Chip on film cutting device

Abstract

The chip on film cutting device comprises a driving mechanism, the upper rotating wheel is connected with the driving mechanism, and a plurality of different upper dies are mounted on the upper rotating wheel; the upper rotating wheel and the lower rotating wheel are installed oppositely, a plurality of different lower dies are installed on the side, close to the upper die, of the lower rotating wheel, the sizes of the upper dies and the sizes of the lower dies correspond to each other, and the upper dies can move towards the lower dies under driving of the driving mechanism. And the thin film on the lower die is cut.

Description

Technical Field

[0001] This utility model relates to the field of liquid crystal film production, specifically to a flip-chip film cutting device. Background Technology

[0002] In the LCD panel manufacturing industry, the final display of an LCD panel requires chip-on-film (COF) for driving. COF is a flexible film on which integrated circuits (ICs) are fixed to a flexible circuit board. A flexible additional circuit board is used as a chip packaging carrier to encapsulate the chip and the flexible substrate circuitry. COF is typically shipped in rolls, so in the bonding process, it needs to be cut into sheets using a punching die. Existing COF cutting equipment can only cut films of a fixed size. If other sizes need to be cut, personnel must change to cutting equipment corresponding to the film size, making the overall production process time-consuming and labor-intensive. Utility Model Content

[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a film-coated film cutting device that allows for quick switching between the upper and lower molds, thereby reducing the working time of the workers.

[0004] This utility model provides a film-on-chip cutting device, comprising:

[0005] Drive mechanism;

[0006] An upper rotating wheel is interconnected with the drive mechanism, and multiple different upper molds are mounted on the upper rotating wheel; and

[0007] A lower rotating wheel is mounted opposite to the upper rotating wheel, and multiple different lower dies are mounted on the side of the lower rotating wheel closest to the upper die.

[0008] The dimensions of the plurality of upper dies and the plurality of lower dies correspond to each other. Driven by the driving mechanism, the upper die can move toward the lower die and cut the film located on the lower die.

[0009] In one embodiment, the system further includes at least two driving members, one of which is mounted on the side of the upper rotating wheel away from the upper mold, and the other of which is mounted on the side of the lower rotating wheel away from the lower mold. The driving members are used to drive the upper rotating wheel and the lower rotating wheel to rotate, thereby causing the upper mold and the lower mold to rotate to positions corresponding to each other in size.

[0010] In one embodiment, a positioning device is also included. The positioning device includes a drive motor, a positioning pin, and a positioning hole. The drive motor is mounted on one side of the drive component. One end of the positioning pin is connected to the upper mold, and the positioning hole is disposed on the lower mold. Under the drive of the drive motor, the other end of the positioning pin can be inserted into the positioning hole.

[0011] In one embodiment, the plurality of upper molds include a cutting head and a fixing plate, one side of the fixing plate is fixedly connected to the upper rotating wheel, the cutting head extends and protrudes from the middle of the other side of the fixing plate, and the fixing plate is connected to the positioning pin.

[0012] In one embodiment, the lower molds are hollow in the middle and have an opening. The upper part of the opening is used to place the flip-chip film to be cut. The lower molds are provided with positioning holes for inserting the positioning pins.

[0013] In one embodiment, the positioning pin is elastic and its length is greater than the height of the cutting head.

[0014] In one embodiment, the lower rotating wheel is recessed inward to form a receiving cavity corresponding to the lower mold, and the receiving cavity and the opening of the lower mold are interconnected.

[0015] In one embodiment, the upper mold and the upper rotating wheel are detachably connected and / or

[0016] The lower mold and the lower rotating wheel are detachably connected.

[0017] In one embodiment, the driving mechanism is a telescopic motor, and the output end of the telescopic motor is connected to the upper rotating wheel.

[0018] In one embodiment, the driving component is a rotary motor.

[0019] The flip-chip film cutting device of this application has upper and lower dies of different sizes, which can quickly change the corresponding upper and lower dies according to the size of the film, saving the operator's time. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of a preferred embodiment of the present invention.

[0021] Figure 2 This is a cross-sectional view of the overall structure of a preferred embodiment of the present invention.

[0022] Figure 3 This is an exploded view of the overall structure of a preferred embodiment of the present invention.

[0023] Explanation of main component symbols

[0024] 10. Driving component; 20. Driving mechanism; 30. Upper rotating wheel; 40. Lower rotating wheel; 41. Receiving cavity; 50. Upper mold; 51. Cutting head; 53. Fixing plate; 60. Lower mold; 61. Opening; 70. Positioning device; 71. Drive motor; 73. Positioning pin; 75. Positioning hole; 100. Film-coated film cutting device. Detailed Implementation

[0025] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0026] The following is a reference to the appendix. Figures 1 to 3 The specific embodiments of this utility model will be described in further detail below.

[0027] refer to Figure 1 This application provides a flip-chip film cutting device 100 having an upper mold 50 and a lower mold 60 of various sizes. The upper mold 50 and the lower mold 60 can be rotated and switched according to the size of the film, so that the mutually adapted upper mold 50 and lower mold 60 are located at both ends of the film, thereby cutting the film.

[0028] refer to Figure 1 The flip-chip film cutting device 100 includes a drive member 10, a drive mechanism 20, an upper rotating wheel 30, a lower rotating wheel 40, a positioning device 70, and an upper mold 50 and a lower mold 60 respectively mounted on the upper rotating wheel 30 and the lower rotating wheel 40. The upper mold 50 and the lower mold 60 are arranged opposite to each other, and the drive member 10 is connected to the upper rotating wheel 30 and the lower rotating wheel 40 respectively, thereby driving the upper rotating wheel 30 and the lower rotating wheel 40 to rotate, so that the upper mold 50 and the lower mold 60 correspond to each other. The positioning device 70 further precisely positions the upper mold 50 and the lower mold 60. The drive mechanism 20 is connected to the upper mold 50, and after the upper mold 50 and the lower mold 60 are positioned, it drives the upper mold 50 to move towards the lower mold 60 to cut the film on the lower mold 60.

[0029] Specifically, there are two drive components 10, which are respectively installed on the opposite sides of the upper rotating wheel 30 and the lower rotating wheel 40. The drive components 10 can drive the upper mold 50 and the lower mold 60 to rotate to a fixed position. In this embodiment, the drive component 10 is a rotary motor.

[0030] The drive mechanism 20 is installed on the side of the upper rotating wheel 30 away from the lower rotating wheel 40. Specifically, the drive mechanism 20 is a telescopic motor, the output of which is connected to the drive component 10 near the upper rotating wheel 30. When the upper mold 50 and the lower mold 60 rotate to their corresponding positions, the output of the telescopic motor extends and drives the upper mold 50 downwards (towards the position of the lower mold 60) to cut the film placed on the lower mold 60. When cutting is complete or when a different size upper mold 50 needs to be replaced, the output retracts, causing the upper mold 50 to reset.

[0031] One side of the upper rotating wheel 30 is connected to the drive component 10, and the other side protrudes with multiple upper molds 50 of different sizes. The lower rotating wheel 40 is arranged opposite to the upper rotating wheel 30, and the side of the lower rotating wheel 40 away from the upper rotating wheel 30 is connected to the drive mechanism 20. Multiple lower molds 60 of different sizes are mounted side-by-side on the side of the lower rotating wheel 40 closest to the upper rotating wheel 30. The sizes of the upper molds 50 and the lower molds 60 correspond to each other. In this embodiment, there are four upper molds 50 and four lower molds 60, each representing a different size of upper mold 50 and lower mold 60. Therefore, this cutting device can cut four different sizes of film.

[0032] refer to Figure 2 and Figure 3 The upper mold 50 includes a cutting head 51 and a fixing plate 53. The fixing plate 53 is square, with one side fixedly connected to the upper rotating wheel 30, and the middle of the other side recessed to form a receiving space for accommodating one end of the cutting head 51. The other end of the cutting head 51 can contact the lower mold 60 and cut the film located on the lower mold 60. Thus, when the upper rotating wheel 30 rotates under the drive of the drive member 10, the fixing plate 53 drives the cutting head 51 to rotate synchronously until it stops at the position of the film. Under the drive of the drive mechanism 20, the cutting head 51 moves towards the lower mold 60 to cut the film on the lower mold 60.

[0033] The positioning device 70 includes a drive motor 71, a positioning pin 73, and a positioning hole 75. The drive motor 71 is located on one side of the drive mechanism 20 and is used to drive the positioning pin 73 to move and insert into the positioning hole 75. The positioning pin 73 is located on the fixed plate 53, and the positioning hole 75 is set on the lower mold 60. When the dimensions of the upper mold 50 and the lower mold 60 correspond to each other, under the drive of the drive motor 71, the positioning pin 73 is aligned with the position of the positioning hole 75 and inserted, so that the film is confined in the positioning pin 73 and cut by the cutting head 51.

[0034] In this embodiment, each upper mold 50 has a positioning pin 73 installed on one of the four corners of the fixing plate 53. The positioning pin 73 is elastic and can be compressed. The length of the positioning pin 73 is not less than the height of the cutting head 51. So when the upper mold 50 cuts the film, the positioning pin 73 can be inserted into the positioning hole 75 to ensure that the film is confined within the positioning pin 73 and will not be displaced or deviated significantly due to the impact force of the upper mold 50.

[0035] Specifically, when the flip-chip film cutting device 100 is not started, four positioning pins 73 on one of the fixed plates 53 are inserted into the positioning holes 75, thereby connecting the upper rotating wheel 30 and the lower rotating wheel 40. The positioning pins 73 on the other three fixed plates 53 are separated from the positioning holes 75. When it is necessary to change to an upper mold 50 and a lower mold 60 of other sizes, the drive motor 71 starts to lift the positioning pins 73 inserted into the positioning holes 75. Then, the drive component 10 drives the upper mold 50 and the lower mold 60 to rotate synchronously and move to the area where the film is located. The drive motor 71 drives the positioning pins 73 to insert into the positioning holes 75. Finally, the drive mechanism 20 drives the upper mold 50 to insert into the lower mold 60, thereby realizing the cutting of the film.

[0036] Multiple lower molds 60 protrude from the side of the lower rotating wheel 40 near the upper mold 50 and are square in shape. Positioning holes 75 are provided on the four corners of each mold for connecting positioning pins 73. The middle of the lower mold 60 is hollow to form an opening 61 for placing the film to be cut. When the film needs to be cut, the rolled film is unfolded and placed on the lower mold 60, and the part to be cut is placed on the opening 61. The positioning pins 73 move downward and are inserted into the positioning holes 75. The upper mold 50 aligns with the position of the opening 61 and moves downward to cut the film in the opening 61.

[0037] Furthermore, the lower rotating wheel 40 has a hollow cavity 41 formed near the opening 61 of the lower mold 60. The cavity 41 is connected to the opening 61. After the film is cut at the opening 61 of the lower mold 60, the film can fall into the cavity 41 from the opening 61. After the film is cut, it can be directly taken out from the cavity 41 for further use.

[0038] Furthermore, the upper molds 50 and the upper rotating wheel 30 are detachably connected, as are the lower molds 60 and the lower rotating wheel 40. When a mold is damaged or needs to be replaced with a mold of a different size, the mold can be disassembled and a new mold installed. In this embodiment, the upper molds 50 and the upper rotating wheel 30, and the lower molds 60 and the lower rotating wheel 40 are connected by threads. However, other connection methods are also possible, such as bonding, insertion, or magnetic attraction.

[0039] When the flip-chip film needs to be cut, first start the drive motor 71 to lift the positioning pin 73 inserted in the insertion hole. Then start the drive unit 10 to rotate the upper mold 50 and the lower mold 60 so that the upper mold 50 and the lower mold 60 are rotated to the position of the film and the dimensions of the upper mold 50 and the lower mold 60 correspond to each other. Then place the film above the opening 61 of the lower mold 60. Start the drive motor 71 again so that the positioning pin 73 of the upper mold 50 to be cut is inserted into the positioning hole 75 of the lower mold 60 to position the relative position of the upper mold 50 and the lower mold 60. At the same time, the drive mechanism 20 drives the upper mold 50 to move downward to cut the film on the opening 61 of the lower mold 60. After the film is cut, it falls into the receiving cavity 41 of the lower rotating wheel 40. After the cutting is completed, the film can be taken out from the receiving cavity 41.

[0040] This utility model can be configured by freely combining the above-described embodiments within the scope of the utility model as described in the claims, or by appropriately modifying or omitting a portion of the embodiments.

[0041] The scope of this utility model is not limited to the above description, but is defined by the claims. Therefore, the embodiments described in this specification are merely illustrative and not intended to limit the scope. Thus, all modifications that do not depart from the scope and limits of the claims, as well as content equivalent to the scope and limits of the claims, are included within the scope of the claims.

Claims

1. A flip-chip thin film cutting device, characterized in that... :include Drive mechanism; An upper rotating wheel is interconnected with the drive mechanism, and multiple different upper molds are mounted on the upper rotating wheel; and A lower rotating wheel is mounted opposite to the upper rotating wheel, and multiple different lower dies are mounted on the side of the lower rotating wheel closest to the upper die. The dimensions of the plurality of upper dies and the plurality of lower dies correspond to each other. Driven by the driving mechanism, the upper die can move toward the lower die and cut the film located on the lower die.

2. The flip-chip film cutting device as described in claim 1, characterized in that... : It also includes at least two driving components, one of which is mounted on the side of the upper rotating wheel away from the upper mold, and the other is mounted on the side of the lower rotating wheel away from the lower mold. The driving components are used to drive the upper rotating wheel and the lower rotating wheel to rotate, thereby driving the upper mold and the lower mold to rotate to positions with corresponding dimensions.

3. The flip-chip film cutting device as described in claim 2, characterized in that... : It also includes a positioning device, which includes a drive motor, a positioning pin, and a positioning hole. The drive motor is mounted on one side of the drive component, one end of the positioning pin is connected to the upper mold, and the positioning hole is set on the lower mold. Under the drive of the drive motor, the other end of the positioning pin can be inserted into the positioning hole.

4. The flip-chip film cutting device as described in claim 3, characterized in that... : The plurality of upper molds include a cutting head and a fixing plate. One side of the fixing plate is fixedly connected to the upper rotating wheel. The cutting head extends and protrudes from the middle of the other side of the fixing plate. The fixing plate is connected to the positioning pin.

5. The flip-chip film cutting device as described in claim 3, characterized in that... : The lower molds are hollow in the middle and have openings. The upper part of the openings is used to place the flip-chip film to be cut. The lower molds are provided with positioning holes for inserting positioning pins.

6. The flip-chip film cutting apparatus as described in claim 4, characterized in that... : The positioning pin is elastic and its length is greater than the height of the cutting head.

7. The flip-chip film cutting apparatus as described in claim 5, characterized in that... : The lower rotating wheel is recessed inward to form a receiving cavity corresponding to the lower mold, and the receiving cavity and the opening of the lower mold are interconnected.

8. The flip-chip film cutting apparatus as described in claim 1, characterized in that... : The upper mold and the upper rotating wheel are detachably connected and / or The lower mold and the lower rotating wheel are detachably connected.

9. The flip-chip thin film cutting apparatus as described in claim 1, characterized in that... : The driving mechanism is a telescopic motor, and the output end of the telescopic motor is connected to the upper rotating wheel.

10. The flip-chip film cutting apparatus as described in claim 2, characterized in that... : The driving component is a rotary motor.

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