Four-way power amplifier circuit system

Abstract

The utility model belongs to the field of electronic information, and discloses a four-way power amplifier circuit system, which comprises a mainboard and a power amplifier circuit board, and a power supply is arranged on the mainboard; the mainboard and the power amplifier circuit board are provided with four power amplifier circuits. The power amplifier circuit and the power supply are respectively arranged on the left and right sides of the mainboard; the power supply comprises a rectifier module, an active power factor corrector, a DC-DC circuit and a transformer which are electrically connected in sequence; the four active power factor correctors are connected in parallel. According to the system, by optimizing the circuit structure, a power supply can effectively load four power amplifier circuits, meanwhile, the occupied area of the power supply is controlled, and sufficient arrangement space is provided for the power amplifier circuits; compared with the previous generation of products, the mainboard area is not increased, and the structure is compact.

Description

Technical Field

[0001] This utility model relates to the field of electronic information, specifically a four-channel power amplifier circuit system. Background Technology

[0002] The applicant has previously filed three patent applications:

[0003] CN115276627A discloses a gallium nitride MOSFET conduction loss power limiting circuit, including a signal input terminal, a first MOSFET and a second MOSFET, a first sampling circuit connected to the first MOSFET for real-time sampling of its operating voltage, a second sampling circuit connected to the second MOSFET for real-time sampling of its operating voltage, a feedback processing module connected to both the first and second sampling circuits for processing the sampled signals into a production limit feedback signal according to a set setting, and a driving module for driving the first and second MOSFETs to switch on and off according to the signals. The feedback processing module and the signal input terminal are respectively connected to a control signal processing module for generating control signals that are input to the driving module to control the on and off states of the first and second MOSFETs, thereby forming an automatic power loss limiting structure. This solution can effectively protect the MOSFETs and improve their operational stability and efficiency.

[0004] 2. CN220673924U A power amplifier system;

[0005] 3. CN220359428U A single-board gallium nitride power amplifier circuit board and power amplifier circuit system.

[0006] The above three solutions constitute the applicant's old power amplifier equipment.

[0007] When arranging four power amplifier circuits on a limited motherboard, especially with increased power, the first consequence is a significant increase in power supply size, which can occupy more than 50% of the motherboard area. Compared to the approximately 50% footprint of older designs, it is much more difficult to arrange four power amplifier circuits without increasing the motherboard area.

[0008] The technical problem this case addresses is: how to optimize the existing power amplifier system to allow four power amplifier circuits to be simultaneously arranged on the motherboard. Utility Model Content

[0009] The purpose of this utility model is to provide a power amplifier circuit system. This system optimizes the circuit structure so that the power supply can effectively load four power amplifier circuits, while controlling the area occupied by the power supply and providing sufficient space for the power amplifier circuits. Compared with the previous generation product, the motherboard area has not increased and the structure is compact.

[0010] To achieve the above objectives, this utility model provides the following technical solution: a four-channel power amplifier circuit system, including a motherboard and a power amplifier circuit board, wherein a power supply is provided on the motherboard; four power amplifier circuits are provided on the motherboard and the power amplifier circuit board; the power amplifier circuits and the power supply are respectively located on the left and right sides of the motherboard;

[0011] The power supply includes a rectifier module, an active power factor corrector, a DC-DC circuit, and a transformer connected in sequence; there are four active power factor correctors connected in parallel.

[0012] In the aforementioned four-channel power amplifier circuit system, a first heat sink is suspended on the motherboard. The first heat sink is located above the active power factor corrector and is used to dissipate heat from the active power factor corrector.

[0013] In the aforementioned four-channel power amplifier circuit system, the motherboard is also equipped with a low-voltage power supply, and the output terminal of the transformer is connected to the low-voltage power supply; the low-voltage power supply is used to power the power amplifier circuit.

[0014] In the aforementioned four-channel power amplifier circuit system, the power supply occupies 50-70% of the motherboard area.

[0015] In the aforementioned four-channel power amplifier circuit system, the power amplifier circuit board is suspended and fixed on the side of the motherboard away from the power supply.

[0016] In the above-mentioned four-channel power amplifier circuit system, there are two DC-DC circuits and two transformers. One DC-DC circuit and one transformer constitute a transformer circuit, and the two transformer circuits are connected in parallel. The output terminals of the two transformer circuits are connected to the low-voltage power supply, and the input terminals of the two transformer circuits are connected to the output terminals of four parallel active power factor correctors.

[0017] In the above-mentioned four-channel power amplifier circuit system, the power amplifier circuit includes an analog signal input terminal, an analog signal amplification circuit, a PWM modulation circuit, a digital signal output terminal, a sampling circuit, a feedback processing module, a first MOSFET, a second MOSFET, a MOSFET driver chip, a signal input terminal, a signal output terminal, an inductor, and an analog signal output terminal.

[0018] The analog signal input terminal, analog signal amplification circuit, PWM modulation circuit, digital signal output terminal, feedback processing module, analog signal output terminal, and inductor are mounted on the motherboard.

[0019] The first MOSFET, the second MOSFET, the MOSFET driver chip, the signal input terminal, and the signal output terminal are mounted on the power amplifier circuit board; the power amplifier circuit board is located directly above the PWM modulation circuit and the feedback processing module.

[0020] The sampling circuit is located on the motherboard or on the power amplifier circuit board.

[0021] In the aforementioned four-channel power amplifier circuit system, the four power amplifier circuits are arranged sequentially on the main board and the power amplifier circuit board along the long side of the power amplifier circuit board.

[0022] In the above-mentioned four-channel power amplifier circuit system, the analog signal input terminal, analog signal amplification circuit, PWM modulation circuit, digital signal output terminal, signal input terminal, and MOSFET driver chip are electrically connected in sequence.

[0023] Both the first MOSFET and the second MOSFET are used to receive and amplify the signals input from the MOSFET driver chip, and send the amplified signals to the signal output terminal. The signal output terminal, the inductor, and the analog signal output terminal are connected in sequence.

[0024] The sampling circuit is used to sample the operating voltage of the first MOSFET and the second MOSFET in real time to obtain the sampling signal. The feedback processing module is used to process the sampling signal into a production limit feedback signal according to the settings. The feedback signal is sent to the MOSFET driver chip, and the MOSFET driver chip controls the on and off of the first MOSFET and the second MOSFET.

[0025] In the above-mentioned four-channel power amplifier circuit system, a heat dissipation device is arranged on the upper surface of the power amplifier circuit board, and the first MOSFET and the second MOSFET are arranged on the lower surface of the power amplifier circuit board; the heat dissipation device is used to absorb, store and dissipate the heat generated by the first MOSFET and the second MOSFET.

[0026] The sampling circuit and MOSFET driver chip are arranged on the lower surface of the power amplifier circuit board.

[0027] In the above-mentioned four-channel power amplifier circuit system, there is one heat dissipation device, which covers the areas where the first MOSFET and the second MOSFET are located.

[0028] The heat dissipation device is a finned heat sink.

[0029] Compared with the prior art, the beneficial effects of this utility model are:

[0030] This invention optimizes the circuit structure, enabling the power supply to effectively load four power amplifier circuits while controlling the power supply's footprint, providing ample space for the power amplifier circuits. Compared to the previous generation, the motherboard area has not increased, resulting in a more compact structure.

[0031] In terms of power circuit structure optimization, four active power factor correctors are connected in parallel and output to the DC-DC circuit and transformer. Compared with four sets of active power factor correctors connected to a DC-DC circuit and transformer separately, the area occupied is significantly reduced. Attached Figure Description

[0032] Figure 1 This is a top view of the motherboard in Embodiment 1;

[0033] Figure 2 This is a bottom view of the power amplifier circuit board of Embodiment 1;

[0034] Figure 3 This is a schematic diagram of the power amplifier circuit board and the main board in Embodiment 1.

[0035] Figure 4 This is the circuit diagram of the power supply. Detailed Implementation

[0036] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0037] Example 1

[0038] refer to Figure 1-3 A four-channel power amplifier circuit system includes a motherboard 1 and a power amplifier circuit board 2. The motherboard 1 is equipped with a power supply 3. The motherboard 1 and the power amplifier circuit board 2 are equipped with four power amplifier circuits. The power amplifier circuits and the power supply 3 are respectively located on the left and right sides of the motherboard 1.

[0039] refer to Figure 4 The power supply 3 includes a rectifier module 31, an active power factor corrector 32, a DC-DC circuit 33, and a transformer 34 connected in sequence; there are four active power factor correctors 32 connected in parallel.

[0040] The power amplifier circuit can be seen in the applicant's prior applications CN220673924U and CN220359428U. In this embodiment, the circuit structure and principle remain unchanged.

[0041] In the original design, two or more power amplifier circuits already made the area of ​​power supply 3 quite large. In this embodiment, when four power amplifier circuits are added, without increasing the area of ​​the motherboard 1 (the casing, etc., have already been molded, and customers are not very accepting of power amplifiers that are too large), it means that the area of ​​power supply 3 needs to be further increased to reduce the area occupied by the power amplifier circuits. Reducing the area occupied by the power amplifier circuits is another inventive point of this embodiment; appropriately increasing the area of ​​power supply 3 while ensuring a stable current supply is a key issue that needs to be considered in this embodiment.

[0042] In power supply section 3, the mains power enters the rectifier module 31 for rectification, and then is input to the input terminals of four sets of parallel active power factor correctors 32. After processing by the active power factor correctors 32, the input power factor is improved, and the switching devices are controlled to make the input current waveform follow the input voltage waveform. Then, the voltage is regulated by the DC-DC circuit 33; and then transformed by the transformer 34 before being used by the power amplifier circuit. Through the above optimization, the area of ​​power supply 3 can be increased without significantly increasing the load on power supply 3, while ensuring a relatively stable power supply quality.

[0043] Preferably, a first heat sink is suspended on the motherboard 1, and the first heat sink is located above the active power factor corrector 32 and is used to dissipate heat from the active power factor corrector 32. The first heat sink is generally preferably a finned heat sink or a tube heat sink, etc.

[0044] Preferably, the motherboard 1 is further provided with a low-voltage power supply 3, and the output terminal of the transformer 34 is connected to the low-voltage power supply 3; the low-voltage power supply 3 is used to supply power to the power amplifier circuit. The low-voltage power supply 3 is located near the power amplifier circuit.

[0045] Preferably, the power supply 3 occupies 150-70% of the area of ​​the motherboard; in this embodiment, it occupies approximately 50-55% of the area.

[0046] Preferably, there are two DC-DC circuits 33 and two transformers 34. One DC-DC circuit 33 and one transformer 34 constitute a transformer circuit, and the two transformer circuits are connected in parallel. The output terminals of the two transformer circuits are connected to the low-voltage power supply 3, and the input terminals of the two transformer circuits are connected to the output terminals of four parallel active power factor correctors 32.

[0047] In a conventional design, if there are four active power factor correctors 32, each active power factor corrector 32 is connected to an independent DC-DC circuit 33 and transformer 34. In this embodiment, it is preferable to reduce the DC-DC circuit 33 and transformer 34 to two and connect them in parallel. This can meet the transformation operation of the output current of the four active power factor correctors 32 connected in parallel, and at the same time reduce the area occupied by these components.

[0048] The power amplifier circuit board 2 is suspended and fixed on the other side of the motherboard 1; the power amplifier circuit includes an analog signal input terminal 4, an analog signal amplification circuit 5, a PWM modulation circuit 6, a digital signal output terminal 7, a sampling circuit 8, a feedback processing module 9, a first MOSFET 10, a second MOSFET 11, a MOSFET driver chip 12, a signal input terminal 13, a signal output terminal 14, an inductor 15, and an analog signal output terminal 16;

[0049] The analog signal input terminal 4, analog signal amplification circuit 5, PWM modulation circuit 6, digital signal output terminal 7, feedback processing module 9, analog signal output terminal 16, and inductor 15 are mounted on the motherboard 1.

[0050] The sampling circuit 8, the first MOSFET 10, the second MOSFET 11, the MOSFET driver chip 12, the signal input terminal 13, and the signal output terminal 14 are disposed on the power amplifier circuit board 2; the power amplifier circuit board 2 is located directly above the PWM modulation circuit 6 and the feedback processing module 9;

[0051] The power amplifier circuit board 2 is rectangular; the short side of the power amplifier circuit board 2 is adjacent to the analog signal input terminal 4.

[0052] Four power amplifier circuits are arranged sequentially on the main board 1 and the power amplifier circuit board 2 along the long side of the power amplifier circuit board 2.

[0053] Preferably, the analog signal input terminal 4, the analog signal amplification circuit 5, the PWM modulation circuit 6, the digital signal output terminal 7, the signal input terminal 13, and the MOSFET driver chip 12 are electrically connected in sequence.

[0054] The first MOSFET 10 and the second MOSFET 11 are both used to receive and amplify the signal input from the MOSFET driver chip 12, and send the amplified signal to the signal output terminal 14. The signal output terminal 14, the inductor 15 and the analog signal output terminal 16 are connected in sequence.

[0055] The sampling circuit 8 is used to sample the working voltage of the first MOSFET 10 and the second MOSFET 11 in real time to obtain the sampling signal. The feedback processing module 9 is used to process the sampling signal into a production limit feedback signal according to the settings. The feedback signal is sent to the MOSFET driver chip 12, and the MOSFET driver chip 12 controls the on / off of the first MOSFET 10 and the second MOSFET 11.

[0056] The working principle of the power amplifier circuit can be found in CN220673924U, a power amplifier system, and CN220359428U, a single-board gallium nitride power amplifier circuit board 2, which are power amplifier circuit systems, and there are no changes to them.

[0057] The following is a brief description of the power amplifier circuit's operation, based on the components mentioned above:

[0058] Analog signal input terminal 4 inputs an analog signal to analog signal amplifier circuit 5. Analog signal amplifier circuit 5 amplifies the analog signal. The amplified analog signal is then pulse-width modulated and converted from analog to digital by PWM modulation circuit 6 to obtain a digital signal. This digital signal is sent to digital signal output terminal 7. Digital signal output terminal 7 is connected to signal input terminal 13 via a pin header. The digital signal is then fed into MOSFET driver chip 12. MOSFET driver chip 12 amplifies the digital signal by feeding it into first MOSFET 10 and second MOSFET 11. Sampling circuit 8 samples the first MOSFET 10 and second MOSFET 11. MOSFET 11 samples the operating voltage in real time to obtain a sampling signal. The feedback processing module 9 processes the sampling signal according to the settings to obtain a production limit feedback signal. The feedback signal is sent to the MOSFET driver chip 12, which controls the on / off state of the first MOSFET 10 and the second MOSFET 11. The first MOSFET 10 and the second MOSFET 11 amplify the digital signal and output it to the inductor 15 through the signal output terminal 14. The inductor 15 performs DA conversion on the signal output terminal 14 to obtain an analog signal. The analog signal output terminal 16 outputs the analog signal.

[0059] CN115276627A discloses the control process between the sampling circuit 8, the feedback processing module 9, and the driving module (i.e., the MOSFET driving chip 12 of this application), which will not be described in detail here.

[0060] The core innovation of this embodiment is not directly related to the working process and processing mode of the power amplifier circuit described above. The main innovation of this embodiment is concentrated on the position of the power amplifier circuit board 2, the shape of the power amplifier circuit board 2, the arrangement of the power amplifier circuit on the motherboard 1 and the power amplifier circuit board 2, and the design of the position of the sampling circuit 8.

[0061] In this embodiment, the sampling circuit 8, originally designed on the motherboard 1, is moved to the power amplifier circuit board 2. This serves two purposes: 1. To provide the space required for the increased size of the electronic components related to the power amplifier circuit on the motherboard 1; 2. To provide the space required for the increased size of the power supply 3.

[0062] To accommodate four power amplifier circuits within a limited space, the power amplifier circuit board 2 was changed from a near-square structure to a rectangular structure, achieving an aspect ratio of 239:122. Generally, an aspect ratio between 1.8 and 2.2 is recommended. This aspect ratio of the power amplifier circuit board 2 allows for...

[0063] While utilizing the spare area of ​​sampling circuit 8, space can be reserved for electronic components with larger dimensions on motherboard 1. Figure 1 In the diagram, box A marks the mounting location of the power amplifier circuit board 2, which is suspended and fixed above the main board 1 by a fixing post.

[0064] In this embodiment, the power amplifier circuit board 2 is moved above the PWM modulation circuit 6 and feedback processing module 9 of the motherboard 1. This increases the area of ​​the power amplifier circuit board 2, allowing for the installation of a larger heat dissipation device 18. This faster heat dissipation method avoids the impact of residual heat on the electronic components on the motherboard 1. At the same time, moving the power amplifier circuit board 2 allows for more space for other electronic components on the motherboard 1, such as the power supply 3.

[0065] In order to enable the power amplifier circuit board 2 to exist with a better aspect ratio, the position of the low-voltage power supply 17 in the original design is changed. Specifically, this embodiment also includes a low-voltage power supply 17 located on the motherboard 1. The low-voltage power supply 17 is electrically connected to the power supply 3. The power supply 3 is used to convert the mains power into low-voltage power, and the low-voltage power supply 17 is used to supply power to the power amplifier circuit.

[0066] Preferably, a heat dissipation device 18 is arranged on the upper surface of the power amplifier circuit board 2, and the first MOSFET 10 and the second MOSFET 11 are arranged on the lower surface of the power amplifier circuit board 2; the heat dissipation device 18 is used to absorb, store and dissipate the heat generated by the first MOSFET 10 and the second MOSFET 11.

[0067] In some implementation cases, the heat dissipation device 18 may be a first heat dissipation device 18 and a second heat dissipation device 18 in a power amplifier system (CN220673924U).

[0068] In practical applications, we found that designing the heat dissipation device 18 as a single finned heatsink is more effective because the change in the position of the power amplifier circuit board 2 necessitates faster heat dissipation. An integrated finned heatsink not only facilitates installation but also allows for the mounting of more fins for even faster heat dissipation. Furthermore, the change in the position of the power amplifier circuit board 2 results in a larger area; combined with the integrated finned heatsink, its heat dissipation performance is superior, reducing the impact on the electronic components below the power amplifier circuit board 2.

[0069] The thermal connection method of heat dissipation device 18 and first MOSFET 10 and second MOSFET 11 refers to CN220673924U A power amplifier system and CN220359428U A single-board gallium nitride power amplifier circuit board 2, power amplifier circuit system.

[0070] Preferably, the sampling circuit 8 and the MOSFET driver chip 12 are arranged on the lower surface of the power amplifier circuit board 2. The heat dissipation device 18 is a single device that covers the area where the first MOSFET 10 and the second MOSFET 11 are located. The heat dissipation device 18 is a finned heat sink.

Claims

1. A four-channel power amplifier circuit system, comprising a motherboard and a power amplifier circuit board, characterized in that, The motherboard is equipped with a power supply; the motherboard and the power amplifier circuit board are equipped with four power amplifier circuits; the power amplifier circuits and the power supply are located on the left and right sides of the motherboard respectively; The power supply includes a rectifier module, an active power factor corrector, a DC-DC circuit, and a transformer connected in sequence; there are four active power factor correctors connected in parallel.

2. The four-channel power amplifier circuit system according to claim 1, characterized in that, A first heat sink is suspended on the motherboard. The first heat sink is located above the active power factor corrector and is used to dissipate heat from the active power factor corrector.

3. The four-channel power amplifier circuit system according to claim 1, characterized in that, The motherboard is also equipped with a low-voltage power supply, and the output terminal of the transformer is connected to the low-voltage power supply; the low-voltage power supply is used to power the power amplifier circuit.

4. The four-channel power amplifier circuit system according to claim 1, characterized in that, The power supply occupies 50-70% of the motherboard area.

5. The four-channel power amplifier circuit system according to claim 3, characterized in that, The DC-DC circuit and the transformer are two in total. One DC-DC circuit and one transformer constitute a transformer circuit. The two transformer circuits are connected in parallel. The output terminals of the two transformer circuits are connected to the low-voltage power supply, and the input terminals of the two transformer circuits are connected to the output terminals of four parallel active power factor correctors.

6. The four-channel power amplifier circuit system according to claim 1, characterized in that, The power amplifier circuit board is suspended and fixed on the side of the motherboard away from the power supply.

7. The four-channel power amplifier circuit system according to claim 1, characterized in that, The power amplifier circuit includes an analog signal input terminal, an analog signal amplification circuit, a PWM modulation circuit, a digital signal output terminal, a sampling circuit, a feedback processing module, a first MOSFET, a second MOSFET, a MOSFET driver chip, a signal input terminal, a signal output terminal, an inductor, and an analog signal output terminal. The analog signal input terminal, analog signal amplification circuit, PWM modulation circuit, digital signal output terminal, feedback processing module, analog signal output terminal, and inductor are mounted on the motherboard. The first MOSFET, the second MOSFET, the MOSFET driver chip, the signal input terminal, and the signal output terminal are mounted on the power amplifier circuit board; the power amplifier circuit board is located directly above the PWM modulation circuit and the feedback processing module. The sampling circuit is located on the motherboard or on the power amplifier circuit board.

8. The four-channel power amplifier circuit system according to claim 1, characterized in that, The four power amplifier circuits are arranged sequentially on the main board and the power amplifier circuit board along the long side of the power amplifier circuit board.

9. The four-channel power amplifier circuit system according to claim 7, characterized in that, The analog signal input terminal, analog signal amplification circuit, PWM modulation circuit, digital signal output terminal, signal input terminal, and MOSFET driver chip are connected in sequence. Both the first MOSFET and the second MOSFET are used to receive and amplify the signals input from the MOSFET driver chip, and send the amplified signals to the signal output terminal. The signal output terminal, the inductor, and the analog signal output terminal are connected in sequence. The sampling circuit is used to sample the operating voltage of the first MOSFET and the second MOSFET in real time to obtain the sampling signal. The feedback processing module is used to process the sampling signal into a production limit feedback signal according to the settings. The feedback signal is sent to the MOSFET driver chip, which controls the on / off state of the first MOSFET and the second MOSFET.

10. The four-channel power amplifier circuit system according to claim 7, characterized in that, A heat dissipation device is arranged on the upper surface of the power amplifier circuit board, and the first MOSFET and the second MOSFET are arranged on the lower surface of the power amplifier circuit board; the heat dissipation device is used to absorb, store and dissipate the heat generated by the first MOSFET and the second MOSFET. The sampling circuit and MOSFET driver chip are arranged on the lower surface of the power amplifier circuit board; The heat dissipation device is a single device, and the heat dissipation device covers the areas where the first MOSFET and the second MOSFET are located. The heat dissipation device is a finned heat sink.

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