Electronic atomizer and electronic atomization device

Abstract

The utility model discloses an electronic atomizer and an electronic atomization device. The electronic atomizer comprises a liquid storage cavity, an airflow channel and a heating assembly. The airflow channel extends along the axial direction of the electronic atomizer; the heating assembly comprises a base body, the base body is provided with a liquid absorbing face and an atomizing face which are oppositely arranged in the thickness direction, and the base body is provided with a plurality of liquid guiding through holes. The liquid guide through hole is communicated with the liquid storage cavity and the airflow channel, and is used for guiding the atomization matrix from the liquid storage cavity to the atomization surface through the liquid absorption surface; the heating assembly further comprises a heating element, and the heating element is used for heating and atomizing the atomization substrate guided to the atomization face. Wherein an included angle is formed between the liquid suction face and the atomization face, the atomization face is obliquely arranged relative to the axial direction of the airflow channel, and the axis of the liquid guide through hole is obliquely arranged relative to the radial direction of the airflow channel. According to the scheme, the transverse speed of the aerosol can be reduced, and the risk that the aerosol collides with the wall is reduced.

Description

Technical Field

[0001] This application relates to the field of electronic atomization technology, and in particular to electronic atomizers and electronic atomization devices. Background Technology

[0002] Atomization technology is the process of turning a liquid into small droplets through a specific method. An electronic atomizer includes a liquid reservoir, a heating element, and an airflow channel. The reservoir stores the atomization matrix, such as a flavored liquid. The heating element is connected to the liquid in the reservoir and has multiple liquid-guiding holes with a microporous structure. This microporous structure is crucial for the heating element to achieve stable liquid guidance and retention. Due to surface tension and capillary action, the liquid can evenly penetrate into the heating element and adhere to its surface. The heating element atomizes the liquid, and the resulting gas, such as an aerosol, is sprayed into the airflow channel. This gas combines with the airflow within the channel and is then carried out for the user to inhale.

[0003] Compared to cylindrical heating elements, flat heating elements offer more flexible installation options. However, when the heating element is placed vertically, the aerosol ejected from it is at greater risk of impacting the wall, especially when the particle size is large. This makes it difficult for the smoke to be carried out smoothly by the airflow, thus affecting the atomization effect. Utility Model Content

[0004] This application provides an electronic atomizer and an electronic atomization device to solve the problem that when the heating component is placed vertically, the high lateral velocity of the aerosol leads to a high risk of the aerosol hitting the wall, thus affecting the aerosol transmission efficiency.

[0005] To solve the above-mentioned technical problems, the first technical solution provided in this application is:

[0006] An electronic atomizer includes a liquid reservoir, an airflow channel, and a heating element. The liquid reservoir stores an atomizing matrix. The airflow channel allows the atomized gas formed after heating the atomizing matrix to flow through it. The airflow channel extends axially along the electronic atomizer. The heating element includes a substrate having a liquid-absorbing surface and an atomizing surface disposed opposite to each other in its thickness direction. The substrate has multiple liquid-guiding holes. The liquid-guiding holes connect the liquid reservoir and the airflow channel, and guide the atomizing matrix from the liquid reservoir through the liquid-absorbing surface to the atomizing surface. The heating element further includes a heating element for heating and atomizing the atomizing matrix guided to the atomizing surface. The liquid-absorbing surface and the atomizing surface are arranged at an angle, the atomizing surface is inclined relative to the axial direction of the airflow channel, and the axis of the liquid-guiding holes is inclined relative to the radial direction of the airflow channel.

[0007] In one embodiment, the atomizing surface is tilted at an angle of 5° to 15° relative to the axial direction of the airflow channel, and / or the axis of the liquid guiding hole is tilted at an angle of 5° to 15° relative to the radial direction of the airflow channel.

[0008] In one embodiment, the axis of the liquid guiding orifice is perpendicular to the atomizing surface.

[0009] In one embodiment, the electronic atomizer has opposing top and bottom along the axial direction of the airflow channel, and the top has a mouthpiece; the distance between the atomizing surface and the axis of the airflow channel gradually decreases along the direction from the bottom to the top.

[0010] In one embodiment, the distance between the liquid-absorbing surface and the atomizing surface gradually increases along the direction from the bottom to the top.

[0011] In one embodiment, the diameter of each of the liquid guiding holes is the same; or, the diameter of each of the liquid guiding holes gradually increases along the direction from the bottom to the top.

[0012] In one embodiment, the spacing between each of the liquid guiding holes is the same; or, the spacing between each of the liquid guiding holes gradually increases along the direction from the bottom to the top.

[0013] In one embodiment, the substrate includes a receiving groove in which the heating element is embedded; or, at least a portion of the atomizing surface of the substrate has conductive heating capability to serve as the heating element.

[0014] In one embodiment, the substrate includes an intrinsic silicon substrate, and the atomizing surface is disposed on the intrinsic silicon substrate; wherein, the heating element is a doped conductive silicon substrate, the intrinsic silicon substrate has the receiving groove on the atomizing surface, and the conductive silicon substrate is embedded in the receiving groove; or, the heating element is a conductive silicon layer formed by doping on the atomizing surface.

[0015] In one embodiment, the substrate further includes a bonding substrate, which is made of glass, ceramic, or quartz. The bonding substrate is disposed on the surface of the intrinsic silicon substrate away from the heating element. The intrinsic silicon substrate has a plurality of first liquid guiding holes, and the bonding substrate has a plurality of second liquid guiding holes that are aligned one-to-one with the plurality of first liquid guiding holes. A first liquid guiding hole and a second liquid guiding hole that are aligned with each other together constitute the liquid guiding through hole.

[0016] To solve the above-mentioned technical problems, the second technical solution provided in this application is:

[0017] An electronic atomizing device includes a power supply device and the aforementioned electronic atomizer, wherein the power supply device is connected to the electronic atomizer.

[0018] The beneficial effects of this application are:

[0019] Unlike existing technologies, the electronic atomizing device provided in this application, which includes such an electronic atomizer, uses a heating element to generate heat and transfer it to the substrate. The atomizing matrix is ​​guided from the substrate to the heating element via capillary action through a liquid-guiding orifice for atomization, thereby generating an atomized gas, such as an aerosol. The aerosol is ejected from the liquid-guiding orifice, combines with the airflow in the airflow channel, and is carried out for the user to inhale. Because the axis of the liquid-guiding orifice is radially inclined relative to the airflow channel, the aerosol ejected from the liquid-guiding orifice has a total velocity that is radially inclined relative to the airflow channel. This total velocity has a radial component (i.e., lateral velocity) and an axial component (i.e., vertical velocity) along the airflow channel. This effectively reduces the lateral velocity of the aerosol, making it less likely for large-diameter aerosol particles to impact the wall surface, allowing them to better combine with the airflow in the airflow channel and be carried out, thereby improving aerosol transmission efficiency, atomization efficiency, and user experience. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein:

[0021] Figure 1 This is a three-dimensional structural schematic diagram of an embodiment of the electronic atomizer provided in this application;

[0022] Figure 2 yes Figure 1 Schematic diagram of section AA;

[0023] Figure 3 yes Figure 1 Schematic diagram of the BB section;

[0024] Figure 4 This is a three-dimensional structural schematic diagram of an embodiment of the heating component in the electronic atomizer provided in this application;

[0025] Figure 5 yes Figure 4 The main view of the heating component;

[0026] Figure 6A yes Figure 4 A schematic diagram showing the split structure of an embodiment of a heating component;

[0027] Figure 6Byes Figure 4 A schematic diagram showing the split structure of another embodiment of the heating component;

[0028] Figure 7 yes Figure 4 A cross-sectional view of the substrate in the heating element along the axial direction of the electronic atomizer;

[0029] Figure 8 It is a simulation diagram of aerosol transport;

[0030] Figure 9 This is a front view of yet another embodiment of the heating component in the electronic atomizer provided in this application;

[0031] Figure 10 This is a three-dimensional structural schematic diagram of another embodiment of the heating component in the electronic atomizer provided in this application;

[0032] Figure 11 yes Figure 10 An exploded view of the heating element.

[0033] Explanation of reference numerals in the attached figures:

[0034] Electronic atomizer 10; heating element 100; substrate 110; receiving tank 1100; liquid guiding hole 111; liquid absorption surface 110a; atomizing surface 110b; intrinsic silicon substrate 112; first liquid guiding hole 1120; bonding substrate 113; second liquid guiding hole 1130; heating element 120; first electrode 131; second electrode 132; top 11; bottom 12; nozzle 13; housing 14; liquid storage chamber 200; lower liquid chamber 201; airflow channel 300; axial direction R1; axial direction R2; thickness direction T; first extension direction E1; second extension direction E2. Detailed Implementation

[0035] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0036] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0037] This application provides an electronic atomizer. In one embodiment, please refer to [link to embodiment]. Figures 1 to 3 , Figure 1 This is a three-dimensional structural schematic diagram of an embodiment of the electronic atomizer provided in this application. Figure 2 yes Figure 1 Schematic diagram of section AA in the middle. Figure 3 yes Figure 1 A cross-sectional schematic diagram of the middle BB shows that the electronic atomizer 10 includes a liquid storage chamber 200, an airflow channel 300, and a heating element 100.

[0038] The liquid reservoir 200 is used to store the atomizing matrix, which can be a flavored liquid. After being heated and atomized, the atomizing matrix can produce flavor substances such as aerosols for the user to inhale. Specifically, the electronic atomizer 10 includes a housing 14, and the liquid reservoir 200 is disposed within the housing 14.

[0039] The airflow channel 300 extends along the axial direction R1 of the electronic atomizer 10. The airflow channel 300 allows the atomized gas formed after the atomizing matrix is ​​heated to circulate. When the user inhales, airflow is generated within the airflow channel 300. The aerosol generated after the atomizing matrix is ​​heated and atomized can combine with the airflow within the airflow channel 300, thus allowing the user to inhale. Specifically, the airflow channel 300 can be located inside the liquid storage chamber 200. For example, the liquid storage chamber 200 can be an annular cavity, and it is arranged around the airflow channel 300. Furthermore, the central axis of the airflow channel 300 coincides with or is parallel to the central axis of the liquid storage chamber 200. Figure 2 and Figure 3 This illustration shows the case where the central axis of the airflow channel 300 coincides with the central axis of the liquid storage chamber 200. Of course, the relative positional relationship between the airflow channel 300 and the liquid storage chamber 200 is not limited to this. Figure 2 and Figure 3 As just one example, the airflow channel 300 can also be located outside the liquid storage chamber 200.

[0040] The heating element 100 is used to convert the atomized matrix into an aerosol. The heating element 100 provided in this embodiment can be a heating element based on Micro-Electro-Mechanical Systems (MEMS). MEMS is based on microelectronics, micromechanics, and materials science, researching, designing, and manufacturing micro-devices with specific functions, including microstructure devices, microsensors, microactuators, micromechanical optical devices, and microsystems. MEMS fabrication technology was developed based on traditional microelectronics fabrication technology (also known as integrated circuit (IC) technology), and later, some unique technologies for fabricating micromechanical components were developed. These unique technologies, combined with conventional integrated circuit processes, realize MEMS; these technologies are collectively referred to as micromachining technology. The heating element 100 of this application is fabricated based on MEMS technology, miniaturized, small in size, and capable of rapid temperature rise.

[0041] Please see Figures 4 to 6B , Figure 4 This is a three-dimensional structural schematic diagram of an embodiment of the heating component 100 in the electronic atomizer 10 provided in this application. Figure 5 yes Figure 4 Main view of the heating component 100 Figure 6A yes Figure 4 A schematic diagram showing the split structure of an embodiment of the heating component 100. Figure 6B yes Figure 4 A split structural diagram of another embodiment of the heating element 100 is shown. The heating element 100 includes a substrate 110, which may be a dense substrate, such as a silicon, glass, ceramic or quartz sheet.

[0042] The substrate 110 has a liquid-absorbing surface 110a and an atomizing surface 110b arranged opposite to each other in the thickness direction T. The substrate 110 is provided with a plurality of liquid-guiding holes 111, which can be circular holes. The liquid-guiding holes 111 connect the liquid storage cavity 200 and the airflow channel 300. The liquid-guiding holes 111 are used to guide the atomized matrix from the liquid storage cavity 200 through the liquid-absorbing surface 110a to the atomizing surface 110b. Therefore, the main function of the substrate 110 in the heating element 100 is to absorb the atomized matrix in the liquid storage cavity 200 and guide the atomized matrix through liquid. The liquid-guiding holes 111 are micropores with a pore size on the micrometer scale. They can draw the atomized matrix in the liquid storage cavity 200 from the liquid-absorbing surface 110a of the substrate 110 into the interior of the substrate 110 and guide it to the atomizing surface 110b of the substrate 110 through capillary action.

[0043] The housing 14 may also be provided with a lower liquid chamber 201, in which the atomized matrix in the liquid storage chamber 200 can flow into the lower liquid chamber 201 and be absorbed by the substrate 110.

[0044] The heating assembly 100 also includes a heating element 120, which is disposed on the atomizing surface 110b. Figure 6A (as shown), or, at least a portion of the substrate 110 on the atomizing surface 110b has conductive heating capability to serve as a heating element 120. Figure 6B As shown, the heating element 120 is used to heat and atomize the atomizing substrate that is guided to the atomizing surface 110b. The heating element can be powered by a power supply device. When the heating element 120 is powered on, the heating element 120 heats up itself and guides the atomizing substrate from the substrate 110 to the position of the heating element 120 for atomization through the capillary action of the liquid guiding hole 111.

[0045] The liquid-absorbing surface 110a and the atomizing surface 110b are arranged at an angle. The atomizing surface 110b is inclined relative to the axial direction R2 of the airflow channel 300, and the axis of the liquid-guiding hole 111 is inclined relative to the radial direction of the airflow channel 300. The angle between the liquid-absorbing surface 110a and the atomizing surface 110b means that they are not parallel, but have an angle greater than zero degrees. Similarly, the inclination of the atomizing surface 110b relative to the axial direction R2 of the airflow channel 300 means that they are not parallel, but have an angle greater than zero degrees. Likewise, the inclination of the axis of the liquid-guiding hole 111 relative to the radial direction of the airflow channel 300 means that the axis of the liquid-guiding hole 111 is not parallel to the radial direction of the airflow channel 300, but has an angle greater than zero degrees.

[0046] Please see Figure 7 , Figure 7 yes Figure 4 The heating component is a cross-sectional view of the substrate 110 along the axial direction R1 of the electronic atomizer 10. In this application, the axis of the liquid guiding hole 111 is set to be radially inclined relative to the airflow channel 300, and the tilt angle α of the axis of the liquid guiding hole 111 relative to the radial direction of the airflow channel 300 is set to be the tilt angle β of the atomizing surface 110b relative to the axial direction R2 of the airflow channel 300.

[0047] Let the total velocity of the aerosol ejected from the liquid guiding orifice 111 be the inclined velocity v. total The tilting speed v total It has a radial component along the airflow channel 300 (lateral velocity v) horizontal ) and the component of axial R2 along the airflow channel 300 (vertical velocity v) vertical ), and the tilting speed v total Lateral velocity v horizontal With vertical velocity v vertical The relationship between them is: And v horizontal=cosα*v total Therefore, the lateral velocity v horizontal It must be less than the tilt velocity v total ,

[0048] In related technologies, the axis of the liquid guiding hole 111 is set parallel to the radial direction of the airflow channel 300. Therefore, the lateral velocity of the aerosol ejected from the liquid guiding hole 111 is the total velocity. However, in this application, the axis of the liquid guiding hole 111 is set inclined relative to the radial direction of the airflow channel 300. Therefore, the lateral velocity of the aerosol ejected from the liquid guiding hole 111 is the radial component of the total velocity. Thus, the lateral velocity is smaller than the total velocity. Therefore, this application can effectively reduce the lateral velocity of the aerosol, making the generated aerosol easier to be carried by the airflow, thereby reducing the possibility of wall collision.

[0049] Please see Figure 8 , Figure 8 It is a simulation diagram of aerosol transport. Figure 8 In Figure (a), the direction of the aerosol ejected from the liquid guiding orifice 111 is parallel to the radial direction of the airflow channel 300. Figure 8 In diagram (b), the direction of the aerosol ejected from the liquid guiding orifice 111 is inclined radially relative to the airflow channel 300, and... Figure 8 The middle line indicates the direction of airflow. Figure 8 The black particles represent aerosol solid particles. It can be seen that by using the liquid guiding hole 111 in the radial direction relative to the airflow channel 300, the risk of aerosol collision with the wall is reduced, and the atomization efficiency is improved by about 25%.

[0050] In one embodiment, the inclination angle β of the atomizing surface 110b relative to the axial direction R2 of the airflow channel 300 is 5° to 15°, and / or, the inclination angle α of the axis of the liquid guiding hole 111 relative to the radial direction of the airflow channel 300 is 5° to 15°. Within the inclination angle range of 5° to 15°, the lateral velocity of the aerosol ejected from the liquid guiding hole 111 can be effectively reduced, while also preventing the atomizing surface 110b from excessively obstructing the airflow within the airflow channel 300. It is understood that in other embodiments, the inclination angle β of the atomizing surface 110b relative to the axial direction R2 of the airflow channel 300, and the inclination angle α of the axis of the liquid guiding hole 111 relative to the radial direction of the airflow channel 300, can also be other values.

[0051] In one embodiment, the liquid absorption surface 110a is arranged parallel to the axial direction R2 of the airflow channel 300, and both the liquid absorption surface 110a and the atomizing surface 110b are planar. It can be understood that in other embodiments, the liquid absorption surface 110a may also be inclined relative to the axial direction R2 of the airflow channel 300, and the liquid absorption surface 110a and the atomizing surface 110b may also be curved surfaces.

[0052] In one embodiment, the liquid guiding hole 111 is perpendicular to the atomizing surface 110b. Therefore, the tilt angle β of the atomizing surface 110b relative to the axial direction R2 of the airflow channel 300 is the same as the tilt angle α of the axis of the liquid guiding hole 111 relative to the radial direction of the airflow channel 300. In this embodiment, with the liquid absorption surface 110a arranged parallel to the axial direction R1 of the electronic atomizer 10 and the atomizing surface 110b arranged inclined relative to the axial direction R1 of the electronic atomizer 10, the liquid guiding hole 111 being perpendicular to the atomizing surface 110b makes the processing of the liquid guiding hole 111 easier and also minimizes the influence of the atomizing surface 110b on the aerosol ejected from the liquid guiding hole 111. It is understood that in other embodiments, the liquid guiding hole 111 may not be perpendicular to the atomizing surface 110b, that is, the tilt angle α and the tilt angle β are different. However, as long as the axis of the liquid guiding hole 111 is tilted relative to the axial direction of the airflow channel 300, the risk of the aerosol ejected from the liquid guiding hole 111 hitting the wall can be reduced.

[0053] See again Figure 7 Furthermore, along the direction from bottom 12 to top 11, the distance between the atomizing surface 110b and the axis of the airflow channel 300 gradually decreases. In this embodiment, the substrate 110 has a wedge-shaped structure with a larger thickness at the top and a smaller thickness at the bottom. When the user inhales, the airflow in the airflow channel 300 can fully contact the atomizing surface 110b, while the atomizing surface 110b does not affect the movement of the airflow in the airflow channel 300. It can be understood that in other embodiments, along the direction from bottom 12 to top 11, the distance between the atomizing surface 110b and the axis of the airflow channel 300 can also gradually increase, which can also make the direction of the aerosol ejected from the liquid guiding hole 111 inclined, reducing the risk of aerosol hitting the wall.

[0054] In one embodiment, the distance between the liquid-absorbing surface 110a and the atomizing surface 110b gradually increases along the direction from the bottom 12 to the top 11. Furthermore, the liquid-absorbing surface 110a can be arranged parallel to the axial direction R2 of the airflow channel 300. In this embodiment, the substrate 110 has a wedge-shaped structure with a larger thickness at the top and a smaller thickness at the bottom; or, along the direction from the bottom 12 to the top 11, the distance between the liquid-absorbing surface 110a and the axis of the airflow channel 300 gradually increases, and the thickness of the substrate 110 also has a larger thickness at the top and a smaller thickness at the bottom.

[0055] Furthermore, the substrate 110 is defined with a first extending direction E1 and a second extending direction E2. The thickness direction T, the first extending direction E1, and the second extending direction E2 are mutually perpendicular. The thickness direction T is perpendicular to the axial direction R1 of the electronic atomizer 10, and the first extending direction E1 is parallel to the axial direction R1 of the electronic atomizer 10. The substrate 110 extends along the first extending direction E1 and also extends along the second extending direction E2. Along the second extending direction E2, the distance between the liquid absorption surface 110a and the atomizing surface 110b remains consistent. In this embodiment, the distance between the liquid absorption surface 110a and the atomizing surface 110b remains consistent along the second extending direction E2, that is, the axial cross-section of the substrate 110 remains consistent. Therefore, the diameter of each liquid guiding hole 111 distributed along the second extending direction E2 on the substrate 110 can be set to be the same, thus achieving consistent liquid supply capacity of the substrate 110 along the second extending direction E2. This makes the processing of the substrate 110 and its liquid guiding holes 111 more convenient. It is understood that in other embodiments, the distance between the liquid absorption surface 110a and the atomizing surface 110b along the second extending direction E2 may not be consistent.

[0056] In this application, the diameter, spacing and arrangement of each liquid guiding hole 111 on the substrate 110 can be varied, and will be described in detail below.

[0057] In one embodiment, see Figure 9 , Figure 9 This is a front view of another embodiment of the heating component 100 in the electronic atomizer 10 provided in this application. In this embodiment, the diameter of each liquid guiding hole 111 on the substrate 110 is the same. Furthermore, the hole spacing of each liquid guiding hole 111 on the substrate 110 is the same. Specifically, the hole spacing in the first extending direction E1 is the first hole spacing, and the hole spacing in the second extending direction E2 is the second hole spacing. Along the direction from the bottom 12 to the top 11, the first hole spacing and the second hole spacing are the same. It can be understood that in other embodiments, the diameter of each liquid guiding hole 111 on the substrate 110, as well as the first hole spacing and the second hole spacing, may not be the same.

[0058] In another embodiment, see again Figures 3 to 5 Along the axial direction R1 of the electronic atomizer 10, the electronic atomizer 10 has a top 11 and a bottom 12, and the top 11 has a mouthpiece 13 for the user to perform inhalation. The mouthpiece 13 can communicate with the airflow channel 300. A plurality of liquid guiding holes 111 on the base 110 are arranged at least along the axial direction R1 of the electronic atomizer 10. Furthermore, along the direction from the bottom 12 to the top 11, the diameter of the liquid guiding holes 111 gradually increases, and the distance between the liquid absorption surface 110a and the atomizing surface 110b also gradually increases.

[0059] In related technologies, the diameter of the liquid guiding holes 111 of the heating element 100 is mostly the same. In actual use, especially when the heating element 100 is placed vertically, that is, when the heating element 100 is placed parallel to the axial direction R1 of the electronic atomizer 10, the lower holes are supplied with liquid not only due to capillary action but also due to gravity, resulting in a more sufficient liquid supply at the bottom and causing a difference in liquid supply between the top and bottom. This design can easily lead to insufficient liquid supply at the top, thereby affecting the stability of the entire atomization process.

[0060] In this application, the diameter of the liquid guiding holes 111 is designed to be gradient-distributed, that is, along the direction from the bottom 12 to the top 11, the diameter of each liquid guiding hole 111 is gradient-distributed with larger diameter at the top and smaller diameter at the bottom. This can solve the problem of uneven liquid supply caused by the uniform diameter of each liquid guiding hole 111 on the substrate 110 in the related technology.

[0061] The specific analysis is as follows:

[0062] The substrate 110 draws the atomizing matrix into its interior through the capillary action of each liquid guiding hole 111. When the diameter of the liquid guiding holes 111 of the substrate 110 is the same at the top and bottom, the liquid guiding holes 111 at the bottom, i.e. the liquid guiding holes 111 near the bottom 12, are more likely to enter the liquid guiding holes 111 at the bottom due to the gravity of the atomizing matrix itself. Therefore, the liquid supply of the liquid guiding holes 111 at the bottom is more sufficient. However, the liquid supply of the liquid guiding holes 111 at the top, i.e. the top 11, is insufficient, which will affect the stability of the entire atomization process. When the gravity of the atomizing matrix is ​​the same, increasing the pore size of the liquid guiding hole 111 can increase the liquid supply capacity of the liquid guiding hole 111. Therefore, this application sets the pore size of each liquid guiding hole 111 of the substrate 110 to a gradient distribution with larger pore size at the top and smaller pore size at the bottom. This solves the problem of uneven liquid supply caused by the uniform pore size of each liquid guiding hole 111 on the substrate 110 in the related technology. It can ensure that the liquid supply of the heating component 100 is uniform and the atomization process is more stable.

[0063] Furthermore, each liquid guiding hole 111 guides the liquid to the atomizing matrix through its capillary action. The smaller the pore size, the stronger the capillary action and the more difficult the air exchange. In this application, the pore size of each liquid guiding hole 111 in the substrate 110 is distributed in a gradient from top to bottom, which reduces the average air exchange pressure of the substrate 110, improves the overall air exchange capacity of the substrate 110, and improves the atomization efficiency of the atomizing matrix.

[0064] Furthermore, when the pore size of each liquid guiding hole 111 on the substrate 110 is distributed in a gradient from top to bottom, the pore size range of each liquid guiding hole 111 on the substrate 110 is 10 to 120 micrometers. That is, along the direction from the bottom 12 to the top 11, the pore size of each liquid guiding hole 111 gradually increases from 10 micrometers to 120 micrometers.

[0065] In addition to guiding the atomizing matrix through capillary action, each liquid-guiding through-hole 111 also has another important function: liquid locking. The meniscus formed at the edge of the liquid-guiding through-hole 111 by the surface tension of the liquid is the key force for locking the atomizing matrix. Therefore, theoretically, the smaller the diameter of the liquid-guiding through-hole 111, the stronger its liquid locking ability and the stronger its capillary action. Stronger capillary action leads to more difficult air exchange, and smaller diameter leads to a decrease in liquid supply capacity. Therefore, in this embodiment, on the one hand, it is necessary to ensure that the minimum diameter of the liquid-guiding through-hole 111 is small enough to enhance its liquid locking ability, and on the other hand, it is necessary to... To ensure that the pore size of the liquid guiding hole 111 is not too small, thus affecting its liquid supply capacity and air exchange efficiency, this embodiment sets the minimum pore size of the lower liquid guiding hole 111 to 10 micrometers. This ensures that the liquid guiding hole 111 at the bottom of the substrate 110 can achieve strong liquid locking ability to prevent leakage and maintain sufficient liquid supply. The maximum pore size of the upper liquid guiding hole 111 is set to 120 micrometers to ensure sufficient liquid supply and air exchange efficiency. It also prevents insufficient capillary force due to excessively large pore size, which could affect the transport of the atomizing matrix within the liquid guiding hole 111.

[0066] In this embodiment, the pore size range of each liquid guiding hole 111 on the substrate 110 is set to 10-120 micrometers, and the pore size of each liquid guiding hole 111 on the substrate 110 is distributed in a gradient distribution with larger pores at the top and smaller pores at the bottom. This ensures the uniformity of liquid supply from top to bottom, and ensures that the smaller pores at the bottom can lock the atomized matrix to prevent leakage, while the larger pores at the top improve the ventilation efficiency. Through the gradient design of the pore size of each liquid guiding hole 111, the substrate 110 in this embodiment adjusts the capillary force, so that the substrate 110 can maintain sufficient liquid supply while avoiding the problem of ventilation difficulties caused by excessive capillary action.

[0067] In related technologies, when the liquid guiding holes 111 on the substrate 110 have the same pore diameter, in order to ensure the liquid supply capacity and air exchange efficiency, the pore diameter of the liquid guiding holes 111 is usually set at about 35 micrometers, and the pore spacing is about twice the pore diameter. However, in this application, along the direction from the bottom 12 to the top 11, the pore diameter of the liquid guiding holes 111 on the substrate 110 gradually increases from 10 micrometers to 120 micrometers. The minimum pore diameter of the lower liquid guiding holes 111 is smaller than the 35 micrometers of the same pore diameter in related technologies, and the maximum pore diameter of the upper liquid guiding holes 111 is larger than the 35 micrometers of the same pore diameter in related technologies. Therefore, the problem of leakage of the lower liquid guiding holes 111 can be avoided. At the same time, the upper liquid guiding holes 111 can also improve the air exchange efficiency, and the overall liquid supply of the substrate 110 is more sufficient and the air exchange efficiency is higher.

[0068] Furthermore, along the direction from the bottom 12 to the top 11, the spacing between the first holes gradually increases, and / or the spacing between the second holes gradually increases. In this embodiment, the spacing between the first holes and / or the spacing between the second holes is also larger for the larger diameter liquid guiding holes 111, avoiding the problem of uneven liquid supply caused by excessive porosity differences in the large and small diameter areas of the substrate 110, thus further increasing the uniformity of liquid supply to the substrate 110. In addition, in this embodiment, the liquid guiding holes 111 on the substrate 110 can be distributed in rows or not, as long as the diameter of each liquid guiding hole 111 on the substrate 110 gradually increases along the direction from the bottom 12 to the top 11.

[0069] See again Figure 5 In one embodiment, a plurality of liquid guiding holes 111 are arranged in multiple rows, and the row direction is parallel to the second extension direction E2. The diameter of each liquid guiding hole 111 in the same row is the same. Along the direction from the bottom 12 to the top 11, the diameter of the liquid guiding holes 111 in each row gradually increases. Figure 4 and Figure 5 The diagram shows the arrangement of the liquid guiding holes 111 on the substrate 110 in rows.

[0070] In this embodiment, the liquid guiding holes 111 on the substrate 110 are arranged in rows. It can be understood that in other embodiments, the liquid guiding holes 111 on the substrate 110 may not be arranged in rows. Furthermore, this embodiment can ensure that the liquid supply capacity is consistent at all positions in the same row. In addition, the gradient distribution of the upper and lower hole diameters makes the liquid supply uniform both above and below. Therefore, the liquid supply capacity of the substrate 110 on the entire atomizing surface 110b can be kept consistent.

[0071] Furthermore, the spacing between adjacent rows in the first extension direction E1 is the first hole spacing, and the spacing between adjacent liquid guiding holes 111 in the same row is the second hole spacing, and the second hole spacing in the same row is the same; along the direction from the bottom 12 to the top 11, both the first hole spacing and the second hole spacing gradually increase; the liquid guiding holes 111 in two adjacent rows are at least partially staggered in the first extension direction E1.

[0072] In this embodiment, the liquid guiding holes 111 are arranged in rows rather than columns, so that the first hole spacing / second hole spacing between the large-diameter liquid guiding holes 111 is larger, and the first hole spacing / second hole spacing between the small-diameter liquid guiding holes 111 is smaller, thereby maintaining the uniformity of liquid supply to the substrate 110. It is understood that in other embodiments, the first hole spacing and the second hole spacing can also be kept consistent, but it is understood that along the direction from the bottom 12 to the top 11, both the first hole spacing and the second hole spacing gradually increase. Compared to keeping the first hole spacing and the second hole spacing consistent, this makes the liquid supply capacity of the substrate 110 more consistent across the entire atomizing surface 110b.

[0073] In this application, regardless of the diameter, spacing and arrangement of each liquid guiding hole 111 on the substrate 110, as long as the axis of the liquid guiding hole 111 is radially inclined relative to the airflow channel 300, the risk of aerosol ejected from the liquid guiding hole 111 hitting the wall can be reduced.

[0074] See again Figure 4 and Figure 5 In this application, the heating element 120 can be a sheet-like structure that covers a portion of the atomizing surface 110b, and its thickness can be set to 0–10 micrometers. It is understood that since the aerosol generated after the atomizing matrix within the substrate 110 is heated by the heating element 120 needs to escape from the atomizing surface 110b, the heating element 120 should not obstruct the liquid guiding hole 111, allowing the aerosol to escape from the liquid guiding hole 111. When the heating element 120 is a sheet-like structure covering the entire surface, the liquid guiding hole 111 can penetrate the heating element 120. Of course, it is not excluded that the heating element 120 can adopt other shapes, such as strips, filaments, or meshes.

[0075] The heating element 120 can be roughly rectangular in shape, or more specifically, it can be an octagonal structure formed by chamfering the corners of the rectangular sheet. Of course, the heating element 120 can also be in other shapes besides rectangle, such as polygons or circles.

[0076] Corresponding to the shape of the heating element 120, the substrate 110 can be roughly rectangular plate structure. The length of the long side of the rectangle can be 4.7mm, the length of the short side of the rectangle can be 3mm, the thickness of the substrate 110 can be 0.8mm, and the dimensions of the substrate 110 can also be other values. Furthermore, the substrate 110 can also be in other shapes besides rectangles, such as polygons, circles, etc.

[0077] In one embodiment, the substrate 110 includes an intrinsic silicon substrate, where intrinsic silicon refers to a single crystal of silicon with a complete crystal lattice and free of impurities. The heating element 120 is a doped conductive silicon substrate. Intrinsic silicon has weak conductivity, while doped conductive silicon has higher conductivity. Figure 6A As shown, the intrinsic silicon substrate has a receiving groove 1100 on the atomized surface 110b, and the conductive silicon substrate is embedded in the receiving groove 1100; or, as Figure 6B As shown, the heating element 120 is a conductive silicon layer formed by doping the atomized surface 110b of the intrinsic silicon substrate. The formation of the conductive silicon layer by doping can be achieved by ion implantation.

[0078] In this embodiment, when the heating element 120 is a conductive silicon layer formed by doping the atomized surface 110b of the intrinsic silicon substrate, the steps for processing the substrate 110 with liquid guiding vias 111 are as follows: first, ion implantation is performed in a designated area of ​​the atomized surface 110b of the intrinsic silicon substrate to form a heating element 120 with high conductivity, and then each liquid guiding via 111 is processed to form an intrinsic silicon substrate with liquid guiding vias 111.

[0079] Furthermore, in this embodiment, since the heating element 120 is a doped conductive silicon substrate, which is a non-metallic material, compared to metallic materials, which are usually exposed and in direct contact with the atomizing matrix, these exposed metallic elements are very prone to oxidation or metal migration due to the high temperature and complexity of the atomizing matrix composition during the heating process. The result of oxidation or metal migration not only leads to a decrease in heating efficiency, but also to contamination of the atomizing matrix composition, and may cause the risk of heavy metal exceeding the standard. When the heating element 120 is a doped conductive silicon substrate, the risk of metal precipitation is greatly reduced, thereby reducing the possibility of contamination of the atomizing matrix composition during the use of the electronic atomizer 10.

[0080] In one embodiment, see Figure 10 and Figure 11 , Figure 10 This is a three-dimensional structural schematic diagram of another embodiment of the heating component 100 in the electronic atomizer 10 provided in this application. Figure 11 yes Figure 10 The exploded structural diagram of the heating element 100 is shown below. In this embodiment, in addition to the intrinsic silicon substrate 112, the substrate 110 also includes a bonding substrate 113. The bonding substrate 113 can be generally rectangular plate-shaped, but other shapes are not excluded. The bonding substrate 113 is made of glass, ceramic, or quartz. The bonding substrate 113 is disposed on the surface of the intrinsic silicon substrate 112 away from the heating element 120, and the bonding substrate 113 can be fixed to the intrinsic silicon substrate 112 by bonding. The intrinsic silicon substrate 112 has a plurality of first liquid guiding holes 1120, and the bonding substrate 113 has a plurality of second liquid guiding holes 1130 aligned one-to-one with the plurality of first liquid guiding holes 1120. The aligned first liquid guiding holes 1120 and second liquid guiding holes 1130 together constitute a liquid guiding through hole 111. In this embodiment, the substrate 110 includes two substrates, wherein the bonding substrate 113 is made of materials such as glass, ceramic or quartz sheet with lower thermal conductivity. Therefore, the bonding substrate 113 can play a role in heat insulation, so as to prevent the temperature of the atomizing matrix near the liquid absorption surface 110a of the substrate 110 from being too high.

[0081] When the intrinsic silicon substrate 112 is approximately rectangular, the bonding substrate 113 can also be approximately rectangular, and the bonding substrate 113 can completely cover the intrinsic silicon substrate 112. The shape and size of the bonding substrate 113 and the intrinsic silicon substrate 112 can be set to be the same, so that the edges of the bonding substrate 113 and the intrinsic silicon substrate 112 just match. The length of the rectangle of the intrinsic silicon substrate 112 and the bonding substrate 113 can be 4.7 mm, the length of the short side of the rectangle can be 3 mm, the thickness of the intrinsic silicon substrate 112 can be 0.3 mm, and the thickness of the bonding substrate 113 can be 0.5 mm. The dimensions of the intrinsic silicon substrate 112 and the bonding substrate 113 can also be other values, and the intrinsic silicon substrate 112 and the bonding substrate 113 can also have other shapes other than rectangles, such as polygons, circles, etc.

[0082] In this embodiment, when the heating element 120 is a conductive silicon layer formed by doping on the surface of the intrinsic silicon substrate 112 away from the bonding substrate 113, the steps for processing the substrate 110 with liquid guiding holes 111 are as follows: First, ion implantation is performed in a designated area of ​​the atomization surface 110b of the intrinsic silicon substrate 112 to form a heating element 120 with high conductivity. Then, each first liquid guiding hole 1120 is processed to form an intrinsic silicon substrate 112 with first liquid guiding holes 1120. Then, each second liquid guiding hole 1130 is processed on the bonding substrate 113. Finally, the intrinsic silicon substrate 112 and the bonding substrate 113 are connected and fixed by bonding, and each first liquid guiding hole 1120 and each second liquid guiding hole 1130 are aligned one by one to form each liquid guiding hole 111.

[0083] See again Figure 4 and Figure 5 In one embodiment, the heating component 100 further includes a first electrode 131 and a second electrode 132, which are electrically connected to opposite sides of the heating element 120, respectively. The first electrode 131 and the second electrode 132 are provided in this embodiment to facilitate the electrical connection between the power supply device and the heating element 120, thereby enabling power supply to the heating element 120.

[0084] This application also provides an electronic atomizing device, which includes a power supply device and an electronic atomizer 10. The power supply device is connected to the electronic atomizer 10 and is used to supply power to the electronic atomizer 10. The specific structure of the electronic atomizer 10 is as described in the above embodiments. Since this electronic atomizing device adopts all the technical solutions of the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0085] The terms "first," "second," and "third" in this application are used for descriptive purposes only and should not be construed as indicating the number of technical features indicated. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of those features. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationships and movement of the components in a specific orientation (as shown in the figures). If the specific orientation changes, the directional indications will also change accordingly. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0086] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. An electronic atomizer, characterized in that, The electronic atomizer includes: The liquid storage chamber is used to store the atomized matrix; An airflow channel is provided for the flow of atomized gas formed after the atomizing matrix is ​​heated; the airflow channel extends along the axial direction of the electronic atomizer; A heating element includes a substrate; the substrate has a liquid-absorbing surface and an atomizing surface disposed opposite to each other in its thickness direction, and the substrate is provided with a plurality of liquid-guiding holes; the liquid-guiding holes connect the liquid storage cavity and the airflow channel, and the liquid-guiding holes are used to guide the atomizing matrix from the liquid storage cavity through the liquid-absorbing surface to the atomizing surface; The heating assembly further includes a heating element for heating the atomizing matrix that is guided to the atomizing surface; The liquid-absorbing surface and the atomizing surface are arranged at an angle, the atomizing surface is inclined relative to the axial direction of the airflow channel, and the axis of the liquid-guiding through hole is inclined relative to the radial direction of the airflow channel.

2. The electronic atomizer according to claim 1, characterized in that, The atomizing surface is tilted at an angle of 5° to 15° relative to the axial direction of the airflow channel, and / or the axis of the liquid guiding hole is tilted at an angle of 5° to 15° relative to the radial direction of the airflow channel.

3. The electronic atomizer according to claim 1, characterized in that, The axis of the liquid guiding hole is perpendicular to the atomizing surface.

4. The electronic atomizer according to any one of claims 1-3, characterized in that, Along the axial direction of the airflow channel, the electronic atomizer has an opposing top and bottom, and the top has a mouthpiece; along the direction from the bottom to the top, the distance between the atomizing surface and the axis of the airflow channel gradually decreases.

5. The electronic atomizer according to claim 4, characterized in that, Along the direction from the bottom to the top, the distance between the liquid-absorbing surface and the atomizing surface gradually increases.

6. The electronic atomizer according to claim 4, characterized in that, All of the described liquid guiding holes have the same diameter; Alternatively, the diameter of each of the liquid guiding holes gradually increases along the direction from the bottom to the top.

7. The electronic atomizer according to claim 6, characterized in that, The spacing between all the described liquid guiding holes is the same; Alternatively, the spacing between the liquid guiding holes gradually increases along the direction from the bottom to the top.

8. The electronic atomizer according to claim 1, characterized in that, The substrate includes a receiving groove, and the heating element is embedded in the receiving groove; Alternatively, at least a portion of the substrate on the atomizing surface has electrical heating capability to serve as the heating element.

9. The electronic atomizer according to claim 8, characterized in that, The substrate includes an intrinsic silicon substrate, and the atomizing surface is disposed on the intrinsic silicon substrate; wherein, the heating element is a doped conductive silicon substrate, the intrinsic silicon substrate has the receiving groove on the atomizing surface, and the conductive silicon substrate is embedded in the receiving groove; or, the heating element is a conductive silicon layer formed by doping on the atomizing surface.

10. The electronic atomizer according to claim 9, characterized in that, The substrate further includes a bonding substrate, which is made of glass, ceramic or quartz. The bonding substrate is disposed on the surface of the intrinsic silicon substrate away from the heating element. The intrinsic silicon substrate has a plurality of first liquid guiding holes, and the bonding substrate has a plurality of second liquid guiding holes that are aligned one-to-one with the plurality of first liquid guiding holes. A first liquid guiding hole and a second liquid guiding hole that are aligned with each other together constitute the liquid guiding through hole.

11. An electronic atomizing device, characterized in that, It includes a power supply device and an electronic atomizer as described in any one of claims 1-10, wherein the power supply device is connected to the electronic atomizer.

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