Stamping die special for LED printed circuit board

Abstract

The utility model relates to the technical field of LED printed circuit board production, and discloses a special stamping die for an LED printed circuit board, which comprises a connecting seat, a lower die is fixedly connected to the top of the connecting seat, a guide cushioning mechanism is arranged at the top of the connecting seat, and a downward-pressing ejection mechanism is arranged outside the connecting seat. The output end of the hydraulic machine is started, the hydraulic machine drives the sliding seat to move downwards, so that the jacking column is synchronously driven to move downwards under the action of gravity, the jacking column is retracted into the lower die, meanwhile, the punch falls into the lower die, punching work is completed, the punch is reset after punching is completed, the jacking column is driven to reset, and punching is completed. When the LED printed circuit board is punched, the ejection column moves upwards, then the punched material can be synchronously pushed out of the lower die, workers can conveniently collect the punched material, meanwhile, the situation that the punched LED printed circuit board cannot be timely and smoothly separated from the die is avoided, the punching period is shortened, and the production efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of LED printed circuit board production, specifically to a special stamping die for LED printed circuit board. BACKGROUND

[0002] As an important component of modern electronic products, the quality and production efficiency of LED printed circuit board have important influence on the development of the entire electronic industry. With the continuous development of science and technology, the structure and function of LED printed circuit board are becoming more and more complex, and the precision and efficiency requirements in the production process are also becoming higher and higher, therefore, developing a special stamping die to improve the production efficiency and product quality of LED printed circuit board has become an important requirement for the current industry development.

[0003] In the prior art, the die is first installed on the stamping machine to ensure that the upper die and the lower die can be accurately aligned, and through the cooperation of the guide column and the guide sleeve, the die can maintain a stable movement trajectory during stamping. When the slide block of the stamping machine descends, the upper die moves downward, and the LED printed circuit board material placed on the working surface of the die is subjected to pressure, and under the action of the pressure, it is stamped into the required parts according to the shape and size requirements of the die. However, in actual use, when the LED printed circuit board material is stamped into the required parts according to the shape and size requirements of the die, the material after stamping is stuck in the lower die, which causes the stamped LED printed circuit board to be unable to timely and smoothly separate from the die, thereby prolonging the stamping cycle and reducing the production efficiency. Therefore, it is necessary to improve a special stamping die for LED printed circuit board. SUMMARY

[0004] The utility model aims at providing a special stamping die for LED printed circuit board to solve the problems in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a special stamping die for LED printed circuit board, comprising a connecting seat, the connecting seat top fixedly connected with lower die, the connecting seat top is provided with the direction buffer mechanism, the connecting seat outside is provided with the lower pressure material pushing mechanism, the lower pressure material pushing mechanism top is provided with the connecting sleeve;

[0006] The lower pressure material pushing mechanism comprises a lower pressure assembly and a material pushing assembly, and the material pushing assembly is arranged at the bottom of the lower pressure assembly.

[0007] The guiding and buffering mechanism comprises a guide column fixedly connected in the connecting seat, a guide sleeve slidably connected outside the guide column, a limiting block fixedly connected at the top of the guide column, a spring fixedly connected between the limiting block and the guide sleeve, and a second spring fixedly connected between the guide sleeve and the connecting seat, so as to buffer and protect the lower mold.

[0008] Preferably, holes are formed at the corresponding positions of the connecting seat and the guide column, and the guide column is fixedly connected in the holes, so as to accurately guide.

[0009] Preferably, the lower pressing assembly comprises a sliding seat fixedly connected outside the guide sleeve, a punch fixedly connected at the bottom of the sliding seat, a push rod fixedly connected at the right side of the punch, a push plate fixedly connected at the bottom of the push rod, an inclined rail slidably connected at the inner side of the push plate, and a dovetail groove block fixedly connected at the right side of the inclined rail, so as to move the punch up and down.

[0010] Preferably, the dovetail groove block is slidably connected in the connecting seat, and a groove is formed at the corresponding position of the push rod and the connecting seat, and the push rod is slidably connected in the groove, so as to move the dovetail groove block leftward and rightward.

[0011] Preferably, the material ejecting assembly comprises a connecting column fixedly connected at the left side of the dovetail groove block, a supporting inclined block fixedly connected at the left side of the connecting column, a limiting strip fixedly connected in the connecting seat, a jacking column slidably connected in the lower mold, a connecting frame fixedly connected at the bottom of the jacking column, and a roller rotatably connected at the bottom of the connecting frame, so as to conveniently eject the raw material after stamping work.

[0012] Preferably, the bottom of the roller abuts against the top of the supporting inclined block, and the connecting frame is slidably connected in the connecting seat, so as to limit the movement of the jacking column.

[0013] Preferably, a groove is formed at the corresponding position of the limiting strip and the supporting inclined block, and the supporting inclined block is slidably connected in the groove, so as to slide the supporting inclined block leftward and rightward.

[0014] Compared with the prior art, the LED printed circuit board special stamping die has the following beneficial effects:

[0015] 1、The LED printed circuit board special stamping die, through the setting of the lower pressing material ejection mechanism, the output end of the hydraulic machine is driven by the hydraulic machine to move downwards, so that the plunger is retracted into the lower die under the action of gravity, at the same time, the punch falls into the lower die, so that the stamping work is completed, and when the stamping is completed, the punch resets, so that the plunger is moved upwards by driving the plunger to reset, thereby the stamped material can be pushed out of the lower die, so that it is convenient for the staff to collect, and the stamped LED printed circuit board cannot be timely and smoothly separated from the die, thereby reducing the stamping cycle and improving the production efficiency.

[0016] 2、The LED printed circuit board special stamping die, through the setting of the guiding shock absorbing mechanism, spring two compression, the slide is moved downwards along the guide of the guide sleeve and the guide column, so that the slide and the rubber pad are contacted, thereby absorbing the impact force in the stamping process. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical scheme in the embodiments of the utility model, the following will briefly introduce the drawings needed to be used in the embodiment description, obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained according to these drawings without creative labor:

[0018] Figure 1 It is the appearance structure schematic diagram of the utility model;

[0019] Figure 2 It is the appearance structure schematic diagram of the lower pressing material ejection mechanism of the utility model;

[0020] Figure 3 It is the expanded structure schematic diagram of the lower pressing assembly of the utility model;

[0021] Figure 4 It is the appearance structure schematic diagram of the material ejection assembly of the utility model;

[0022] Figure 5 It is the appearance structure schematic diagram of the guiding shock absorbing mechanism of the utility model.

[0023] In the drawing: 1, connecting seat;2, lower die;3, guiding shock absorbing mechanism;4, connecting sleeve;5, lower pressing material ejection mechanism;51, lower pressing assembly;52, material ejection assembly;511, slide;512, punch;513, push rod;514, push plate;515, inclined rail;516, dovetail groove block;521, connecting column;522, supporting inclined block;523, limiting strip;524, plunger;525, connecting frame;526, roller;31, guide column;32, limiting block;33, guide sleeve;34, spring one;35, spring two;36, rubber pad. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present application will be apparently and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0025] In the present application, unless explicitly defined and limited, the terms "mounting", "connection", "connecting", "fixing" and the like should be understood in a broad sense. For example, it can be fixed connection, or detachable connection, or integrated; it can be mechanical connection, or electrical connection; it can be direct connection, or indirect connection through intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances. EMBODIMENT

[0026] Please refer to Figures 1-5 The present application provides a technical scheme: a stamping die special for LED printed circuit board, comprising a connecting seat 1, a lower die 2 fixedly connected to the top of the connecting seat 1, a guiding and damping mechanism 3 arranged on the top of the connecting seat 1, a downward pressing and material feeding mechanism 5 arranged outside the connecting seat 1, and a connecting sleeve 4 arranged on the top of the downward pressing and material feeding mechanism 5.

[0027] The downward pressing and material feeding mechanism 5 comprises a downward pressing assembly 51 and a material feeding assembly 52, and the material feeding assembly 52 is arranged at the bottom of the downward pressing assembly 51.

[0028] Further, the downward pressing assembly 51 comprises a sliding seat 511 fixedly connected outside the guiding sleeve 33, a punch 512 fixedly connected to the bottom of the sliding seat 511, a push rod 513 fixedly connected to the right side of the punch 512, a push plate 514 fixedly connected to the bottom of the push rod 513, an inclined rail 515 slidably connected to the inner side of the push plate 514, and a dovetail groove block 516 fixedly connected to the right side of the inclined rail 515, which facilitates the up-and-down movement of the punch 512.

[0029] Further, the dovetail groove block 516 is slidably connected inside the connecting seat 1, and a groove is formed in the corresponding position of the connecting seat 1 and the push rod 513, and the push rod 513 is slidably connected in the groove, which facilitates the left-and-right movement of the dovetail groove block 516.

[0030] Further, the top material assembly 52 comprises a connecting column 521 fixedly connected on the left side of the dovetail groove block 516, a supporting inclined block 522 fixedly connected on the left side of the connecting column 521, a limiting strip 523 fixedly connected inside the connecting seat 1, a top column 524 slidingly connected inside the lower die 2, a connecting frame 525 fixedly connected on the bottom of the top column 524, a roller 526 rotatably connected on the bottom of the connecting frame 525, so as to facilitate the ejection of the raw material after the stamping work.

[0031] Further, the bottom of the roller 526 abuts against the top of the supporting inclined block 522, and the connecting frame 525 is slidingly connected inside the connecting seat 1, so as to facilitate the movement of the top column 524.

[0032] Further, the limiting strip 523 is provided with a slot at a position corresponding to the supporting inclined block 522, and the supporting inclined block 522 is slidingly connected in the slot, so as to facilitate the left and right sliding of the supporting inclined block 522. Embodiment

[0033] Please refer to Figure 5 In combination with Embodiment One, it is further obtained that the guiding and shock-absorbing mechanism 3 comprises a guiding column 31 fixedly connected inside the connecting seat 1, a guiding sleeve 33 slidingly connected outside the guiding column 31, a limiting block 32 fixedly connected on the top of the guiding column 31, a spring one 34 fixedly connected between the limiting block 32 and the guiding sleeve 33, and a spring two 35 fixedly connected between the guiding sleeve 33 and the connecting seat 1, so as to play a buffering protection role for the lower die 2.

[0034] Further, the connecting seat 1 is provided with a hole at a position corresponding to the guiding column 31, and the guiding column 31 is fixedly connected in the hole, so as to play an accurate guiding role.

[0035] In actual operation, when the device is used, first, the device is connected to the punch machine, the output end of the hydraulic machine in the punch machine is fixedly connected to the connecting sleeve 4, so as to drive the connecting sleeve 4 to move up and down, then the material is placed on the top of the lower die 2, then the lower pressing and material ejecting mechanism 5 is set, the output end of the hydraulic machine is driven to move downward by the hydraulic machine, the punch 512 is driven to move downward by the sliding seat 511, and the push rod 513 is driven to move downward by the punch 512 in the process of moving downward, the push plate 514 is driven to move downward by the push rod 513, the push plate 514 moves along the sliding rail guide, the dovetail groove block 516 fixedly connected to the outside of the sliding rail is driven to move rightward by the push plate 514 in the process of moving downward, the connecting column 521 is driven to move rightward by the dovetail groove block 516, the supporting inclined block 522 is driven to move rightward by the connecting column 521, so that the bottom surface of the supporting inclined block 522 is in contact with the roller 526, so as to drive the top column 524 to move downward synchronously under the action of gravity, the top column 524 is retracted into the lower die 2, at the same time, the punch 512 falls into the lower die 2, so as to complete the stamping work, and when the stamping is completed, the punch 512 is reset, so as to drive the top column 524 to reset, the top column 524 moves upward, and then the material after stamping can be pushed out of the lower die 2, and in the process of stamping, the guiding and shock absorbing mechanism 3 is set, the spring 35 is compressed, the sliding seat 511 moves downward along the guide of the guide sleeve 33 and the guide column 31, the sliding seat 511 is in contact with the rubber pad 36, and the impact force in the process of stamping is absorbed.

[0036] It should be noted that, in the present document, the terms“first”,“second”, and the like, merely serve to distinguish one entity or action from another, and do not necessarily require or imply any actual relationship or order between such entities or actions. Moreover, the terms“comprising”,“containing”, or any other similar words, are intended to encompass non-exclusive inclusion, such that processes, methods, articles, or apparatuses that comprise a list of elements are not limited to those elements, but can include other elements not expressly listed, or can include elements inherent in such processes, methods, articles, or apparatuses. Without more limitations, an element defined by the phrase“comprising a” does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes the element.

Claims

1. A stamping die for LED printed circuit boards, comprising a connecting base (1), characterized in that: The connecting seat (1) is fixedly connected to the lower mold (2) at the top. The connecting seat (1) is provided with a guide damping mechanism (3) at the top. The connecting seat (1) is provided with a pressing and ejecting mechanism (5) on the outside. The pressing and ejecting mechanism (5) is provided with a connecting sleeve (4) at the top. The pressing and top-feeding mechanism (5) includes a pressing component (51) and a top-feeding component (52), wherein the top-feeding component (52) is disposed at the bottom of the pressing component (51); The guide damping mechanism (3) includes a guide post (31), which is fixedly connected inside the connecting seat (1). A guide sleeve (33) is slidably connected to the outside of the guide post (31). A limit block (32) is fixedly connected to the top of the guide post (31). A spring is fixedly connected between the limit block (32) and the guide sleeve (33). A second spring (35) is fixedly connected between the guide sleeve (33) and the connecting seat (1).

2. The special stamping die for LED printed circuit boards according to claim 1, characterized in that: The connecting seat (1) has a hole at the corresponding position of the guide post (31), and the guide post (31) is fixedly connected in the hole.

3. The special stamping die for LED printed circuit boards according to claim 1, characterized in that: The pressing assembly (51) includes a slide (511), which is fixedly connected to the outside of the guide sleeve (33). A punch (512) is fixedly connected to the bottom of the slide (511). A push rod (513) is fixedly connected to the right side of the punch (512). A push plate (514) is fixedly connected to the bottom of the push rod (513). A sloping rail (515) is slidably connected to the inside of the push plate (514). A dovetail groove block (516) is fixedly connected to the right side of the sloping rail (515).

4. The special stamping die for LED printed circuit boards according to claim 3, characterized in that: The dovetail groove block (516) is slidably connected inside the connecting seat (1), and the push rod (513) is provided with a groove at the corresponding position of the connecting seat (1), and the push rod (513) is slidably connected in the groove.

5. A stamping die for LED printed circuit boards according to claim 3, characterized in that: The top material assembly (52) includes a connecting column (521), which is fixedly connected to the left side of the dovetail groove block (516). A supporting inclined block (522) is fixedly connected to the left side of the connecting column (521). A limit strip (523) is fixedly connected inside the connecting seat (1). A top column (524) is slidably connected inside the lower mold (2). A connecting frame (525) is fixedly connected to the bottom of the top column (524). A roller (526) is rotatably connected to the bottom of the connecting frame (525).

6. The special stamping die for LED printed circuit boards according to claim 5, characterized in that: The bottom of the roller (526) abuts against the top of the support inclined block (522), and the connecting frame (525) is slidably connected inside the connecting seat (1).

7. A stamping die for LED printed circuit boards according to claim 5, characterized in that: The limiting strip (523) has a groove at the corresponding position of the supporting inclined block (522), and the supporting inclined block (522) is slidably connected in the groove.

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