Quad flat no-lead (QFN) chip test socket with heat dissipation function
By introducing upper and lower grounding copper blocks and heat dissipation holes into the QFN chip test socket, the problem of excessive temperature during testing is solved, achieving higher detection accuracy and safety, and reducing cost.
Patent Information
- Application Number
- CN202422902117.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-27
- Publication Date
- 2025-11-18
- Estimated Expiration
- 2034-11-27
AI Technical Summary
The existing QFN chip test socket design is unreasonable, resulting in excessively high temperatures during testing, causing damage to solder balls and reduced testing accuracy, which affects customer losses and safety.
A QFN chip test socket with heat dissipation function was designed. By setting an upper grounding copper block and a lower grounding copper block between the upper and lower needle plates, and setting heat dissipation holes on them, excess heat is absorbed and the detection temperature is reduced. At the same time, the split combination structure is adopted to facilitate assembly and disassembly.
It effectively reduces the detection temperature, prevents solder ball damage, improves detection accuracy and safety, reduces waste costs, and increases detection efficiency.
Smart Images
Figure CN223565738U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to QFN chip test application technical field, specifically relates to a QFN chip test seat with heat dissipation function. BACKGROUND
[0002] QFN is a kind of pinless package, square or rectangle, there is a large area bare pad in the central position of package bottom to guide heat, and there is conductive pad for realizing electrical connection around the package periphery of large pad.
[0003] Chip production includes chip design, wafer fabrication, package fabrication and testing.
[0004] Chip testing is actually testing the performance, reliability and other of chip, obtaining many key data, improving chip production and improving yield.
[0005] At present, the test seat for QFN chip has unreasonable design structure, causes temperature to be too high in testing process, and then leads to the damage of chip's tin ball, causes customer loss, and also indirectly affects the accuracy of testing, and there is certain detection safety influence.
[0006] Based on the above problems, the utility model provides a QFN chip test seat with heat dissipation function. UTILITY MODEL CONTENT
[0007] The utility model aims at the shortage of prior art, provides a QFN chip test seat with heat dissipation function, solves the problems in background art, i.e.
[0008] Technical scheme: the utility model provides a QFN chip test seat with heat dissipation function, which comprises upper needle plate, lower needle plate, test probe and tested chip, one side of the upper needle plate is internally provided with upper needle plate recess, one side of the upper needle plate is provided with upper needle plate pinhole in the upper needle plate recess, the lower needle plate is internally provided with lower needle plate through slot, the lower needle plate is internally provided with lower needle plate pinhole matched with the upper needle plate pinhole outside the lower needle plate through slot, the upper needle plate recess is internally provided with guide frame, the guide frame is internally provided with guide frame through slot, the upper needle plate and the lower needle plate are vertically provided with upper ground copper block and lower ground copper block through the lower needle plate through slot, and the upper ground copper block and the lower ground copper block are respectively and uniformly provided with upper ground copper block heat dissipation hole and lower ground copper block heat dissipation hole.
[0009] The QFN chip test seat with the heat dissipation function also comprises a first screw hole arranged in the upper needle plate and located in the groove of the upper needle plate, a second screw hole arranged in the guide frame and located in the through outer layer of the guide frame, a third screw hole arranged in the lower needle plate and located in the through slot layer of the lower needle plate, and a first screw for fixing the upper needle plate, the guide frame and the lower needle plate through the first screw hole, the second screw hole and the third screw hole.
[0010] The QFN chip test seat with the heat dissipation function also comprises a fourth screw hole arranged in the groove of the upper needle plate and located at one side of the first screw hole, a fifth screw hole arranged in the four corners of the lower needle plate, and a second bolt for fixing the upper needle plate and the lower needle plate through the fourth screw hole and the fifth screw hole.
[0011] The QFN chip test seat with the heat dissipation function also comprises an upper needle plate through hole arranged in the four corners of the upper needle plate, and a bolt for fixing the upper needle plate through the upper needle plate through hole.
[0012] Compared with the prior art, the QFN chip test seat with the heat dissipation function has the following beneficial effects: 1. The heat dissipation pad can be directly welded on the circuit board during overall use, the upper ground copper block, the lower ground copper block, the upper ground copper block through hole and the lower ground copper block through hole are designed to absorb excess heat, so that the purpose of power dissipation is achieved, thereby reducing the detection temperature and preventing the phenomenon of the influence of high temperature on the tested chip test; 2. The overall design is a split combination type, which is convenient to assemble, use and disassemble, easy to operate, improves the detection efficiency and is beneficial to promotion. BRIEF DESCRIPTION OF DRAWINGS
[0013] In order to more clearly illustrate the technical scheme in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments. Obviously, the drawings described below are only some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creating any creative labor.
[0014] Figure 1 is an explosion structure schematic view of the QFN chip test seat with the heat dissipation function of the present application;
[0015] Figure 2 is Figure 1 is an enlarged structure schematic view of the upper ground copper block, the lower ground copper block, the upper ground copper block pin hole and the lower ground copper block pin hole in the QFN chip test seat with the heat dissipation function;
[0016] Figure 3 is Figure 1 is an enlarged structure schematic view of the lower needle plate in the QFN chip test seat with the heat dissipation function;
[0017] Figure 4 is Figure 1 Enlarged structural schematic view of the upper needle plate;
[0018] In the figure, the serial numbers are as follows: 1-upper needle plate, 11-upper needle plate groove, 12-first screw hole, 13-fourth screw hole, 14-upper needle plate needle hole, 15-upper needle plate through hole, 2-guide frame, 21-guide frame through slot, 22-second screw hole, 3-lower needle plate, 31-lower needle plate through slot, 32-third screw hole, 33-fifth screw hole, 34-lower needle plate needle hole, 4-upper ground copper block, 41-upper ground copper block heat dissipation hole, 5-lower ground copper block, 51-lower ground copper block heat dissipation hole, 6-test probe, 7-chip to be tested, 8-first screw, 9-second bolt, 10-bolt. DETAILED DESCRIPTION
[0019] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0020] In the description of the present application, it should be noted that the terms "top", "bottom", "one side", "the other side", "front", "back", "intermediate position", "interior", "top end", "bottom end" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application; the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance; in addition, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the communication between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0021] Embodiment one
[0022] As Figure 1 , Figure 2 , Figure 3 and Figure 4The QFN chip test seat with heat dissipation function shown comprises an upper needle plate 1, a lower needle plate 3, test probes 6 and a chip 7 to be tested,
[0023] One side of the upper needle plate 1 is provided with an upper needle plate groove 11,
[0024] One side of the upper needle plate 1 and located in the upper needle plate groove 11 is provided with an upper needle plate pin hole 14,
[0025] The lower needle plate 3 is provided with a lower needle plate through slot 31,
[0026] The lower needle plate 3 and located outside the lower needle plate through slot 31 is provided with a lower needle plate pin hole 34 matched with the upper needle plate pin hole 14,
[0027] The upper needle plate groove 11 is provided with a guide frame 2,
[0028] The guide frame 2 is provided with a guide frame through slot 21,
[0029] The upper needle plate 1 and the lower needle plate 3 are vertically provided with an upper grounding copper block 4 and a lower grounding copper block 5 through the lower needle plate through slot 31,
[0030] The upper grounding copper block 4 and the lower grounding copper block 5 are respectively and uniformly provided with an upper grounding copper block heat dissipation hole 41 and a lower grounding copper block heat dissipation hole 51.
[0031] The working principle is that the guide frame 2 is placed in the upper needle plate 1 through the upper needle plate groove 11, and the test probes 6 are placed in the guide frame through slot 21, so that one end of the test probes 6 penetrates through the upper needle plate pin hole 14 to contact the tin ball pin of the chip 7 to be tested, and the other end penetrates through the lower needle plate pin hole 34 to contact the PAD on the PCB for power test, at this time, the excess power generated is diffused into the upper grounding copper block 4 and the lower grounding copper block 5 through the upper grounding copper block heat dissipation hole 41 and the lower grounding copper block heat dissipation hole 51, and at this time, the excess heat can be absorbed.
[0032] Example two
[0033] On the basis of example one, the QFN chip test seat with heat dissipation function further comprises a first screw hole 12 provided on the upper needle plate 1 and located in the upper needle plate groove 11, a second screw hole 22 provided in the guide frame 2 and located outside the guide frame through slot 21, a third screw hole 32 provided in the lower needle plate 3 and located outside the lower needle plate through slot 31, and a first screw 8 for fixing the upper needle plate 1, the guide frame 2 and the lower needle plate 3 through the first screw hole 12, the second screw hole 22 and the third screw hole 32.
[0034] In this way, the upper needle plate 1, the guide frame 2 and the lower needle plate 3 constitute a structure design of easy disassembly and assembly, which is convenient to use.
[0035] Embodiment two
[0036] On the basis of embodiment one or embodiment two, the QFN chip test seat with heat dissipation function further comprises a fourth screw hole 13 arranged in the upper needle plate groove 11 and located at one side of the first screw hole 12, a fifth screw hole 33 arranged in the four corners of the lower needle plate 3, and a second bolt 9 for fixing the upper needle plate 1 and the lower needle plate 3 through the fourth screw hole 13 and the fifth screw hole 33.
[0037] In this way, the upper needle plate 1 and the lower needle plate 3 form a structure design of easy disassembly and assembly, which is convenient to use
[0038] Embodiment four
[0039] On the basis of embodiment one or embodiment two or embodiment three, the QFN chip test seat with heat dissipation function further comprises an upper needle plate through hole 15 arranged in the four corners of the upper needle plate 1, and a bolt 10 for fixing the upper needle plate 1 through the upper needle plate through hole 15. During use, the upper needle plate 1 and the like can be fixed with the test equipment through the upper needle plate through hole 15 and the bolt 10.
[0040] It should be noted that in this text, terms such as "including", "containing" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or includes elements inherent to such process, method, article or equipment. Without more limitations, the element defined by the statement "including a" does not exclude the presence of another identical element in the process, method, article or equipment including the element.
[0041] It is obvious for those skilled in the art that the present application is not limited to the details of the above exemplary embodiments, and can be realized in other specific forms without departing from the spirit or essential characteristics of the present application. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting, and the scope of the present application is defined by the appended claims rather than the above description, and therefore all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present application. Any reference signs in the claims should not be regarded as limiting the claims involved.
Claims
1. A QFN chip test seat with heat dissipation function, comprising an upper pin plate (1), a lower pin plate (3), a test probe (6) and a tested chip (7), characterized in that: one side of the upper pin plate (1) is provided with an upper pin plate groove (11); one side of the upper pin plate (1) and located in the upper pin plate groove (11) is provided with an upper pin plate pin hole (14); the lower pin plate (3) is provided with a lower pin plate through slot (31); the lower pin plate (3) and located outside the lower pin plate through slot (31) is provided with a lower pin plate pin hole (34) matched with the upper pin plate pin hole (14); the upper pin plate groove (11) is provided with a guide frame (2); the guide frame (2) is provided with a guide frame through slot (21); the upper pin plate (1) and the lower pin plate (3) are vertically provided with an upper ground copper block (4) and a lower ground copper block (5) through the lower pin plate through slot (31); the upper ground copper block (4) and the lower ground copper block (5) are respectively and uniformly provided with an upper ground copper block heat dissipation hole (41) and a lower ground copper block heat dissipation hole (51).
2. The QFN chip test seat with heat dissipation function according to claim 1, characterized in that: the QFN chip test seat with heat dissipation function further comprises a first screw hole (12) provided on the upper pin plate (1) and located in the upper pin plate groove (11), a second screw hole (22) provided in the guide frame (2) and located outside the guide frame through slot (21), a third screw hole (32) provided in the lower pin plate (3) and located outside the lower pin plate through slot (31), and a first screw (8) for fixing the upper pin plate (1), the guide frame (2) and the lower pin plate (3) through the first screw hole (12), the second screw hole (22) and the third screw hole (32). The QFN chip test seat with heat dissipation function further comprises a fourth screw hole (13) provided in the upper pin plate groove (11) and located on one side of the first screw hole (12), a fifth screw hole (33) provided in the four corners of the lower pin plate (3), and a second bolt (9) for fixing the upper pin plate (1) and the lower pin plate (3) through the fourth screw hole (13) and the fifth screw hole (33). The QFN chip test seat with heat dissipation function further comprises an upper pin plate through hole (15) provided in the four corners of the upper pin plate (1), and a bolt (10) for fixing the upper pin plate (1) through the upper pin plate through hole (15). 3. The QFN chip test socket with heat dissipation function according to claim 2, characterized in that: 4. The QFN chip test socket with heat dissipation function according to claim 1 or 2 or 3, characterized in that: