Glass sheet packaging assembly

Abstract

The utility model provides a glass sheet packaging assembly, and relates to the packaging technology field, the glass sheet packaging assembly comprises a base body, the base body is provided with a groove, a plurality of groups of glass sheet clamping grooves and a positioning structure, the groove is used for placing wafers, the glass sheet clamping grooves are used for placing glass sheets, the glass sheet clamping grooves are arranged in the groove, and the positioning structure is arranged on the base body. The depth of the glass sheet clamping groove is smaller than the thickness of the glass sheet, and the positioning structure is used for positioning the placing position of the wafer in the groove. Through the arrangement of the glass sheet clamping groove and the positioning structure, the subsequent packaging precision is ensured, the packaging efficiency is improved, the glue consumption can be improved in the glue spraying stage, the glass sheet can be uniformly and fully coated with glue, the defect that gaps are reserved in the glue is avoided, the fitting flatness of the glass sheet and the chip is improved, and the product quality is improved; and when the glass sheets are cut and cracked, the glass sheets are independent, so that the risks of edge breakage, breakage, scratch, short circuit or open circuit during bonding of the glass sheets are avoided, and the reliability and yield of products are improved.

Description

Technical Field

[0001] This utility model relates to the field of packaging technology, and in particular to glass sheet packaging components. Background Technology

[0002] Currently, the common encapsulation methods for glass sheets in silicon-based OLED microdisplays are large-sheet bonding and small-sheet bonding.

[0003] Large-scale bonding involves bonding the entire silicon wafer to a glass cover under vacuum. After bonding, the wafer needs to be cut. However, when cutting the wafer into smaller chips, the glass may chip or be scratched, increasing the risk of short circuits or open circuits during bonding, which affects product reliability and yield.

[0004] Therefore, most manufacturers currently adopt a small-piece bonding packaging method. Small-piece bonding involves individually bonding a glass cover to each chip location. This bonding method basically requires a pick-and-place machine to bond the glass covers one by one to the chip, which places high precision requirements on the pick-and-place machine and is very slow, increasing production costs. At the same time, when applying the glass bonding adhesive to the chip, the pick-and-place machine uses a drop-coating process, and the glass covers are pressed together to cause the adhesive to expand and cover the surrounding area. This may lead to the risk of incomplete adhesive coverage, resulting in defects such as incomplete bonding and unevenness, leading to poor product gloss and reduced product yield. Before curing, the glass covers may also shift due to the pressing tension, resulting in decreased bonding accuracy. In more serious cases, there is a risk that the glass covers the PAD area.

[0005] This application is submitted in response to the above-mentioned problems. Utility Model Content

[0006] The purpose of this invention is to provide a glass cover assembly that can attach glass covers to all chips on a whole wafer at once, and achieve a one-to-one precise correspondence between chips and glass covers. This not only meets high precision requirements, but also greatly improves the efficiency of chip mounting and reduces chip mounting production costs.

[0007] To address the aforementioned issues, this utility model provides a glass sheet encapsulation assembly, comprising a substrate, on which are provided grooves, several sets of glass sheet slots, and a positioning structure. The grooves are used to place wafers, and the glass sheet slots are used to place glass sheets. The glass sheet slots are disposed within the grooves, and the depth of the glass sheet slots is less than the thickness of the glass sheets. The positioning structure is used to position the wafers within the grooves.

[0008] The size and shape of the glass plate slot are not limited and can be adapted to the shape of the glass plate and product requirements.

[0009] The distribution of the glass plate slots is preferably one-to-one with the chips on the silicon-based OLED, and alignment is achieved under the action of the positioning structure. In some embodiments, the number of glass plate slots may be different from the number of chips on the silicon-based OLED.

[0010] The glass plate slot can fix the glass plate. Since the depth of the slot is less than the thickness of the glass plate, after the glass plate is placed, the surface of the glass plate is higher than the slot plate. Therefore, there is a certain depth of groove between the glass plates. When bonding with the wafer, excess glass glue on the glass plate will directly enter the groove, preventing the glass plates from sticking together. At the same time, it can also ensure that the glue is evenly coated on the glass plate, without the defect of glue gaps. This improves the flatness of the bonding between the glass plate and the chip, thereby improving the parallelism of the light output of the OLED chip and improving the quality of the product.

[0011] Optionally, the substrate may be a one-piece molded structure or a modular structure.

[0012] In this solution, the substrate includes a frame and a slot plate, and the glass plate slot is formed on the slot plate.

[0013] Preferably, the groove is formed by a frame and a slot plate, the frame forming the sidewall of the groove and the slot plate forming the bottom wall of the groove.

[0014] Optionally, the frame and the slot plate are fixedly connected, such as by welding or riveting; alternatively, the frame and the slot plate can be detachably connected, such as by snap-fit ​​or bolt connection. The detachable connection method facilitates the replacement of the slot plate and adapts to different production needs.

[0015] Optionally, the positioning structure is disposed on the side wall or bottom wall of the groove.

[0016] According to one embodiment of the present invention, the positioning structure includes a plurality of raised positioning points.

[0017] Preferably, the raised positioning points are provided in three groups and are not evenly distributed.

[0018] According to one embodiment of the present invention, the diameter of the groove is larger than the diameter of the wafer.

[0019] Optionally, the substrate may be made of materials such as plastic or metal.

[0020] The beneficial effects of this utility model are as follows: by setting up the glass sheet slot and positioning structure, the glass sheet and the chip are aligned one by one and in one go, ensuring the subsequent packaging accuracy and improving packaging efficiency. Since the depth of the slot is less than the thickness of the glass sheet, a channel is formed between the glass sheets to accommodate excess adhesive. This allows for a higher amount of adhesive to be used during the adhesive spraying stage, ensuring that the adhesive is evenly applied to the glass sheet and avoiding defects such as gaps in the adhesive. This improves the flatness of the glass sheet and chip bonding, thereby improving the parallelism of the light emitted by the OLED chip and improving product quality. Excess glass adhesive on the glass sheet will directly enter the channel, preventing adhesion between the glass sheets. When cutting the glass sheets, since they are independent, there is no risk of glass sheet chipping, breakage, scratches, short circuits, or open circuits during bonding, thus improving product reliability and yield. Attached Figure Description

[0021] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0022] Figure 1 This is a schematic diagram of the overall structure of the glass sheet encapsulation assembly;

[0023] Figure 2 This is a schematic diagram of the wafer structure;

[0024] Figure 3 This is a schematic diagram of the chip and glass sheet packaging process. Detailed Implementation

[0025] The following description is only intended to disclose the present invention so that those skilled in the art can implement it. The embodiments in the following description are merely examples, and those skilled in the art will conceive of other obvious modifications. The basic principles of the present invention defined in the following description can be applied to other embodiments, modifications, improvements, equivalents, and other solutions that do not depart from the spirit and scope of the present invention.

[0026]

Example 1

[0027] Glass sheet encapsulated components, such as Figure 1 It includes a base, which is connected to the frame 4 by a slot plate 3 through a welding process. The base is preferably made of plastic.

[0028] A groove 8, several sets of glass plate slots 2, and a positioning structure 1 are formed in the substrate.

[0029] The groove is used to place the wafer. Preferably, the diameter of the groove 8 is larger than the diameter of the wafer. The groove 8 is surrounded by a frame 4 and a slot plate 3. The frame 4 forms the side wall of the groove 8, and the slot plate 3 forms all or part of the bottom wall of the groove 8.

[0030] The glass plate slot 2 is used to place glass plates. The glass plate slot 2 is set on the slot plate 3. The depth of the glass plate slot 2 is less than the thickness of the glass plate. The size and shape of the glass plate slot 2 are not limited. It is designed according to the shape of the glass plate and product requirements. In this solution, the glass plate slot 2 is a square slot. The distribution of the glass plate slot 2 corresponds one-to-one with the chip 5 on the silicon substrate 9.

[0031] The glass plate slot 2 can fix the glass plate 7. Since the depth of the slot is less than the thickness of the glass plate, after the glass plate is placed, the surface of the glass plate is higher than the slot plate. Therefore, there is a certain depth of groove between the glass plates. When bonding with the wafer, the excess glass glue on the glass plate will directly enter the groove, which will not cause the glass plates to stick together. At the same time, it can also ensure that the glue is evenly coated on the glass plate, without the defect of glue gaps. This improves the flatness of the bonding between the glass plate and the chip, thereby improving the parallelism of the light output of the OLED chip and improving the quality of the product.

[0032] The positioning structure 1 is used to position the wafer within the groove 8. In this embodiment, the positioning structure 1 is a raised positioning point, which can be located on the side wall or bottom wall of the groove 8. Preferably, three sets of raised positioning points are provided, and they are not evenly distributed. Figure 2 A corresponding positioning notch 6 is provided on the silicon substrate 9. The raised positioning point is aligned with the positioning notch 6 to fix the wafer and also to accurately align the glass sheet and the chip.

[0033] The glass encapsulation steps are as follows:

[0034] like Figure 3 The glass sheet 7 is fixed into the glass sheet slot 2. Glass bonding adhesive is evenly sprayed onto the glass sheet 7. The amount of adhesive can be more than required. Since there are channels between the glass sheets 7, when bonding with the wafer, the excess adhesive on the glass sheet 7 will directly enter the channels, preventing the glass sheets from sticking together. At the same time, it can ensure that the adhesive is evenly applied to the glass sheet, without leaving gaps. This improves the flatness of the bonding between the glass sheet and the chip, thereby improving the parallelism of the light output of the OLED chip and improving the quality of the product.

[0035] A 12-inch silicon-based OLED (not limited to this size; when packaging wafers of other sizes, the size of the glass sheet packaging assembly is adapted) is directly bonded to the glass sheet packaging assembly. The positioning notch 6 on the silicon substrate 9 is aligned with the raised positioning point to fix the wafer and also to accurately align the glass sheet and the chip 5, ensuring the one-to-one alignment accuracy between the chip 5 and the glass sheet 7.

[0036] When cutting and splitting 12-inch silicon-based OLEDs, since the glass sheets are independent, there is no risk of glass chipping, breakage, scratches, short circuits or open circuits during bonding, which improves product reliability and yield.

[0037] Those skilled in the art should understand that the embodiments of the present invention described above and shown in the accompanying drawings are merely examples and do not limit the present invention. The purpose of the present invention has been fully and effectively achieved. The functional and structural principles of the present invention have been shown and explained in the embodiments. Without departing from the stated principles, the implementation of the present invention may have any variations and modifications.

Claims

1. A glass sheet encapsulation assembly, characterized in that: The system includes a substrate, on which are provided a groove (8), several sets of glass plate slots (2) and a positioning structure (1). The groove is used to place a wafer, and the glass plate slots (2) are used to place a glass plate. The glass plate slots (2) are set in the groove (8), and the depth of the glass plate slots (2) is less than the thickness of the glass plate. The positioning structure (1) is used to position the wafer in the groove (8). The substrate includes a frame (4) and a slot plate (3). The glass plate slots (2) are formed on the slot plate (3). The groove (8) is surrounded by the frame (4) and the slot plate (3). The positioning structure (1) includes several raised positioning points. The raised positioning points are provided in three sets and are not uniformly arranged.

2. The glass sheet encapsulation assembly according to claim 1, characterized in that: The frame (4) and the slot plate (3) are fixedly connected.

3. The glass sheet encapsulation assembly according to claim 1, characterized in that: The frame (4) and the slot plate (3) are detachably connected.

4. The glass sheet encapsulation assembly according to claim 2, characterized in that: The positioning structure (1) is set on the side wall or bottom wall of the groove (8).

5. The glass sheet encapsulation assembly according to any one of claims 1-4, characterized in that: The diameter of the groove (8) is larger than the diameter of the wafer.

6. The glass sheet encapsulation assembly according to any one of claims 1-4, characterized in that: The substrate is made of plastic.

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