Automatic single crystal wafer pasting device

Abstract

The utility model discloses an automatic single crystal wafer pasting device, which relates to the technical field of single crystal wafer pasting devices and comprises a mounting frame, a plurality of mounting grooves are arranged on the mounting frame, pasting columns are detachably mounted in the mounting grooves, and a mounting box is detachably mounted on the mounting frame and used for placing single crystal wafers. And a vibration mechanism is arranged on the mounting frame and is used for uniformly vibrating the mounting frame. By arranging the mounting box to be matched with the vibration mechanism and the negative pressure mechanism, automatic batch operation can be carried out on mounting and taking down of the single crystal wafers, the attaching degree of the single crystal wafers and the fixing grooves is high, time is saved, manual participation is reduced, the product failure probability is reduced, the mold core product quality is guaranteed, and the production efficiency is improved under normal use of the device. The polished single mold core can achieve the stable and high-yield effect, the product quality is effectively guaranteed, the production efficiency is improved, and the production cost is saved.

Description

Technical Field

[0001] This utility model relates to the technical field of single-crystal bonding devices, and in particular to an automatic single-crystal bonding device. Background Technology

[0002] A single-chip wafer is a material used in semiconductors, including integrated circuits and various electronic devices. After being cut, the surface of a single-chip wafer is polished to create a mold core. During the polishing process, the single-chip wafer needs to be fixed in place.

[0003] The existing method of bonding single crystal wafers requires manual bonding and removal, which is time-consuming and labor-intensive. At the same time, manual operation cannot guarantee that the single crystal wafer is completely bonded to the bottom of the fixing groove. After polishing, the parallelism of the mold core does not meet the technical standards of the mold core product, which lowers the pass rate of the mold core product. Utility Model Content

[0004] The main objective of this invention is to provide an automatic single-chip bonding device that can effectively solve the technical problems in the background art.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0006] An automatic single-crystal bonding device includes a mounting frame with multiple mounting slots, bonding posts being detachably mounted in the mounting slots, and a mounting box being detachably mounted on the mounting frame for placing the single crystal.

[0007] The mounting frame is equipped with a vibration mechanism for uniformly vibrating the mounting frame.

[0008] A negative pressure mechanism is provided between the mounting bracket and the adhesive post for adsorbing and blowing out single crystal wafers.

[0009] As a further embodiment of this utility model, the vibration mechanism includes a vibration frame located at the bottom of the mounting frame. The vibration frame and the mounting frame are connected by multiple vibration springs. A motor is fixedly installed inside the vibration frame. An eccentric wheel is fixedly installed on the output shaft of the motor. A circular groove is provided at the bottom of the mounting frame, and the eccentric wheel is slidably connected to the circular groove.

[0010] As a further embodiment of this utility model, the negative pressure mechanism includes a negative pressure hole, which is fixedly installed at the center of the mounting groove. The negative pressure hole is fixedly connected to an air pump via a flexible hose, and a through hole is provided through the center of the adhesive column.

[0011] As a further embodiment of this utility model, the mounting box includes a box body, the box body has multiple mounting holes, and multiple connecting rods are fixedly mounted on the bottom end of the box body.

[0012] As a further embodiment of this utility model, the negative pressure hole and the through hole are adapted to each other, and a filter screen is fixedly installed at the top of the through hole.

[0013] As a further embodiment of this utility model, a sealing plate is fixedly installed inside the through hole, and a sealing block is slidably installed through the sealing plate. T-shaped blocks are fixedly installed at both the upper and lower ends of the sealing block, and the T-shaped blocks are connected to the sealing plate by multiple springs.

[0014] As a further embodiment of this utility model, a fixing groove is fixedly provided at the top of the adhesive column, and the negative pressure hole and the through hole are adapted to each other.

[0015] The beneficial effects of this utility model are as follows:

[0016] By incorporating a mounting box, vibration mechanism, and negative pressure mechanism, the single crystal moves continuously under the vibration of the vibration mechanism during installation, thus entering the fixing groove. Under the action of the negative pressure mechanism, the single crystal is only adsorbed when it is completely in contact with the bottom of the fixing groove; if not adsorbed, it continues to be affected by vibration until it is adsorbed. This results in a high degree of contact between the single crystal and the fixing groove, saving time, reducing manual intervention, lowering the probability of product failure, and ensuring the quality of the mold core product.

[0017] When removing a single crystal chip, the air pump switches from suction to inflation, which blows out the polished single crystal chip. Under the vibration of the box, the single crystal chip is detached from the fixing slot, so that the installation and removal of single crystal chips can be automated in batches, completely avoiding the errors caused by manual operation. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of an automatic single-crystal bonding device according to the present invention;

[0019] Figure 2 This is a schematic diagram of the mounting box structure of an automatic single-chip bonding device according to the present invention;

[0020] Figure 3 This is a schematic diagram of the vibration mechanism of an automatic single-crystal bonding device according to the present invention;

[0021] Figure 4 This utility model relates to an automatic single-chip bonding device. Figure 3 A schematic diagram of the split structure;

[0022] Figure 5 This is a schematic diagram of the bonding column structure of an automatic single-crystal bonding device according to the present invention;

[0023] Figure 6 This is a schematic diagram of the internal structure of the bonding column in an automatic single-crystal bonding device according to this utility model.

[0024] In the diagram: 1. Mounting bracket; 2. Mounting groove; 3. Adhesive post; 4. Fixing groove; 5. Mounting box; 51. Box body; 52. Mounting hole; 53. Connecting rod; 6. Vibration mechanism; 61. Vibration frame; 62. Vibration spring; 63. Eccentric wheel; 64. Motor; 65. Circular groove; 7. Negative pressure mechanism; 71. Negative pressure hole; 72. Air pump; 73. Through hole; 74. Filter screen; 75. T-block; 76. Sealing plate; 77. Sealing block. Detailed Implementation

[0025] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0026] like Figure 1-6 As shown, an automatic single-crystal bonding device includes a mounting frame 1 with multiple mounting slots 2. Bonding posts 3 are detachably mounted within each mounting slot 2, preferably using snap-fit ​​connections or threaded connections. The bonding posts 3 can be freely replaced to accommodate single crystals of different sizes. The mounting slots 2 are arranged in an array, ensuring even distribution of the bonding posts 3 and facilitating subsequent grinding and polishing. A fixing slot 4 is provided at the top of each bonding post 3 for placing the single crystal, ensuring that the single crystal is on the same plane after grinding and polishing.

[0027] In this embodiment, a vibration mechanism 6 is provided on the mounting frame 1 to provide stable planar vibration for the mounting frame 1. The vibration mechanism 6 includes an eccentric wheel 63, which is slidably connected to the circular groove 65 of the mounting frame 1 via an eccentric shaft, so that the rotation of the eccentric wheel 63 causes the mounting frame 1 to vibrate. A motor 64 is fixedly connected to the bottom end of the eccentric wheel 63 to drive the eccentric wheel 63 to rotate. Multiple vibration springs 62 are fixedly connected around the perimeter of the mounting frame 1, and the other end of each vibration spring 62 is fixedly connected to a vibration frame 61. The vibration springs 62 make the vibration operation of the mounting frame 1 more stable. By driving the eccentric wheel 63 to rotate through the motor 64, the mounting frame 1 can be rotated, thereby causing the mounting frame 1 to vibrate in the horizontal direction.

[0028] In this embodiment, the negative pressure mechanism 7 includes a negative pressure hole 71, which is fixedly installed at the center of the mounting groove 2. An air pump 72 is fixedly connected to the negative pressure hole 71 via a flexible hose. The air pump 72 can pump or inflate the negative pressure hole 71, thus placing it in a negative pressure state or a gas impact state. A through hole 73 is provided through the center of the adhesive column 3, and the negative pressure hole 71 can be stably inserted into the through hole 73, forming a passage. When the air pump 72 is working, the single crystal wafer can be adsorbed into the inside of the fixing groove 4 through the flexible hose, negative pressure hole 71, and through hole 73, so that the single crystal wafer is stably adsorbed at the bottom of the fixing groove 4, facilitating subsequent grinding and polishing. Alternatively, the single crystal wafer can be ejected from the fixing groove 4 by the impact of airflow, facilitating the removal of the polished single crystal wafer in one go. A filter screen 74 is fixedly installed at the top of the through hole 73, which can effectively prevent large impurities from entering the through hole 73 and affecting its operation.

[0029] In this embodiment, a sealing plate 76 is fixedly installed inside the through hole 73. A circular hole is formed through the center of the sealing plate 76, and a sealing block 77 is slidably installed inside the circular hole, which can completely block the circular hole. Sealing and communication are achieved by the sealing block 77 detaching from and engaging with the circular hole of the sealing plate 76. T-shaped blocks 75 are fixedly installed at both the upper and lower ends of the sealing block 77. The T-shaped blocks 75 are connected to the sealing block 77 via cylinders, and the diameter of the cylinders is smaller than the diameter of the sealing block 77. This ensures that when the sealing block 77 detaches from the sealing plate 76, the sealing plate 76 is in a connected state, and the through hole 73 is also in a connected state. When the air pump 72 operates, the sealing block 77 detaches from the sealing plate 76, and the through hole 73 becomes connected, allowing for the adsorption and blowing of the single crystal wafer. The T-shaped block 75 and the sealing plate 76 are connected by multiple springs. When the air pump 72 stops working, the sealing block 77 blocks the sealing plate 76 under the elastic force of the spring. When a single crystal is adsorbed, the through hole 73 is still in a negative pressure state, which can adsorb the single crystal. This makes it easy to remove the adhesive post 3 and then polish the single crystal.

[0030] In this embodiment, a mounting box 5 is detachably mounted on the mounting frame 1 to provide space for the installation and removal of the single crystal. The mounting box 5 includes a box body 51 with multiple mounting holes 52 inside. The mounting holes 52 engage with the adhesive posts 3, making the bottom of the box body 51 flush with the top of the adhesive posts 3, facilitating the adsorption and detachment of the single crystal plate. A connecting rod 53 is fixedly connected to the bottom of the box body 51. The connecting rod 53 can be detachably connected to the mounting frame 1, preferably by snap-fit ​​or threaded connection. It should be noted that when threaded connection is used, the connection between the connecting rod 53 and the box body 51 is a rotational connection to avoid motion interference. The detachable connection of the connecting rod 53 makes the installation and removal of the box body 51 more convenient.

[0031] It should be noted that this utility model is an automatic single-crystal bonding device. In use, the box 51 is mounted on the mounting frame 1 via the connecting rod 53, so that the mounting hole 52 engages with the bonding post 3. The single crystal is placed inside the box 51, and the motor 64 is started. The motor 64 drives the eccentric wheel 63 to rotate, thereby causing the mounting frame 1 to vibrate uniformly in the horizontal direction, which in turn causes the box 51 to vibrate synchronously. This causes the single crystal inside the box 51 to vibrate and shift until it falls into the fixing groove 4. The air pump 72 is started to evacuate air, so that the top of the through hole 73 is in a negative pressure state, which allows the single crystal to enter the fixing groove 4 and be adsorbed, so that the single crystal is fixed at the bottom of the fixing groove 4. After all the single crystals are fixed, the motor 64 is stopped, and the vibration stops. Remove the mounting box 5, polish the single crystal, and reinstall the mounting box 5. Change the air pump 72 from suction to blowing to create negative pressure contact. At the same time, the single crystal in the fixing slot 4 can be blown out. The motor 64 works to make the mounting box 5 vibrate continuously until all the single crystal enters the box 51, making it easy to remove in one go.

[0032] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. An automatic single-crystal bonding device, comprising a mounting frame (1), wherein the mounting frame (1) has a plurality of mounting slots (2), and bonding posts (3) are detachably mounted in the mounting slots (2), characterized in that: The mounting frame (1) is detachably mounted with a mounting box (5) for placing a single crystal chip; The mounting frame (1) is provided with a vibration mechanism (6) for uniformly vibrating the mounting frame (1); A negative pressure mechanism (7) is provided between the mounting bracket (1) and the adhesive post (3) for adsorbing and blowing out single crystal wafers.

2. The automatic single-crystal bonding device according to claim 1, characterized in that: The vibration mechanism (6) includes a vibration frame (61), which is located at the bottom of the mounting frame (1). The vibration frame (61) and the mounting frame (1) are connected by multiple vibration springs (62). A motor (64) is fixedly installed inside the vibration frame (61). An eccentric wheel (63) is fixedly installed on the output shaft of the motor (64). A circular groove (65) is opened at the bottom of the mounting frame (1). The eccentric wheel (63) is slidably connected to the circular groove (65).

3. The automatic single-crystal bonding device according to claim 1, characterized in that: The negative pressure mechanism (7) includes a negative pressure hole (71), which is fixedly installed at the center of the mounting groove (2). The negative pressure hole (71) is fixedly connected to an air pump (72) through a hose, and a through hole (73) is opened through the center of the adhesive column (3).

4. The automatic single-crystal bonding device according to claim 1, characterized in that: The mounting box (5) includes a box body (51), which has multiple mounting holes (52) and multiple connecting rods (53) fixedly mounted at the bottom of the box body (51).

5. The automatic single-crystal bonding device according to claim 3, characterized in that: The negative pressure hole (71) and the through hole (73) are adapted to each other, and a filter screen (74) is fixedly installed at the top of the through hole (73).

6. The automatic single-crystal bonding device according to claim 3, characterized in that: A sealing plate (76) is fixedly installed inside the through hole (73), and a sealing block (77) is slidably installed through the sealing plate (76). T-shaped blocks (75) are fixedly installed at both the upper and lower ends of the sealing block (77), and the T-shaped blocks (75) and the sealing plate (76) are connected by multiple springs.

7. The automatic single-crystal bonding device according to claim 3, characterized in that: The top of the adhesive column (3) is fixedly provided with a fixing groove (4), and the negative pressure hole (71) and the through hole (73) are adapted to each other.

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