Electroplating sand feeding mechanism

By designing an electroplating and abrasive application mechanism for components such as columnar cylinders and material carrier cylinders, the problems of uneven coating and uneven diamond abrasive were solved, achieving high-quality electroplating and stable operation of diamond wire saws.

CN223548138UActive Publication Date: 2025-11-14DINGLI AUTOMATIC TECH CO LTD
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Patent Information

Application Number
CN202422227197.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-11
Publication Date
2025-11-14
Estimated Expiration
2034-09-11

AI Technical Summary

Technical Problem

Traditional electroplating abrasive devices suffer from uneven plating, uneven abrasive application, and leakage caused by abrasive particles accumulating in the storage tank, affecting the quality and reliability of diamond wire saws.

Method used

Design an electroplating abrasive loading mechanism including a cylindrical tube, a material carrier tube, a guide tube, and valves. By controlling the flow of electroplating solution and the distribution of diamond abrasive, uniform electroplating is achieved. The material carrier tube is connected to the anode to make nickel ions on nickel beads uniformly electroplated onto the surface of metal wire. The flow and discharge of diamond abrasive are controlled by the guide tube and valves.

Benefits of technology

This achieves uniform dispersion of diamond abrasive and uniformity of the electroplated layer, improving the quality and production efficiency of diamond wire saws and preventing the accumulation of abrasive particles and leakage in the storage tank.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of electroplating equipment, in particular to an electroplating sand feeding mechanism which comprises a cylindrical barrel, and an upper mounting seat and a lower mounting seat are respectively mounted at two ends of the cylindrical barrel, so that an electroplating cavity for circulating electroplating liquid and allowing a metal wire to penetrate through is defined; the electroplating device further comprises a material carrying barrel capable of being connected with the anode, the material carrying barrel extends to the electroplating cavity, and a plurality of mesh holes are formed in the material carrying barrel. And the mounting upper seat is provided with a material guide pipe of which the bottom end extends into the columnar barrel and which is used for guiding the carborundum. The electroplating liquid flows through the electroplating cavity from bottom to top, and the metal wire penetrates through the electroplating cavity from bottom to top, so that electroplating sand feeding is more uniform, and the subsequent sand feeding quality and uniformity are improved.
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Description

Technical Field

[0001] This utility model relates to the field of electroplating equipment technology, and in particular to an electroplating sanding mechanism. Background Technology

[0002] In the production process of electroplated diamond wire saws, abrasive application is a crucial step, directly affecting the quality and performance of the diamond wire saw. Traditional abrasive application devices and methods have many shortcomings, such as leakage of abrasive from the storage tank, wire rubbing, uneven coating, and uneven application of diamond abrasive. These problems not only lead to a decline in the quality of the diamond wire saw but also reduce the reliability of the equipment and production efficiency.

[0003] Specifically, traditional abrasive plating devices typically use static or low-speed agitation of the electroplating solution, resulting in uneven distribution of diamond particles and inconsistent electroplating quality. Furthermore, the poor flow of the electroplating solution easily leads to the accumulation of abrasive particles in the storage tank, causing leakage and affecting the normal operation of the equipment. Therefore, this paper provides an electroplating abrasive plating mechanism to solve the above-mentioned technical problems. Utility Model Content

[0004] The purpose of this utility model is to provide an electroplating abrasive application mechanism to address the shortcomings of existing technologies, thereby solving the technical problems of uneven plating and uneven application of corundum.

[0005] To achieve the above objectives, the technical solution of this utility model is as follows:

[0006] An electroplating sanding mechanism includes a cylindrical tube with an upper mounting seat and a lower mounting seat installed at both ends of the cylindrical tube, thereby forming an electroplating chamber for the flow of electroplating solution and for the passage of metal wires.

[0007] It also includes a material carrier that can be connected to the anode, the material carrier extending into the electroplating chamber, and the material carrier having several mesh holes; the mounting base is equipped with a guide tube whose bottom end extends into the columnar cylinder and is used to guide the diamond abrasive.

[0008] Furthermore, a funnel-shaped cavity is formed inside the mounting base, and a support flange is fixedly installed at the bottom of the mounting base. A funnel-shaped through hole is formed inside the support flange. The funnel-shaped through hole, the funnel-shaped cavity, and the electroplating chamber inside the columnar cylinder are coaxially connected. The diameter of the top port of the through hole is the same as the diameter of the bottom port of the cavity.

[0009] Furthermore, a sealing block is fixed at the bottom of the support flange to block the bottom port of the funnel-shaped through hole, and a sealing gasket is provided between the bottom port of the funnel-shaped through hole and the top of the sealing block; both the sealing block and the sealing gasket have through holes through which the electroplating wire passes from bottom to top, and the through holes are coaxially arranged with the electroplating chamber inside the columnar cylinder.

[0010] Furthermore, the sealing block is formed with several gourd-shaped holes for bolts to pass through. The bolts pass through the gourd-shaped holes and are fixedly connected to the support flange to fix the sealing block to the support flange.

[0011] Furthermore, the support flange is formed with a liquid inlet that communicates with the bottom end of the funnel-shaped through hole, and a liquid inlet pipe that communicates with the liquid inlet is provided on the outside of the support flange, and a first valve is provided on the liquid inlet pipe.

[0012] Furthermore, the upper mounting base is equipped with a liquid outlet pipe that communicates with the electroplating chamber inside the cylindrical tube, and a second valve is provided on the liquid outlet pipe.

[0013] Furthermore, the mounting base is equipped with a drain pipe that communicates with the top port of the funnel-shaped cavity, and a third valve is provided on the drain pipe; a sand discharge port that communicates with the top port of the funnel-shaped through hole is installed on the support flange, and a sand discharge pipe that communicates with the sand discharge port is provided on the sand discharge port, and a fourth valve is provided on the sand discharge pipe.

[0014] Furthermore, both the bottom of the upper mounting base and the top of the lower mounting base are formed with mounting grooves for the end of the cylindrical tube to be inserted. The mounting grooves are annular grooves, and a sealing ring is provided between the mounting groove and the end of the cylindrical tube. It also includes several connecting rods for fixing the upper mounting base and the lower mounting base, and the two ends of the connecting rods are respectively fixedly connected to the upper mounting base and the lower mounting base by bolts.

[0015] Furthermore, at least two material carrier cylinders are provided and arranged in an equidistant array around the axis of the cylindrical cylinder.

[0016] Furthermore, the top of the guide tube is positioned outside the mounting base, and the top of the guide tube has a feed inlet formed thereon, with the diameter of the feed inlet being larger than the diameter of the guide tube.

[0017] The beneficial effects of this utility model are as follows: When electroplating with abrasive is required, nickel beads are first filled into the carrier cylinder so that they are immersed in the electroplating solution. Then, diamond abrasive is introduced into the electroplating chamber through the guide pipe so that it is deposited at the bottom of the electroplating chamber. As the electroplating solution flows from bottom to top through the electroplating chamber, the deposited diamond abrasive is mixed with the electroplating solution, so that the diamond abrasive is evenly dispersed in the electroplating solution and flows with the electroplating solution. The carrier cylinder is connected to the anode, and the nickel beads and the electroplating solution are also connected to the anode. The metal wire to be electroplated continuously passes through the electroplating chamber from bottom to top and is connected to the cathode, so that the nickel ions on the nickel beads are electroplated onto the surface of the metal wire to form a coating. Then, abrasive treatment is performed so that the surface of the metal wire is coated with diamond abrasive, thus realizing uninterrupted electroplating with abrasive treatment.

[0018] By allowing the electroplating solution to flow from bottom to top through the electroplating chamber, and by allowing the metal wire to pass through the electroplating chamber from bottom to top, the sandblasting process can be more uniform, improving the quality and uniformity of subsequent sandblasting. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0020] Figure 2 This is a schematic diagram of the internal structure of this utility model.

[0021] Figure 3 This is a partial structural schematic diagram of the present invention.

[0022] The reference numerals in the figures include:

[0023] 201. Upper mounting seat; 202. Lower mounting seat; 20201. Beveled edge; 20202. Cavity; 203. Columnar cylinder; 204. Connecting rod; 205. Mounting groove; 206. Sealing ring; 207. Support flange; 2071. Through hole; 208. Sealing block; 2081. Hoist hole; 209. Sealing gasket; 2010. Connecting block; 2011. Material carrier cylinder; 2012. Mesh; 2013. Fixing block; 2014. Guide pipe; 2015. Feed inlet; 2016. Liquid inlet pipe; 2017. First valve; 2018. Liquid inlet; 2019. Liquid outlet pipe; 2020. Second valve; 2021. Drain pipe; 2022. Third valve; 2023. Sand discharge port; 2024. Sand discharge pipe; 2025. Fourth valve. Detailed Implementation

[0024] The following is a detailed description of an electroplating sanding mechanism according to the present invention, with reference to the accompanying drawings.

[0025] like Figure 1-3 As shown, an embodiment of the electroplating sanding mechanism of this utility model includes a cylindrical tube 203, which is arranged vertically and has an upper mounting seat 201 and a lower mounting seat 202 respectively installed at its upper and lower ends. The bottom of the upper mounting seat 201 and the top of the lower mounting seat 202 are both formed with mounting grooves 205 for the ends of the cylindrical tube 203 to be inserted. The mounting grooves 205 are annular grooves, and a sealing ring 206 is provided between the mounting grooves 205 and the ends of the cylindrical tube 203. The upper mounting seat 201 and the lower mounting seat 202 are respectively installed at the upper and lower ends of the cylindrical tube 203, so that the interior of the cylindrical tube 203 forms an electroplating chamber through which the electroplating solution flows. When the electroplating solution flows through the electroplating chamber, the electroplating wire will pass through the electroplating chamber from bottom to top, thereby performing electroplating sanding treatment. Furthermore, with sealing rings 206 installed at both the upper and lower ends of the cylindrical tube 203, the electroplating solution is prevented from flowing out from the installation gaps when it flows through the electroplating chamber.

[0026] In addition, it also includes several connecting rods 204 for fixing the upper mounting base 201 and the lower mounting base 202. The two ends of the connecting rods 204 are respectively fixedly connected to the upper mounting base 201 and the lower mounting base 202 by bolts. After the upper mounting base 201 and the lower mounting base 202 are respectively installed at the upper and lower ends of the columnar tube 203, the upper mounting base 201 and the lower mounting base 202 are fixed by the connecting rods 204 to prevent the upper mounting base 201 and the lower mounting base 202 from detaching from the columnar tube 203.

[0027] The mounting base 202 has a funnel-shaped cavity 20202 formed inside, and a support flange 207 is fixedly mounted at the bottom of the mounting base 202. A funnel-shaped through hole 2071 is formed inside the support flange 207. The funnel-shaped through hole 2071, the funnel-shaped cavity 20202, and the electroplating chamber in the cylindrical tube 203 are coaxially connected. The diameter of the top end of the through hole 2071 is the same as the diameter of the bottom end of the cavity 20202. After diamond abrasive is placed into the electroplating chamber of the cylindrical tube 203, it will be deposited in the funnel-shaped cavity 20202. Then, the electroplating solution flows from bottom to top through the funnel-shaped through hole 2071 through the funnel-shaped cavity 20202 and the electroplating chamber in the cylindrical tube 203, thereby mixing the deposited diamond abrasive with the electroplating solution, so that the diamond abrasive is evenly dispersed in the electroplating solution and flows with it.

[0028] Furthermore, the mounting base 201 is equipped with a carrier cylinder 2011 that can be connected to the anode. The carrier cylinder 2011 has at least two electroplating chambers that extend into the cylindrical tube 203. The carrier cylinder 2011 has several mesh openings 2012. The carrier cylinder 2011 is used to fill nickel beads or other materials that can be electroplated onto the metal wire to form a coating. After the nickel beads are filled into the carrier cylinder 2011, the nickel beads are immersed in the electroplating solution. The carrier cylinder 2011 is connected to the anode, and the nickel beads and the electroplating solution are also connected to the anode. The metal wire to be electroplated is continuously passed from bottom to top through the electroplating chamber and connected to the cathode, thereby electroplating the nickel ions on the nickel beads onto the surface of the metal wire to form a coating. Subsequently, a sandblasting treatment is performed to attach diamond grit to the surface of the metal wire, so as to achieve uninterrupted electroplating sandblasting treatment. Furthermore, the carrier cylinders 2011 are arranged in an equidistant array around the axis of the cylindrical cylinder 203, and the metal wire to be electroplated is aligned with the axis of the cylindrical cylinder 203 when passing through the electroplating chamber. This arrangement ensures more uniform nickel plating and improves the quality and uniformity of subsequent sand coating. Additionally, each carrier cylinder 2011 is equipped with a connecting block 2010 at its top for electrical connection to the anode. By connecting the connecting block 2010 to the anode, the carrier cylinder 2011 is connected to the anode.

[0029] A sealing block 208 is fixedly provided at the bottom of the support flange 207 to block the bottom port of the funnel-shaped through hole 2071. The sealing block 208 has several gourd-shaped holes 2081 formed on it for bolts to pass through. The bolts pass through the gourd-shaped holes 2081 and are fixedly connected to the support flange 207 to secure the sealing block 208 to the support flange 207. A sealing gasket 209 is provided between the bottom port of the funnel-shaped through hole 2071 and the top of the sealing block 208. By providing the sealing gasket 209, the electroplating solution is prevented from flowing out from the gap between the funnel-shaped through hole 2071 and the sealing block 208. Both the sealing block 208 and the sealing gasket 209 have through holes for electroplating wires to pass through (e.g., ...). Figure 3 As shown), the perforation is coaxially aligned with the electroplating chamber inside the cylindrical tube 203. The electroplating wire is passed from bottom to top through the perforation on the sealing block 208, then through the perforation on the sealing gasket 209, and subsequently through the funnel-shaped through-hole 2071, the funnel-shaped cavity 20202, and the electroplating chamber inside the cylindrical tube 203, finally exiting from the mounting base 201. The wire undergoes nickel plating and sandblasting treatment while passing through the electroplating chamber inside the cylindrical tube 203. Additionally, when replacing the wire with a new one, loosen the bolt passing through the gourd hole 2081 (do not remove it), and then rotate clockwise (rotation direction is...). Figure 3 After the sealing block 208 is at the specified angle (based on the reference), the sealing block 208 can be removed from the support flange 207 so that the new metal wire to be electroplated can be passed through the perforations on the sealing block 208 and the gasket 209.

[0030] To allow the electroplating solution to flow through the electroplating chamber inside the cylindrical tube 203, the supporting flange 207 is formed with an inlet 2018 that communicates with the bottom end of the funnel-shaped through hole 2071. An inlet pipe 2016 that communicates with the inlet 2018 is provided on the outside of the supporting flange 207, and a first valve 2017 is provided on the inlet pipe 2016. The inlet pipe 2016 transports the electroplating solution from the inlet 2018 into the funnel-shaped through hole 2071. The electroplating solution flows from bottom to top through the funnel-shaped cavity 20202 and then flows into the electroplating chamber inside the cylindrical tube 203. In doing so, the deposited diamond grit is mixed with the electroplating solution. Additionally, an outlet pipe 2019, communicating with the electroplating chamber inside the cylindrical tube 203, is installed on the mounting base 201. A second valve 2020 is provided on the outlet pipe 2019. When the electroplating solution flows from bottom to top into the electroplating chamber inside the cylindrical tube 203, it flows out from the outlet pipe 2019, allowing the electroplating solution to flow through the electroplating chamber inside the cylindrical tube 203. Simultaneously, the metal wire continuously passes through the electroplating chamber from bottom to top, achieving continuous electroplating and sandblasting treatment of the metal wire. When electroplating is not required, the first valve 2017 and the second valve 2020 can be closed to stop the flow of the electroplating solution.

[0031] During the electroplating process, to ensure sufficient diamond content in the electroplating solution, the mounting base 201 is equipped with a fixing block 2013. The fixing block 2013 is fitted with a guide tube 2014, whose bottom end extends into the cylindrical tube 203 for guiding the diamond. The top of the guide tube 2014 is positioned outside the mounting base 201, and an inlet 2015 is formed at the top of the guide tube 2014, with the diameter of the inlet 2015 being larger than the diameter of the guide tube 2014. The inlet 2015 facilitates the pouring of diamond into the guide tube 2014, which then flows into the cylindrical tube 203, where it settles in the funnel-shaped cavity 20202. In addition, a bevel 20201 is provided on the inner edge of the top port of the funnel-shaped cavity 20202. By providing the bevel 20201, the diamond powder is guided and fully poured into the funnel-shaped cavity 20202.

[0032] After the metal wire is electroplated and sandblasted, the first valve 2017 and the second valve 2020 are controlled to close the inlet pipe 2016 and the outlet pipe 2019. After a period of sedimentation, the diamond sand will remain in the funnel-shaped cavity 20202, and the electroplating solution will remain in the electroplating chamber of the columnar cylinder 203. In order to discharge the residual diamond sand and electroplating solution, a drain pipe 2021 connected to the top port of the funnel-shaped cavity 20202 is installed on the mounting base 202. A third valve 2022 is installed on the drain pipe 2021. A sand discharge port 2023 connected to the top port of the funnel-shaped through hole 2071 is installed on the support flange 207, and a sand discharge pipe 2024 connected to the sand discharge port 2023 is provided. A fourth valve 2025 is installed on the sand discharge pipe 2024. After a period of settling, open the third valve 2022 and the fourth valve 2025 simultaneously. At this time, close the first valve 2017 and the second valve 2020. The remaining electroplating solution will be discharged from the drain pipe 2021, and the remaining diamond sand will be discharged from the sand discharge pipe 2024. When electroplating sand treatment is required, close the third valve 2022 and the fourth valve 2025, and open the first valve 2017 and the second valve 2020.

[0033] In summary, this utility model possesses the aforementioned excellent characteristics, enabling it to achieve unprecedented efficiency in use and thus become a highly practical product.

[0034] The above description is only a preferred embodiment of this utility model. For those skilled in the art, there will be changes in the specific implementation method and application scope based on the idea of ​​this utility model. The content of this specification should not be construed as a limitation of this utility model.

Claims

1. An electroplating sanding mechanism, characterized in that: It includes a cylindrical tube (203), with an upper mounting seat (201) and a lower mounting seat (202) installed at both ends of the cylindrical tube (203), thereby forming an electroplating chamber for the flow of electroplating solution and for the passage of metal wire; It also includes a carrier cylinder (2011) that can be connected to the anode, the carrier cylinder (2011) extending into the electroplating chamber, and the carrier cylinder (2011) having a number of mesh holes (2012); the mounting base (201) is equipped with a guide tube (2014) whose bottom end extends into the columnar cylinder (203) and is used to guide the diamond.

2. The electroplating sanding mechanism according to claim 1, characterized in that: The mounting base (202) has a funnel-shaped cavity (20202) formed inside, and a support flange (207) is fixedly installed at the bottom of the mounting base (202). The support flange (207) has a funnel-shaped through hole (2071) formed inside. The funnel-shaped through hole (2071), the funnel-shaped cavity (20202), and the electroplating chamber in the cylindrical tube (203) are coaxially connected. The diameter of the top end of the through hole (2071) is the same as the diameter of the bottom end of the cavity (20202).

3. The electroplating sanding mechanism according to claim 2, characterized in that: A sealing block (208) is fixedly provided at the bottom of the support flange (207) to block the bottom port of the funnel-shaped through hole (2071). A sealing gasket (209) is provided between the bottom port of the funnel-shaped through hole (2071) and the top of the sealing block (208). Both the sealing block (208) and the sealing gasket (209) have through holes formed on them for the electroplating wire to pass through from bottom to top. The through holes are coaxially arranged with the electroplating chamber inside the columnar cylinder (203).

4. The electroplating sanding mechanism according to claim 3, characterized in that: The sealing block (208) has several gourd-shaped holes (2081) for bolts to pass through. The bolts pass through the gourd-shaped holes (2081) and are fixedly connected to the support flange (207) so that the sealing block (208) and the support flange (207) are fixedly set.

5. The electroplating sanding mechanism according to claim 3, characterized in that: The support flange (207) is formed with an inlet (2018) that communicates with the bottom end of a funnel-shaped through hole (2071). The outside of the support flange (207) is provided with an inlet pipe (2016) that communicates with the inlet (2018), and a first valve (2017) is provided on the inlet pipe (2016).

6. The electroplating sanding mechanism according to claim 5, characterized in that: The mounting base (201) is equipped with a liquid outlet pipe (2019) that communicates with the electroplating chamber inside the cylindrical tube (203), and a second valve (2020) is provided on the liquid outlet pipe (2019).

7. The electroplating sanding mechanism according to claim 6, characterized in that: The mounting base (202) is equipped with a drain pipe (2021) that communicates with the top port of the funnel-shaped cavity (20202), and a third valve (2022) is provided on the drain pipe (2021); a sand discharge port (2023) that communicates with the top port of the funnel-shaped through hole (2071) is installed on the support flange (207), and a sand discharge pipe (2024) that communicates with the sand discharge port (2023) is provided, and a fourth valve (2025) is provided on the sand discharge pipe (2024).

8. The electroplating sanding mechanism according to claim 1, characterized in that: The bottom of the upper mounting base (201) and the top of the lower mounting base (202) are both formed with mounting grooves (205) for the end of the cylindrical tube (203) to be inserted. The mounting grooves (205) are annular grooves, and a sealing ring (206) is provided between the mounting groove (205) and the end of the cylindrical tube (203). It also includes several connecting rods (204) for fixing the upper mounting base (201) and the lower mounting base (202), and the two ends of the connecting rods (204) are fixedly connected to the upper mounting base (201) and the lower mounting base (202) by bolts.

9. The electroplating sanding mechanism according to claim 1, characterized in that: At least two material carrier cylinders (2011) are arranged in an equidistant array around the axis of the cylindrical cylinder (203).

10. The electroplating sanding mechanism according to claim 1, characterized in that: The top of the guide tube (2014) is placed outside the mounting base (201), and the top of the guide tube (2014) is formed with a feed port (2015), and the diameter of the feed port (2015) is larger than the diameter of the guide tube (2014).