Welding type printed circuit board capable of preventing large-scale voids

Abstract

The utility model relates to the technical field of circuit boards, in particular to a welding type printed circuit board capable of preventing large-scale voids, which comprises a substrate, a central CPU (central processing unit) mounting area, side mounting areas and other dense mounting areas are constructed on the substrate, the central CPU mounting area is used for mounting electronic components, the side mounting areas are positioned on two sides of the central CPU mounting area, and a CPU chip can be mounted in the central CPU mounting area. Large electronic devices can be installed in the side installation areas, passive elements can be installed in the dense installation areas, welding channels are formed between the side installation areas and the middle CPU installation area and between the dense installation areas and the middle CPU installation area, and tin blocking grooves are formed in the two sides of the paths of the welding channels. According to the utility model, through the arrangement of the tin blocking grooves, when welding shake occurs, soldering tin flows out of the welding channel, and then due to the tin blocking grooves arranged at the two sides of the path of the welding channel, molten soldering tin flows into the tin blocking grooves and cannot be fused with soldering tin in other welding channels, so that the soldering tin between welding spots is reduced; and when shaking occurs, the soldering tin flows out to be overlapped and fused with soldering tin in other welding spots.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, specifically to a printed circuit board designed to prevent large voids in solder joints. Background Technology

[0002] Printed Circuit Board (PCB) is a core component that provides mechanical assembly support and electrical connections for various electronic systems. It also carries the signal transmission, signal reception, and power supply of electronic devices and is known as the "mother of electronic products." Because the square heat dissipation pad area is soldered as a whole, the large soldering area is prone to voids, resulting in poor soldering between the heat dissipation pad and the chip. This leads to poor heat dissipation of the chip on the circuit board after soldering, affecting the chip's lifespan and normal use.

[0003] Based on the above problems, the existing patent publication number CN221487956U discloses a printed circuit board with anti-large void solder joints. The board consists of a central solder group, a first side solder group, and a second side solder group, which are separated from each other by a solder resist section. The solder resist section includes multiple solder resist channels arranged horizontally and vertically. A U-shaped solder connection section is located between the central dense solder section and the pin solder section, which is used to solder the central dense solder section and the pin solder section and / or to solder the central dense solder section and the insulating area. The design of the solder resist channels enables small-area, dense, and unitized soldering during printing and soldering, ensuring that a large number of large void solder joints will not occur in the central dense solder section after the solder is printed, thereby improving the performance of the chip in the later stage.

[0004] However, when implementing the aforementioned type of printed circuit board designed to prevent large voids in soldering, at least the following problems were found: During the soldering process, after the solder melts at high temperature, it forms a teardrop-like shape that wraps around the soldering head. If there is significant vibration or shaking, such as vibration of the soldering head caused by machinery or vibration of the equipment holding the circuit board, the liquid solder can easily flow out of the area to be soldered, especially in delicate areas where the spacing between multiple solder joints is small. The liquid solder formed at high temperature overlaps with the solder of multiple solder joints after cooling, causing the circuit board to need to be reworked and re-soldered, affecting production efficiency. Utility Model Content

[0005] (a) Technical problems to be solved

[0006] To address the shortcomings of existing technologies, this utility model provides a printed circuit board designed to prevent large voids in the soldering process. This design prevents liquid solder from easily flowing out of the area to be soldered, thus solving the problem in existing technologies where liquid solder easily flows out of the area to be soldered due to vibrations from machinery or equipment holding the circuit board, causing the solder from multiple solder joints to overlap after cooling.

[0007] (II) Technical Solution

[0008] To achieve the above objectives, this utility model provides a large-void-resistant printed circuit board, comprising: a substrate on which a central CPU mounting area for mounting electronic components, side mounting areas located on both sides of the central CPU mounting area, and other dense mounting areas are constructed. A CPU chip can be mounted in the central CPU mounting area, larger electronic devices can be mounted in the side mounting areas, and passive components can be mounted in the dense mounting areas. Soldering paths are provided between the side mounting areas and the dense mounting areas and the central CPU mounting area, and solder resist grooves are provided on both sides of the soldering path.

[0009] Optionally, the soldering path is recessed inward to match the depth of the solder resist bath.

[0010] Optionally, the solder resist bath and soldering path have multiple connection ports.

[0011] Optionally, a perimeter fence can be extended around the densely installed area.

[0012] Optionally, the area enclosure may include multiple partitioned enclosures that divide the densely packed installation area into multiple smaller installation areas.

[0013] Optionally, screw holes are provided at all four corners of the substrate.

[0014] Optionally, a connecting groove is provided between the screw holes on one side of the substrate, and the connecting groove communicates with the screw holes.

[0015] (III) Beneficial Effects

[0016] Compared with the prior art, this utility model provides a printed circuit board that prevents large voids in the soldering process, which has the following advantages:

[0017] 1. This utility model, by setting up a solder resisting tank, prevents the molten solder from flowing out of the soldering path when vibration occurs during soldering. The solder resisting tanks on both sides of the soldering path prevent the molten solder from flowing into the solder resisting tanks and mixing with the solder in other soldering paths. This can reduce the problem of solder flowing out and mixing with the solder in other soldering points when vibration occurs, thus reducing the need for rework and re-soldering.

[0018] 2. The recessed welding path of this utility model allows solder to flow more easily into the welding path under the action of gravity, ensuring full filling of the welding point, thereby improving the uniformity and stability of the welding. The consistent depth design can make the circuit board manufacturing process simpler and more standardized.

[0019] 3. This utility model divides multiple small installation areas by multiple partitions, which allows for more flexible arrangement of components, makes full use of space, avoids mutual interference between components, and reduces the impact of welding heads on multiple welding points. Attached Figure Description

[0020] Figure 1 This is a photograph of a printed circuit board after printing using existing technology.

[0021] Figure 2 It shows Figure 1 A schematic diagram showing the division of the central CPU mounting area, side mounting area, and densely mounted area.

[0022] Figure 3 It shows Figure 1 Enlarged structural diagram at point A in the diagram;

[0023] Figure 4 A schematic diagram of a partial cross-section of the substrate is shown.

[0024] In the diagram: 1. Substrate; 2. Central CPU mounting area; 3. Side mounting area; 4. Dense mounting area; 401. Small mounting area; 5. Soldering path; 6. Solder resist tray; 7. Connecting port; 8. Area enclosure; 9. Separator enclosure; 10. Screw hole; 11. Connecting slot. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0026] Example: Please refer to Figures 1 to 4 According to an embodiment of the present invention, a technical solution is provided: a printed circuit board with anti-large void soldering type, comprising: a substrate 1, on which a central CPU mounting area 2 for mounting electronic components is constructed, side mounting areas 3 located on both sides of the central CPU mounting area 2, and other dense mounting areas 4 are constructed. CPU chips can be installed in the central CPU mounting area 2, larger electronic devices can be installed in the side mounting areas 3, and passive components can be installed in the dense mounting areas 4. Soldering paths 5 are opened between the side mounting areas 3 and the dense mounting areas 4 and the central CPU mounting area 2, and solder resist grooves 6 are opened on both sides of the soldering path 5.

[0027] The above-described anti-large void soldering printed circuit board, when soldering electronic components in the central CPU mounting area 2, side mounting area 3, and dense mounting area 4, if vibration occurs during soldering, the molten solder flows out of the soldering path 5. Then, due to the solder resisting grooves 6 opened on both sides of the soldering path 5, the molten solder will flow into the solder resisting grooves 6 and will not merge with the solder in other soldering paths 5. This can reduce the problem of solder between solder joints overlapping and merging with the solder in other solder joints when vibration occurs, thus requiring rework and resoldering.

[0028] The soldering passage 5 is recessed inward to the same depth as the solder resist pool 6. The recess of the soldering passage 5 allows the solder to flow into the soldering passage 5 more easily under the action of gravity, ensuring that the solder joint is fully filled, thereby improving the uniformity and stability of the soldering. The consistent depth design can make the circuit board manufacturing process simpler and more standardized.

[0029] The solder resist bath 6 has multiple connecting ports 7 with the soldering passage. These ports 7 can guide the flow of solder. If solder in the soldering passage 5 accidentally flows into the solder resist bath 6, it can flow into the soldering passage 5 as subsequent soldering continues. However, during normal soldering, the solder in the soldering passage 5 will generally wrap around the soldering head and will not flow freely. It will not flow into the solder resist bath 6 during normal soldering.

[0030] During welding in the densely installed area 4, multiple spot welding operations are often performed. However, the welding head can easily affect multiple welding points, causing the solder in these points to pool into large solder balls that flow rapidly along the outer side of the substrate 1. This can affect surrounding welding equipment or machinery. Therefore, an area enclosure 8 extends outward from the densely installed area 4. When solder pools into large solder balls that flow out, the area enclosure 8 can block them, allowing the solder to gradually spread along the inner side of the area enclosure 8, thus providing a guiding effect.

[0031] The area enclosure 8 is equipped with multiple partition enclosures 9, which divide the dense installation area 4 into multiple small installation areas 401. The dense installation area 4 usually needs to install a large number of passive components, and the different components have different sizes and shapes. By using multiple small installation areas 401, the layout of the components can be arranged more flexibly, making full use of space, avoiding mutual interference between components, and reducing the problem of the welding head affecting multiple welding points.

[0032] Screw holes 10 are provided at all four corners of the substrate 1. The design of the screw holes 10 makes the installation and removal of the circuit board more convenient. When assembling or repairing the equipment, the circuit board can be easily fixed or removed with simple tools (such as screwdrivers), which improves work efficiency.

[0033] The electronic devices installed in the side mounting area 3 generally require a lot of solder. Therefore, in order to further prevent the molten solder from flowing out, a connecting groove 11 is provided between the screw holes 10 on one side of the substrate 1. The connecting groove 11 is connected to the screw holes 10.

[0034] Working principle: When performing soldering, if soldering vibration occurs, the molten solder may flow out of the soldering passage 5. However, since there are solder resisting grooves 6 on both sides of the soldering passage 5, the flowing solder will flow into the solder resisting grooves 6 and will not mix with the solder in other soldering passages 5. At the same time, if the solder in the soldering passage 5 accidentally flows into the solder resisting grooves 6, if there is too much solder in the solder resisting grooves 6 after continuous soldering, it can be allowed to flow back into the soldering passage 5.

[0035] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A type of printed circuit board designed to prevent large voids in solder joints, characterized in that, include: A substrate (1) is constructed thereon with a central CPU mounting area (2) for mounting electronic components, side mounting areas (3) located on both sides of the central CPU mounting area (2), and other dense mounting areas (4). CPU chips can be installed in the central CPU mounting area (2), larger electronic devices can be installed in the side mounting areas (3), and passive components can be installed in the dense mounting areas (4). Soldering paths (5) are provided between the side mounting areas (3) and the dense mounting areas (4) and the central CPU mounting area (2). Solder resist grooves (6) are provided on both sides of the soldering path (5).

2. The printed circuit board for preventing large voids in soldering according to claim 1, characterized in that: The soldering passage (5) is recessed inward to the same depth as the solder resisting groove (6).

3. A printed circuit board for preventing large voids in soldering according to claim 2, characterized in that: The solder resist bath (6) has multiple communication ports (7) with the soldering passage (5).

4. A printed circuit board for preventing large voids in soldering according to claim 1, characterized in that: The densely installed area (4) extends outwards to form a perimeter fence (8).

5. A printed circuit board for preventing large voids in soldering according to claim 4, characterized in that: The area enclosure (8) is provided with multiple partition enclosures (9), which divide the densely installed area (4) into multiple small installation areas (401).

6. A printed circuit board for preventing large voids in soldering according to claim 1, characterized in that: The substrate (1) has screw holes (10) at all four corners.

7. A printed circuit board for preventing large voids in soldering according to claim 5, characterized in that: A connecting groove (11) is provided between the screw holes (10) on one side of the substrate (1), and the connecting groove (11) communicates with the screw holes (10).

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