OLED binding offset detection and particle detection device
By combining a stage and an elastic flattening mechanism with a focusing system, the detection device solves the problems of detection accuracy and stability during OLED bonding, achieving efficient and automated bonding offset and particle detection, and ensuring product quality.
Patent Information
- Application Number
- CN202422981090.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-04
- Publication Date
- 2025-11-11
- Estimated Expiration
- 2034-12-04
AI Technical Summary
Existing technologies struggle to effectively detect bonding offsets and particles during OLED bonding, especially due to the flexibility of OLED materials leading to imaging differences and focal length variations, which affect detection accuracy and effectiveness.
The testing device combines a stage, an elastic flattening mechanism, and a focus tracking system. The stage supports the OLED product, the elastic flattening mechanism stabilizes the bonding area, and the focus tracking system enables all-around high-precision testing.
It improves the accuracy and stability of OLED bonding detection, the automated process reduces manual intervention, increases detection speed, and promptly detects misalignment and particle issues, ensuring product quality.
Smart Images

Figure CN223538774U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the technical field of bonding detection equipment, specifically to an OLED bonding offset detection and particle detection device. Background Technology
[0002] In the manufacturing process of display panels, the bonding process plays a crucial role, ensuring a precise connection between the display panel and external drive or control signals. This connection relies on high-precision bonding between the display panel and the flexible wiring substrate or driver chip. However, mechanical errors, material deformation, and other factors often introduce misalignment during bonding, adversely affecting the final display effect and performance of the product.
[0003] Current market equipment for post-bonding precision inspection primarily relies on CCD technology to capture markings on the panel and chips on the film, and performs inspection by precisely calculating the distance between them and the spacing of the transparent conductive oxide bumps (ITO bumps). However, this type of equipment faces challenges when applied to OLED inspection because the inherent flexibility of OLED materials causes the inspected products to easily float, making effective and accurate inspection difficult.
[0004] Because the particle size (the diameter of ACF adhesive particles used in OLED products is approximately 0.002-0.003 mm) and line width (typically approximately 0.015-0.03 mm) are extremely small, a 5-10x microscope objective is usually required for observation. However, in this case, the depth of field is limited to 0.03-0.08 mm. Due to the flexible nature of the product, the focal length varies considerably, leading to reflections (such as...). Figure 1 (As shown), this affects the detection results. Utility Model Content
[0005] To address the aforementioned shortcomings, this invention provides an OLED bonding offset detection and particle detection device, which can automatically, efficiently, and accurately detect OLED bonding offset, thereby improving OLED production quality and efficiency.
[0006] In a first aspect, this utility model provides an OLED bonding offset detection and particle detection device, comprising: a stage, configured with inspection holes and mounted on a Y-axis linear module for supporting the OLED product to be detected; an elastic flattening mechanism disposed above the stage for firmly pressing the bonding area of the OLED; a particle detection camera connected to the X-axis linear module via a bracket and located below the flattening mechanism, the particle detection camera being equipped with a focusing system; and an offset detection camera connected to the X-axis linear module via a bracket and located below the flattening mechanism.
[0007] In one embodiment of this utility model, the elastic flattening mechanism includes: a flattening steel frame; a cylinder disposed at one end of the flattening steel frame; a flattening base plate with the cylinder connected to its top and a first through groove provided at its bottom, with fixing holes evenly distributed on both sides of the first through groove; and a pressure plate component, the top of which is installed in the first through groove and connected to the fixing holes by fixing bolts, the lower part of which is equipped with a flexible pressure plate, and the bottom of the flexible pressure plate is provided with a first bottom plate and a second bottom plate, with a second through groove formed between the two.
[0008] In one embodiment of this utility model, a spring mounting groove is provided on the top of the pressure plate component, and a spring component is provided in the spring mounting groove.
[0009] In one embodiment of this utility model, the offset detection camera is connected to the bracket via a camera mounting bracket. The camera mounting bracket includes a first slide, a micro-motion connecting plate, a second slide, a fine-tuning bracket, and an offset light source bracket. The first slide is mounted on the bracket, the micro-motion connecting plate is slidably connected to the first slide via a slider, the bottom of the micro-motion connecting plate is configured as the offset detection camera, the second slide is mounted on the upper part of the micro-motion connecting plate, the fine-tuning bracket is slidably connected to the second slide via a slider, and the fine-tuning bracket is connected to the offset light source via the offset light source bracket.
[0010] In one embodiment of this utility model, multiple offset light source brackets are respectively arranged around the fine-tuning bracket, and each offset light source bracket is equipped with an offset light source, which are arranged around the offset detection camera.
[0011] In one embodiment of this utility model, the offset light source bracket is connected to the offset light source through an L-shaped offset light source angle plate. One end of the offset light source angle plate is fixedly connected to the offset light source, and the other end of the offset light source angle plate is provided with two centrally symmetrical arc-shaped adjustment holes. The offset light source bracket is connected to the two arc-shaped adjustment holes through adjustment bolts.
[0012] In one embodiment of this utility model, the focusing system is a coaxial laser focusing system.
[0013] In one embodiment of this utility model, an objective lens holder is installed on the focusing system, and an objective lens is installed on the objective lens holder.
[0014] In summary, this utility model provides an OLED bonding offset detection and particle detection device, and the beneficial effects of this utility model are as follows:
[0015] This invention effectively solves the problem of imaging differences caused by the flexibility of OLEDs during the bonding process, leading to inaccurate detection of offsets and particles, by designing a flattening mechanism. This improves the accuracy and stability of bonding inspection. Simultaneously, combined with a focus tracking system, it achieves comprehensive, high-precision inspection of the OLED bonding area. The automated inspection process reduces manual intervention, significantly increases inspection speed, and promptly detects bonding offsets and particle effects, preventing defective products from entering subsequent production stages and ensuring product quality stability. Attached Figure Description
[0016] Figure 1 This is an image that shows reflections during the offset detection process.
[0017] Figure 2 This is a three-dimensional structural diagram of the OLED binding offset detection and particle detection device provided in Example 1.
[0018] Figure 3 This is a top view of the platform structure.
[0019] Figure 4 This is a three-dimensional structural diagram of an elastic flattening mechanism.
[0020] Figure 5 This is a three-dimensional structural diagram of the pressure plate component.
[0021] Figure 6 This is a three-dimensional structural diagram of a focus tracking system.
[0022] Figure 7 This is a 3D structural diagram of the offset detection camera and offset light source.
[0023] Figure 8 This is a schematic diagram of the particle detection camera.
[0024] Key element symbols: 1. Stage; 11. Y-axis linear module; 12. DD motor; 13. AOI stage; 14. Inspection hole; 15. Vacuum suction hole; 2. Elastic flattening mechanism; 21. Flattening steel frame; 22. Cylinder; 23. Flattening base plate; 231. Fixing hole; 232. Limiting support; 233. Limiting rod; 24. Pressure plate component; 241. Flexible pressure plate; 242. First base plate; 243. Second base plate; 244. Second through slot; 245. Spring mounting slot; 25. Fixing screw 26. Bolt; 26. Limiting steel structure; 261. Limiting connecting plate; 262. Limiting bolt; 3. Detection system; 31. X-axis linear module; 32. Hanger; 33. Offset detection camera; 331. First slide; 332. Micro-motion connecting plate; 333. Second slide; 334. Micro-adjustment bracket; 335. Offset light source bracket; 336. Offset light source angle plate; 3361. Arc-shaped adjustment hole; 34. Particle detection camera; 341. Focusing system; 342. Objective lens bracket; 343. Objective lens; 35. Offset light source. Detailed Implementation
[0025] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this utility model, not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model. Therefore, the following detailed description of the embodiments of this utility model provided in the accompanying drawings is not intended to limit the scope of the claimed utility model, but merely represents selected embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.
[0026] Example 1
[0027] like Figure 2 As shown, an OLED bonding offset detection and particle detection device includes: a stage 1, an elastic flattening mechanism 2, and a vision system 3.
[0028] The stage 1 is used to support the OLED product to be tested. For example... Figure 2 , 3As shown, stage 1 is mounted on DD motor 12, which is mounted on Y-axis linear module 11 via a mounting plate. One end of Y-axis linear module 11 is connected to Y-axis servo motor. AOI stage 13 is provided at one end of stage 1. AOI stage 13 is provided with vacuum adsorption hole 15, and an inspection hole 14 for OLED bonding offset detection is provided on one side of vacuum adsorption hole 15.
[0029] Next, the elastic flattening mechanism 2 is positioned above the stage 1 to firmly press down the bonding area of the OLED.
[0030] like Figure 4 As shown, the elastic flattening mechanism 2 includes: a flattening steel frame 21, a cylinder 22, a flattening base plate 23, a pressure plate component 24, and a limiting mechanism.
[0031] The cylinder 22 is located at one end of the flattening steel frame 21 and provides the flattening driving force.
[0032] Next, the top of the flattening substrate 23 is connected to the cylinder 22, and the bottom of the flattening substrate 23 is provided with a first through groove, with fixing holes 231 evenly distributed on both sides of the first through groove. Limiting supports 232 are respectively provided on both sides of the flattening substrate 23, and limiting supports 233 are installed on the limiting supports 232.
[0033] like Figure 5 As shown, the top of the pressure plate component 24 is installed in the first through groove and connected to the fixing hole 231 by fixing bolts 25. A flexible pressure plate 241 is provided at the lower part of the pressure plate component 24. A first base plate 242 and a second base plate 243 are provided at the bottom of the flexible pressure plate 241. A second through groove 244 is provided between the first base plate 242 and the second base plate 243 to accommodate the flexibility of the OLED and distribute the pressure evenly. The first base plate 242 and the second base plate 243 are preferably made of rubber.
[0034] Furthermore, the top of the pressure plate component 24 is provided with a spring mounting groove 245, and a spring is provided in the spring mounting groove 245 to enhance the flexibility and adaptability of the flattening, so as to provide additional cushioning and adaptability and ensure that the OLED is not damaged during the pressing process.
[0035] Two limiting mechanisms are respectively set on both sides of the flattening steel frame 21. Each limiting mechanism includes a limiting steel structure 26. One end of the limiting steel structure 26 is provided with a limiting connecting plate 261. A limiting bolt 262 is installed on the limiting connecting plate 261. The limiting bolt 262 is located directly below the limiting support rod 233 and plays a limiting role for the elastic flattening mechanism.
[0036] like Figure 6As shown, the vision system 3 includes an X-axis linear module 31, a bracket 32, an offset detection camera 33, a particle detection camera 34, and an offset light source 35. Both the offset detection camera 33 and the particle detection camera 34 are positioned below the flattening mechanism, with the particle detection camera 34 enabling precise focusing. The offset detection camera 33 is used to capture images. The offset detection camera 33 and the particle detection camera 34 are connected to the X-axis linear module 31 via the bracket 32, and one end of the X-axis linear module 31 is connected to an X-axis servo motor. The offset detection camera 33 is used for offset inspection of the OLED bonding area, and the particle detection camera 34 is used for particle detection in the OLED bonding area.
[0037] The offset light source 35 is positioned around the offset detection camera 33 to provide a stable offset light source for the offset detection camera 33, thereby improving inspection accuracy. In this embodiment, as... Figure 7 As shown, the offset detection camera 33 is connected to the bracket 32 via a camera mounting bracket. The camera mounting bracket includes a first slide 331, a micro-motion connecting plate 332, a second slide 333, a fine-tuning bracket 334, and an offset light source bracket 335. The first slide 331 is mounted on the bracket 32. The micro-motion connecting plate 332 is slidably connected to the first slide 331 via a slider. The bottom of the micro-motion connecting plate 332 is configured as the offset detection camera 33. The second slide 333 is mounted on the upper part of the micro-motion connecting plate 332. The fine-tuning bracket 334 is slidably connected to the second slide 333 via a slider. The fine-tuning bracket 334 is connected to the offset light source 35 via the offset light source bracket 335.
[0038] Furthermore, offset light source brackets 335 are respectively provided around the fine-tuning bracket 334, and each offset light source bracket 335 is provided with an offset light source 35, which are located around the offset detection camera 33.
[0039] In a further optimized manner, the offset light source bracket 335 is connected to the offset light source 35 via the offset light source angle plate 336. The offset light source angle plate 336 is L-shaped, with one end of the offset light source angle plate 336 fixedly connected to the offset light source 35. Two arc-shaped adjustment holes 3361 are provided on the other end of the offset light source angle plate 336. The two arc-shaped adjustment holes 3361 are arranged symmetrically around the center. The offset light source bracket 335 is connected to the two arc-shaped adjustment holes 3361 via adjustment bolts.
[0040] like Figure 8As shown, the particle detection camera 34 is equipped with a focusing system 341, an objective lens holder 342 is mounted on the upper side of the focusing system 341, and an objective lens 343 is mounted on the objective lens holder 342. The focusing system 341 is preferably a coaxial laser focusing system. This system measures light using a sensor and automatically adjusts the position of the condenser to ensure that the light is always focused at the focal point. The coaxial laser focusing system has advantages such as good focusing effect, high tracking accuracy, and wide application range.
[0041] Furthermore, a coaxial light source is provided between the particle detection camera 34 and the OLED product under test, or on the other side of the OLED product under test relative to the particle detection camera 34, to provide illumination for particle detection.
[0042] Example 2
[0043] The OLED bonding offset detection and particle detection method includes the following steps: The panel and COF bonding area are pressed together by the elastic flattening mechanism 2. Then, the focusing system is activated for real-time distance measurement and compensation, ensuring the objective lens of the particle detection camera 34 remains within the depth of field for clear imaging. The particle detection camera 34 captures images of the bonding area for particle detection. Simultaneously, the offset detection camera 33 captures images of the bonding area for offset detection. Finally, the detection system analyzes the captured images using image processing algorithms to accurately calculate the bonding offset, the number of particles after bonding, and the bonding effect. The flattening mechanism is raised to release the flattening, and then the Y-axis linear module 11 moves the product under test along the Y direction, bringing the COF and FPC bonding point directly above the vision system 3. The bonding area is then pressed together by the flattening mechanism, and the bonding offset, the number of particles after bonding, and the bonding effect are accurately calculated.
[0044] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.
Claims
1. An OLED bonding offset detection and particle detection device, characterized in that, It includes: The stage, equipped with inspection holes and mounted on the Y-axis linear module, is used to support the OLED products to be tested; An elastic flattening mechanism is positioned above the stage to firmly press down the bonding area of the OLED. The particle detection camera is connected to the X-axis linear module via a bracket and is located below the flattening mechanism. The particle detection camera is equipped with a Z-axis compensated tracking focus system. The offset detection camera is connected to the X-axis linear module via a bracket and is located below the flattening mechanism.
2. The OLED bonding offset detection and particle detection device according to claim 1, characterized in that, The elastic flattening mechanism includes: Flatten the steel frame; A cylinder is located at one end of the flattening steel frame; A flattened substrate is connected to a cylinder at its top and has a first through groove at its bottom. Fixing holes are evenly distributed on both sides of the first through groove. The pressure plate component has its top installed in the first through groove and connected to the fixing hole by fixing bolts. The lower part of the pressure plate component is equipped with a flexible pressure plate. The bottom of the flexible pressure plate is provided with a first bottom plate and a second bottom plate, and a second through groove is formed between the two.
3. The OLED bonding offset detection and particle detection device according to claim 2, characterized in that, The pressure plate component has a spring mounting groove on its top, and a spring component is installed in the spring mounting groove.
4. The OLED bonding offset detection and particle detection device according to claim 1, characterized in that, The offset detection camera is connected to the bracket via a camera mounting bracket. The camera mounting bracket includes a first slide, a micro-motion connecting plate, a second slide, a micro-adjustment bracket, and an offset light source bracket. The first slide is mounted on the bracket. The micro-motion connecting plate is slidably connected to the first slide via a slider. The bottom of the micro-motion connecting plate is configured as the offset detection camera. The second slide is mounted on the upper part of the micro-motion connecting plate. The micro-adjustment bracket is slidably connected to the second slide via a slider. The micro-adjustment bracket is connected to the offset light source via the offset light source bracket.
5. The OLED bonding offset detection and particle detection device according to claim 4, characterized in that, Multiple offset light source brackets are set around the fine-tuning bracket, and each offset light source bracket is equipped with an offset light source. The offset light sources are arranged around the offset detection camera.
6. The OLED bonding offset detection and particle detection device according to claim 5, characterized in that, The offset light source bracket is connected to the offset light source through an L-shaped offset light source angle plate. One end of the offset light source angle plate is fixedly connected to the offset light source, and the other end of the offset light source angle plate is provided with two centrally symmetrical arc-shaped adjustment holes. The offset light source bracket is connected to the two arc-shaped adjustment holes through adjustment bolts.
7. The OLED bonding offset detection and particle detection device according to claim 1, characterized in that, The autofocus system is a coaxial laser autofocus system.
8. The OLED bonding offset detection and particle detection device according to claim 7, characterized in that, The focusing system is equipped with an objective lens holder, and the objective lens is mounted on the objective lens holder.