Case

Abstract

The utility model provides a case. The case comprises a shell assembly, the shell assembly comprises a shell structure and a backboard structure, the shell structure is provided with a plug-in port, a containing cavity and an air outlet, and the plug-in port and the air outlet are both communicated with the containing cavity; at least part of the board card structure is inserted into the containing cavity through the insertion port, the board card structure is provided with an air inlet part, a mounting cavity and an air outlet part, the air outlet part is communicated with the air inlet part through the mounting cavity, and the air inlet part is communicated with the outside; the fan structure is arranged in the containing cavity, and an air outlet part of the fan structure communicates with the air outlet; wherein the backboard structure is arranged between the fan structure and the board card structure; and the flow guide structure is arranged on the board card structure and / or the fan structure, the flow guide structure is provided with a flow guide cavity, and the air outlet part communicates with the air inlet part of the fan structure through the flow guide cavity. According to the utility model, the problem of poor heat dissipation reliability of communication equipment in the prior art is effectively solved.

Description

Technical Field

[0001] This utility model relates to the field of communication equipment technology, and more specifically, to a chassis. Background Technology

[0002] Currently, heat dissipation performance is one of the core performance indicators ensuring the stable operation of high-end communication equipment. Besides fan performance, the specific structural layout of the chassis's airflow channels significantly affects heat dissipation performance. Airflow channels can be categorized based on their airflow direction: front-in or side-front-in / rear-out, bottom-in / top-out or rear-out. Bottom-in airflow structures have been abandoned due to their tendency to allow dust to enter the chassis and increased installation difficulty; front-in airflow structures have gradually become the mainstream airflow layout.

[0003] However, the air outlets of front-to-back / rear-to-front airflow cooling ducts are mainly located on the back panel of the chassis, and their heat dissipation reliability is highly dependent on the size of the air outlets on the back panel. In fact, the back panel is also the actual mounting structure for connectors used with business boards in the chassis. Especially for chassis types with many boards, the back panel will house a large area of ​​circuit boards and corresponding wiring structures, which results in very limited area on the back panel available for air outlets, allowing only small-sized air outlets. Small-sized air outlets not only affect the overall heat dissipation performance of the chassis, but also cause a significant increase in airflow velocity at the air outlet and an overall increase in the overall wind resistance of the cooling duct. To overcome this wind resistance, operators usually choose to install high-power fan structures. However, the above improvements have very limited effect on the overall heat dissipation performance of the air duct structure and will significantly increase the operating noise of the chassis and manufacturing costs. Utility Model Content

[0004] The main objective of this invention is to provide a chassis to solve the problem of poor heat dissipation reliability in existing communication equipment.

[0005] To achieve the above objectives, this utility model provides a chassis, comprising: a shell assembly including a shell structure and a back plate structure, the shell structure having an insertion interface, a receiving cavity, and an air outlet, both the insertion interface and the air outlet communicating with the receiving cavity; a board structure, at least a portion of which is inserted into the receiving cavity via the insertion interface, the board structure having an air inlet, a mounting cavity, and an air outlet, the air outlet communicating with the air inlet via the mounting cavity, and the air inlet communicating with the outside; a fan structure disposed within the receiving cavity, the air outlet of which is communicating with the air outlet; wherein, the back plate structure is disposed between the fan structure and the board structure; and a flow guiding structure disposed on the board structure and / or the fan structure, the flow guiding structure having a flow guiding cavity, the air outlet communicating with the air inlet of the fan structure via the flow guiding cavity.

[0006] Furthermore, there are at least two air outlets, with at least one air outlet located at the top of the plate structure and at least another air outlet located at the side of the plate structure; wherein, the flow guiding structure also has an air inlet and an air outlet communicating with the flow guiding cavity, the air outlet communicating with the air inlet and the air inlet communicating with the air outlet, and there are at least two air inlets, with at least two air inlets corresponding to at least two air inlets.

[0007] Furthermore, the flow guiding structure has: a covering part having an air inlet and covering multiple air outlets; a converging part having an air outlet and being disposed at the air inlet; wherein, the converging part has a converging cavity communicating with the air outlets, and the air inlet is connected to the air outlets through the converging part.

[0008] Furthermore, the confluence section is a hood-shaped structure, with the opening of the hood-shaped structure forming an air outlet and the inner cavity of the hood-shaped structure forming a confluence cavity; wherein, along the direction from the fan structure to the hood-shaped structure, the size of the hood-shaped structure gradually decreases.

[0009] Furthermore, the air outlet located at the top of the plate structure is the first air outlet, and there are at least two covering parts, including the first covering part covering the first air outlet. The first covering part is plate-shaped. The flow guiding structure also includes a connecting member disposed between the first covering part and the confluence part. The inner cavity of the first covering part is connected to the confluence cavity through the connecting member.

[0010] Furthermore, the board structure includes: a board assembly having an air inlet, a mounting cavity, and a flow port, wherein there are multiple flow ports, which are spaced apart around the central axis of the board assembly; wherein the board structure includes multiple sets of board assemblies, which are spaced apart along the width direction of the housing structure, and multiple board assemblies in any set are spaced apart along the height direction of the housing structure, the mounting cavities of two adjacent board assemblies are connected through the flow ports, the flow port of the board assembly located at the top of the board structure forms a first air outlet, and the flow port of the board assembly located on the side of the board structure forms a second air outlet.

[0011] Furthermore, the covering part also includes a second covering part covering the side of the board structure. The second covering part covers multiple board assemblies. The second covering part is plate-shaped and has a slow flow cavity and a connecting part. The air inlet is connected to the connecting part through the slow flow cavity, and the connecting part is connected to the confluence cavity. The flow ports of the multiple board assemblies form multiple second air outlets. The second covering part has multiple air inlets, and the multiple air inlets are arranged in a one-to-one correspondence with the multiple second air outlets.

[0012] Furthermore, the connecting part is orifice-shaped, and the confluence part is also provided with a plug pipe that communicates with the confluence cavity, at least a part of which extends into the slow flow cavity through the connecting part.

[0013] Furthermore, the air inlet of the second enclosure is a grille air inlet, and the chassis also includes: a grille structure, at least part of which is disposed within the grille air inlet. The grille structure includes N air guides spaced apart along the length and / or width of the air inlet, and the extension direction of each air guide is set at an angle to the plate surface of the second enclosure; wherein, N is a positive integer, there are multiple grille structures, and multiple grille structures are arranged one-to-one with multiple grille air inlets. In the direction from the bottom to the top of the plate structure, the number of air guides in each grille structure gradually increases, and the angle between the air guides in each grille structure gradually increases.

[0014] Furthermore, the board assembly includes: a housing having an air inlet, a mounting cavity, and a flow port; a circuit board disposed within the mounting cavity, the circuit board having a ventilation opening for connecting the flow ports located on two sides of the circuit board; and a heat dissipation device disposed on the circuit board and located between the ventilation opening and the air inlet.

[0015] Furthermore, the board assembly also includes: a fan device, disposed on the circuit board and located between the heat dissipation device and the air intake, the fan device blowing gas into the mounting cavity through the air intake, the fan device including multiple fan blades arranged along the width direction of the circuit board; and a flow guiding assembly, disposed on the circuit board, the flow guiding assembly including a first flow guiding member and a second flow guiding member; wherein, the first flow guiding member is disposed between the fan device and the inner wall of the mounting cavity, so as to divide the mounting cavity into an air intake cavity and a heat dissipation cavity through the first flow guiding member and the fan device, the air intake is connected to the fan device through the air intake cavity, the heat dissipation device is disposed in the heat dissipation cavity, and the second flow guiding member is disposed in the air intake cavity, so as to divide the air intake cavity into multiple sub-air intake cavities, the multiple sub-air intake cavities being arranged one-to-one with multiple fan blades.

[0016] Furthermore, the chassis also includes: a power supply module, located on the side of the back panel structure away from the circuit board structure, with the exhaust section of the power supply module connected to the air outlet; a control module, located on the back panel structure and the power supply module, with the inner cavity of the control module connected to the inner cavity of the power supply module, and a connection port provided on the outer shell of the control module; wherein, the shell structure also has an air inlet, and an airflow channel is formed between the inner wall of the receiving cavity and at least part of the outer peripheral surface of the circuit board structure, and the air inlet is connected to the inner cavity of the control module through the airflow channel and the connection port, so that when the fan in the power supply module rotates, the airflow entering the control module and the power supply module through the air inlet, the airflow channel and the connection port can dissipate heat from the control module and the power supply module.

[0017] According to the technical solution of this utility model, the chassis housing assembly includes a housing structure and a back plate structure. The housing structure has a plug-in interface, a receiving cavity, and an air outlet. Both the plug-in interface and the air outlet are connected to the receiving cavity. At least a portion of the board structure is inserted into the receiving cavity through the plug-in interface. The board structure has an air inlet, a mounting cavity, and an air outlet. The air outlet is connected to the air inlet through the mounting cavity, and the air inlet is connected to the outside. The air outlet of the fan structure, which is located in the receiving cavity, is connected to the air outlet. The back plate structure is located between the fan structure and the board structure. A flow guiding structure is located on the board structure and / or the fan structure. The flow guiding structure has a flow guiding cavity, and the air outlet is connected to the air inlet of the fan structure through the flow guiding cavity. In this way, by connecting the air outlet of the circuit board structure with the air inlet of the fan structure through a flow-guiding structure, the fan structure can draw air sequentially through the air inlet, mounting cavity, air outlet, and flow-guiding cavity to dissipate heat from the electrical components inside the housing structure. Furthermore, the backplate structure used to mount circuit boards and other electrical components does not require any holes. The size of the flow-guiding cavity can be adjusted by increasing the chassis size or by rationally arranging the internal structure of the cavity. This means the overall heat dissipation performance of the chassis is no longer limited by the backplate structure, thus greatly improving the chassis's heat dissipation performance and solving the problem of poor heat dissipation reliability in existing communication equipment. Simultaneously, this design also reduces air resistance inside the chassis, allowing operators to select a fan structure with appropriate power, thereby reducing overall chassis operating noise and improving the user experience. Attached Figure Description

[0018] The accompanying drawings, which form part of this application, are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an undue limitation of the present invention. In the drawings:

[0019] Figure 1 A perspective structural schematic diagram of an embodiment of the chassis according to the present invention is shown;

[0020] Figure 2 It shows Figure 1 A three-dimensional structural diagram of the chassis after the outer shell structure has been removed.

[0021] Figure 3 It shows Figure 2 A three-dimensional structural diagram of the chassis after the outer shell structure has been removed, taken from another angle.

[0022] Figure 4 It shows Figure 2 A three-dimensional structural diagram of the chassis after the outer shell structure has been removed, taken from another angle.

[0023] Figure 5 It shows Figure 1A three-dimensional structural diagram of the airflow guiding structure of the chassis after assembly of the confluence section, connecting parts and the first cover section;

[0024] Figure 6 It shows Figure 1 A three-dimensional structural diagram of the second shroud of the airflow guiding structure in the chassis;

[0025] Figure 7 It shows Figure 1 A perspective view of the board components in the chassis's board structure;

[0026] Figure 8 It shows Figure 7 A schematic diagram of the internal structure of the board components;

[0027] Figure 9 It shows Figure 1 A three-dimensional structural diagram of the fan structure in the chassis;

[0028] Figure 10 It shows Figure 1 A top view of the internal airflow direction of the chassis;

[0029] Figure 11 It shows Figure 1 A side view of the internal airflow direction of the chassis.

[0030] The above figures include the following reference numerals:

[0031] 10. Shell structure; 11. Socket; 12. Air outlet; 13. Air inlet; 20. Back panel structure;

[0032] 30. Board structure; 31. Air inlet; 32. Mounting cavity; 33. Air outlet; 331. First air outlet; 332. Second air outlet; 34. Board assembly; 341. Flow port; 342. Housing; 343. Circuit board; 3431. Vent; 344. Heat dissipation device; 345. Fan assembly; 3451. Fan blades; 346. Airflow guide assembly; 3461. First airflow guide; 3462. Second airflow guide; 3463. Third airflow guide;

[0033] 40. Fan structure; 41. Air outlet;

[0034] 50. Flow guiding structure; 51. Air inlet; 52. Air outlet; 53. Covering part; 531. First covering part; 532. Second covering part; 5321. Connecting part; 54. Merging part; 541. Merging cavity; 55. Insert pipe; 56. Connecting component;

[0035] 60. Grille structure; 61. Air guide plate; 62. First grille structure; 63. Second grille structure; 64. Third grille structure; 65. Fourth grille structure;

[0036] 70. Power supply module; 71. Exhaust unit;

[0037] 80. Control module; 81. Housing; 82. Communication port;

[0038] 90. Airflow channel. Detailed Implementation

[0039] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0040] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0041] In this utility model, unless otherwise stated, directional terms such as "upper" and "lower" are generally used in relation to the direction shown in the accompanying drawings, or in relation to the vertical, perpendicular, or gravitational direction; similarly, for ease of understanding and description, "left" and "right" are generally used in relation to the left and right shown in the accompanying drawings; "inner" and "outer" refer to the inner and outer contours of each component itself, but the above directional terms are not used to limit this utility model.

[0042] To address the problem of poor heat dissipation reliability in existing communication equipment, this application provides a chassis.

[0043] like Figures 1 to 11 As shown, the chassis includes a housing assembly, a circuit board structure 30, a fan structure 40, and a flow guide structure 50. The housing assembly includes a housing structure 10 and a backplate structure 20. The housing structure 10 has an interface 11, a receiving cavity, and an air outlet 12. Both the interface 11 and the air outlet 12 are connected to the receiving cavity. At least a portion of the circuit board structure 30 is inserted into the receiving cavity through the interface 11. The circuit board structure 30 has an air inlet 31, a mounting cavity 32, and an air outlet 33. The air outlet 33 is connected to the air inlet 31 through the mounting cavity 32, and the air inlet 31 is connected to the outside. The fan structure 40 is disposed within the receiving cavity, and the air outlet 41 of the fan structure 40 is connected to the air outlet 12. The backplate structure 20 is disposed between the fan structure 40 and the circuit board structure 30. The flow guiding structure 50 is installed on the plate structure 30 and / or the fan structure 40. The flow guiding structure 50 has a flow guiding cavity, and the air outlet 33 is connected to the air inlet of the fan structure 40 through the flow guiding cavity.

[0044] Applying the technical solution of this embodiment, the chassis housing assembly includes a housing structure 10 and a backplate structure 20. The housing structure 10 has an insertion interface 11, a receiving cavity, and an air outlet 12. Both the insertion interface 11 and the air outlet 12 are connected to the receiving cavity. At least a portion of the board structure 30 is inserted into the receiving cavity through the insertion interface 11. The board structure 30 has an air inlet 31, a mounting cavity 32, and an air outlet 33. The air outlet 33 is connected to the air inlet 31 through the mounting cavity 32. The air inlet 31 is connected to the outside. The air outlet 41 of the fan structure 40, which is disposed in the receiving cavity, is connected to the air outlet 12. The backplate structure 20 is disposed between the fan structure 40 and the board structure 30. The flow guide structure 50 is disposed on the board structure 30 and / or the fan structure 40. The flow guide structure 50 has a flow guide cavity, and the air outlet 33 is connected to the air inlet of the fan structure 40 through the flow guide cavity. In this way, by setting the airflow guiding structure 50 to connect the air outlet 33 of the board structure 30 with the air inlet of the fan structure 40, the fan structure 40 can not only draw air through the air inlet 31, mounting cavity 32, air outlet 33, and airflow guiding cavity in sequence to dissipate heat from the electrical components inside the housing structure 10, but also eliminates the need for any holes in the backplate structure 20 used to mount electrical components such as circuit boards (e.g., PCB boards). Furthermore, the size of the airflow guiding cavity can be adjusted by increasing the chassis size or by rationally arranging the internal structure of the cavity, thus freeing the overall heat dissipation performance of the chassis from the limitations of the backplate structure 20. This significantly improves the chassis's heat dissipation performance and solves the problem of poor heat dissipation reliability in existing communication equipment. Simultaneously, the above-mentioned design also reduces the air resistance inside the chassis, allowing operators to select a fan structure 40 with appropriate power, thereby reducing the overall operating noise of the chassis and improving the user experience.

[0045] For example, the housing structure 10 is a cuboid housing, and on its length direction, the two opposite sides of the housing structure 10 are respectively provided with an interface 11 and an air outlet 12 to realize the front air / rear air outlet function of the chassis.

[0046] For example, the backplate structure 20 extends along the width direction of the housing structure 10.

[0047] like Figure 9 As shown, the fan structure 40 includes a fan housing and multiple fans disposed within the fan housing.

[0048] For example, the air inlet and air outlet 41 of the fan structure 40 are both located in the fan housing, and the fan structure 40 contains two fans of a specified model.

[0049] It should be noted that the specific structure of the fan structure 40 is not limited to this and can be adjusted according to the actual working conditions and usage requirements.

[0050] Optionally, there are at least two air outlets 33, with at least one air outlet 33 located at the top of the board structure 30 and at least another air outlet 33 located on the side of the board structure 30. The flow guiding structure 50 also has an air inlet 51 and an air outlet 52 communicating with the flow guiding cavity. The air outlet 52 communicates with the air inlet, and the air inlet 51 communicates with the air outlet 33. There are at least two air inlets 51, with each of the at least two air inlets 51 corresponding to one of the at least two air inlets 31. This arrangement, on the one hand, allows multiple air outlets 33 in different locations to form multiple airflow channels with different directions inside the board structure 30, thereby increasing the heat dissipation range and improving the heat dissipation reliability of the fan structure 40 on the board structure 30; on the other hand, it ensures that all the air outlets 33 can communicate with the air inlet through the flow guiding structure 50, thereby improving the connectivity reliability of the flow guiding structure 50. At the same time, the above-mentioned configuration also makes the number of air outlets 33 more flexible and diverse, so as to adapt to different working conditions and usage needs, and also improve the processing flexibility of the staff.

[0051] like Figures 1 to 6 As shown, the airflow guiding structure 50 has a covering part 53 and a converging part 54. The covering part 53 has an air inlet 51 and covers multiple air outlets 33. The converging part 54 has an air outlet 52 and is located at the air inlet. The converging part 54 has a converging cavity 541 that communicates with the air outlet 52, and the air inlet 51 communicates with the air outlet 52 through the converging part 54. In this way, multiple airflows discharged into the airflow guiding structure 50 through multiple air outlets 33 can converge in the converging part 54 before flowing into the fan structure 40, thereby avoiding interference and turbulence between multiple airflows, which would affect the airflow speed and thus improve the overall heat dissipation performance of the chassis.

[0052] like Figure 5 As shown, the manifold 54 has a hood-like structure, with the opening of the hood-like structure forming the air outlet 52, and the inner cavity of the hood-like structure forming the manifold cavity 541. The size of the hood-like structure gradually decreases along the direction from the fan structure 40 to the hood-like structure. This arrangement allows the airflow velocity within the manifold cavity 541 to gradually increase as it flows towards the air outlet 52, further improving the heat dissipation performance of the chassis. Furthermore, it simplifies the structure of the manifold 54, making it easier to manufacture and implement, thereby reducing the processing difficulty and cost for workers.

[0053] like Figure 5 As shown, the size of the dome structure can be its width W.

[0054] For example, the cross-section of the manifold 54 along its width direction can be trapezoidal, with the larger end having an air outlet 52 to form a hood-like structure.

[0055] For example, the air outlet 33 located at the top of the board structure 30 is a first air outlet 331, and there are at least two covering parts 53, including the first covering part 531 covering the first air outlet 331. The first covering part 531 is plate-shaped. The flow guiding structure 50 also includes a connecting member 56 disposed between the first covering part 531 and the confluence part 54. The inner cavity of the first covering part 531 is connected to the confluence cavity 541 through the connecting member 56. This arrangement simplifies the structure of the first covering part 531 and makes it easier to implement. Furthermore, it allows the first covering part 531 to connect with the confluence part 54 through the connecting member 56, and the connecting member 56 increases the installation range of the first covering part 531, thereby improving the versatility of the flow guiding structure 50.

[0056] In some embodiments, the first cover portion 531 may be, for example, a plate-shaped housing, with housing components removed from one plate surface to form the first cover portion 531.

[0057] In some embodiments, the connecting member 56 may be a square tube structure, the overall size of which matches the size of the first covering portion 531, so as to increase the communication area between the first covering portion 531 and the connecting member 56.

[0058] It should be noted that the specific structure of the connecting member 56 can be adjusted according to actual usage requirements. For example, the connecting member 56 can be bent to further adapt to the internal structural layout of the chassis.

[0059] Optionally, the board structure 30 includes a board assembly 34, which has an air inlet 31, a mounting cavity 32, and an outlet 341. Multiple outlets 341 are spaced apart around the central axis of the board assembly 34. The board structure 30 includes multiple sets of board assemblies 34, which are spaced apart along the width of the housing structure 10. Multiple board assemblies 34 within any set are spaced apart along the height of the housing structure 10. The mounting cavities 32 of adjacent board assemblies 34 are connected through outlets 341. The outlet 341 of the board assembly 34 located at the top of the board structure 30 forms a first air outlet 331, and the outlet 341 of the board assembly 34 located on the side of the board structure 30 forms a second air outlet 332. In this way, the above configuration enables the connection between multiple board components 34 through the flow port 341, thereby making the number of board components 34 in the board structure 30 more flexible and diverse to adapt to different working conditions and usage requirements; on the other hand, it makes the formation of the air outlet 33 simpler and easier to implement, thereby reducing the processing cost of the board structure 30.

[0060] Optionally, the board component 34 can be a service board or a main control board.

[0061] For example, the board structure 30 may include two sets of board assemblies 34 arranged along the width direction of the housing structure 10, and each set of board assemblies 34 includes four board assemblies 34 arranged along the height direction of the housing structure 10. In this way, the above arrangement actually makes the board structure 30 have two first air outlets 331, eight second air outlets 332 and eight air inlets 31 as a whole.

[0062] It should be noted that the specific structure of the board structure 30 is not limited to this. For example, the bottom housing of the board assembly 34 may not only have an outlet 341. In this way, multiple sets of board assemblies 34 can also be arranged at intervals along the length of the housing structure 10. Multiple sets of board assemblies 34 along the length of the housing structure 10 can be connected through the air intake 31 and the outlet 341 located on the bottom housing of the board assembly 34.

[0063] like Figure 6 As shown, the covering portion 53 further includes a second covering portion 532 covering the side of the plate structure. The second covering portion 532 covers multiple plate assemblies 34. The second covering portion 532 is plate-shaped and has a flow-slowing cavity and a connecting portion 5321. The air inlet 51 communicates with the connecting portion 5321 through the flow-slowing cavity, and the connecting portion 5321 communicates with the confluence cavity 541. The flow outlets 341 of the multiple plate assemblies 34 form multiple second air outlets 332. The second covering portion 532 has multiple air inlets 51, and the multiple air inlets 51 are arranged in a one-to-one correspondence with the multiple second air outlets 332. In this way, the above arrangement allows the second covering portion 532 to communicate with multiple second air outlets 332 simultaneously; on the other hand, the second covering portion 532 covering the multiple plate assemblies 34 can actually fix the multiple plate assemblies 34, thereby improving the assembly stability of the plate assemblies.

[0064] For example, the second cover portion 532 has four air inlets 51, which are connected to four second air outlets 332 of four board assemblies 34 in a group.

[0065] like Figure 5 and Figure 6 As shown, the connecting part 5321 is perforated, and the manifold 54 is also provided with a connector 55 that communicates with the manifold cavity 541. At least a portion of the connector 55 extends into the slow-flow cavity through the connecting part 5321. In this way, the above arrangement not only simplifies the structure for connecting the manifold 54 and the second cover part 532, but also reduces the difficulty for workers to assemble the two.

[0066] like Figure 6As shown, the air inlet 51 of the second enclosure 532 is a grille air inlet. The chassis also includes a grille structure 60, at least a portion of which is disposed within the grille air inlet. The grille structure 60 includes N air guide plates 61 spaced apart along the length and / or width of the air inlet 51. The extending direction of each air guide plate 61 forms an angle with the surface of the second enclosure 532. Here, N is a positive integer, and there are multiple grille structures 60, each corresponding to a specific grille air inlet. From the bottom to the top of the board structure 30, the number of air guide plates 61 within each grille structure 60 gradually increases, as does the angle between the air guide plates 61 within each grille structure 60. In this way, the air guide plates 61 within the grille structure 60 can adjust the airflow direction and flow rate at the grille air inlet, thereby improving the airflow stability and ultimately enhancing the chassis's heat dissipation reliability. Meanwhile, the aforementioned arrangement of the air guide plates 61 within the multiple grille structures 60 ensures that the airflow resistance of each board component 34 is relatively balanced, thereby improving the heat dissipation consistency of each board component 34.

[0067] For example, considering that the first air outlet 331 is located at the top of the board structure 30 (closer to the fan structure 40), that is, during the airflow process, the airflow in the board assembly 34 located at the bottom of the board structure 30 will increase the airflow rate in the board assembly 34 located at the top of the board structure 30 as it flows towards the first air outlet 331, and the wind resistance will also increase accordingly. The airflow rate flowing out through the second air outlet 332 is adjusted by the air guide plates 61 of each grille structure 60 (as the included angle increases and the number N of air guide plates 61 increases). The larger air volume (and reduced airflow) makes it easier for the airflow in the board assembly 34 at the bottom of the board structure 30 to flow out from the second air outlet 332. That is, the airflow from the board assembly 34 at the bottom of the board structure 30 to the first air outlet 331 is smaller, thereby reducing the airflow in the board assembly 34 at the bottom of the board structure 30. This allows the airflow in each board assembly 34 to gradually become consistent during the dynamic flow of airflow, thereby balancing wind resistance, improving heat dissipation uniformity, and reducing the possibility of local overheating.

[0068] In some embodiments, in the direction from the bottom to the top of the board structure 30, the four grid structures 60 are respectively a first grid structure 62, a second grid structure 63, a third grid structure 64 and a fourth grid structure 65.

[0069] For example, the included angle of each air guide plate 61 in the first grille structure 62 is 30°, and the number N of air guide plates 61 is three.

[0070] For example, the included angle of each air guide plate 61 in the second grille structure 63 is 45°, and the number N of air guide plates 61 is five.

[0071] For example, the included angle of each air guide plate 61 in the third grille structure 64 is 60°, and the number N of air guide plates 61 is seven.

[0072] For example, the included angle of each air guide plate 61 in the fourth grille structure 65 is 75°, and the number N of air guide plates 61 is nine.

[0073] In some embodiments, there are two flow guiding structures 50, and the two flow guiding structures 50 are arranged in a one-to-one correspondence with the two sets of board components 34.

[0074] like Figure 7 and Figure 8 As shown, the board assembly 34 includes a housing 342, a circuit board 343, and a heat dissipation device 344. The housing 342 has an air inlet 31, a mounting cavity 32, and an outlet 341. The circuit board 343 is disposed within the mounting cavity 32 and has a vent 3431 for connecting the outlets 341 located on the two sides of the circuit board 343. The heat dissipation device 344 is disposed on the circuit board 343 and located between the vent 3431 and the air inlet 31. In this way, while ensuring that the outlets on both sides of the circuit board can be connected through the vent 3431, and ensuring that the mounting cavities 32 of two adjacent board assemblies 34 in any direction can be connected, the heat dissipation device 344 located between the vent 3431 and the air inlet 31 allows the airflow entering the mounting cavity 32 through the air inlet 31 to first pass through the heat dissipation device 344 to remove the heat from the heat dissipation device 344 before flowing to the vent 3431, further improving the heat dissipation reliability of the chassis.

[0075] In some embodiments, the outer casing 342 is a cuboid casing with four flow ports 341 on its outer peripheral surface.

[0076] In some embodiments, the heat dissipation device 344 is a heat dissipation fin.

[0077] In some embodiments, the board assembly 34 further includes a fan device 345 and a flow guide assembly 346. The fan device 345 is disposed on the circuit board 343 and located between the heat dissipation device 344 and the air inlet 31. The fan device 345 blows gas into the mounting cavity 32 through the air inlet 31. The fan device 345 includes a plurality of fan blades 3451 arranged along the width direction of the circuit board 343. The flow guide assembly 346 is disposed on the circuit board 343 and includes a first flow guide 3461 and a second flow guide 3462. The first guide element 3461 is disposed between the fan device 345 and the inner wall of the mounting cavity 32, dividing the mounting cavity 32 into an air intake cavity and a heat dissipation cavity through the first guide element 3461 and the fan device 345. The air intake section 31 is connected to the fan device 345 through the air intake cavity, and the heat dissipation device 344 is disposed in the heat dissipation cavity. The second guide element 3462 is disposed in the air intake cavity, dividing the air intake cavity into multiple sub-air intake cavities. The multiple sub-air intake cavities are arranged one-to-one with multiple fan blade sections 3451. In this way, the fan device 345 located between the heat dissipation device 344 and the air intake section 31 can assist in air intake, forming a series system with the fan structure 40, thereby ensuring that the board structure 30, which generates a large amount of heat, has sufficiently high heat dissipation performance. Meanwhile, the above-mentioned configuration, on the one hand, blocks the airflow flowing into the heat dissipation cavity via the fan device 345 through the separation function of the first guide member 3461, so as to prevent the airflow in the heat dissipation cavity from flowing back into the air intake cavity; on the other hand, the second guide member 3462 can prevent the airflow between two adjacent fan blades 3451 from interfering with each other and causing turbulence, thereby improving the air intake reliability of the fan device 345.

[0078] In some embodiments, the fan device 345 is provided with two axial flow fans, and the fan blades 3451 are the fan blades of the axial flow fans.

[0079] In some embodiments, both the first guide member 3461 and the second guide member 3462 are plate-shaped.

[0080] In some embodiments, a third air guide 3463 is further provided between the fan device 345 and the heat dissipation device 344. The third air guide 3463 is in the shape of a bent plate and there are two of them. The two third air guides 3463 are arranged opposite to each other to form a guide space. The guide space can guide all the airflow blown out by the heat dissipation device 344 to the heat dissipation device 344, so as to further improve the heat dissipation reliability of the board assembly 34.

[0081] Optionally, the chassis also includes a power module 70 and a control module 80. The power module 70 is located on the side of the back panel structure 20 away from the board structure 30, and its exhaust section is connected to the air outlet 12. The control module 80 is mounted on the back panel structure 20 and the power module 70, and its inner cavity is connected to the inner cavity of the power module 70. A connection port 82 is provided on the outer shell 81 of the control module 80. The shell structure 10 also has an air inlet 13, and an airflow channel 90 is formed between the inner wall of the receiving cavity and at least a portion of the outer peripheral surface of the board structure 30. The air inlet 13 is connected to the inner cavity of the control module 80 through the airflow channel 90 and the connection port 82, so that when the fan inside the power module 70 rotates, the airflow entering the control module 80 and the power module 70 through the air inlet 13, the airflow channel 90, and the connection port 82 dissipates heat from the control module 80 and the power module 70. While the control module 80 controls the operation of the internal devices of the chassis, outside air can flow into the control module 80 and the power module 70 through the air inlet 13, the airflow channel 90 and the connecting port 82, thereby dissipating heat from the control module 80 and the power module 70.

[0082] In some embodiments, the control module 80 is a power control box.

[0083] In some embodiments, the power module 70 has a built-in axial fan, and its exhaust section 71 is disposed on its power housing.

[0084] The chassis in this embodiment has at least the following advantages:

[0085] 1. It solves the heat dissipation limitations of existing communication equipment caused by the heat dissipation performance of the heat dissipation channel relying too much on the opening size of the back plate structure, and greatly improves the heat dissipation performance of the chassis.

[0086] 2. By limiting the number N and included angle A of the air guide plates 61 in the multiple grille structures 60, the problem of airflow difference caused by wind resistance in each board component 34 is solved, which greatly improves the situation of poor heat dissipation consistency.

[0087] 3. For the individual board assembly 34, its outer shell 342 has a flow port 341 and the circuit board has a ventilation port 3431, forming a through-type multi-channel heat dissipation air duct.

[0088] 4. For the individual board assembly 34, a built-in fan device 345 is provided to increase the air pressure and airflow velocity inside the individual board assembly 34, enhance the turbulence effect, and further improve the situation of poor heat dissipation consistency.

[0089] 5. For the individual board component 34, the built-in airflow guiding component 346 greatly improves the internal airflow return and enhances heat dissipation efficiency.

[0090] As can be seen from the above description, the embodiments of this utility model achieve the following technical effects:

[0091] The chassis housing assembly includes a housing structure and a backplate structure. The housing structure has a connector, a receiving cavity, and an air outlet. Both the connector and the air outlet communicate with the receiving cavity. At least a portion of the circuit board structure is inserted into the receiving cavity via the connector. The circuit board structure has an air inlet, a mounting cavity, and an air outlet. The air outlet communicates with the air inlet through the mounting cavity. The air inlet communicates with the outside environment. The air outlet of the fan structure, located within the receiving cavity, communicates with the air outlet. The backplate structure is positioned between the fan structure and the circuit board structure. A flow guide structure is positioned on the circuit board structure and / or the fan structure. The flow guide structure has a flow guide cavity, and the air outlet communicates with the air inlet of the fan structure through the flow guide cavity. In this way, by connecting the air outlet of the circuit board structure with the air inlet of the fan structure through a flow-guiding structure, the fan structure can draw air sequentially through the air inlet, mounting cavity, air outlet, and flow-guiding cavity to dissipate heat from the electrical components inside the housing structure. Furthermore, the backplate structure used to mount circuit boards and other electrical components does not require any holes. The size of the flow-guiding cavity can be adjusted by increasing the chassis size or by rationally arranging the internal structure of the cavity. This means the overall heat dissipation performance of the chassis is no longer limited by the backplate structure, thus greatly improving the chassis's heat dissipation performance and solving the problem of poor heat dissipation reliability in existing communication equipment. Simultaneously, this design also reduces air resistance inside the chassis, allowing operators to select a fan structure with appropriate power, thereby reducing overall chassis operating noise and improving the user experience.

[0092] Obviously, the embodiments described above are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.

[0093] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0094] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in sequences other than those illustrated or described herein.

[0095] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A chassis, characterized in that, include: The housing assembly includes a housing structure (10) and a back plate structure (20). The housing structure (10) has an insertion interface (11), a receiving cavity, and an air outlet (12). The insertion interface (11) and the air outlet (12) are both connected to the receiving cavity. The board structure (30) is at least partially inserted into the receiving cavity through the insertion interface (11). The board structure (30) has an air inlet (31), a mounting cavity (32) and an air outlet (33). The air outlet (33) is connected to the air inlet (31) through the mounting cavity (32). The air inlet (31) is connected to the outside. A fan structure (40) is disposed within the receiving cavity, and the air outlet (41) of the fan structure (40) is connected to the air outlet (12); wherein, the back plate structure (20) is disposed between the fan structure (40) and the plate structure (30); A flow guiding structure (50) is provided on the plate structure (30) and / or the fan structure (40). The flow guiding structure (50) has a flow guiding cavity, and the air outlet (33) is connected to the air inlet of the fan structure (40) through the flow guiding cavity. The flow guiding structure (50) also has an air inlet (51) and an air outlet (52) that are connected to the flow guiding cavity. The air outlet (52) is connected to the air inlet, and the air inlet (51) is connected to the air outlet (33).

2. The chassis according to claim 1, characterized in that, There are at least two air outlets (33), at least one of the air outlets (33) is located on the top of the board structure (30), and at least the other air outlet (33) is located on the side of the board structure (30); There are at least two air inlets (51), and at least two air inlets (51) are provided in a one-to-one correspondence with at least two air intakes (31).

3. The chassis according to claim 2, characterized in that, The flow guiding structure (50) has: The cover (53) has the air inlet (51) and covers the plurality of air outlets (33); The confluence section (54) has the air outlet (52) and is located at the air inlet section; The confluence section (54) has a confluence cavity (541) that communicates with the air outlet (52), and the air inlet (51) communicates with the air outlet (52) through the confluence section (54).

4. The chassis according to claim 3, characterized in that, The confluence section (54) is a cover-shaped structure, the opening of the cover-shaped structure forms the air outlet (52), and the inner cavity of the cover-shaped structure forms the confluence cavity (541). In the direction from the fan structure (40) to the hood structure, the size of the hood structure gradually decreases.

5. The chassis according to claim 3, characterized in that, The air outlet (33) located at the top of the plate structure (30) is the first air outlet (331). There are at least two cover parts (53). The at least two cover parts (53) include the first cover part (531) covering the first air outlet (331). The first cover part (531) is plate-shaped. The flow guiding structure (50) also includes a connecting member (56) disposed between the first cover part (531) and the confluence part (54). The inner cavity of the first cover part (531) is connected to the confluence cavity (541) through the connecting member (56).

6. The chassis according to claim 5, characterized in that, The board structure (30) includes: The board assembly (34) has the air inlet (31), the mounting cavity (32) and the flow port (341), and there are multiple flow ports (341), which are spaced apart around the central axis of the board assembly (34). The board structure (30) includes multiple sets of board components (34), which are spaced apart along the width direction of the housing structure (10). Multiple board components (34) in any set are spaced apart along the height direction of the housing structure (10). The mounting cavities (32) of two adjacent board components (34) are connected through the flow port (341). The flow port (341) of the board component (34) located at the top of the board structure (30) forms the first air outlet (331), and the flow port (341) of the board component (34) located on the side of the board structure (30) forms the second air outlet (332).

7. The chassis according to claim 6, characterized in that, The covering part (53) further includes a second covering part (532) covering the side of the board structure (30). The second covering part (532) covers a plurality of board assemblies (34). The second covering part (532) is plate-shaped and has a slow flow cavity and a connecting part (5321). The air inlet (51) is connected to the connecting part (5321) through the slow flow cavity. The connecting part (5321) is connected to the manifold (541). The multiple board components (34) have multiple outlet ports (341) forming multiple second air outlets (332), and the second cover (532) has multiple air inlets (51). The multiple air inlets (51) are arranged in a one-to-one correspondence with the multiple second air outlets (332).

8. The chassis according to claim 7, characterized in that, The connecting part (5321) is perforated, and the confluence part (54) is also provided with a plug pipe (55) communicating with the confluence cavity (541). At least a portion of the plug pipe (55) extends into the slow-flow cavity through the connecting part (5321).

9. The chassis according to claim 7, characterized in that, The air inlet (51) of the second enclosure (532) is a grille air inlet, and the chassis also includes: A grille structure (60) is provided in the grille air inlet hole. The grille structure (60) includes N air guide plates (61) spaced apart along the length and / or width of the grille air inlet hole. The extension direction of each air guide plate (61) is set at an angle with the plate surface of the second cover part (532). Wherein, N is a positive integer. There are multiple grille structures (60), and each grille structure (60) is arranged in a one-to-one correspondence with a multiple grille air inlet. In the direction from the bottom to the top of the plate structure (30), the number of air guide plates (61) inside each grille structure (60) gradually increases, and the included angle of the air guide plates (61) inside each grille structure (60) gradually increases.

10. The chassis according to claim 6, characterized in that, The board assembly (34) includes: The housing (342) has the air inlet (31), the mounting cavity (32) and the outlet (341); A circuit board (343) is disposed in the mounting cavity (32). A vent (3431) is provided on the circuit board (343). The vent (3431) is used to connect the flow ports (341) located on the two sides of the circuit board (343). A heat dissipation device (344) is disposed on the circuit board (343) and located between the vent (3431) and the air intake (31).

11. The chassis according to claim 10, characterized in that, The board assembly (34) also includes: A fan device (345) is disposed on the circuit board (343) and located between the heat dissipation device (344) and the air inlet (31). The fan device (345) blows gas into the mounting cavity (32) through the air inlet (31). The fan device (345) includes a plurality of fan blades (3451) arranged along the width direction of the circuit board (343). A flow guiding component (346) is disposed on the circuit board (343), and the flow guiding component (346) includes a first flow guiding element (3461) and a second flow guiding element (3462). The first guide member (3461) is disposed between the inner wall of the fan device (345) and the mounting cavity (32) to divide the mounting cavity (32) into an air inlet cavity and a heat dissipation cavity through the first guide member (3461) and the fan device (345). The air inlet part (31) is connected to the fan device (345) through the air inlet cavity. The heat dissipation device (344) is disposed in the heat dissipation cavity. The second guide member (3462) is disposed in the air inlet cavity to divide the air inlet cavity into multiple sub-air inlet cavities. The multiple sub-air inlet cavities are disposed one-to-one with the multiple fan blades (3451).

12. The chassis according to claim 1, characterized in that, The chassis also includes: A power module (70) is disposed on the side of the back panel structure (20) away from the board structure (30), and the exhaust section of the power module (70) is connected to the air outlet (12); A control module (80) is disposed on the back plate structure (20) and the power module (70). The inner cavity of the control module (80) is connected to the inner cavity of the power module (70). A communication port (82) is provided on the outer shell (81) of the control module (80). The housing structure (10) also has an air inlet (13). An airflow channel (90) is formed between the inner wall of the accommodating cavity and at least part of the outer peripheral surface of the board structure (30). The air inlet (13) is connected to the inner cavity of the control module (80) through the airflow channel (90) and the connecting port (82) so that when the fan in the power module (70) rotates, the airflow entering the control module (80) and the power module (70) through the air inlet (13), the airflow channel (90) and the connecting port (82) can dissipate heat from the control module (80) and the power module (70).

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