Winding automatic belt splicing device

Abstract

The utility model relates to an automatic winding and tape splicing device, and relates to the technical field of tape splicing equipment. The device comprises a tape connecting table used for placing a pole piece, the tape connecting table comprises a bottom table, two placing tables, a support, a lifting part and two negative pressure adsorption platforms, the two placing tables are arranged on the surface of the bottom table, one negative pressure adsorption platform is arranged between the placing tables on the two sides, the support is arranged on the surface of the bottom table, the top end of the support is bent, and the lifting part is arranged on the bottom table. The bent part of the support is located above the lower negative pressure adsorption platform, the lifting piece is arranged on the bottom wall of the bent part of the support, and the other negative pressure adsorption platform is arranged at the movable end of the lifting piece. The automatic tape splicing device has the effect of realizing the automatic tape splicing work of the pole pieces.

Description

Technical Field

[0001] This application relates to the field of tape splicing equipment technology, and in particular to an automatic tape splicing device for winding. Background Technology

[0002] Die-cutting and winding is a crucial step in the die-cutting process, involving the neat and tight winding of the die-cut material for subsequent processing or use. In the die-cutting process, parameters such as winding tension, winding speed, and winding accuracy all significantly affect the winding quality. In existing technologies, the scrap material removed during the die-cutting and winding process has a long disposal time, uneven cuts, and is difficult to recycle and rewind. Furthermore, manual splicing is inefficient. Therefore, this application proposes an automatic splicing device for winding to achieve rapid splicing of scrap sheets. Utility Model Content

[0003] In order to achieve automatic splicing of electrode sheets, this application provides an automatic splicing device for winding.

[0004] The automatic tape splicing device for winding provided in this application adopts the following technical solution:

[0005] An automatic tape-splitting device for winding includes a tape-splitting platform for placing electrode sheets. The tape-splitting platform includes a base, two placement platforms, a support, a lifting component, and two negative pressure adsorption platforms. Both placement platforms are disposed on the surface of the base. One of the negative pressure adsorption platforms is disposed between the two placement platforms. The support is disposed on the surface of the base, with its top end bent. The bent portion of the support is located above the lower negative pressure adsorption platform. The lifting component is disposed on the bottom wall of the bent portion of the support. The other negative pressure adsorption platform is disposed on the movable end of the lifting component.

[0006] By adopting the above technical solution, two electrodes that need to be joined are placed on the corresponding placement platform surface, and the adjacent ends of the two electrodes are placed on the surface of the negative pressure adsorption platform below. The negative pressure adsorption platform clamps the electrodes, and the adhesive tape for joining is placed on the negative pressure adsorption platform above. The lifting component drives the negative pressure adsorption platform to descend, and the adhesive tape reaches the interface of the electrodes on both sides. Under the downward pressure of the lifting component, the electrodes are bonded. Compared with the manual joining method, the joining device of this application has a higher degree of automation and can effectively improve the joining efficiency.

[0007] Optionally, the bottom wall of the bracket is provided with a sensor for detecting the position of the electrode plates on the two side placement platforms.

[0008] By adopting the above technical solution, the sensor can detect the adjacent interfaces of the two electrode plates to determine whether the interface is located at the tape on the negative pressure adsorption platform above, thereby improving the accuracy of subsequent tape splicing.

[0009] Optionally, the surface of the placement platform is provided with an adjustment groove, which is opened along the length of the placement platform. A belt mechanism is provided in the adjustment groove, and the belt mechanism is communicatively connected to the sensor.

[0010] By adopting the above technical solution, the belt mechanism can adjust the position of the electrode based on the sensor detection results, which further improves the automation performance of the belt splicing device of this application and enhances the convenience and efficiency of the belt splicing process.

[0011] Optionally, the surface of the belt mechanism is provided with anti-slip texture.

[0012] By adopting the above technical solution, the anti-slip texture can effectively increase the friction between the electrode and the belt mechanism, thereby enabling the belt mechanism to stably drive the electrode to adjust its position and improve the accuracy of belt connection.

[0013] Optionally, an adjusting cylinder is provided on each of the two sides of the placement platform along its length, with the piston rods of the adjusting cylinders on both sides facing each other, and an alignment plate provided on the end wall of the piston rod of the adjusting cylinder.

[0014] By adopting the above technical solution and setting an adjusting cylinder and an alignment plate, the electrode sheets can be aligned in the center, thereby ensuring that the electrode sheets on both sides can be accurately connected. This makes the splicing process more precise and improves the quality of the spliced ​​products.

[0015] Optionally, the negative pressure adsorption platform sidewall of the lifting component is provided with a connecting rod, the connecting rod is arranged along the length direction of the placement platform, and a pressing plate is provided at the end of the connecting rod.

[0016] By adopting the above technical solution and setting up connecting rods and clamping plates, the stability of the electrode plates on the placement table surface can be improved during the tape splicing process. Due to the existence of the lifting components, there is no need to set up additional power components, which can effectively save costs and improve the economic efficiency of the tape splicing process.

[0017] Optionally, the pressing plate has several sliding holes extending through it along its thickness direction. A buffer rod is slidably connected in each sliding hole. A buffer plate is provided at the bottom end of the buffer rod. A buffer spring is sleeved on the peripheral wall of the buffer rod between the pressing plate and the buffer plate. The buffer spring abuts against the bottom wall of the pressing plate and the surface of the buffer plate.

[0018] By adopting the above technical solution, when the pressing plate descends with the negative pressure adsorption platform above, the buffer plate contacts the electrode sheet before the negative pressure adsorption platform. As the negative pressure adsorption platform above continues to descend, the buffer spring is gradually compressed and simultaneously presses against the electrode sheet on the placement platform to improve the stability of the electrode sheet during the bonding process, thereby improving the quality and effect of the bonding work.

[0019] Optionally, the buffer rod is provided with an anti-detachment piece at one end above the pressure plate, and the diameter of the anti-detachment piece is larger than the diameter of the sliding hole.

[0020] By adopting the above technical solution, the anti-detachment plate can prevent the buffer rod and buffer plate from falling off the pressure plate, thereby improving the overall stability.

[0021] In summary, this application includes at least one of the following beneficial technical effects:

[0022] 1. Place the two electrodes to be joined on the corresponding placement platform surface, with the adjacent ends of the two electrodes placed on the negative pressure adsorption platform surface below. The negative pressure adsorption platform clamps the electrodes. Place the adhesive tape for joining on the negative pressure adsorption platform above. The lifting component drives the negative pressure adsorption platform to descend, and the adhesive tape reaches the interface of the electrodes on both sides. Under the downward pressure of the lifting component, the electrodes are bonded. Compared with the manual joining method, the joining device of this application has a higher degree of automation and can effectively improve the joining efficiency.

[0023] 2. The sensor is set to detect the adjacent interfaces of the two side electrodes to determine whether the interface is located on the tape on the negative pressure adsorption platform above, thereby improving the accuracy of subsequent tape splicing.

[0024] 3. The belt mechanism can adjust the position of the electrode based on the sensor detection results, which further improves the automation performance of the belt splicing device of this application and enhances the convenience and efficiency of the belt splicing process. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the structure of an automatic winding and splicing device according to an embodiment of this application.

[0026] Figure 2 This is a schematic diagram of the receiving platform in an embodiment of this application.

[0027] Explanation of reference numerals in the attached drawings: 1. Belt receiving platform; 2. Base platform; 3. Placement platform; 4. Support; 5. Lifting component; 6. Negative pressure adsorption platform; 7. Sensor; 8. Adjustment groove; 9. Belt mechanism; 10. Anti-slip texture; 11. Adjustment cylinder; 12. Alignment plate; 13. Connecting rod; 14. Pressing plate; 15. Sliding hole; 16. Buffer rod; 17. Buffer plate; 18. Buffer spring; 19. Anti-detachment plate. Detailed Implementation

[0028] The following is in conjunction with the appendix Figure 1-2 This application will be described in further detail.

[0029] This application discloses an automatic tape take-up device. (Refer to...) Figure 1 and Figure 2 The assembly includes a tape receiving platform 1, which comprises a base 2, two placement platforms 3, a support 4, a lifting component 5, and two negative pressure adsorption platforms 6. The two placement platforms 3 are arranged in a straight line on the surface of the base 2. One negative pressure adsorption platform 6 is located between the two placement platforms 3. The support 4 is arranged vertically on the surface of the base 2, with its top end bent horizontally. The bent part is located above the negative pressure adsorption platform 6. The lifting component 5 is located on the bottom wall of the bent part of the support 4. The other negative pressure adsorption platform 6 is connected to the movable end of the lifting component 5. The two negative pressure adsorption platforms 6 are arranged in the same vertical direction. The upper negative pressure adsorption platform 6 is used to adsorb the tape for bonding the two electrode sheets.

[0030] Reference Figure 1 A sensor 7 is installed on the bottom wall of the bent part of the bracket 4. The sensor 7 is used to detect the position of the electrode on the surface of the lower placement platform 3, thereby determining whether the electrode on both sides is placed accurately. An adjustment groove 8 is opened on the surface of the placement platform 3. The adjustment groove 8 is opened along the length of the placement platform 3. A belt mechanism 9 is installed in the adjustment groove 8. The belt mechanism 9 is communicatively connected to the sensor 7. Based on the detection result of the sensor 7, the belt mechanism 9 will be activated to drive the electrode to adjust its position left and right so that the interface of the electrode comes to the preset position. In this embodiment, in order to improve the stability of the electrode movement, the surface of the belt mechanism 9 is provided with several anti-slip textures 10 to improve the friction between the electrode and the belt mechanism 9.

[0031] Reference Figure 1 An adjusting cylinder 11 is provided on each of the two sides of the placement platform 3 along its length. The two adjusting cylinders 11 are arranged facing each other. An alignment plate 12 is provided on the piston rod end wall of the adjusting cylinder 11. The two alignment plates 12 are used to center and align the electrode plates on the surface of the belt mechanism 9, thereby improving the accuracy of docking.

[0032] Reference Figure 1The negative pressure adsorption platform 6, mounted on the lifting component 5, has connecting rods 13 on both sides of the sidewalls near the placement platform 3. The connecting rods 13 are positioned along the length of the placement platform 3, and a pressing plate 14 is located at the other end of each connecting rod 13. The pressing plate 14 has several sliding holes 15 extending through it along its thickness. A buffer rod 16 is slidably connected within each sliding hole 15. A buffer plate 17 is located at the bottom end of the buffer rod 16. A buffer spring 18 is fitted around the periphery of the buffer rod 16 between the buffer plate 17 and the pressing plate 14. 18 abuts between the buffer plate 17 and the pressing plate 14. Under the action of the buffer spring 18, the buffer plate 17 maintains a downward movement trend. When the buffer spring 18 is in a relaxed state, the bottom end of the buffer plate 17 is lower than the bottom end of the negative pressure adsorption platform 6 on the lifting component 5, so as to press the electrode sheet and improve the stability of the tape splicing process. In this embodiment, the end wall of the buffer rod 16 located at the upper end of the pressing plate 14 is provided with an anti-detachment piece 19. The diameter of the anti-detachment piece 19 is larger than the diameter of the sliding hole 15 to prevent the buffer plate 17 from falling off.

[0033] The implementation principle of the automatic tape splicing device of this application is as follows: two electrodes to be joined are placed on the surface of the corresponding placement platform 3, with the adjacent ends of the two electrodes placed on the surface of the negative pressure adsorption platform 6 below. The negative pressure adsorption platform 6 clamps the electrodes. The tape for splicing is placed on the negative pressure adsorption platform 6 above. The sensor 7 detects the placement position of the electrodes on both sides. The belt mechanism 9 drives the belt mechanism 9 to run based on the detection result of the sensor 7 to adjust the position of the electrodes. The lifting component 5 drives the negative pressure adsorption platform 6 above to descend. The buffer plate 17 abuts against the electrodes to improve the stability of the electrodes. The tape reaches the interface of the electrodes on both sides. Under the downward pressure of the lifting component 5, the electrodes are bonded. Compared with the manual splicing method, the tape splicing device of this application has a higher degree of automation and can effectively improve the splicing efficiency.

[0034] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. An automatic tape splicing device for winding, characterized in that: The device includes a receiving platform (1) for placing electrode sheets. The receiving platform (1) includes a base (2), two placement platforms (3), a support (4), a lifting component (5), and two negative pressure adsorption platforms (6). Both placement platforms (3) are disposed on the surface of the base (2). One of the negative pressure adsorption platforms (6) is disposed between the two placement platforms (3). The support (4) is disposed on the surface of the base (2). The top of the support (4) is bent. The bent part of the support (4) is located above the lower negative pressure adsorption platform (6). The lifting component (5) is disposed on the bottom wall of the bent part of the support (4). The other negative pressure adsorption platform (6) is disposed on the movable end of the lifting component (5).

2. The automatic tape splicing device according to claim 1, characterized in that: The bottom wall of the bracket (4) is provided with a sensor (7) for detecting the position of the electrode plates on the surface of the two side placement platforms (3).

3. The automatic tape splicing device according to claim 2, characterized in that: The surface of the placement platform (3) is provided with an adjustment groove (8), which is opened along the length of the placement platform (3). A belt mechanism (9) is provided in the adjustment groove (8), and the belt mechanism (9) is communicatively connected to the sensor (7).

4. The automatic tape splicing device for winding according to claim 3, characterized in that: The surface of the belt mechanism (9) is provided with anti-slip texture (10).

5. The automatic tape splicing device for winding according to claim 1, characterized in that: The placement platform (3) is provided with adjusting cylinders (11) on both sides along its length. The piston rods of the adjusting cylinders (11) on both sides are arranged facing each other, and the end walls of the piston rods of the adjusting cylinders (11) are provided with alignment plates (12).

6. The automatic tape splicing device according to claim 1, characterized in that: The negative pressure adsorption platform (6) on the lifting component (5) is provided with a connecting rod (13) on its side wall. The connecting rod (13) is arranged along the length direction of the placement platform (3), and a pressing plate (14) is provided at the end of the connecting rod (13).

7. The automatic tape splicing device according to claim 6, characterized in that: The pressing plate (14) has several sliding holes (15) through it along the thickness direction. A buffer rod (16) is slidably connected in each sliding hole (15). A buffer plate (17) is provided at the bottom end of the buffer rod (16). A buffer spring (18) is sleeved on the peripheral wall of the buffer rod (16) between the pressing plate (14) and the buffer plate (17). The buffer spring (18) abuts against the bottom wall of the pressing plate (14) and the surface of the buffer plate (17).

8. The automatic tape splicing device according to claim 7, characterized in that: The buffer rod (16) is provided with an anti-detachment piece (19) at one end above the pressure plate (14), and the diameter of the anti-detachment piece (19) is larger than the diameter of the sliding hole (15).

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