Electronic product connector stamping die with buffering effect

By introducing a buffer system into the stamping die, the problems of wear and component damage caused by stress concentration in traditional dies have been solved, thereby extending the die life and improving product quality.

CN223557046UActive Publication Date: 2025-11-18KUN SHAN YOULIXUN PRECISION MOLD CO LTD
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Patent Information

Application Number
CN202422883786.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-26
Publication Date
2025-11-18
Estimated Expiration
2034-11-26

AI Technical Summary

Technical Problem

Traditional stamping dies experience accelerated wear due to stress concentration during the stamping process, making connector components prone to damage, affecting product quality and yield, and increasing production costs.

Method used

A buffer system is introduced into the mold, including a lifting plate, a buffer plate, a buffer block, and a buffer spring. The buffer plate makes initial contact with the material, absorbing and dispersing the impact force, reducing stress concentration, and ensuring the protection of the mold and connector components.

Benefits of technology

It significantly extends the service life of molds, reduces the frequency of mold replacement and production costs, and improves the quality and yield of connector components.

✦ Generated by Eureka AI based on patent content.

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    Figure CN223557046U_ABST
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Abstract

The electronic product connector stamping die with the buffering effect comprises a base, supporting rods are fixedly connected to the four sides of the top of the base, a lifting plate is arranged at the positions, close to the tops, of the four supporting rods in a sleeving and sliding mode, an upper die base is fixedly connected to the center of the bottom of the lifting plate, and a lower die base is fixedly connected to the bottom of the upper die base. The center of the bottom of the upper die base is fixedly connected with a stamping base, and the center of the top of the base is fixedly connected with a lower die base. According to the electronic product connector stamping die with the buffering effect, through abutting plates arranged at the four corners of the lifting plate, a buffering plate arranged at the bottom of the lifting plate, and a first buffering block and a first buffering spring arranged on a directional rod in a sleeving mode, when an air cylinder drives the lifting plate and the upper die base to descend for stamping, the buffering plate firstly makes contact with a material; and then the buffer block I further absorbs and disperses the impact force under the action of the buffer spring I, so that the stress concentration directly acting on the lower die holder and the material is obviously reduced, and the die and the connector part are effectively protected from being damaged.
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Description

TECHNICAL FIELD

[0001] The utility model relates to punch press die technical field, concretely is electronic product connector punch press die with buffer effect. BACKGROUND

[0002] In the field of electronic product manufacturing, connectors are critical components for signal transmission and power supply between devices, with extremely high quality and precision requirements. Traditional electronic product connector punch press dies play a crucial role in the production process, as they are responsible for accurately shaping connector components to meet subsequent assembly and functional requirements.

[0003] In the traditional punch press process, the upper die seat directly acts on the material on the lower die seat, resulting in instantaneous release of impact force and generation of huge stress concentration. This stress concentration not only accelerates die wear, but also may cause cracks, deformation, or even damage to connector components, severely affecting product quality and yield. Lacking a buffer mechanism, the key components of the die are easily damaged by impact under continuous high-strength punch press operation, accelerating the fatigue aging process of the die. Frequent replacement of the die not only increases production costs, but also affects the continuity and efficiency of the production line. SUMMARY

[0004] The utility model aims at providing a kind of electronic product connector punch press die with buffer effect to solve the problem that traditional punch press die in punch press process in the above background technique, since the upper die seat directly acts on the material on the lower die seat, resulting in instantaneous release of impact force and generation of huge stress concentration. This stress concentration not only accelerates die wear, but also may cause cracks, deformation, or even damage to connector components, severely affecting product quality and yield. Lacking a buffer mechanism, the key components of the die are easily damaged by impact under continuous high-strength punch press operation, accelerating the fatigue aging process of the die. Frequent replacement of the die not only increases production costs, but also affects the continuity and efficiency of the production line.

[0005] In order to achieve the above object, the utility model provides the following technical scheme: A kind of electronic product connector punch press mould with buffering effect, including base, the four sides of the top of the base are fixedly connected with support rod, the top position of four support rods is sleeved and is slidably connected with lifting plate, the bottom center of the lifting plate is fixedly connected with upper die holder, the bottom center of the upper die holder is fixedly connected with punch press seat, the top center of the base is fixedly connected with lower die holder, the four corner positions of the lifting plate are all provided with directional hole, the top of the four corner positions of the lifting plate top is provided with abutment plate corresponding four directional holes, the four corners of the abutment plate bottom are all fixedly connected with damping rod, the bottom of the damping rod is fixedly connected with the top of lifting plate, the bottom of the both sides of lower die holder is fixedly connected with side bottom plate corresponding the top of base, the front side and the back side of the top of side bottom plate are all fixedly connected with directional rod, the bottom position of the both sides of upper die holder is fixedly connected with T-shaped plate, the top of directional rod is penetrated to the outside of T-shaped plate and is slidably connected with T-shaped plate.

[0006] Compared with prior art, the utility model has the advantages that:

[0007] The electronic product connector punch press mould with buffering effect, through abutment plate and its bottom buffer plate set on the four corners of lifting plate and buffer block one and buffer spring one set on directional rod, when cylinder drives lifting plate and upper die holder to descend and stamp, buffer plate first contacts with material, then buffer block one further absorbs and disperses impact force under the action of buffer spring one, significantly reduces stress concentration directly acting on lower die holder and material, effectively protects mould and connector component from damage, the introduction of buffer spring one and buffer spring two not only reduces impact force in stamping process, but also plays the role of shock absorption and buffering, reduces direct collision and friction between parts of mould, thereby significantly prolongs service life of mould, reduces replacement frequency and production cost due to mould wear, buffer block two set in positioning groove in the bottom of upper die holder and its top buffer spring two and sliding block and sliding slot slidably connected ensure accurate alignment and stable contact between upper die holder and lower die holder during stamping process, effectively avoid cracks, deformation or damage of connector component due to excessive impact force, significantly improve the quality and yield of connector component. BRIEF DESCRIPTION OF DRAWINGS

[0008] Figure 1 It is structure schematic diagram of the utility model;

[0009] Figure 2 It is structure schematic diagram of the utility model Figure 1 It is partial enlarged schematic diagram of A in the utility model;

[0010] Figure 3 It is partial enlarged schematic diagram of B in the utility model Figure 1 It is partial enlarged schematic diagram of B in the utility model

[0011] Figure 4 It is the structure perspective drawing of the T-shaped plate of the utility model.

[0012] In the figure: 1, base; 2, support rod; 3, top end plate; 4, air cylinder; 5, lifting plate; 6, upper die holder; 7, stamping seat; 8, lower die holder; 9, side bottom plate; 10, directional rod; 11, buffer block one; 12, buffer spring one; 13, T-shaped plate; 14, positioning column; 15, positioning groove; 16, sliding groove; 17, buffer block two; 18, sliding block; 19, buffer spring two; 20, abutment plate; 21, damping rod; 22, buffer plate; 23, directional hole. DETAILED DESCRIPTION

[0013] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model and not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0014] Please refer to Figures 1-4 The utility model provides a kind of technical solutions: a kind of electronic product connector stamping die with buffering effect, including base 1, the four sides of the top of base 1 are all fixedly connected with support rod 2, the top position of four support rods 2 is sleeved and slidably connected with lifting plate 5, the center of the bottom of lifting plate 5 is fixedly connected with upper die holder 6, the center of the bottom of upper die holder 6 is fixedly connected with stamping seat 7, the center of the top of base 1 is fixedly connected with lower die holder 8, the top of lifting plate 5 is set with abutment plate 20 at the top of the four directional holes 23 corresponding to the top of four directional holes 23 at the corner position, the bottom of abutment plate 20 is fixedly connected with damping rod 21 at the corner of four corners, the bottom of damping rod 21 is fixedly connected with the top of lifting plate 5, the bottom of lower die holder 8 is fixedly connected with side bottom plate 9 corresponding to the top of base 1 at two sides, the front side and rear side of the top of side bottom plate 9 are all fixedly connected with directional rod 10, the bottom position of the two sides of upper die holder 6 is all fixedly connected with T-shaped plate 13, the top of directional rod 10 is penetrated to the outside of T-shaped plate 13 and is slidably connected with T-shaped plate 13.

[0015] The center of the bottom of abutment plate 20 is fixedly connected with buffer plate 22.

[0016] Four directional rods 10 are located below four directional holes 23 respectively.

[0017] The bottom position of the surface of the directional rod 10 is sleeved and slidably connected with the buffer block one 11, the surface of the directional rod 10 is sleeved with the buffer spring one 12, and the top and bottom of the buffer spring one 12 are fixedly connected with the bottom of the buffer block one 11 and the top of the side bottom plate 9 respectively.

[0018] The top of the four support rods 2 is fixedly connected with the top end plate 3, the center of the top of the top end plate 3 is fixedly installed with the air cylinder 4, and the output end of the bottom of the air cylinder 4 penetrates to the bottom of the top end plate 3 and is fixedly connected with the center of the top of the lifting plate 5.

[0019] The bottom of the upper die seat 6 is provided with the positioning groove 15 at the four corner positions, the inside of the positioning groove 15 is provided with the buffer block two 17, the top of the buffer block two 17 is fixedly connected with the buffer spring two 19, and the top of the buffer spring two 19 is fixedly connected with the top of the positioning groove 15.

[0020] The two sides of the positioning groove 15 are provided with the sliding groove 16, and the two sides of the buffer block two 17 are fixedly connected with the sliding block 18.

[0021] Working principle: when the air cylinder 4 receives the stamping signal, the piston rod thereof extends downward, pushes the lifting plate 5 to stably descend along the support rod 2, in the process, the damping rod 21 serves as a guide and stabilizing element to ensure that the abutting plate 20 and the buffer plate 22 move stably, with the descent of the lifting plate 5, the buffer plate 22 first contacts the top of the directional rod 10, due to the existence of the damping rod 21, the contacting process becomes gentle, and the instantaneous impact force is reduced, with the continuous descent of the buffer plate 22, the directional rod 10 pushes the buffer block one 11 to slide along the surface thereof, and at the same time, the buffer spring one 12 is compressed, this step effectively absorbs part of the impact force, and further slows down the descending speed of the lifting plate 5 and the upper die seat 6, when the buffer plate 22 and the buffer system below it fully absorb and disperse the impact force, the stamping seat 7 finally contacts the material on the lower die seat 8, and the stamping action is completed, at this time, due to the effect of the previous buffering, the impact force has been greatly reduced, and the high-quality forming of the connector part is ensured, in the stamping process, the positioning groove 15 at the bottom of the upper die seat 6 is tightly matched with the positioning column 14 at the top of the lower die seat 8, when the stamping seat 7 applies pressure, the buffer block two 17 in the positioning groove 15 slides in the sliding groove 16 through the sliding block 18, and at the same time, the buffer spring two 19 is compressed, further absorbing and dispersing the lateral impact force in the stamping process, protecting the accurate positioning of the mold and the integrity of the connector part, after the stamping is completed, the piston rod of the air cylinder 4 is retracted, drives the lifting plate 5 and the upper die seat 6 to stably ascend along the support rod 2, and returns to the initial position, at this time, the buffer system gradually releases the stored energy, and prepares for the next stamping action.

[0022] In conclusion, the electronic product connector stamping die with buffering effect, through the setting of the abutting plate 20 at four corners of the lifting plate 5 and the buffering plate 22 at the bottom of the abutting plate 20, and the buffering block one 11 and the buffering spring one 12 sleeved on the directional rod 10, when the cylinder 4 drives the lifting plate 5 and the upper die seat 6 to descend for stamping, the buffering plate 22 first contacts the material, then the buffering block one 11 further absorbs and disperses the impact force under the action of the buffering spring one 12, which significantly reduces the stress concentration directly acting on the lower die seat 8 and the material, effectively protects the die and the connector parts from damage, the introduction of the buffering spring one 12 and the buffering spring two 19 not only reduces the impact force in the stamping process, but also plays a role of shock absorption and buffering, reduces the direct collision and friction between the parts of the die, thereby significantly prolongs the service life of the die, reduces the replacement frequency and production cost caused by die wear, the buffering block two 17 arranged in the positioning groove 15 at the bottom of the upper die seat 6 and the buffering spring two 19 at the top of the buffering block two 17, and the sliding connection of the sliding block 18 and the sliding groove 16, ensure the accurate alignment and stable contact between the upper die seat 6 and the lower die seat 8 during stamping, effectively avoid the cracks, deformation or damage of the connector parts caused by excessive impact force, significantly improve the quality and yield of the connector parts.

[0023] It should be noted that the relational terms herein such as first and second and the like are used solely to distinguish one entity or action from another, without necessarily requiring or implying any such actual relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus.

[0024] The electrical components in the text are all connected with the main controller and 220V mains electricity, and the main controller can be a conventional known device such as a computer.

[0025] Although the embodiments of the present application have been shown and described, it should be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. An electronic product connector stamping die with buffering effect, comprising a base (1), characterized in that: The top of the base (1) is fixedly connected with four support rods (2), the top of the four support rods (2) is sleeved and slidably connected with a lifting plate (5), the bottom of the lifting plate (5) is fixedly connected with an upper die seat (6), the bottom of the upper die seat (6) is fixedly connected with a stamping seat (7), the top of the base (1) is fixedly connected with a lower die seat (8), the four corners of the lifting plate (5) are provided with directional holes (23), the top of the lifting plate (5) is provided with resisting plates (20) corresponding to the top of the four directional holes (23), the bottom of the resisting plate (20) is fixedly connected with damping rods (21), the bottom of the damping rod (21) is fixedly connected with the top of the lifting plate (5), the bottom of the lower die seat (8) is fixedly connected with side bottom plates (9) corresponding to the top of the base (1), the front and rear sides of the top of the side bottom plate (9) are fixedly connected with directional rods (10), the two sides of the upper die seat (6) are fixedly connected with T-shaped plates (13) corresponding to the bottom, and the top of the directional rod (10) penetrates to the outside of the T-shaped plate (13) and is slidably connected with the T-shaped plate (13).

2. The electronic product connector stamping die with a buffering effect according to claim 1, characterized in that: The bottom of the resisting plate (20) is fixedly connected with a buffer plate (22).

3. The electronic product connector stamping die with a buffering effect according to claim 1, characterized in that: The four directional rods (10) are located directly below the four directional holes (23) respectively.

4. The electronic product connector stamping die with a buffering effect according to claim 1, characterized in that: The surface of the directional rod (10) is sleeved and slidably connected with a buffer block one (11), the surface of the directional rod (10) is sleeved with a buffer spring one (12), and the top and bottom of the buffer spring one (12) are fixedly connected with the bottom of the buffer block one (11) and the top of the side bottom plate (9) respectively.

5. The electronic product connector stamping die with a buffering effect according to claim 1, characterized in that: The top of the four support rods (2) is fixedly connected with a top end plate (3), the top of the top end plate (3) is fixedly connected with a cylinder (4), and the output end of the bottom of the cylinder (4) penetrates to the bottom of the top end plate (3) and is fixedly connected with the center of the top of the lifting plate (5).

6. The electronic product connector stamping die with a buffering effect according to claim 1, characterized in that: The bottom of the upper die seat (6) is provided with positioning grooves (15) corresponding to the four corners, the positioning grooves (15) are provided with buffer blocks two (17), the top of the buffer block two (17) is fixedly connected with a buffer spring two (19), and the top of the buffer spring two (19) is fixedly connected with the top of the positioning groove (15).

7. The electronic product connector stamping die with a buffering effect according to claim 6, characterized in that: The two sides of the positioning groove (15) are provided with sliding grooves (16), the two sides of the buffer block two (17) are fixedly connected with sliding blocks (18), and the side, away from the buffer block two (17), of the sliding block (18) penetrates to the inside of the sliding groove (16) and is slidably connected with the sliding groove (16).