MOS tube pin fixing structure

Abstract

The utility model relates to the technical field of MOS tube processing, in particular to an MOS tube pin fixing structure, which comprises a bottom plate, a propelling assembly and a pressing assembly, the propelling assembly comprises a supporting plate, a propeller and a propelling plate, the supporting plate is arranged at one end above the bottom plate, the propeller penetrates through the supporting plate and is connected with the propelling plate, and the pressing assembly is arranged on the bottom plate. According to the MOS tube pin fixing structure, the supporting plate, the propeller and the propelling plate in the propelling assembly are matched with one another, and the precise and stable propelling effect is achieved. The supporting plate arranged at one end above the bottom plate is used for installing the propeller, the propeller penetrates through the supporting plate and is connected with the propelling plate, the propeller can adopt an electric push rod, an air cylinder and other driving modes (selected according to actual application scenes and design requirements), the propelling plate can be pushed to move according to set parameters such as speed and stroke, and it is guaranteed that the ends of MOS tubes are flush; and the material is pressed and fixed through the pressing assembly, so that the MOS tube pin can be positioned and cut subsequently.

Description

Technical Field

[0001] This utility model relates to the field of MOSFET processing technology, specifically a MOSFET pin fixing structure. Background Technology

[0002] Lead fabrication for MOSFETs (Metal-Oxide-Semiconductor Field-Effect Transistors) is a crucial step in the manufacturing process.

[0003] Positioning devices are needed during lead processing. Traditional positioning devices can only fix one set of materials for processing, which is time-consuming, labor-intensive and inconvenient to use when cutting leads. Utility Model Content

[0004] (a) Technical problems to be solved

[0005] To address the shortcomings of existing technologies, this invention provides a MOS transistor pin fixing structure.

[0006] (II) Technical Solution

[0007] To achieve the above objectives, this utility model provides the following technical solution: a MOS transistor pin fixing structure, comprising a base plate, a push assembly, and a pressing assembly. The push assembly includes a support plate, a pusher, and a push plate. A support plate is disposed at one end of the base plate. The pusher passes through the support plate and is connected to the push plate. The pressing assembly includes a top plate, a lifter, a pressing plate, and a buffer assembly. The top plate is disposed above the side of the push plate away from the pusher. The lifter passes through the top plate and is connected to the pressing plate. Several sets of buffer assemblies are also disposed below the pressing plate. Guide grooves are symmetrically disposed on the left and right sides above the support plate. A guide block that is slidably connected to the guide groove is also disposed below the push plate.

[0008] In order to clamp and fix the material, the present invention is improved by including an elastic element and a buffer plate, wherein the upper and lower ends of the elastic element are respectively connected to the lower pressure plate and the buffer plate.

[0009] Preferably, the elastic element includes a spring and a telescopic rod, the spring is sleeved on the telescopic rod, and the upper and lower ends of the spring and the telescopic rod are respectively connected to the lower pressure plate and the buffer plate.

[0010] To ensure the stability of the lower pressure plate's lifting and lowering, this utility model is improved by providing two sets of guide rods that penetrate the top plate above the lower pressure plate.

[0011] Preferably, the guide block is inverted T-shaped.

[0012] To ensure the strength of the connection between the propulsion plate and the top plate, this utility model is improved by providing several sets of reinforcing ribs between the propulsion plate and the top plate.

[0013] (III) Beneficial Effects

[0014] Compared with the prior art, the present invention provides a MOS transistor pin fixing structure, which has the following advantages:

[0015] This MOSFET pin-fixing structure, with its support plate, pusher, and pusher plate working together in the propulsion assembly, achieves precise and stable propulsion. The support plate at one end of the base plate is used to mount the pusher, which passes through the support plate and connects to the pusher plate. The pusher can be driven by electric actuators, cylinders, etc. (selected according to the actual application scenario and design requirements), and can move the pusher plate according to set speed, stroke, and other parameters to ensure the MOSFET ends are flush. A pressing assembly then presses down and fixes the material for subsequent positioning and cutting of the MOSFET pins. Attached Figure Description

[0016] Figure 1 This is a rear view schematic diagram of the structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the structure of this utility model;

[0018] Figure 3 This is a partial schematic diagram of the structure of this utility model;

[0019] Figure 4 The structure of this utility model Figure 3 A magnified view of a portion of the image.

[0020] In the diagram: 1. Base plate; 2. Support plate; 3. Thruster; 4. Thruster plate; 5. Top plate; 6. Lifter; 7. Lower pressure plate; 8. Guide block; 9. Buffer plate; 10. Spring; 11. Telescopic rod; 12. Guide rod; 13. Reinforcing rib. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Please see Figure 1-4A MOS transistor pin fixing structure includes a base plate 1, a push assembly, and a pressing assembly. The push assembly includes a support plate 2, a pusher 3, and a push plate 4. The support plate 2 is disposed at one end of the base plate 1. The pusher 3 passes through the support plate 2 and is connected to the push plate 4. The pressing assembly includes a top plate 5, a lifter 6, a pressing plate 7, and a buffer assembly. The top plate 5 is disposed above the side of the push plate 4 away from the pusher 3. The lifter 6 passes through the top plate 5 and is connected to the pressing plate 7. Several sets of buffer assemblies are disposed below the pressing plate 7. Guide grooves are symmetrically disposed on the left and right sides above the support plate 2. Guide blocks 8 are slidably connected to the guide grooves below the push plate 4.

[0023] A support plate 2 is provided at one end of the base plate 1. The pusher 3 is installed on the support plate 2 and passes through it to connect with the push plate 4. If the pusher 3 uses an electric push rod as the driving method (of course, other suitable driving methods such as cylinders can also be selected), when the electric push rod is started, it will push the push plate 4 connected to it to move according to the preset speed and stroke parameters. For example, when multiple sets of MOSFET materials placed on the push plate 4 need to be transported to a designated pin processing position (such as the working area corresponding to the pin cutting equipment), the electric push rod extends, driving the push plate 4 to move along the guide grooves symmetrically arranged on the left and right sides above the support plate 2. The inverted T-shaped guide block 8 set below the push plate 4 slides in cooperation with the guide groove. The inverted T-shaped structure allows the guide block 8 to be firmly stuck in the guide groove, limiting the possibility of displacement of the push plate 4 other than along the direction of the guide groove (that is, the pushing direction). This ensures that the push plate 4 will not experience unstable situations such as left and right deviation or up and down swaying during the movement, thereby achieving precise and stable pushing action. This ensures that the MOSFET materials can be accurately delivered to the appropriate processing position, laying the groundwork for subsequent pin processing operations and ensuring that the ends of the MOSFETs are in an ideal state of being flush during processing, facilitating unified subsequent processing.

[0024] After the pusher plate 4 pushes the MOSFET material to the predetermined processing position, the pressing assembly is needed to press down and fix the material to ensure that the material will not be displaced during subsequent pin processing (such as pin trimming). The top plate 5 in the pressing assembly is installed above the pusher plate 4 on the side away from the pusher 3, and the lifter 6 passes through the top plate 5 and is connected to the pressing plate 7;

[0025] After the lifting device 6 is activated (it can also be driven by electric, pneumatic or other methods), the lifting device 6 will drive the lower pressure plate 7 to move in a straight line in the up and down direction. Two sets of guide rods 12 are provided above the lower pressure plate 7, which penetrate the top plate 5. The guide rods 12 cooperate with the corresponding guide holes on the top plate 5, which further restricts the lower pressure plate 7 to move only in the up and down direction, effectively preventing the lower pressure plate 7 from tilting or deviating during the lifting process, and ensuring the smoothness and accuracy of the pressing action;

[0026] The buffer assembly includes an elastic element and a buffer plate 9. The upper and lower ends of the elastic element are connected to the lower pressure plate 7 and the buffer plate 9, respectively. The elastic element includes a spring 10 and a telescopic rod 11. The spring 10 is sleeved on the telescopic rod 11. The upper and lower ends of both the spring 10 and the telescopic rod 11 are connected to the lower pressure plate 7 and the buffer plate 9, respectively. Two sets of guide rods 12 penetrating the top plate 5 are also provided above the lower pressure plate 7.

[0027] The elastic element in the buffer assembly (composed of spring 10 and telescopic rod 11, with spring 10 sleeved on telescopic rod 11, this structure can maintain good stability while ensuring elastic expansion and contraction) is connected to the lower pressure plate 7 and the buffer plate 9 at its upper and lower ends respectively. When the lifting device 6 drives the lower pressure plate 7 to move downward, the buffer plate 9 first contacts the surface of the MOS tube material.

[0028] As the pressure plate 7 continues to press down, if there is a certain impact force (such as the instantaneous impact force generated by the rapid movement of the lifting device 6) or the surface of the material is uneven, the buffer plate 9 will perform appropriate compression and buffering under the elastic action of the elastic element. This can prevent the pressure plate 7 from applying excessive rigid pressure to the material and damaging the MOSFET, thus protecting the material. It also allows the buffer plate 9 to better conform to the surface of the material, and the elastic restoring force of the elastic element applies a suitable clamping force to the material, so that the material can be effectively fixed in the horizontal direction and pressed tightly against the push plate 4 in the vertical direction. This achieves reliable pressing and fixing of the MOSFET material, ensuring its stability during processing such as lead cutting and guaranteeing processing quality.

[0029] In this embodiment, a number of reinforcing ribs 13 are also provided between the push plate 4 and the top plate 5. The reinforcing ribs 13 ensure the stability of the push plate 4 and the top plate 5.

[0030] In this document, the term "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The term "embodiment" appearing in various places throughout the specification does not necessarily refer to the same embodiment, nor does it specifically limit its independence or connection with other embodiments. In principle, in this application, as long as there are no technical contradictions or conflicts, the technical features mentioned in each embodiment can be combined in any way to form corresponding implementable technical solutions.

[0031] Unless otherwise defined, the technical terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the use of related terms herein is merely for the purpose of describing particular embodiments and is not intended to limit this application.

[0032] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention.

Claims

1. A MOS transistor pin fixing structure, comprising a base plate (1), a push assembly, and a push-down assembly, characterized in that: The propulsion assembly includes a support plate (2), a thruster (3), and a propulsion plate (4). The support plate (2) is provided at one end of the bottom plate (1). The thruster (3) passes through the support plate (2) and is connected to the propulsion plate (4). The pressing assembly includes a top plate (5), a lifter (6), a pressing plate (7), and a buffer assembly. The top plate (5) is provided above the side of the propulsion plate (4) away from the thruster (3). The lifter (6) passes through the top plate (5) and is connected to the pressing plate (7). Several sets of buffer assemblies are also provided below the pressing plate (7). Guide grooves are symmetrically provided on the left and right sides above the support plate (2). Guide blocks (8) that are slidably connected to the guide grooves are also provided below the propulsion plate (4).

2. The MOS transistor pin fixing structure according to claim 1, characterized in that: The buffer assembly includes an elastic element and a buffer plate (9), with the upper and lower ends of the elastic element connected to the lower pressure plate (7) and the buffer plate (9) respectively.

3. The MOS transistor pin fixing structure according to claim 2, characterized in that: The elastic element includes a spring (10) and a telescopic rod (11). The spring (10) is sleeved on the telescopic rod (11). The upper and lower ends of the spring (10) and the telescopic rod (11) are respectively connected to the lower pressure plate (7) and the buffer plate (9).

4. The MOS transistor pin fixing structure according to claim 3, characterized in that: Two sets of guide rods (12) that penetrate the top plate (5) are also provided above the lower pressure plate (7).

5. The MOS transistor pin fixing structure according to claim 4, characterized in that: The guide block (8) is inverted T-shaped.

6. The MOS transistor pin fixing structure according to claim 5, characterized in that: Several sets of reinforcing ribs (13) are also provided between the propulsion plate (4) and the top plate (5).

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