Type-C adapter

Abstract

The utility model, which relates to the technical field of the adapter, provides a Type-C adapter comprising a main MCU module, a photoelectric coupling module, a power supply module, a transmit-receive module, a switching MCU module, a ZIGBEE module, a wireless Bluetooth module, and an interface conversion module. The main MCU module is respectively connected with the photoelectric coupling module and the receiving and transmitting module, the photoelectric coupling module is connected with the receiving and transmitting module, the receiving and transmitting module is respectively connected with the power supply module and the switching MCU module, and the switching MCU module is respectively connected with the ZIGBEE module, the wireless Bluetooth module and the interface conversion module. According to the Type-C adapter, multiple functional modules such as the main MCU module, the photoelectric coupling module, the power supply module, the transceiver module, the switching MCU module, the ZIGBEE module, the wireless Bluetooth module and the interface conversion module are integrated, so that the multi-functionalization and intellectualization of the Type-C adapter are realized.

Description

Technical Field

[0001] This utility model relates to the field of adapter technology, and in particular to a Type-C adapter. Background Technology

[0002] With the rapid development and widespread adoption of electronic devices, the Type-C interface has gradually become the mainstream interface standard for many electronic devices due to its reversible plug design, high transmission speed, and support for high-power charging. However, in practical applications, users often need to convert the Type-C interface to other types of interfaces (such as USB-A, HDMI, SD card slots, etc.) to meet different connection requirements. Therefore, Type-C adapters have emerged and become an indispensable accessory in the market.

[0003] Traditional Type-C adapters mostly only offer a single interface conversion function, meaning they can only convert a Type-C interface to another specific type of interface. However, with the diversification of user needs, this single interface conversion function is no longer sufficient to meet market demands. Users expect adapters to not only perform interface conversion but also provide multiple functions such as data transmission, charging, data storage, and wireless communication.

[0004] Therefore, a Type-C adapter is proposed. Utility Model Content

[0005] This manual provides a Type-C adapter that integrates multiple functional modules, including a main MCU module, an optocoupler module, a power supply module, a transceiver module, an adapter MCU module, a Zigbee module, a wireless Bluetooth module, and an interface conversion module, to achieve multifunctionality and intelligence in the Type-C adapter.

[0006] This manual provides a Type-C adapter, including:

[0007] Main MCU module, optocoupler module, power supply module, transceiver module, adapter MCU module, Zigbee module, wireless Bluetooth module, interface conversion module;

[0008] The main MCU module is connected to the optocoupler module and the transceiver module, respectively. The optocoupler module is connected to the transceiver module, respectively. The transceiver module is connected to the power module and the adapter MCU module, respectively. The adapter MCU module is connected to the ZIGBEE module, the wireless Bluetooth module, and the interface conversion module, respectively.

[0009] Optionally, the main MCU module includes: MCU component U12, which is connected to the optocoupler module and resistor R319 respectively. Resistor R319 is connected to resistor R320, resistor R320 is connected to field-effect transistor Q12, field-effect transistor Q12 is connected to field-effect transistor Q13, field-effect transistor Q13 is connected to resistor R321, resistor R321 is connected to resistor R322, and resistor R322 is connected to the transceiver module.

[0010] Optionally, the optocoupler module includes: optocoupler U35 and optocoupler U36; optocoupler U35 is connected to resistor R330, and resistor R330 is connected to the transceiver module; optocoupler U35 is also connected to resistor R328, the base of field-effect transistor Q14, and resistor R329 respectively; resistor R329 is connected to capacitor C112 and the collector of field-effect transistor Q14 respectively; capacitor C112 is connected to the MCU device U12; and resistor R328 is connected to the emitter of field-effect transistor Q14.

[0011] The optocoupler U36 is connected to resistor R333, which is connected to the transceiver module; the optocoupler U36 is also connected to resistor R331, which is connected to capacitor C113, which is connected to the MCU device U12.

[0012] Optionally, the power module includes: a power supply component U26, which is connected to capacitors C97 and C98 respectively; capacitor C98 is connected to voltage regulator component U27 and capacitor C100 respectively; voltage regulator component U27 is connected to capacitor C100, resistor R148, resistor R147, and capacitor C99 respectively; and resistor R148 is connected to the transceiver module.

[0013] Optionally, the transceiver module includes: a CAN transceiver U33, an extended serial bus USB1, a transceiver U32, and a transceiver U14; the CAN transceiver U33 is connected to the adapter MCU module, capacitor C21, resistor R30, resistor R33, capacitor C105, resistor R31, and transient suppression diode D3, respectively; resistor R31 is connected to transient suppression diode D4; transient suppression diodes D3 and D4 are both connected to the extended serial bus USB1; and the extended serial bus USB1 is connected to the optocoupler module and transient suppression diode D14, respectively. 7. Transient suppression diode D9; transient suppression diode D7 is connected to resistor R67; resistor R67 is connected to resistor R74 and transceiver U14; resistor R74 is connected to resistor R77; resistor R77 is connected to transient suppression diode D9; transceiver U14 is connected to capacitor C59, resistor R66, resistor R73, collector of transistor Q2, and emitter of transistor Q2; base of transistor Q2 is connected to resistor R76; resistor R76 is connected to resistor R75; resistor R75 is connected to resistor R73 and power module.

[0014] The extended serial bus USB1 is also connected to transient suppression diodes D20 and D21 respectively. Transient suppression diode D20 is connected to resistor R155. Resistor R155 is connected to resistor R158 and transceiver U32. Resistor R158 is connected to resistor R160. Resistor R160 is connected to transient suppression diode D21. Transceiver U32 is connected to capacitor C111, resistor R156, resistor R157, collector of transistor Q3, and emitter of transistor Q3 respectively. Base of transistor Q3 is connected to resistor R161. Resistor R161 is connected to resistor R159. Resistor R159 is connected to resistor R157 and power module.

[0015] Optionally, the transceiver module further includes: connector J14, field-effect transistor Q12, and field-effect transistor Q13; connector J14 is connected to transient suppression diode D20, transient suppression diode D21, resistor R316, and resistor R317 respectively; resistor R316 is connected to resistor R322; resistor R322 is connected to resistor R321; resistor R321 is connected to resistor R317, field-effect transistor Q13, and resistor R324 respectively; field-effect transistor Q13 is connected to field-effect transistor Q12 and resistor R323 respectively; field-effect transistor Q12 is connected to resistor R319 and resistor R320 respectively; and resistors R319 and R320 are both connected to the main MCU module.

[0016] Optionally, the adapter MCU module includes: MCU component U3, which is connected to resistors R26, R32, and R25, capacitor C20, LED1, and LED2 respectively; resistors R26, R32, R25, and capacitor C20 are all connected to TF card U34; TF card U34 is connected to TF card U5; LED1 is connected to resistor R2; and LED2 is connected to resistor R325.

[0017] Optionally, the ZIGBEE module includes a ZIGBEE component U4, which is connected to a capacitor C22. The capacitor C22 is connected to a capacitor C23, and the capacitor C23 is connected to the MCU component U3.

[0018] Optionally, the wireless Bluetooth module includes: a wireless component U11 connected to the MCU component U3, the wireless component U11 connected to a capacitor C42, the capacitor C42 connected to a resistor R50 and an inductor L2 respectively, the resistor R50 connected to a resistor R53, the inductor L2 connected to a capacitor C40, the capacitor C40 connected to a transient suppression diode D5 and a monitoring component U10 respectively, and the monitoring component U10 connected to a resistor R51 and a capacitor C41 respectively.

[0019] Optionally, the interface conversion module includes: an interface conversion component U8 connected to the MCU component U3, the interface conversion component U8 being connected to a network transformer U7, the network transformer U7 being connected to capacitor C29, capacitor C30, resistor R35, and resistor R36 respectively, resistor R35 being connected to capacitor C31, and resistor R36 being connected to capacitor C332.

[0020] This invention, by integrating multiple functional modules, significantly reduces the number and size of required components, resulting in a more compact, lightweight, and portable structure. The transceiver module supports multiple communication protocols such as CAN and USB, ensuring high-speed and stable data transmission. Simultaneously, the addition of protective components such as an optocoupler module and transient suppression diodes further enhances the reliability and security of data transmission. The adapter MCU module supports TF card expansion storage, allowing users to easily expand storage capacity as needed. Furthermore, the inclusion of a ZIGBEE module and a wireless Bluetooth module enables the adapter to easily connect to various wireless devices, achieving broader connectivity and applications. The power module employs voltage regulators and filter capacitors to ensure stable power output, providing reliable power for all functional modules. The adapter MCU module is equipped with multiple indicator lights (such as LED1 and LED2) to display the adapter's operating status and connection status in real time, facilitating troubleshooting and status monitoring. This adapter supports a Type-C interface, ensuring broad compatibility with various Type-C devices and providing users with significant convenience. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the structure of a Type-C adapter provided in an embodiment of this specification;

[0023] Figure 2 This is a schematic diagram of the structure of the main MCU module 100 provided in the embodiments of this specification;

[0024] Figure 3 This is a schematic diagram of the structure of the optocoupler module 200 provided in the embodiments of this specification;

[0025] Figure 4 This is a schematic diagram of the power module 300 provided in the embodiments of this specification;

[0026] Figure 5 This is a schematic diagram of the transceiver module 400 provided in the embodiments of this specification;

[0027] Figure 6 This is a schematic diagram of the structure of the adapter MCU module 500 provided in the embodiments of this specification;

[0028] Figure 7This is a schematic diagram of the structure of the ZIGBEE module 600 provided in the embodiments of this specification;

[0029] Figure 8 This is a schematic diagram of the structure of the wireless Bluetooth module 700 provided in the embodiments of this specification;

[0030] Figure 9 This is a schematic diagram of the interface conversion module 800 provided in the embodiments of this specification.

[0031] The attached diagram shows: 100, main MCU module; 200, optocoupler module; 300, power supply module; 400, transceiver module; 500, adapter MCU module; 600, Zigbee module; 700, wireless Bluetooth module; 800, interface conversion module. Detailed Implementation

[0032] The following description is intended to disclose the present invention so that those skilled in the art can implement it. The preferred embodiments described below are merely examples, and other obvious variations will occur to those skilled in the art. The basic principles of the present invention defined in the following description can be applied to other embodiments, modifications, improvements, equivalents, and other technical solutions that do not depart from the spirit and scope of the present invention.

[0033] The following is in conjunction with the appendix Figure 1-9 Exemplary embodiments of the present invention will be described more fully. However, exemplary embodiments can be implemented in many forms and should not be construed as limiting the present invention to the embodiments set forth herein. Rather, these exemplary embodiments are provided to make the present invention more comprehensive and complete, and to facilitate the full communication of the inventive concept to those skilled in the art. The same reference numerals in the figures denote the same or similar elements, components, or parts, and therefore repeated descriptions of them are omitted.

[0034] Subject to the technical concept of this utility model, the features, structures, characteristics or other details described in a particular embodiment may be combined in one or more other embodiments in a suitable manner.

[0035] In the description of specific embodiments, the features, structures, characteristics, or other details described herein are intended to enable those skilled in the art to fully understand the embodiments. However, it is not excluded that those skilled in the art can practice the technical solutions of this utility model without one or more of the specific features, structures, characteristics, or other details.

[0036] The terms “and / or” or “and / or” include all combinations of any one or more of the listed items.

[0037] like Figure 1 As shown, this specification provides a Type-C adapter, comprising: a Type-C adapter comprising:

[0038] The adapter comprises a main MCU module 100, an optocoupler module 200, a power supply module 300, a transceiver module 400, an adapter MCU module 500, a ZigBee module 600, a wireless Bluetooth module 700, and an interface conversion module 800. The main MCU module 100 is connected to the optocoupler module 200 and the transceiver module 400. The optocoupler module 200 is connected to the transceiver module 400. The transceiver module 400 is connected to the power supply module 300 and the adapter MCU module 500. The adapter MCU module 500 is connected to the ZigBee module 600, the wireless Bluetooth module 700, and the interface conversion module 800. By integrating multiple functional modules such as the main MCU module 100, the optocoupler module 200, the power supply module 300, the transceiver module 400, the adapter MCU module 500, the ZigBee module 600, the wireless Bluetooth module 700, and the interface conversion module 800, the Type-C adapter achieves multifunctionality and intelligence.

[0039] like Figure 2 As shown, the main MCU module 100 includes an MCU component U12, which is connected to the optocoupler module 200 and resistor R319. The connection between the MCU component U12 and the optocoupler module 200 achieves electrical isolation, improving the safety and stability of the adapter. Resistor R319 is connected to resistor R320, resistor R320 is connected to field-effect transistor Q12, and field-effect transistor Q12 is connected to field-effect transistor Q13. The circuit connection between field-effect transistors Q12 and Q13 may achieve signal amplification or isolation functions, which helps to enhance signal transmission capability and reduce signal loss and interference. Field-effect transistor Q13 is connected to resistor R321, resistor R321 is connected to resistor R322, and resistor R322 is connected to transceiver module 400.

[0040] like Figure 3As shown, the optocoupler module 200 includes optocoupler U35 and optocoupler U36, which achieve electrical isolation through optical signal transmission, effectively preventing direct electrical connection between high-voltage circuits and low-voltage circuits, and improving the safety and stability of the system. Optocoupler U35 is connected to resistor R330, which in turn is connected to transceiver module 400. Optocoupler U35 is also connected to resistor R328, the base of MOSFET Q14, and resistor R329. Resistor R329 is connected to capacitor C112 and the collector of MOSFET Q14. Capacitor C112 is connected to MCU device U12, and resistor R328 is connected to the emitter of MOSFET Q14. Optocoupler U36 is connected to resistor R333, which in turn is connected to transceiver module 400. Optocoupler U36 is also connected to resistor R331, which is connected to capacitor C113. Capacitor C113 is connected to MCU device U12. Capacitors C112 and C113 act as filters and decouplers in the circuit, helping to reduce signal interference and noise, ensuring that MCU device U12 can receive stable and clear signals.

[0041] like Figure 4 As shown, the power module 300 includes: a power supply component U26, which is connected to capacitors C97 and C98 respectively. Capacitor C98 is connected to voltage regulators U27 and C100 respectively. Voltage regulator U27 is connected to capacitor C100, resistor R148, resistor R147, and capacitor C99 respectively. Capacitor C100, resistors R147 and R148, and capacitor C99 together form a voltage regulator or filter circuit to further ensure the stability and accuracy of the output voltage. Resistor R148 is connected to the transceiver module 400 to transmit the stabilized power supply voltage to the transceiver module 400 for its normal operation.

[0042] like Figure 5As shown, the transceiver module 400 includes: a CAN transceiver U33, an extended serial bus USB1, a transceiver U32, and a transceiver U14. The CAN transceiver U33 is connected to the adapter MCU module 500, capacitor C21, resistor R30, resistor R33, capacitor C105, resistor R31, and transient suppression diode D3. Resistor R31 is connected to transient suppression diode D4. Transient suppression diodes D3 and D4 are both connected to the extended serial bus USB1. The extended serial bus USB1 is connected to the optocoupler module 200, transient... Suppression diode D7 and transient suppression diode D9 are connected. Transient suppression diode D7 is connected to resistor R67. Resistor R67 is connected to resistor R74 and transceiver U14. Resistor R74 is connected to resistor R77. Resistor R77 is connected to transient suppression diode D9. Transceiver U14 is connected to capacitor C59, resistor R66, resistor R73, collector of transistor Q2, emitter of transistor Q2, base of transistor Q2 is connected to resistor R76, resistor R76 is connected to resistor R75, resistor R75 is connected to resistor R73 and power module 300.

[0043] The extended serial bus USB1 is also connected to transient suppression diodes D20 and D21. Transient suppression diode D20 is connected to resistor R155, which in turn is connected to resistor R158 and transceiver U32. Resistor R158 is connected to resistor R160, which in turn is connected to transient suppression diode D21. Transceiver U32 is connected to capacitor C111, resistors R156 and R157, the collector and emitter of transistor Q3, the base of transistor Q3, resistor R161, resistor R161, resistor R159, resistor R159, resistor R157, and power module 300. CAN transceivers U33, U32, and U14 are connected to the extended serial bus USB1 and other components through a complex interconnect network. These connections involve multiple aspects such as filtering, signal conditioning, transient voltage protection, and power management, which together ensure the stability and reliability of the transceiver module 400.

[0044] The transceiver module 400 also includes: connector J14, field-effect transistor Q12, and field-effect transistor Q13. Connector J14 is connected to transient suppression diodes D20 and D21, resistors R316 and R317, respectively. Resistor R316 is connected to resistor R322, resistor R322 is connected to resistor R321, resistor R321 is connected to resistor R317, field-effect transistor Q13, and resistor R324, respectively. Field-effect transistor Q13 is connected to field-effect transistor Q12 and resistor R323, and field-effect transistor Q12 is connected to resistors R319 and R320, respectively. Resistors R319 and R320 are both connected to the main MCU module 100. Connector J14, field-effect transistors Q12 and Q13 are connected to the transient suppression diodes through a complex resistor network, forming a protection circuit and a signal conditioning circuit.

[0045] like Figure 6 As shown, the adapter MCU module 500 includes: MCU component U3, which is connected to resistors R26, R32, R25, capacitor C20, LED1, and LED2. LED1 and LED2 are used to indicate the working status of the MCU or provide a certain alarm signal. Resistors R26, R32, R25, and capacitor C20 are all connected to TF card U34. TF card U34 is connected to TF card U5. LED1 is connected to resistor R2, and LED2 is connected to resistor R325.

[0046] like Figure 7 As shown, the ZIGBEE module 600 includes a ZIGBEE component U4, which is connected to capacitor C22. Capacitor C22 is used to filter out high-frequency noise on the power line of the ZIGBEE component U4, ensuring the stability and reliability of ZIGBEE communication. Capacitor C22 is connected to capacitor C23, and capacitor C23 is connected to MCU component U3.

[0047] like Figure 8 As shown, the wireless Bluetooth module 700 includes: a wireless component U11 connected to the MCU component U3; the wireless component U11 is connected to a capacitor C42; the capacitor C42 is connected to a resistor R50 and an inductor L2; the inductor L2, capacitors C42 and C40 together form a π-type filter to further reduce noise on the power line; resistor R50 is connected to a resistor R53; inductor L2 is connected to a capacitor C40; capacitor C40 is connected to a transient suppression diode D5 and a monitoring component U10; the monitoring component U10 is connected to a resistor R51 and a capacitor C41.

[0048] like Figure 9As shown, the interface conversion module 800 includes: an interface conversion component U8 connected to the MCU component U3; the interface conversion component U8 connected to the network transformer U7; the network transformer U7 connected to capacitors C29 and C30, resistors R35 and R36; resistor R35 connected to capacitor C31; and resistor R36 connected to capacitor C332. The interface conversion module 800 is an integrated module with the interface conversion component U8 as its core, including the network transformer U7, multiple filter capacitors (C29, C30, C31, C332), and current-limiting / voltage-dividing resistors (R35, R36). It connects to the MCU component U3, converting the MCU's signals into a format suitable for network transmission, and performing signal isolation and impedance matching through the network transformer before finally outputting to the network. These components and connections collectively ensure the stability and transmission performance of the interface conversion module 800.

[0049] In this invention, by integrating multiple functional modules, the adapter significantly reduces the number and size of required components, making the overall structure more compact, lightweight, and easy to carry and use. The transceiver module 400 supports multiple communication protocols such as CAN and USB, ensuring high-speed and stable data transmission. Simultaneously, the addition of protective components such as the optocoupler module 200 and transient suppression diodes further enhances the reliability and security of data transmission. The adapter MCU module 500 supports TF card expansion storage, allowing users to easily expand storage capacity as needed. Furthermore, the inclusion of the ZIGBEE module 600 and the wireless Bluetooth module 700 enables the adapter to easily connect to various wireless devices, achieving a wider range of connections and applications. The power module 300 employs voltage regulators and filter capacitors to ensure stable power output, providing reliable power for all functional modules. The adapter MCU module 500 is equipped with multiple indicator lights (such as LED1 and LED2) that can display the adapter's operating status and connection status in real time, facilitating troubleshooting and status monitoring for users. This adapter supports the Type-C interface and is widely compatible with various Type-C devices, providing great convenience to users.

[0050] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of this utility model. It should be understood that this utility model is not inherently related to any specific computer, virtual device, or electronic device, and various general-purpose devices can also implement this utility model. The above descriptions are merely specific embodiments of this utility model and are not intended to limit this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

[0051] The various embodiments in this specification are described in a progressive manner. The same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on describing the differences from other embodiments.

[0052] The above description is merely an embodiment of this application and is not intended to limit the scope of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of the claims of this application.

Claims

1. A Type-C adapter, characterized in that, include: Main MCU module (100), optocoupler module (200), power supply module (300), transceiver module (400), adapter MCU module (500), ZIGBEE module (600), wireless Bluetooth module (700), interface conversion module (800); The main MCU module (100) is connected to the optocoupler module (200) and the transceiver module (400) respectively. The optocoupler module (200) is connected to the transceiver module (400). The transceiver module (400) is connected to the power module (300) and the adapter MCU module (500) respectively. The adapter MCU module (500) is connected to the ZIGBEE module (600), the wireless Bluetooth module (700), and the interface conversion module (800) respectively.

2. The Type-C adapter as described in claim 1, characterized in that, The main MCU module (100) includes: MCU component U12, which is connected to the optocoupler module (200) and resistor R319 respectively. Resistor R319 is connected to resistor R320, resistor R320 is connected to field-effect transistor Q12, field-effect transistor Q12 is connected to field-effect transistor Q13, field-effect transistor Q13 is connected to resistor R321, resistor R321 is connected to resistor R322, and resistor R322 is connected to transceiver module (400).

3. The Type-C adapter as described in claim 2, characterized in that, The optocoupler module (200) includes: optocoupler U35 and optocoupler U36; optocoupler U35 is connected to resistor R330, and resistor R330 is connected to the transceiver module (400); optocoupler U35 is also connected to resistor R328, the base of field-effect transistor Q14, and resistor R329 respectively; resistor R329 is connected to capacitor C112 and the collector of field-effect transistor Q14 respectively; capacitor C112 is connected to the MCU device U12; and resistor R328 is connected to the emitter of field-effect transistor Q14. The optocoupler U36 is connected to resistor R333, which is connected to the transceiver module (400); the optocoupler U36 is also connected to resistor R331, which is connected to capacitor C113, which is connected to MCU device U12.

4. The Type-C adapter as described in claim 3, characterized in that, The power module (300) includes: a power supply component U26, which is connected to capacitors C97 and C98 respectively; capacitor C98 is connected to voltage regulator component U27 and capacitor C100 respectively; voltage regulator component U27 is connected to capacitor C100, resistor R148, resistor R147 and capacitor C99 respectively; and resistor R148 is connected to the transceiver module (400).

5. The Type-C adapter as described in claim 4, characterized in that, The transceiver module (400) includes: a CAN transceiver U33, an extended serial bus USB1, a transceiver U32, and a transceiver U14. The CAN transceiver U33 is connected to the adapter MCU module (500), capacitor C21, resistor R30, resistor R33, capacitor C105, resistor R31, and transient suppression diode D3. Resistor R31 is connected to transient suppression diode D4. Transient suppression diodes D3 and D4 are both connected to the extended serial bus USB1. The extended serial bus USB1 is connected to the optocoupler module (200), the transient suppression diode... Transistor D7 and transient suppression diode D9 are connected. Transistor D7 is connected to resistor R67. Resistor R67 is connected to resistor R74 and transceiver U14. Resistor R74 is connected to resistor R77. Resistor R77 is connected to transient suppression diode D9. Transceiver U14 is connected to capacitor C59, resistor R66, resistor R73, collector of transistor Q2, and emitter of transistor Q2. Base of transistor Q2 is connected to resistor R76. Resistor R76 is connected to resistor R75. Resistor R75 is connected to resistor R73 and power module (300). The extended serial bus USB1 is also connected to transient suppression diodes D20 and D21 respectively. Transient suppression diode D20 is connected to resistor R155. Resistor R155 is connected to resistor R158 and transceiver U32 respectively. Resistor R158 is connected to resistor R160. Resistor R160 is connected to transient suppression diode D21. Transceiver U32 is connected to capacitor C111, resistor R156, resistor R157, collector of transistor Q3, and emitter of transistor Q3 respectively. Base of transistor Q3 is connected to resistor R161. Resistor R161 is connected to resistor R159. Resistor R159 is connected to resistor R157 and power module (300).

6. The Type-C adapter as described in claim 5, characterized in that, The transceiver module (400) further includes: connector J14, field-effect transistor Q12, and field-effect transistor Q13; connector J14 is connected to transient suppression diode D20, transient suppression diode D21, resistor R316, and resistor R317 respectively; resistor R316 is connected to resistor R322; resistor R322 is connected to resistor R321; resistor R321 is connected to resistor R317, field-effect transistor Q13, and resistor R324 respectively; field-effect transistor Q13 is connected to field-effect transistor Q12 and resistor R323 respectively; field-effect transistor Q12 is connected to resistor R319 and resistor R320 respectively; and resistors R319 and R320 are both connected to the main MCU module (100).

7. The Type-C adapter as described in claim 6, characterized in that, The adapter MCU module (500) includes: MCU component U3, which is connected to resistors R26, R32, R25, capacitor C20, LED1, and LED2 respectively. Resistors R26, R32, R25, and C20 are all connected to TF card U34. TF card U34 is connected to TF card U5. LED1 is connected to resistor R2, and LED2 is connected to resistor R325.

8. The Type-C adapter as described in claim 7, characterized in that, The ZIGBEE module (600) includes a ZIGBEE component U4, which is connected to a capacitor C22. The capacitor C22 is connected to a capacitor C23, and the capacitor C23 is connected to the MCU component U3.

9. The Type-C adapter as described in claim 8, characterized in that, The wireless Bluetooth module (700) includes: a wireless component U11 connected to the MCU component U3, the wireless component U11 being connected to a capacitor C42, the capacitor C42 being connected to a resistor R50 and an inductor L2, the resistor R50 being connected to a resistor R53, the inductor L2 being connected to a capacitor C40, the capacitor C40 being connected to a transient suppression diode D5 and a monitoring component U10, and the monitoring component U10 being connected to a resistor R51 and a capacitor C41.

10. The Type-C adapter as described in claim 9, characterized in that, The interface conversion module (800) includes: an interface conversion component U8 connected to the MCU component U3, the interface conversion component U8 being connected to a network transformer U7, the network transformer U7 being connected to capacitor C29, capacitor C30, resistor R35, and resistor R36 respectively, resistor R35 being connected to capacitor C31, and resistor R36 being connected to capacitor C332.

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