Forming die of light-emitting module

Abstract

The utility model discloses a forming die of a light-emitting module. The forming die of the light-emitting module comprises a die body, a forming cavity formed in the die body, a forming column inserted into the forming cavity and at least one sealing ring connected to the forming column in a sleeved mode. At least one groove is formed in the forming column, the sealing ring is correspondingly embedded in the groove, the sealing ring partially extends out of the groove, and the gap between the forming column and the forming cavity is filled with the sealing ring extending out of the groove. The sealing ring is arranged on the forming column to prevent volatile substances of the plastic packaging adhesive from climbing, so that the accuracy of the plastic packaging operation position of the forming column is improved, and the plastic packaging reliability and repeatability of the LED device are improved.

Description

Technical Field

[0001] This utility model relates to the field of mold technology, specifically to a molding mold for a light-emitting module. Background Technology

[0002] In the current LED device molding process, a light-emitting cavity needs to be formed in the molding layer above the light-emitting area of ​​the LED device. The existing operation process generally involves setting a molding cavity and molding pillars in the LED device molding mold. The molding pillars abut against the LED device, so that the molded body of the LED device can form a light-emitting area above the LED chip.

[0003] During the encapsulation process of LED devices, volatile substances from the encapsulating adhesive can climb along the gap between the molding pillars and the molding cavity, eventually adhering to the molding pillars. This increases friction between the molding pillars and the molding cavity. During molding and closing, the relative position of the molding pillars within the molding cavity can easily deviate, resulting in insufficient contact between the molding pillars and the LED device's support structure. This can lead to adhesive overflow in the light-emitting area of ​​the LED device. Alternatively, the molding pillars may exert excessive pressure on the LED device, potentially causing damage to the LED device's support structure and affecting the reliability of the encapsulation process. Utility Model Content

[0004] The purpose of this utility model is to overcome the shortcomings of the prior art. This utility model provides a molding die for a light-emitting module. By setting a sealing ring on the molding column to block the climbing of volatile substances in the molding adhesive, the accuracy of the molding column molding operation position is improved, thereby improving the molding reliability and repeatability of LED devices.

[0005] This utility model provides a molding die for a light-emitting module. The molding die for the light-emitting module includes: a mold body, a molding cavity disposed in the mold body, a molding post inserted into the molding cavity, and at least one sealing ring sleeved on the molding post.

[0006] The molding column is provided with at least one groove, the sealing ring is correspondingly fitted into the groove, and the sealing ring extends out of the groove, such that the sealing ring extending out of the groove fills the gap between the molding column and the molding cavity.

[0007] Furthermore, the inner diameter of the sealing ring is d1, the outer diameter of the groove position of the forming column is d2, and the constraint relationship between d1 and d2 is: d1 < d2.

[0008] Furthermore, when the forming column is provided with multiple grooves, the multiple grooves are arranged in parallel to each other, or the multiple grooves form a spiral groove structure.

[0009] Furthermore, the distance between any two adjacent grooves is greater than the width of any of the grooves.

[0010] Furthermore, the cross-sectional shape of the groove is V-shaped, or the cross-sectional shape of the groove is arc-shaped.

[0011] Furthermore, the groove width is 200mm to 350mm.

[0012] Furthermore, the sealing ring is made of graphite, fluororubber, butyl rubber, or polyvinyl fluoride.

[0013] Furthermore, the sealing ring has a high temperature resistance of ≥200℃.

[0014] Furthermore, the surface of the sealing ring is coated with a coating.

[0015] Furthermore, the bottom of the forming column is provided with a clearance groove, and when the forming column abuts against the bracket of the LED device, the LED chip of the light-emitting module is located in the clearance groove.

[0016] Furthermore, the clearance groove is configured as a square groove, or the clearance groove is configured as a hemispherical groove.

[0017] Furthermore, a baffle and a spring are provided at the top of the forming column, and the spring is sleeved at the top position of the forming column;

[0018] One end of the spring is connected to the baffle, and the other end of the spring is connected to the mold body.

[0019] Furthermore, the spring is a helical spring or a disc spring.

[0020] This invention provides a molding die for a light-emitting module. By fitting a sealing ring onto the molding post and filling the gap between the molding post and the molding cavity, the volatile substances in the encapsulant are blocked from climbing, preventing the encapsulant from adhering to the molding post. This ensures that the molding post maintains the accurate working position during the encapsulation process of the light-emitting module, avoids excess adhesive in the light-emitting area of ​​the light-emitting module, and prevents the molding post from squeezing and damaging the LED device's support. This improves the reliability and repeatability of the encapsulation of the light-emitting module. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the molding die for the light-emitting module in an embodiment of this utility model;

[0023] Figure 2 This is a schematic diagram of the molding column structure of the molding die for the light-emitting module in this embodiment of the present invention;

[0024] Figure 3 This is a schematic diagram of the sealing ring structure of the molding die for the light-emitting module in this embodiment of the present invention;

[0025] Figure 4 This is a schematic diagram of the upper mold body structure of the molding die in an embodiment of this utility model;

[0026] Figure 5 This is a schematic diagram of the structure of a molded column with multiple grooves in an embodiment of this utility model;

[0027] Figure 6 This is another structural schematic diagram of a molded column with multiple grooves in an embodiment of this utility model. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0029] Figure 1 The diagram shows a schematic of the molding die for the light-emitting module in an embodiment of the present invention. The molding die for the light-emitting module includes: a mold body 1, a molding cavity 111 disposed in the mold body 1, a molding post 2 inserted into the molding cavity 111, and at least one sealing ring 3 sleeved on the molding post 2. By the cooperation of the molding cavity 111 and the molding post 2 disposed inside the mold body 1, a light-emitting channel can be formed above the LED chip when the light-emitting module is encapsulated, and the light-emitting direction of the LED chip is defined based on the light-emitting channel.

[0030] Furthermore, the molding cavity 111 is disposed on the upper mold body 11 of the mold body 1, and the lower mold body 12 of the mold body 1 is used to place the bracket of the LED device. The upper mold body 11 and the lower mold body 12 are closed to form an injection space, and the bracket of the LED device is encapsulated by injection molding.

[0031] Specifically, Figure 2 This diagram shows a schematic of the molding column structure of the molding die for the light-emitting module in an embodiment of the present invention. Figure 3 A schematic diagram of the sealing ring structure of the molding die for the light-emitting module in an embodiment of this utility model is shown; Figure 4 The diagram shows the upper mold body structure of the molding die in this embodiment of the present invention. At least one groove 23 is provided on the molding column 2. The sealing ring 3 is correspondingly fitted into the groove 23, and a portion of the sealing ring 3 extends outside the groove 23, filling the gap between the molding column 2 and the molding cavity 111. Based on the sealing ring 3 filling the gap between the molding column 2 and the molding cavity 111, the volatiles of the encapsulant are prevented from creeping into the gap between the molding column 2 and the molding cavity 111, thereby ensuring the reliability of the assembly fit between the molding column 2 and the molding cavity 111. This allows the molding column 2 to move to the accurate processing position during mold closing. The molding column 2 can abut against the support of the LED device, thereby preventing glue overflow in the light-emitting area of ​​the light-emitting module and ensuring good light emission performance of the light-emitting module.

[0032] Furthermore, the sealing ring 3 is limited by the groove 23, so that the sealing ring 3 can be located in the accurate position of the forming column 2, and the sealing ring 3 is not offset or misaligned on the forming column 2 when the forming column 2 moves up and down inside the forming cavity 111, so that the sealing ring 3 can meet the movement and adjustment of the forming column 2 during use.

[0033] Furthermore, the groove 23 of the molding column 2 is located at the wedge-shaped position at the lower end of the molding column 2. That is, when the molding column 2 abuts against the bracket of the LED device, the groove 23 is located near the bottom port of the molding cavity 111, so that the sealing ring 3 can block the volatile substances of the encapsulating colloid entering the molding cavity 111 in a timely manner, and prevent the volatile substances of the encapsulating colloid from adhering to the molding column 2.

[0034] Specifically, the inner diameter of the sealing ring 3 is d1, and the outer diameter of the groove 23 of the molding post 2 is d2. The constraint relationship between d1 and d2 is: d1 < d2. By setting the inner diameter of the sealing ring 3 to be smaller than the outer diameter of the groove 23 of the molding post 2, the sealing ring 3 can be fitted onto the groove 23 and can be in a tensioned state, thereby improving the reliability of the fit between the sealing ring 3 and the molding post 2, so that the molding post 2 can meet the encapsulation requirements of the light-emitting module.

[0035] Furthermore, the sealing ring 3 and the forming post 2 are configured for a clearance fit. The fit tolerance between the sealing ring 3 and the groove 23 of the forming post 2 is H7 / js6. The bore diameter tolerance of the sealing ring 3 is ±0.1mm, and the shaft diameter tolerance of the forming post 2 is ±0.05mm. This ensures that when the sealing ring 3 is nested in the groove 23 of the forming post 2, the sealing ring 3 has a certain degree of elasticity and rotational flexibility. When the forming post 2 moves inside the forming cavity 111, the sealing ring 3 can move with the forming post 2 inside the forming cavity 111 and maintain a sleeve fit with the forming post 2.

[0036] Specifically, Figure 5 This invention provides a schematic diagram of the structure of a molded column with multiple grooves in an embodiment of the present invention. Figure 6 This diagram illustrates another structural schematic of a molding column with multiple grooves in an embodiment of the present invention. When the molding column 2 is provided with multiple grooves 23, the multiple grooves 23 can be arranged in parallel to each other, and multiple sealing rings 3 are fitted one-to-one into the multiple grooves 23, thereby improving the reliability of the fit between the sealing rings 3 and the molding column 2.

[0037] Furthermore, the plurality of grooves 23 can form a spiral groove 23 structure, and a single sealing ring 3 with a large inner diameter is arranged along the spiral groove 23, so that the sealing ring 3 can be tightly fitted onto the forming column 2, thereby satisfying the forming and positioning operation of the forming column 2.

[0038] Specifically, the distance between any two adjacent grooves 23 is greater than the width of any groove 23. Multiple sealing rings 3 are arranged in parallel on the forming column 2, such that the width of any groove 23 is less than the distance between any two adjacent grooves 23. This ensures that there is sufficient deformation distance between two adjacent sealing rings 3, preventing motion interference such as mutual contact between two adjacent sealing rings 3 when the forming column 2 moves within the forming cavity 111, and ensuring the stability of each sealing ring 3 on the forming column 2.

[0039] Furthermore, when the molding column 2 moves inside the molding cavity 111, the sealing ring 3 is deformed due to the compression between the molding cavity 111 and the molding column 2. By setting the spacing between adjacent sealing rings 3, the sealing ring 3 has sufficient deformation space to avoid mutual interference that could cause the sealing ring 3 to detach from the groove 23.

[0040] Specifically, the cross-sectional shape of the groove 23 can be V-shaped or arc-shaped, so that when the sealing ring 3 is fitted into the groove 23, the sealing ring 3 can be self-centered in the middle position of the groove 23, thereby improving the stability of the fit between the sealing ring 3 and the groove 23 of the forming column 2.

[0041] Specifically, the groove 23 has a groove width of 200mm to 350mm, so that the groove 23 can meet the fitting requirements of the sealing ring 3.

[0042] Specifically, the sealing ring 3 is made of graphite, fluororubber, butyl rubber, or polyvinyl fluoride. Graphite has physical properties such as high temperature resistance, high strength, good toughness, and self-lubrication, which can meet the sealing requirements of the sealing ring 3 for sealing the gap between the molding column 2 and the molding cavity 111. At the same time, it can reduce the friction between the molding column 2 and the molding cavity 111, ensure that the molding column 2 can move up and down inside the molding cavity 111, and facilitate the adjustment of the movement position of the molding column 2 inside the molding cavity 111.

[0043] Furthermore, fluororubber, butyl rubber, and polyvinyl fluoride have good wear resistance and high temperature resistance, which can adapt to the movement of the molding column 2 inside the molding cavity 111 and meet the encapsulation operation requirements of the light-emitting module.

[0044] Specifically, the sealing ring 3 has a high temperature resistance of ≥200℃, which enables the sealing ring 3 to maintain a seal between the molding post 2 and the molding cavity 111 during the high temperature molding process of the light-emitting module, thus preventing the molding adhesive from adhering to the surface of the molding post 2.

[0045] Specifically, the surface of the sealing ring 3 is coated with a coating to reduce the contact friction between the sealing ring 3 and the molding cavity 111 of the mold body 1, so that the sealing ring 3 can move with the molding column 2 inside the molding cavity 111 of the mold body 1.

[0046] Specifically, the bottom of the molding column 2 is provided with a clearance groove 22. When the molding column 2 abuts against the bracket of the LED device, the LED chip of the light-emitting module is located in the clearance groove 22. The bracket of the LED device is placed at the position of the lower mold body 12 of the mold body 1. Based on the mold assembly of the upper mold body 11 and the lower mold body 12, the molding column 2 is located above the LED chip of the light-emitting module. By pressing the mold, the molding column 2 moves downward along the molding cavity 111 and the bottom end of the molding column 2 abuts against the bracket of the LED device. The LED chip on the bracket can be located in the clearance groove 22. Based on the clearance groove 22, the LED chip of the light-emitting module is protected during the molding process of the light-emitting module, avoiding glue overflow in the light-emitting area of ​​the light-emitting module and ensuring that the light-emitting module has a good light-emitting effect.

[0047] Furthermore, the anti-cavity groove 22 is used to protect the LED chip of the LED device bracket, to prevent glue overflow in the light-emitting area of ​​the light-emitting module during the molding process, thereby ensuring the molding reliability of the light-emitting module.

[0048] Furthermore, the clearance groove 22 can be configured as a square groove, or the clearance groove 22 can also be configured as a hemispherical groove, so as to clean the inside of the clearance groove 22.

[0049] Specifically, a baffle 21 and a spring 4 are provided at the top of the molding column 2. The spring 4 is sleeved on the top position of the molding column 2. One end of the spring 4 is connected to the baffle 21, and the other end of the spring 4 is connected to the mold body 1. Based on the baffle 21 at the top of the molding column 2, the spring 4 makes the molding column 2 and the top of the molding cavity 111 of the mold body 1 form an elastic connection. During the molding and sealing process of the light-emitting module, the baffle 21 of the molding column 2 is pushed by the molding equipment, so that the molding column 2 moves downward along the axial direction of the molding cavity 111 and compresses the spring 4. Based on the spring 4, the uniformity of the downward pressure contact of the molding column 2 on the support of the LED device is improved, and the risk of the support of the LED device being squeezed and damaged is reduced.

[0050] Furthermore, the spring 4 can be a helical spring 4 or a disc spring 4, which can be adjusted according to the actual usage requirements of the forming column 2.

[0051] Furthermore, based on the cooperation between the molding column 2 and the spring 4, the molding column 2 can achieve uniform compression of the LED device bracket during the pressing process, based on the action of the spring 4, thereby improving the stability and reliability of the light-emitting module molding.

[0052] Furthermore, the spring 4 is disposed on the molding column 2 in a sleeve manner, which can improve the ease of replacement of the spring 4 on the molding column 2 when the spring 4 is worn out.

[0053] Specifically, the working principle of the molding die for the light-emitting module provided in this embodiment of the present invention is as follows: the bracket of the LED device is placed in the lower mold body 12 of the mold body 1, and the upper mold body 11 of the mold body 1 is connected to the lower mold body 12, so that the molding cavity 111 of the upper mold body 11 is located above the LED chip of the LED device bracket. By closing the upper mold body 11 and the lower mold body 12, the molding column 2 in the molding cavity 111 is pushed downward, so that the molding column 2 presses against the bracket of the LED device, and the LED chip of the light-emitting module is covered and protected based on the clearance groove 22 of the molding column 2. Plastic sealant is injected into the mold body 1 through the injection channel 112 of the upper mold body 1, so that the plastic sealant forms a plastic seal layer on the bracket of the LED device, and the light emission channel of the light-emitting module is formed based on the molding column 2.

[0054] This utility model embodiment provides a molding die for a light-emitting module. By fitting a sealing ring 3 onto the molding post 2 and filling the gap between the molding post 2 and the molding cavity 111 with the sealing ring 3, the climbing path of the volatile substances of the encapsulant is blocked, preventing the encapsulant from adhering to the molding post 2. This ensures that the molding post 2 maintains the accuracy of its working position during the encapsulation process of the light-emitting module, avoids glue overflow in the light-emitting area of ​​the light-emitting module, and prevents the molding post 2 from squeezing and damaging the support of the LED device, thereby improving the reliability and repeatability of the encapsulation of the light-emitting module.

[0055] Furthermore, the molding die for a light-emitting module provided in the embodiments of this utility model has been described in detail above. Specific examples have been used to illustrate the principle and implementation of this utility model. The description of the above embodiments is only for the purpose of helping to understand the method and core idea of ​​this utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the idea of ​​this utility model. Therefore, the content of this specification should not be construed as a limitation of this utility model.

Claims

1. A molding die for a light-emitting module, characterized in that, The molding die for the light-emitting module includes: a die body, a molding cavity disposed in the die body, a molding post inserted into the molding cavity, and at least one sealing ring sleeved on the molding post; The molding column is provided with at least one groove, the sealing ring is correspondingly fitted into the groove, and the sealing ring extends out of the groove, such that the sealing ring extending out of the groove fills the gap between the molding column and the molding cavity.

2. The molding die for the light-emitting module as described in claim 1, characterized in that, The inner diameter of the sealing ring is d1, the outer diameter of the groove of the forming column is d2, and the constraint relationship between d1 and d2 is: d1≤d2.

3. The molding die for the light-emitting module as described in claim 1, characterized in that, When the forming column is provided with multiple grooves, the multiple grooves are arranged in parallel to each other, or the multiple grooves form a spiral groove structure.

4. The molding die for the light-emitting module as described in claim 1, characterized in that, The distance between any two adjacent grooves is greater than the width of any of the grooves.

5. The molding die for the light-emitting module as described in claim 1, characterized in that, The groove has a V-shaped cross-section or an arc-shaped cross-section.

6. The molding die for the light-emitting module as described in claim 1, characterized in that, The groove has a width of 200mm to 350mm.

7. The molding die for the light-emitting module as described in claim 1, characterized in that, The sealing ring is made of graphite, fluororubber, butyl rubber, or polyvinyl fluoride.

8. The molding die for the light-emitting module as described in claim 1, characterized in that, The sealing ring has a high temperature resistance of ≥200℃.

9. The molding die for the light-emitting module as described in claim 1, characterized in that, The surface of the sealing ring is coated with a coating.

10. The molding die for the light-emitting module as described in claim 1, characterized in that, The bottom of the forming column is provided with a clearance groove. When the forming column abuts against the bracket of the LED device, the LED chip of the light-emitting module is located in the clearance groove.

11. The molding die for the light-emitting module as described in claim 10, characterized in that, The clearance groove is configured as a square groove, or the clearance groove is configured as a hemispherical groove.

12. The molding die for the light-emitting module as described in claim 1, characterized in that, A baffle and a spring are provided at the top of the forming column, and the spring is sleeved at the top position of the forming column; One end of the spring is connected to the baffle, and the other end of the spring is connected to the mold body.

13. The molding die for the light-emitting module as described in claim 12, characterized in that, The spring is a helical spring or a disc spring.

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