were not positively correlated, the gap 3 might be too large or too small, affecting the capillary effect. For example, if gap 3 does not increase appropriately with the increase in orifice diameter, it may result in gap 3 being relatively too small, leading to excessive capillary action and over-absorption of aerosols, affecting the stability of atomization; or gap 3 being relatively too large, resulting in insufficient capillary action and ineffective aerosol absorption and transport. This positive correlation ensures smooth aerosol flow and improves atomization efficiency on the one hand, and maintains stable capillary action on the other, ensuring a stable supply of aerosols on the other. The combination of these two factors allows aerosols to pass through gap 3 efficiently and be output stably, thereby improving the consistency of multiple inhalations, ultimately enhancing atomization performance and providing users with a better product experience.

[0049] This application does not limit the specific shape of the heating element 2. Specifically, the heating element 2 can be roughly "e" shaped (see...). Figure 3 Heating element 2 is disposed in groove 11), double helix shape (see Figure 4 and Figure 5 Heating element 2 is outside the groove 11), and ring (see Figure 6 and Figure 7 The heating element 2 (outside the groove 11) has an irregular shape, and correspondingly, the groove 11 also has an irregular shape. The three structures—"e" shape, double helix shape, and ring shape—represent the centrally symmetrical heating element 2, the circular or elliptical heating element 2, and the axisymmetric heating element 2, respectively. The thermal simulation results are as follows: Before the improvement, the atomizing core 100 (with the heating element 2 directly attached to the atomizing surface of the substrate 1) had an average heating area of ​​2.20 mm². 2 The average heating volume is 0.81 mm. 3 The improved atomizing core 100 (i.e., the connection method between the substrate 1 and the heating element 2 provided in this application) has an average heating area of ​​2.81 mm². 2 Average volume 0.88mm 3Thermal simulation results show that after the improvement, the heating volume is increased, and the heating area is increased by 27%, resulting in a larger heating area and improved heating efficiency. The heating area refers to the area of ​​the atomizing surface that reaches the effective atomization temperature of the aerosol generation matrix, while the heating volume refers to the volume of the substrate 1 that reaches the effective atomization temperature of the aerosol generation matrix, including not only the atomizing surface of the substrate 1 but also the internal heating volume of the porous body. Furthermore, the TPM aerosol test results of the improved atomizing core 100 also show significant improvement.

[0050] According to a second aspect of this disclosure, an atomizing device is provided, which includes a heating element 2. The structure of the heating element 2 is as described above. Since the atomizing device adopts all the technical solutions of all the above embodiments, it at least has the beneficial effects brought about by the technical solutions of the above embodiments, and will not be described in detail here. Specifically, the atomizing device includes a housing, an atomizing core 100 disposed in the housing, an atomizing cavity defined between the base 1 and the shell wall of the housing, and the heating element 2 disposed on the side of the base 1 facing the atomizing cavity. The aerosol formed by heating and atomizing is released into the atomizing cavity and finally discharged, so as to be inhaled or used.

[0051] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0052] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0053] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0054] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. An atomizing core, characterized in that, include: The matrix is ​​used to store the aerosol generation matrix; as well as, A heating element is arranged along a first direction with the substrate, the heating element having a bottom surface facing the substrate along the first direction and a side surface bent and connected to the bottom surface. There is a gap between the bottom surface and the substrate, and the side surface is thermally connected to the substrate.

2. The atomizing core according to claim 1, characterized in that, The substrate has a groove on one side facing the bottom surface, and the bottom surface and the bottom wall of the groove are spaced apart to form the gap. The side wall of the groove is thermally connected to the side surface.

3. The atomizing core according to claim 2, characterized in that, Along the first direction, the orthographic projection of the heating element on the substrate overlaps with the bottom wall of the groove.

4. The atomizing core according to claim 2, characterized in that, The heating element is at least partially disposed within the groove, and its side surface abuts against the side wall of the groove.

5. The atomizing core according to claim 4, characterized in that, The side surface fits in full circumference with the side wall of the groove so that the heating element is snapped into the side wall.

6. The atomizing core according to claim 4, characterized in that, Along the first direction, the side surface of the heating element facing away from the substrate is closer to the bottom wall of the groove than the groove opening end face.

7. The atomizing core according to claim 4, characterized in that, Along the first direction, the side surface of the heating element facing away from the substrate is flush with the end face of the groove opening.

8. The atomizing core according to claim 2, characterized in that, Along the first direction, the bottom surface is flush with the end face of the groove opening.

9. The atomizing core according to any one of claims 1 to 8, characterized in that, The matrix comprises a porous body, and the size of the gap in a first direction is 3 to 15 times the pore diameter of the porous body.

10. An atomizing device, characterized in that, Includes the atomizing core as described in any one of claims 1 to 9.

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