Signal source board card, quantum computing measurement and control system and quantum computer

Abstract

The utility model discloses a signal source board card, a quantum computing measurement and control system and a quantum computer, and the system comprises a PCB which is provided with a metal through hole penetrating through a first surface and a second surface which are opposite to each other; the functional module is integrated on the first surface and the second surface of the PCB and used for generating a plurality of measurement and control signals, and the functional module at least comprises a heating electronic device; the upper cover plate covers the first surface of the PCB, a first cooling fin is arranged on the outer wall of the upper cover plate, and a first heat conduction boss is arranged on the inner wall of the upper cover plate; the lower cover plate covers the second surface of the PCB, the outer wall of the lower cover plate is provided with a second radiating fin, and the inner wall of the lower cover plate is provided with a second heat conduction boss; the top surface of any heating electronic device is in contact with the first heat conduction boss or the second heat conduction boss, and the bottom surface of the heating electronic device is in contact with the second heat conduction boss or the first heat conduction boss through a metal via hole. Heat generated by the heating electronic device is conducted outwards through the top face and the bottom face, and the heat dissipation effect is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to quantum computer technical field especially relates to a signal source board card, quantum computation measurement and control system and quantum computer. BACKGROUND

[0002] Quantum computer is a kind of physical device that carries out high-speed mathematical and logic operation, storage and processing quantum information according to quantum mechanics law;It is mainly composed of quantum measurement and control system, quantum chip system, quantum computing environment support system and quantum computer operating system. Among them, the quantum measurement and control system includes signal generating device, for providing high-frequency measurement and control signal for each quantum bit in quantum chip. The existing quantum computer directly uses the purchased commercial signal source as the signal generating device required by quantum measurement and control system, and the commercial signal source usually pursues the performance of single channel, and the expandability is generally very poor, a commercial signal source provides a way of measurement and control signal, and with the increasing number of quantum bits integrated on quantum chip, the number of commercial signal sources required is more.

[0003] Therefore, a signal source product capable of providing multiple measurement and control signals is needed, and when the signal source product provides multiple measurement and control signals, the electronic devices integrated thereon are also more, and the requirement for heat dissipation performance becomes more stringent.

[0004] It should be noted that the information disclosed in the background section of the present application is only intended to deepen the understanding of the general background of the present application, and should not be regarded as acknowledging or implying in any form that the information constitutes prior art known to those skilled in the art. UTILITY MODEL CONTENT

[0005] The utility model aims at providing a signal source board card, quantum computation measurement and control system and quantum computer with good heat dissipation effect.

[0006] In order to realize the above-mentioned purpose, the utility model provides the following technical scheme:

[0007] The utility model provides a signal source board card in the first aspect, including:

[0008] A PCB board is provided with metal via holes penetrating through the opposite first surface and second surface;

[0009] The functional module for generating multiple measurement and control signals integrated on the first surface and the second surface of the PCB board, the functional module includes at least one heating electronic device;

[0010] The upper cover plate of the first surface of the PCB board is provided with first heat dissipation fins on the outer wall, and first heat conduction bosses on the inner wall;

[0011] A lower cover plate is arranged on the second surface of the PCB, and a second heat dissipation fin is arranged on the outer wall of the lower cover plate, and a second heat conduction boss is arranged on the inner wall of the lower cover plate;

[0012] The top surface of any of the heat generating electronic devices is in contact with the first heat conduction boss or the second heat conduction boss, and the bottom surface of the heat generating electronic device is in contact with the second heat conduction boss or the first heat conduction boss through the metal via hole.

[0013] The signal source board card as described above, further, one side of the first heat conduction boss away from the upper cover plate is provided with a first heat conduction silica gel pad; and / or, one side of the second heat conduction boss away from the lower cover plate is provided with a second heat conduction silica gel pad.

[0014] The signal source board card as described above, further, the functional module comprises:

[0015] The first frequency up-conversion module is configured to output a first signal and a second signal with a frequency higher than 100 MHz based on the received 100 MHz reference clock signal.

[0016] The first power division module is configured to receive the first signal and divide the first signal into a plurality of third signals.

[0017] The second power division module is configured to receive the second signal and divide the second signal into a plurality of fourth signals.

[0018] A plurality of second frequency up-conversion modules are provided, and each of the second frequency up-conversion modules is configured to output a tracking and control signal based on one of the third signals and one of the fourth signals.

[0019] The signal source board card as described above, further, the plurality of second frequency up-conversion modules are arranged on the first surface of the PCB.

[0020] The first frequency up-conversion module, the first power division module, and the second power division module are arranged on the second surface of the PCB.

[0021] The heat generating electronic devices on the first frequency up-conversion module are arranged staggered with the heat generating electronic devices on the second frequency up-conversion module.

[0022] The signal source board card as described above, further, a plurality of heat conduction ribs made of heat conduction material are arranged on the PCB to separate the plurality of second frequency up-conversion modules.

[0023] The inner wall of the upper cover plate is further provided with a third heat conduction boss, and one end of the heat conduction rib away from the PCB is in contact with the third heat conduction boss.

[0024] The signal source board card as described above, further, the inner wall of the upper cover plate is further provided with a fourth heat conduction boss, and both side ends of the heat conduction rib are provided with a clamping groove matched with the fourth heat conduction boss.

[0025] The signal source board card as described above, further, any second frequency up-conversion module comprises: a DDS, a frequency mixer, a phase-locked loop unit and a power adjustment unit.

[0026] The input end of each DDS is electrically connected with one output end of the first power division module, the output end of the DDS is electrically connected with one input end of the frequency mixer, the other input end of the frequency mixer is electrically connected with one output end of the second power division module, and the output end of the frequency mixer is electrically connected with the phase-locked loop unit and the power adjustment unit in sequence.

[0027] The signal source board card as described above, further comprising an FPGA, used for providing control signals to the phase-locked loop unit and the DDS.

[0028] One port of the FPGA is in communication connection with a plurality of phase-locked loop units, and / or one port of the FPGA is in communication connection with a plurality of DDSs.

[0029] The second aspect of the utility model provides a quantum computing measurement and control system, comprising the signal source board card, the signal source board card is used for outputting multiple measurement and control signals to a quantum chip.

[0030] The third aspect of the utility model provides a quantum computer, comprising the quantum computing measurement and control system and a quantum chip, and the quantum chip operates a quantum computing task according to the first measurement and control signal provided by the quantum computing measurement and control system.

[0031] The utility model has the advantages that:

[0032] The top surface of the heat generating electronic device is in contact with the first heat conduction boss or the second heat conduction boss, and the bottom surface of the heat generating electronic device is in contact with the second heat conduction boss or the first heat conduction boss through the metal via, so that the heat of the heat generating electronic device is conducted to the first heat sink on the upper cover plate and the second heat sink on the lower cover plate through the first heat conduction boss and the second heat conduction boss, the heat generated by the heat generating electronic device is conducted outward through the top surface and the bottom surface, and the heat dissipation effect is improved.

[0033] The quantum computing measurement and control system and the quantum computer provided by the utility model both comprise the signal generating device, and therefore have the same beneficial effects, which will not be repeated here. BRIEF DESCRIPTION OF DRAWINGS

[0034] Figure 1 The utility model provides a signal source board card's structural schematic diagram for embodiment of the utility model;

[0035] Figure 2 The first surface structure schematic diagram of the PCB provided by the utility model for embodiment;

[0036] Figure 3 A second surface structure schematic view of the PCB provided by the embodiment of the present application is provided.

[0037] Figure 4 A structure schematic view of the functional module integrated on the PCB provided by the embodiment of the present application is provided.

[0038] In the drawing marks:

[0039] 1, PCB; 1a, metal via; 2, upper cover plate; 3, first heat dissipation fin; 4, first heat conduction boss; 5, first heat conduction silica gel pad; 6, lower cover plate; 7, second heat dissipation fin; 8, second heat conduction boss; 9, second heat conduction silica gel pad; 100, heating electronic device; 200, spacer rib;

[0040] 10, first frequency up-regulation module; 20, first power division module; 30, second power division module; 40, second frequency up-regulation module; 41, DDS; 42, frequency mixer; 43, phase-locked loop unit; 44, power adjustment unit. DETAILED DESCRIPTION

[0041] In order for those skilled in the art to better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor should belong to the scope of protection of the present application. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present application, and cannot be interpreted as a limitation on the present application.

[0042] In the description of the present application, it should be understood that the terms "center", "upper", "lower", "left", "right" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0043] In addition, the terms "first", "second" are only for description purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise explicitly specified.

[0044] With the increase of the number of quantum bits integrated on the quantum chip, a signal source product capable of providing multiple measurement and control signals is urgently needed. When the signal source product provides multiple measurement and control signals, more electronic devices are integrated thereon, and the heat dissipation performance requirement becomes more stringent. The heat dissipation performance of the signal source product can be improved from the two aspects of improving the heat dissipation effect and reducing the heat production. Figure 1 The structure diagram of the signal source board card provided by the embodiment of the utility model is shown in the figure. Figure 1 The embodiment of the application discloses a signal source board card, which comprises:

[0045] A PCB board 1 is provided with metal vias 1a penetrating the opposite first surface and second surface.

[0046] The functional modules for generating multiple measurement and control signals integrated on the first surface and the second surface of the PCB board 1, the functional modules at least include one heating electronic device 100.

[0047] The upper cover plate 2 is arranged on the first surface of the PCB board 1, the outer wall of which is provided with first heat dissipation fins 3, and the inner wall of which is provided with first heat conduction bosses 4.

[0048] The lower cover plate 6 is arranged on the second surface of the PCB board 1, the outer wall of which is provided with second heat dissipation fins 7, and the inner wall of which is provided with second heat conduction bosses 8.

[0049] The top surface of any one of the heating electronic devices 100 is in contact with the first heat conduction boss 4 or the second heat conduction boss 8, and the bottom surface of the heating electronic device 100 is in contact with the second heat conduction boss 8 or the first heat conduction boss 4 through the metal via 1a.

[0050] The signal source board card of the application, by contacting the top surface of the heating electronic device 100 with the first heat conduction boss 4 or the second heat conduction boss 8, and at the same time, the bottom surface of the heating electronic device 100 is in contact with the second heat conduction boss 8 or the first heat conduction boss 4 through the metal via 1a, so that the heat of the heating electronic device 100 is conducted to the first heat dissipation fins 3 on the upper cover plate 2 and the second heat dissipation fins 7 on the lower cover plate 6 through the first heat conduction boss 4 and the second heat conduction boss 8, so that the heat generated by the heating electronic device 100 is conducted outward through the top surface and the bottom surface, and the heat dissipation effect is improved.

[0051] In the embodiment, the material of the first heat conduction boss 4 and the second heat conduction boss 8 is not limited, in order to improve the heat dissipation effect, the material of the first heat conduction boss 4 and the second heat conduction boss 8 is aluminum alloy or copper or copper alloy.

[0052] In the embodiment, the metal via 1a can be a copper-containing via.

[0053] In the embodiment, the heat generating electronic device 100 generally refers to a device that generates heat during operation, and exemplary heat generating electronic devices 100 include DDSs, amplifiers, mixers, FPGAs, attenuators, and the like.

[0054] In the embodiment, the shape of the first heat sink 3 is not specifically limited, and the first heat sink 3 can be in the shape of a long sheet, an S shape, a wave shape, or a polyline shape, in order to increase the heat dissipation area and improve the heat dissipation effect. In order to further increase the heat dissipation area and improve the heat dissipation effect, the first heat sink 3 is provided with a plurality of protrusions or recesses. In the embodiment, a plurality of first heat sinks 3 are generally arranged, and the plurality of first heat sinks 3 are arranged vertically to the upper cover plate 2 and in parallel and at intervals, forming a plurality of heat dissipation channels.

[0055] In the embodiment, the shape of the second heat sink 7 is not specifically limited, and the second heat sink 7 can be in the shape of a long sheet, an S shape, a wave shape, or a polyline shape, in order to increase the heat dissipation area. In order to further increase the heat dissipation area and improve the heat dissipation effect, the second heat sink 7 is provided with a plurality of protrusions or recesses. In the embodiment, a plurality of second heat sinks 7 are generally arranged, and the plurality of second heat sinks 7 are arranged vertically to the lower cover plate 6 and in parallel and at intervals, forming a plurality of heat dissipation channels.

[0056] In order to further improve the heat dissipation effect, in some embodiments of the embodiment, one side of the first heat-conducting boss 4 away from the upper cover plate 2 is provided with a first heat-conducting silica gel pad 5, and / or one side of the second heat-conducting boss 8 away from the lower cover plate 6 is provided with a second heat-conducting silica gel pad 9. By providing the first heat-conducting silica gel pad 5 and / or the second heat-conducting silica gel pad 9, the heat transfer efficiency of the heat generated by the heat generating electronic device 100 is improved, and the heat dissipation effect is improved.

[0057] Figure 4 A structural schematic diagram of a functional module integrated on a PCB 1 according to the embodiment of the utility model is shown in FIG. 1. Figure 4 As shown in FIG. 1, in some embodiments of the embodiment, the functional module includes:

[0058] A first frequency up-conversion module 10 is configured to output a first signal and a second signal with a frequency higher than 100 MHz based on a received 100 MHz reference clock signal.

[0059] A first power division module 20 is configured to receive the first signal and divide the first signal into a plurality of third signals.

[0060] A second power division module 30 is configured to receive the second signal and divide the second signal into a plurality of fourth signals.

[0061] A plurality of second frequency up-conversion modules 40 are configured to output a control signal based on one of the third signals and one of the fourth signals.

[0062] By setting the first power division module 20 and the second power division module 30 and the plurality of second frequency up-conversion modules 40, the signal generating device of the present application can output multiple control signals at the same time, and the plurality of second frequency up-conversion modules 40 share one first frequency up-conversion module 10. Compared with directly providing multiple separate modules to generate multiple third signals and multiple fourth signals, not only is the circuit simplified, the number of heat-emitting electronic devices 100 is reduced to reduce the heat output of the signal source board card, but also the integration of the signal source board card is improved. The multiple control signals of the present embodiment are all based on a 100MHz clock signal as a reference signal, which ensures the stability of the phase difference of the final multiple control signals.

[0063] In the present embodiment, the first frequency up-conversion module 10 is not specifically limited, and exemplarily, the first frequency up-conversion module 10 includes an amplifier and a comb spectrum generator or a frequency multiplier connected in series, wherein the amplifier is configured to receive a 100MHz reference clock signal and perform power amplification processing on the reference clock signal; the comb spectrum generator or the frequency multiplier is configured to receive the signal after power amplification processing and perform frequency multiplication processing, and output a first signal and a second signal with a frequency higher than 100MHz. At this time, the heat-emitting electronic devices 100 in the first frequency up-conversion module 10 include the amplifier and the comb spectrum generator or the frequency multiplier. In actual application, the first frequency up-conversion module 10 can also increase a filter as needed.

[0064] In the present embodiment, the first power division module 20 is not specifically limited, and exemplarily, the first power division module 20 includes a one-to-eight power divider, and in actual application, an amplifier can also be added as needed.

[0065] In the present embodiment, the second power division module 30 is not specifically limited, and exemplarily, the second power division module 30 includes a one-to-eight power divider, and in actual application, an amplifier can also be added as needed.

[0066] In the present embodiment, the second frequency up-conversion module 40 is not specifically limited, and exemplarily, as shown in Figure 4 any one of the second frequency up-conversion modules 40 includes a DDS 41, a frequency mixer 42, a phase-locked loop unit 43, and a power adjustment unit 44.

[0067] The input end of each of the DDSs 41 is electrically connected with one output end of the first power division module 20, the output end of the DDS 41 is electrically connected with one input end of the frequency mixer 42, the other input end of the frequency mixer 42 is electrically connected with one output end of the second power division module 30, and the output end of the frequency mixer 42 is electrically connected with the phase-locked loop unit 43 and the power adjustment unit 44 in sequence.

[0068] The second frequency up-regulation module 40 can accurately regulate the frequency of the TT&C signal by setting the DDS 41, the frequency mixer 42 and the phase-locked loop, and can regulate the power of the TT&C signal by setting the power adjustment unit 44 to meet the working requirements of the quantum chip, so that the quality of each TT&C signal is good to ensure the accuracy of the TT&C process.

[0069] In the embodiment, the power adjustment unit 44 is not specifically limited, and exemplarily, the power adjustment unit 44 comprises an amplifier and at least one variable attenuation element connected in series, wherein the variable attenuation element can comprise a digital attenuator and / or a voltage-controlled attenuator. By setting the digital attenuator and / or the voltage-controlled attenuator, the power of the TT&C signal can be finely adjusted in small steps, so that the quality and accuracy of the TT&C signal are improved to improve the accuracy of the TT&C. At this time, the heat-emitting electronic device 100 in the second frequency up-regulation module 40 comprises the DDS 41, the frequency mixer 42, the phase-locked loop unit 43, the amplifier and the variable attenuation element. In actual application, the second frequency up-regulation module 40 can also increase a filter according to requirements.

[0070] In order to reduce the heat generation of the signal source board card, in some embodiments of the embodiment, the signal source board card further comprises an FPGA for providing a control signal to the phase-locked loop unit 43 and the DDS 41; one port of the FPGA is in communication connection with a plurality of phase-locked loop units 43, and / or one port of the FPGA is in communication connection with a plurality of DDSs 41, so that the port multiplexing of the FPGA is realized, which is not only conducive to integration, but also reduces the use of signal lines and the heat generation of the signal source board card. Further, in some embodiments of the embodiment, the signal source board card further comprises a buffer, and the FPGA is in communication connection with the phase-locked loop unit 43 and the DDS 41 through the buffer; the buffer plays a role in protecting the FPGA. The FPGA in the embodiment can be arranged on the second surface of the PCB board 1.

[0071] In order to further improve the heat dissipation effect, Figure 2 A first surface structure schematic view of the PCB board 1 provided by the embodiment of the utility model is shown in the figure; Figure 3 A second surface structure schematic view of the PCB board 1 provided by the embodiment of the utility model is shown in the figure; Figure 2 And Figure 3 As shown in the figure, in some embodiments of the embodiment, a plurality of second frequency up-regulation modules 40 are arranged on the first surface of the PCB board 1; the first frequency up-regulation module 10, the first power division module 20 and the second power division module 30 are arranged on the second surface of the PCB board 1; the heat-emitting electronic device 100 on the first frequency up-regulation module 10 is arranged staggeredly with the heat-emitting electronic device 100 on the second frequency up-regulation module 40.

[0072] In order to further improve the heat dissipation effect, in some embodiments of the present embodiment, the third heat-conducting boss is provided with a third heat-conducting silica gel pad between the third heat-conducting boss and the partition rib 200. Figure 2 As shown in the figure: the PCB board 1 is provided with a plurality of partition ribs 200 made of heat-conducting material, which are used to separate a plurality of second frequency up-conversion modules 40; the inner wall of the upper cover plate 2 is also provided with a third heat-conducting boss, and the end of the partition rib 200 away from the PCB board 1 is in contact with the third heat-conducting boss.

[0073] By separating a plurality of second frequency up-conversion modules 40 through the partition rib 200, the mutual interference of signals between the plurality of second frequency up-conversion modules 40 is reduced, thereby improving the quality of the plurality of monitoring signals generated finally. Since the partition rib 200 is made of heat-conducting material and is in contact with the third heat-conducting boss on the upper cover plate 2, the heat on the PCB board 1 is sequentially conducted to the first heat-dissipating fins 3 on the upper cover plate 2 through the partition rib 200 and the third heat-conducting boss, and then effectively dispersed into the surrounding environment, thereby realizing the dissipation of heat to improve the heat dissipation effect. In order to further improve the heat dissipation effect, in some embodiments of the present embodiment, a third heat-conducting silica gel pad is provided between the third heat-conducting boss and the partition rib 200.

[0074] In order to further improve the heat dissipation effect, in some embodiments of the present embodiment, the inner wall of the upper cover plate 2 is also provided with a fourth heat-conducting boss, and the two side ends of the partition rib 200 are provided with clamping grooves matched with the fourth heat-conducting boss. By providing the fourth heat-conducting boss and clamping the two side ends of the partition rib 200 with the fourth heat-conducting boss, the heat on the PCB board 1 can also be sequentially conducted to the first heat-dissipating fins 3 on the upper cover plate 2 through the partition rib 200 and the fourth heat-conducting boss, and then effectively dispersed into the surrounding environment, thereby realizing the dissipation of heat to improve the heat dissipation effect. In addition, through the fourth heat-conducting boss and the clamping groove, the positioning of the upper cover plate 2 and the PCB board 1 during installation is facilitated. In order to further improve the heat dissipation effect, in some embodiments of the present embodiment, a fourth heat-conducting silica gel pad is provided between the fourth heat-conducting boss and the clamping groove.

[0075] In order to further improve the heat dissipation performance of the signal source board card, in some embodiments of the present embodiment, the PCB board 1 is also provided with a heat-conducting column perpendicular to the first face and / or the second face, and the end of the heat-conducting column away from the first face and / or the second face is in contact with the upper cover plate 2 or the lower cover plate 6. By providing the heat-conducting column, the heat on the PCB board 1 is conducted to the upper cover plate 2 or the lower cover plate 6 through the heat-conducting column, thereby improving the overall heat dissipation effect of the signal source board card. In the present embodiment, the shape of the heat-conducting column is not specifically limited, which can be a cylindrical body or a square column; the connection mode of the heat-conducting column and the upper cover plate 2 or the lower cover plate 6 is not specifically limited, and exemplarily, a threaded hole is provided at the center of the heat-conducting column, a mounting hole is provided on the upper cover plate 2 or the lower cover plate 6, and a screw is passed through the mounting hole and the threaded hole to realize the detachable connection of the heat-conducting column and the upper cover plate 2 or the lower cover plate 6.

[0076] Based on the same application concept, the embodiment of the present application also proposes a quantum measurement and control circuit, comprising the above-mentioned signal source board card, and the signal source board card is used to output multiple measurement and control signals to a quantum chip.

[0077] The quantum measurement and control circuit of the present application comprises the above-mentioned signal source board card, and therefore has the same beneficial effects as the signal source board card, which will not be repeated here.

[0078] Based on the same application concept, the embodiment of the present application also proposes a quantum computer, comprising the above-mentioned quantum computing measurement and control system and a quantum chip, and the quantum chip operates a quantum computing task according to the first measurement and control signal provided by the quantum computing measurement and control system.

[0079] The quantum computer of the present application comprises the above-mentioned quantum computing measurement and control system, and therefore has the same beneficial effects as the quantum computing measurement and control system, which will not be repeated here.

[0080] In the description of the present specification, the description referring to the terms "some embodiments" or "examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiments or examples are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above-mentioned terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in the present specification.

[0081] The above-mentioned is only the preferred embodiment of the present application, and does not limit the present application in any way. Any person skilled in the art can make any form of equivalent replacement or modification of the technical scheme and technical content disclosed in the present application without departing from the scope of the technical scheme of the present application, which belongs to the content of the technical scheme of the present application and still belongs to the protection scope of the present application.

Claims

1. A signal source board, characterized in that, include: A PCB board has metal vias that penetrate through opposite first and second sides; A functional module for generating multiple measurement and control signals is integrated on the first and second sides of a PCB board, and the functional module includes at least one heat-generating electronic device. The top cover plate, which is installed on the first side of the PCB board, has a first heat sink on its outer wall and a first heat-conducting protrusion on its inner wall. The lower cover plate, which is installed on the second side of the PCB board, has a second heat sink on its outer wall and a second heat-conducting protrusion on its inner wall. The top surface of any of the heat-generating electronic devices is in contact with the first or second heat-conducting boss, and the bottom surface of the heat-generating electronic device is in contact with the second or first heat-conducting boss through the metal via.

2. The signal source board according to claim 1, characterized in that, The side of the first thermally conductive protrusion away from the upper cover plate is provided with a first thermally conductive silicone pad; And / or, the side of the second thermally conductive protrusion away from the lower cover plate is provided with a second thermally conductive silicone pad.

3. The signal source board according to claim 1, characterized in that, The functional modules include: The first frequency up-adjustment module is used to output a first signal and a second signal with a frequency higher than 100MHz based on the received 100MHz reference clock signal; The first power divider module is used to receive the first signal and divide it into multiple third signals. The second power divider module is used to receive the second signal and divide it into multiple fourth signals; Multiple second frequency up-adjustment modules are provided, each of which is used to output a measurement and control signal based on one of the third signals and one of the fourth signals.

4. The signal source board according to claim 3, characterized in that, Multiple second frequency up-adjustment modules are arranged on the first side of the PCB board; The first frequency up-adjustment module, the first power divider module, and the second power divider module are arranged on the second side of the PCB board; The heating electronic devices on the first frequency up-adjustment module and the heating electronic devices on the second frequency up-adjustment module are arranged in a staggered manner.

5. The signal source board according to claim 4, characterized in that, The PCB board is provided with multiple thermally conductive ribs to separate the multiple second frequency up-adjustment modules. The inner wall of the upper cover plate is also provided with a third heat-conducting protrusion, and the end of the partition rib away from the PCB board is in contact with the third heat-conducting protrusion.

6. The signal source board according to claim 5, characterized in that, The inner wall of the upper cover plate is also provided with a fourth heat-conducting protrusion, and both ends of the partition rib are provided with a slot that matches the fourth heat-conducting protrusion.

7. The signal source board according to claim 3, characterized in that, Any of the second frequency up-adjustment modules includes: a DDS, a mixer, a phase-locked loop unit, and a power adjustment unit; The input terminal of each DDS is electrically connected to one output terminal of the first power divider module, the output terminal of the DDS is electrically connected to one input terminal of the mixer, the other input terminal of the mixer is electrically connected to one output terminal of the second power divider module, and the output terminal of the mixer is sequentially electrically connected to the phase-locked loop unit and the power adjustment unit.

8. The signal source board according to claim 7, characterized in that, It also includes an FPGA for providing control signals to the phase-locked loop unit and the DDS; One port of the FPGA is communicatively connected to multiple phase-locked loop units, and / or one port of the FPGA is communicatively connected to multiple DDS units.

9. A quantum computing measurement and control system, characterized in that, Includes the signal source board as described in any one of claims 1-8, wherein the signal source board is used to output multiple measurement and control signals to the quantum chip.

10. A quantum computer, characterized in that, The system includes the quantum computing measurement and control system as described in claim 9 and a quantum chip, wherein the quantum chip performs quantum computing tasks based on a first measurement and control signal provided by the quantum computing measurement and control system.

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