Information acquisition packaging structure, information acquisition module and electronic equipment

Abstract

The utility model provides an information acquisition packaging structure, an information acquisition module and electronic equipment, and relates to the technical field of biological information identification, the information acquisition packaging structure comprises a packaging substrate, a plurality of acquisition chips are arranged on the packaging substrate, and a packaging body wrapping the plurality of acquisition chips is further arranged on the packaging substrate. The information acquisition packaging structure is pressed by a target object to enable the packaging body to be pressed, and the plurality of acquisition chips are used for acquiring biological characteristic information of the target object. According to the invention, multiple functions are realized by utilizing the acquisition areas expanded by the plurality of acquisition chips, the success rate of each function can be effectively improved, the functionality and availability are effectively enriched, the requirements of diversified scenes are met, and the user experience is optimized.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of biological information recognition, in particular to an information collection packaging structure, an information collection module and an electronic device. BACKGROUND

[0002] With the innovation of technology, many new types of products have appeared in the consumer electronics field, among which the market share of smart terminals is increasing. In smart terminal products, more and more functional modules are actively installed to obtain a more rich interactive experience, for example, integrating a capacitive fingerprint module on the terminal product, so that the terminal product has the function of unlocking the device through the capacitive fingerprint module.

[0003] At present, the capacitive fingerprint module usually has a built-in fingerprint chip, so its collection area is relatively limited, which not only easily affects the success rate of fingerprint recognition, but also the implementation effect is not ideal when developing various operation functions using the capacitive fingerprint module. CONTENT OF THE UTILITY MODEL

[0004] The present application aims at the deficiencies in the prior art, and provides an information collection packaging structure, an information collection module and an electronic device.

[0005] To achieve the above-mentioned purpose, the technical solutions adopted by the embodiments of the present application are as follows:

[0006] In one aspect of the embodiments of the present application, an information collection packaging structure is provided, which comprises a packaging substrate, a plurality of collection chips are arranged on the packaging substrate, and a packaging body wrapping the plurality of collection chips is also arranged on the packaging substrate. The information collection packaging structure is pressed by a target object to make the packaging body be pressed, and the plurality of collection chips are all used for collecting biological feature information of the target object.

[0007] Optionally, the plurality of collection chips are tiled on the packaging substrate.

[0008] And / or, the plurality of collection chips are arranged in a linear array or a rectangular array.

[0009] Optionally, the plurality of collection chips are arranged in a linear array, and the length direction of the collection chip is consistent with the arrangement direction.

[0010] Optionally, the surface of each collection chip has an effective collection area for collecting biological feature information.

[0011] The effective collection area and the outer surface of the packaging body directly above the effective collection area have a first spacing, and any two first spacings are equal.

[0012] Optionally, the collection chip has an effective collection area for collecting biological feature information.

[0013] In a plurality of acquisition chips, at least two acquisition chips have their effective acquisition areas set adjacent to each other.

[0014] Optionally, the spacing between two adjacent acquisition chips is less than or equal to 0.1 mm.

[0015] Optionally, a filter circuit encapsulated inside the package body is also provided on the packaging substrate, and the filter circuit is electrically connected to multiple acquisition chips.

[0016] Optionally, a microcontroller chip encapsulated within the package body is also disposed on the packaging substrate. Multiple acquisition chips are electrically connected to the microcontroller chip via a filtering circuit. The biometric information is a biometric image. The microcontroller chip is used to stitch together the biometric images acquired by multiple acquisition chips. The microcontroller chip can be a packaged chip or an unpackaged chip.

[0017] Optionally, a pressure sensor encapsulated inside the package is also provided on the packaging substrate. The pressure sensor is used to output an electrical signal characterizing the pressure state of the package. The pressure sensor can be a packaged chip or an unpackaged chip.

[0018] Optionally, a pressure processing chip is also disposed on the packaging substrate, and the pressure processing chip is encapsulated inside the package. The pressure processing chip is electrically connected to the pressure sensor and is used to convert the electrical signal into first identifiable information. The pressure processing chip may be a packaged chip or an unpackaged chip.

[0019] Optionally, the acquisition chip has an acquisition unit and a processing unit electrically connected. The acquisition unit is used to acquire biometric information, and the pressure sensor is electrically connected to the processing unit. The processing unit is used to convert the electrical signal into first identifiable information and the biometric information into second identifiable information.

[0020] Optionally, at least one acquisition chip may be stacked on top of the microcontroller chip.

[0021] Optionally, a first insulating adhesive layer is provided between the stacked microcontroller chip and the acquisition chip, and the acquisition chip stacked on top of the microcontroller chip is connected to the packaging substrate by wire bonding.

[0022] Alternatively, a first TSV via is provided on the microcontroller chip, and a data acquisition chip stacked on top of the microcontroller chip has a first contact, which is electrically connected to the packaging substrate through the first TSV via.

[0023] Optionally, at least one acquisition chip may be stacked above the pressure sensor.

[0024] Optionally, a second insulating layer is provided between the stacked pressure sensor and the acquisition chip, and the acquisition chip stacked on top of the pressure sensor is connected to the packaging substrate by wire bonding.

[0025] Alternatively, a second TSV via is provided on the pressure sensor, and the acquisition chip stacked on top of the pressure sensor has a second contact, which is electrically connected to the packaging substrate through the second TSV via.

[0026] Optionally, at least one acquisition chip may be stacked on top of the pressure processing chip.

[0027] Optionally, a third insulating layer is provided between the stacked pressure processing chip and the acquisition chip, and the acquisition chip stacked on top of the pressure processing chip is connected to the packaging substrate by wire bonding.

[0028] Alternatively, a third TSV via is provided on the pressure processing chip, and a data acquisition chip stacked on top of the pressure processing chip has a third contact, which is electrically connected to the packaging substrate through the third TSV via.

[0029] Optionally, the microcontroller chip, the filter circuit, and the multiple acquisition chips are all located on the same side surface of the packaging substrate, and the microcontroller chip and the filter circuit are located on opposite sides or the same side of the multiple acquisition chips.

[0030] Optionally, multiple acquisition chips and packages are located on the front side of the packaging substrate, and signal contacts that are electrically connected to the multiple acquisition chips are provided on the back side of the packaging substrate.

[0031] In another aspect of this application, an information acquisition module is provided, including a circuit board and the aforementioned information acquisition packaging structure. The information acquisition packaging structure is disposed on the circuit board, and a plurality of acquisition chips of the information acquisition packaging structure are electrically connected to the circuit board.

[0032] Optionally, the information acquisition module also includes a filter circuit mounted on a circuit board, which is electrically connected to multiple acquisition chips.

[0033] Optionally, the information acquisition module also includes a microcontroller chip mounted on a circuit board. The microcontroller chip is electrically connected to multiple acquisition chips via a filtering circuit. The biometric information acquired by the multiple acquisition chips is a biometric image, and the microcontroller chip is used to stitch together the biometric images acquired by the multiple acquisition chips.

[0034] Optionally, the information acquisition module also includes a pressure sensor mounted on a circuit board. The pressure sensor is electrically connected to the circuit board and is used to output an electrical signal characterizing the pressure state of the information acquisition packaging structure.

[0035] Optionally, the information acquisition package structure and the pressure sensor are located on the same side of the circuit board.

[0036] Optionally, a receiving groove is provided on the information acquisition packaging structure, and the pressure sensor is at least partially received in the receiving groove;

[0037] Alternatively, the information acquisition packaging structure and the orthographic projection of the pressure sensor on the circuit board do not intersect.

[0038] Optionally, the information acquisition package structure and the pressure sensor are distributed on opposite sides of the circuit board.

[0039] Optionally, the information acquisition module also includes a pressure pad, with the pressure pad and pressure sensor located on the same side of the circuit board;

[0040] The orthographic projections of the pressure pad and the pressure sensor on the circuit board do not intersect;

[0041] Alternatively, the pressure pads can be stacked on the side of the pressure sensor away from the circuit board.

[0042] Optionally, the circuit board includes a first sub-board and a second sub-board stacked together, an information acquisition packaging structure is disposed on the side of the first sub-board opposite to the second sub-board, and a pressure sensor is disposed on the side of the second sub-board opposite to the first sub-board.

[0043] Optionally, the circuit board also includes a bending plate, through which the first sub-board and the second sub-board are electrically connected.

[0044] Optionally, when the orthographic projections of the pressure pad and the pressure sensor on the circuit board do not intersect, a reinforcing sheet is also provided on the first sub-board, distributed on the same side as the second sub-board, and the pressure pad is disposed on the reinforcing sheet.

[0045] Optionally, the information acquisition module also includes a pressure processing chip disposed on the circuit board. The pressure processing chip is electrically connected to the pressure sensor and is used to convert the electrical signal into first identifiable information.

[0046] Optionally, the acquisition chip has an acquisition unit and a processing unit electrically connected. The acquisition unit is used to acquire biometric information, and the pressure sensor is electrically connected to the processing unit. The processing unit is used to convert the electrical signal into first identifiable information and the biometric information into second identifiable information.

[0047] Optionally, a conductive ring is fixedly disposed on the outer periphery of the information acquisition packaging structure, and a conductive sheet electrically connected to the conductive ring is also disposed on the circuit board, with the conductive sheet grounded through the ground wire in the circuit board.

[0048] In another aspect of this application, an information acquisition module is provided, including a circuit board and the aforementioned information acquisition packaging structure. The information acquisition packaging structure is disposed on the circuit board, and a plurality of acquisition chips of the information acquisition packaging structure are electrically connected to the circuit board.

[0049] In another aspect of the embodiments of this application, an electronic device is provided, including a motherboard and any of the above-described information acquisition modules, wherein the information acquisition module is electrically connected to the motherboard.

[0050] The beneficial effects of this application include:

[0051] This application provides an information acquisition packaging structure, an information acquisition module, and an electronic device, including a packaging substrate, on which multiple acquisition chips are disposed, and a package encapsulating the multiple acquisition chips is also disposed on the packaging substrate. The information acquisition packaging structure is pressed by a target object to compress the package. All multiple acquisition chips are used to acquire the biometric information of the target object. The expanded acquisition area using multiple acquisition chips enables multiple functions, effectively improving the success rate of each function, enriching functionality and usability, meeting the needs of diverse scenarios, and optimizing the user experience. Attached Figure Description

[0052] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0053] Figure 1 One of the front top views of an information acquisition and packaging structure provided in an embodiment of this application;

[0054] Figure 2 for Figure 1 A side view of an information acquisition and encapsulation structure;

[0055] Figure 3 for Figure 1 A rear view of an information acquisition and encapsulation structure;

[0056] Figure 4 One of the schematic diagrams of another information acquisition and encapsulation structure provided in the embodiments of this application;

[0057] Figure 5 A second schematic diagram of another information acquisition and encapsulation structure provided in the embodiments of this application;

[0058] Figure 6 A third schematic diagram of another information acquisition and encapsulation structure provided in the embodiments of this application;

[0059] Figure 7 A fourth schematic diagram of another information acquisition and encapsulation structure provided in the embodiments of this application;

[0060] Figure 8 Fifth schematic diagram of another information acquisition and encapsulation structure provided in the embodiments of this application;

[0061] Figure 9A sixth schematic diagram of another information acquisition and encapsulation structure provided in the embodiments of this application;

[0062] Figure 10 Schematic diagram seven of another information acquisition and encapsulation structure provided in the embodiments of this application;

[0063] Figure 11 Eighth schematic diagram of another information acquisition and encapsulation structure provided in the embodiments of this application;

[0064] Figure 12 Schematic diagram nine of another information acquisition and encapsulation structure provided in the embodiments of this application;

[0065] Figure 13 Schematic diagram ten of another information acquisition and encapsulation structure provided in the embodiments of this application;

[0066] Figure 14 Schematic diagram eleven of another information acquisition and encapsulation structure provided in the embodiments of this application;

[0067] Figure 15 This is one of the schematic diagrams of an information collection module provided in an embodiment of this application;

[0068] Figure 16 This is a second schematic diagram of an information collection module provided in an embodiment of this application;

[0069] Figure 17 This is the third schematic diagram of an information acquisition module provided in an embodiment of this application;

[0070] Figure 18 This is the fourth schematic diagram of an information collection module provided in an embodiment of this application;

[0071] Figure 19 Fifth schematic diagram of an information acquisition module provided in the embodiments of this application;

[0072] Figure 20 This is the sixth schematic diagram of an information collection module provided in the embodiments of this application.

[0073] Icons: 10 - Information acquisition packaging structure; 11 - Receiving slot; 110 - Acquisition chip; 111 - Effective acquisition area; 120 - Packaging substrate; 121 - Signal contact; 130 - Package body; 140 - Filtering circuit; 150 - Microcontroller chip; 160 - Pressure sensor; 170 - Pressure processing chip; 20 - Information acquisition module; 210 - Circuit board; 211 - First sub-board; 212 - Second sub-board; 213 - Bending plate; 220 - Connector; 230 - Pressing pad; 240 - Reinforcing sheet. Detailed Implementation

[0074] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. It should be noted that, in the absence of conflict, the various features in the embodiments of this application can be combined with each other, and the combined embodiments are still within the protection scope of this application.

[0075] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and therefore should not be construed as limiting this application. Furthermore, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0076] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0077] One aspect of this application provides an information acquisition encapsulation structure (hereinafter referred to as the encapsulation structure). This encapsulation structure incorporates multiple acquisition chips through an encapsulation process, thereby expanding the acquisition area of ​​the encapsulation structure itself. This not only allows for the implementation of multiple functions using the expanded acquisition area, but the larger acquisition area also effectively improves the success rate of each function, significantly enriching the functionality and usability of the encapsulation structure, meeting the needs of diverse scenarios, and optimizing the user experience.

[0078] Please refer to the reference. Figures 1 to 3 The packaging structure includes a packaging substrate 120, on which multiple acquisition chips 110 are disposed, and a package body 130 is also disposed on the packaging substrate 120. The package body 130 can wrap all the acquisition chips 110 on the packaging substrate 120 and cover the exposed upper surface of the packaging substrate 120, so as to achieve packaging protection for multiple acquisition chips 110 and extend the service life of the packaging structure.

[0079] In practical use, the target object can directly or indirectly press the package 130. Specifically, for example, when the target object presses the package structure, it can directly contact the outer surface of the package 130 to achieve pressing; or, for example, a cover plate or coating can be provided on the outer surface of the package 130 to protect it. Therefore, when the target object presses the package structure, it directly contacts the cover plate or coating to achieve pressing, and the pressing is indirectly applied to the package 130 through the cover plate or coating. Whether the target object directly or indirectly presses the package 130, each acquisition chip 110 encapsulated inside the package 130 can collect the biometric information of the target object through the package 130.

[0080] Specifically, such as Figure 1 As shown, each acquisition chip 110 in the packaging structure has an effective acquisition area 111. Therefore, the acquisition area of ​​the packaging structure itself can be obtained by superimposing multiple effective acquisition areas 111, thus effectively expanding the acquisition area of ​​the packaging structure. When the target object is pressed onto the acquisition area, the acquisition chips 110 can use the effective acquisition area 111 to acquire the biometric information of the target object.

[0081] The collected biometric information can be used for identity verification, such as in scenarios like device unlocking and payment confirmation. Biometric information, combined with subsequent data analysis and processing, enables the identification of the target object. An expanded collection area can acquire more biometric information about the target object, which helps improve the accuracy and usability of identity verification.

[0082] Furthermore, the collected biometric information can also be used for pressure location recognition. For example, in scenarios such as volume adjustment, song switching, answering or ending voice calls, and swipe navigation, biometric information, combined with subsequent data analysis and processing, can be used to identify the pressure location of the target object. Specifically, in volume adjustment scenarios, different pressure locations can be used to increase or decrease the volume, for example… Figure 1 As shown, two sensing chips 110 are built into the package structure. When the left sensing chip 110 detects that the target object is pressed at the left sensing chip 110, the volume is increased or decreased. Conversely, when the right sensing chip 110 detects that the target object is pressed at the right sensing chip 110, the volume is adjusted in the opposite way. In a sliding navigation scenario, multiple pressing positions within a preset time period are used to identify the sliding operation of the target object on the surface of the package structure. Figure 1As shown, two sensing chips 110 are also built into the package structure. Within a preset time period, as the pressing position of the target object gradually shifts from the left sensing chip 110 to the right sensing chip 110, the sliding operation of the target object from left to right can be detected. The reverse sliding operation is similar. Therefore, the expanded sensing area can provide a wider pressing range, which helps to improve the accuracy and usability of various operation functions.

[0083] It should be understood that the target object can be a finger, palm, etc., and the corresponding biometric information can be a fingerprint, palm print, etc. In addition, the acquisition chip 110 can be a capacitive fingerprint chip or an ultrasonic fingerprint chip, etc. For example, when the acquisition chip 110 is used as a capacitive fingerprint chip to acquire biometric information, changes in capacitance can be used to characterize fingerprint information.

[0084] In some possible implementations, multiple acquisition chips 110 can be laid flat on the same side of the packaging substrate 120, so that the effective acquisition area 111 of each acquisition chip 110 can all play the role of expanding the acquisition area of ​​the packaging structure. For example Figure 1 and Figure 2 As shown, two acquisition chips 110 are built into the package structure. Both acquisition chips 110 are located on the front side of the package substrate 120, and they are arranged alternately without being stacked on top of each other; for example, Figure 4 As shown, four acquisition chips 110 are built into the package structure. All four acquisition chips 110 are located on the front side of the package substrate 120, and are spaced apart from each other, without being stacked. Of course, in another embodiment, the multiple acquisition chips 110 can be laid flat on the same side of the package substrate 120, as long as the effective acquisition areas 111 of the multiple acquisition chips 110 do not overlap in the direction perpendicular to the thickness of the package substrate 120. For example, the areas of the multiple acquisition chips 110 other than the effective acquisition area 111 (such as the logic circuit area) can be stacked, thereby minimizing the size of the package structure while ensuring that the package structure has the same acquisition area.

[0085] In some possible implementations, multiple acquisition chips 110 may be distributed on different sides of the packaging substrate 120, for example, some may be located on the front side of the packaging substrate 120, and others may be located on the back side and / or side side of the packaging substrate 120.

[0086] In some possible implementations, the multiple acquisition chips 110 are arranged in a linear or rectangular array. This allows for a more regular arrangement of the chips, which helps improve the accuracy and usability of various operational function recognition. For example... Figure 1 and Figure 2As shown, two acquisition chips 110 are built into the package structure and arranged in a linear array, which expands the acquisition area in the linear arrangement direction; for example... Figure 4 As shown, four acquisition chips 110 are built into the package structure. The four acquisition chips 110 are arranged in a rectangular array. The length direction of the rectangular array is the length direction b of the package structure, and the width direction of the rectangular array is the width direction d of the package structure. This can expand the acquisition area in the length and width directions of the rectangular array.

[0087] It should be understood that the arrangement of the multiple acquisition chips 110 can be adaptively set according to the operational functions required by the packaging structure. For example, in some possible implementations, when the operational functions required by the packaging structure include sliding navigation, volume adjustment, etc., the size requirement of the acquisition area of ​​the packaging structure in the vertical sliding direction is not high, but it needs to have a certain size along the sliding direction. Therefore, the multiple acquisition chips 110 can be arranged in a linear array, and the length direction of the acquisition chips 110 is consistent with the arrangement direction. This makes it convenient for the target object to slide along the arrangement direction during sliding operations, so as to more accurately identify the operation. For example Figure 1 As shown, the two acquisition chips 110 are arranged in a straight line along their respective length direction b. This allows the target object to slide a longer distance along the length direction b during the sliding operation, and the packaging structure can also acquire the pressing position over a longer range, thereby enabling more accurate identification of the sliding operation of the target object.

[0088] Based on the foregoing description, the acquisition area of ​​the package structure is formed by superimposing the effective acquisition areas 111 of multiple acquisition chips 110. Due to process limitations, there may be a certain gap between adjacent acquisition chips 110. Excessive gap may significantly affect acquisition continuity. Therefore, it is necessary to keep the gap between adjacent acquisition chips 110 within a suitable range. In some possible implementations, the gap between two adjacent acquisition chips 110 is less than or equal to 0.1 mm, specifically 0.08 mm, 0.05 mm, etc. For example... Figure 1 and Figure 2 As shown, the distance 'a' between the two acquisition chips 110 is less than or equal to 0.1 mm. For example... Figure 4 As shown, the distance a between the upper left and upper right acquisition chips 110 is less than or equal to 0.1 mm (the same applies to the lower left and lower right acquisition chips 110).

[0089] When optimizing the acquisition continuity between adjacent acquisition chips 110, at least two acquisition chips 110 can have their effective acquisition areas 111 set adjacently. For example... Figure 1 As shown, the effective acquisition area 111 of the acquisition chip 110 on the left is closer to the adjacent acquisition chip 110 on its right. Specifically, the area of ​​the acquisition chip 110 on the left, excluding the effective acquisition area 111, and the effective acquisition area 111 can be arranged on the top surface of the acquisition chip 110 in a left-to-right direction; the same applies to the acquisition chip 110 on the right. Figure 4 The same applies to the packaging structure shown.

[0090] As mentioned above, the acquisition chip 110 can acquire biometric information of the target object through the package 130. When there are multiple acquisition chips 110 on the package substrate 120, it is necessary to unify the clarity of the information acquired by the multiple acquisition chips 110 as much as possible. In this way, the biometric information acquired by different acquisition chips 110 can have better fusion or comparability during the identification process. Therefore, in some possible implementations, the acquisition distance, chip specifications, etc. of each acquisition chip 110 can be selectively unified.

[0091] For example, the effective acquisition area 111 and the surface of the package 130 directly above it have a first distance, and any two first distances are equal. This ensures that the distance from the effective acquisition area 111 of all acquisition chips 110 to the outer surface of the package 130 is consistent, which helps reduce the difference in clarity between the information acquired by each acquisition chip 110. When the acquired information is image information, it facilitates the comparison or stitching of the image information acquired by each acquisition chip 110. Specifically, such as... Figure 2 , Figures 12 to 14 As shown, the top surface of the acquisition chip 110 on the left is its effective acquisition area 111, and there is a first gap c between the effective acquisition area 111 and the outer surface of the package 130 directly above it. Similarly, the acquisition chip 110 on the right also has a first gap c. The first gap c of the acquisition chip 110 on the left and the first gap c of the acquisition chip 110 on the right are equal. This can effectively reduce the difficulty of stitching and improve the stitching effect in the subsequent image stitching process.

[0092] In some possible implementations, such as Figures 5 to 14As shown, a filter circuit 140, encapsulated within a package 130, is also disposed on the packaging substrate 120. The filter circuit 140 is electrically connected to multiple acquisition chips 110, which facilitates effective noise reduction of the information output by each acquisition chip 110 through the filter circuit 140. Furthermore, since both the filter circuit 140 and the acquisition chips 110 are integrated into the packaging substrate 120, the filter circuit 140 can be electrically connected to the acquisition chips 110 with a shorter distance, thus providing better filtering effects and helping to improve the signal quality of the acquired biometric information.

[0093] In order to stitch together the information collected by multiple acquisition chips 110, in some possible implementations, such as Figures 6 to 14 As shown, a microcontroller unit (MCU) 150 is also disposed on the packaging substrate 120 and encapsulated inside the package body 130. The MCU 150 is electrically connected to multiple acquisition chips 110. The biometric information acquired by each acquisition chip 110 can be biometric images. After the acquisition chips 110 acquire the biometric images, the MCU 150 stitches them together. When both a filter circuit 140 and the MCU 150 are disposed on the packaging substrate 120, the multiple acquisition chips 110 are electrically connected to the MCU 150 through the filter circuit 140, which facilitates improving the signal-to-noise ratio of the information received by the MCU 150. The package body 130 encapsulates the MCU 150, protecting it from damage caused by external environments such as moisture, pollution, and impact, thus extending its service life. It also optimizes signal transmission speed, noise suppression, and electromagnetic compatibility, ensuring signal transmission quality and stability.

[0094] It is understood that the filter circuit 140 can adopt a circuit scheme well known in the art, and this application does not impose specific limitations on it. For example, the filter circuit 140 at least includes an inductor electrically connected to the acquisition chip 110, and the inductor is enclosed inside the package 130; or, for example Figures 5 to 14 As shown, the filter circuit 140 includes at least a capacitor electrically connected to the acquisition chip 110, and the capacitor is enclosed inside the package 130; or, the filter circuit 140 includes a capacitor and an inductor, in which case both the inductor and the capacitor are enclosed inside the package 130.

[0095] To improve the filtering effect of the filter circuit 140, when the acquisition chip 110 is electrically connected to the packaging substrate 120 by wire bonding, such as Figures 5 to 13 As shown, the filter circuit 140 can be made to be close to the wire bonding side of at least one acquisition chip 110, which can further shorten the distance between the filter circuit 140 and the acquisition chip 110.

[0096] To further enrich the functionality of the packaging structure, in some possible implementations, the packaging structure incorporates a pressure sensor 160 through the packaging process. In this way, the packaging structure can also expand to have multiple functions based on the pressure state of the packaging structure sensed by the pressure sensor 160.

[0097] like Figures 8 to 14 As shown, a pressure sensor 160 is also disposed on the packaging substrate 120, and the package 130 encapsulates the pressure sensor 160 to protect it from damage caused by external environmental factors such as moisture, contamination, and impact, thereby extending its service life. It also optimizes signal transmission speed, noise suppression, and electromagnetic compatibility, ensuring signal transmission quality and stability.

[0098] When the target object is pressed against the encapsulation structure, the pressure sensor 160 in the encapsulation structure can sense the pressure state of the encapsulation body 130 and then output an electrical signal characterizing the pressure state of the encapsulation body 130. The pressure state of the encapsulation body 130 includes the pressure intensity and the duration of pressure, and the electrical signal output by the pressure sensor 160 can be characterized by voltage or current waveforms. For example, during the pressure process of the encapsulation body 130, the pressure intensity can be characterized by the amplitude of the waveform in the electrical signal, and the duration of pressure can be characterized by the output duration of the electrical signal waveform. Therefore, based on the electrical signal output by the pressure sensor 160, different operations such as light press, heavy press, long press, and short press of the target object can be identified through subsequent data analysis and processing, and then functions such as answering / hanging up calls, playing / pausing playback, switching audio and video, and increasing / decreasing volume can be implemented in different scenarios.

[0099] Therefore, by incorporating the pressure sensor 160 into the packaging structure through the packaging process, more functional scenarios can be expanded based on the pressure sensor 160, thereby enriching the application scenarios of the packaging structure.

[0100] The packaging structure is used to collect information, so in practical applications, it is equipped with a response device that responds to the packaging structure. For example, the motherboard in an electronic device, or more specifically, the main processor on the motherboard. The main processor includes, but is not limited to, one or more of the following: a central processing unit (CPU) and a graphics processing unit (GPU).

[0101] When the motherboard responds to the package structure, the information output by the package structure usually needs to meet the requirements that the motherboard can recognize. Therefore, the information conversion can be completed inside the package structure. The following will explain the information conversion methods of the acquisition chip 110 and the pressure sensor 160 respectively:

[0102] Example 1

[0103] In some possible implementations, the acquisition chip 110 has an electrically connected acquisition unit and a processing unit. The acquisition unit (with the effective acquisition area 111 belonging to the acquisition unit) can be used to acquire biometric information, and the processing unit can convert the biometric information acquired by the acquisition unit into second identifiable information that can be recognized by the motherboard. This allows the motherboard to easily recognize and respond to the second identifiable information upon receiving it. Of course, as mentioned earlier, the second identifiable information can be filtered by the filtering circuit 140 and processed by the microcontroller chip 150 before being sent to the motherboard.

[0104] Example 2

[0105] In some possible implementations, such as Figure 8 , Figure 9 , Figures 11 to 14 As shown, a pressure processing chip 170 can be disposed on the packaging substrate 120, and the package 130 encapsulates the pressure processing chip 170. The pressure processing chip 170 is electrically connected to the pressure sensor 160. The electrical signal output by the pressure sensor 160 is first converted into first identifiable information that can be recognized by the motherboard by the pressure processing chip 170, and then the pressure processing chip 170 outputs the first identifiable information to the motherboard. In this way, the motherboard can easily recognize and respond to the first identifiable information when it receives it.

[0106] Example 3

[0107] In some possible implementations, since the acquisition chip 110 in Example 1 has a processing unit capable of converting biometric information, therefore, as Figure 10 As shown, the processing unit of the acquisition chip 110 can also be electrically connected to the pressure sensor 160. This allows the processing unit to convert the electrical signal output by the pressure sensor 160 into first identifiable information. This enables the pressure sensor 160 to perform electrical signal conversion using the processing unit in the acquisition chip 110, allowing the conversion of both electrical signals and biometric information to be completed by the processing unit. This eliminates the need for a pressure processing chip 170, helps reduce the size of the packaging structure, and makes it suitable for more installation scenarios.

[0108] Of course, the microcontroller chip 150 encapsulated within the package 130 can be either a packaged chip or an unpackaged chip. When the microcontroller chip 150 is an unpackaged chip, it offers lower packaging costs and better packaging reliability. For example, in some possible implementations, such as... Figure 6 , Figure 8 , Figure 10 or Figure 11As shown, the microcontroller chip 150 encapsulated within the package 130 is a packaged chip to ensure a longer lifespan. For example, in some possible implementations, such as... Figure 7 or Figure 9 As shown, the microcontroller chip 150 encapsulated inside the package 130 is an unpackaged chip, such as an unpackaged bare chip, which simplifies the packaging process. That is, the unpackaged chip is directly mounted on the package substrate 120, and the package 130 is used to encapsulate the unpackaged chip, eliminating the need for a separate encapsulation step.

[0109] Similarly, the pressure sensor 160 encapsulated within the package 130 can be a packaged chip or an unpackaged chip. When the pressure sensor 160 is an unpackaged chip, it offers lower packaging costs and better packaging reliability. For example, in some possible implementations, such as... Figure 8 , Figure 10 or Figure 11 As shown, the pressure sensor 160, enclosed within the package 130, is a packaged chip to ensure a longer service life. Furthermore, in some possible implementations, such as... Figure 9 As shown, the pressure sensor 160 enclosed inside the package 130 is an unpackaged chip, such as a bare chip without packaging, which simplifies the packaging process. That is, the unpackaged chip is directly mounted on the packaging substrate 120, and the package 130 is used to encapsulate the unpackaged chip, eliminating the need for a separate packaging step.

[0110] In some possible implementations, the pressure processing chip 170 encapsulated within the package 130 can be a packaged chip or an unpackaged chip. When the pressure processing chip 170 is an unpackaged chip, it offers lower packaging costs and better packaging reliability. For example, in some possible implementations, such as... Figure 8 or Figure 11 As shown, the pressure processing chip 170, enclosed within the package 130, is a packaged chip to ensure a longer lifespan. For example, in some possible embodiments, such as... Figure 9 As shown, the pressure processing chip 170 encapsulated inside the package 130 is an unpackaged chip, such as an unpackaged bare chip, which simplifies the packaging process. That is, the unpackaged chip is directly mounted on the package substrate 120, and the package 130 is used to encapsulate the unpackaged chip, eliminating the need for a separate encapsulation step.

[0111] In some possible implementations, for ease of use by the user, the multiple acquisition chips 110 can be distributed as close as possible to the center of the packaging substrate 120.

[0112] It should be understood that when a packaging structure faces different installation environments, the three-dimensional dimensions (i.e., length, width, and height) of the packaging structure will vary depending on the differences in these environments. Figure 1 and Figure 2 The dimensions (length b, width d, and height e) of the package structure shown may vary. To adapt the package structure to various mounting environments, the internal component arrangement can be modified, thus altering the three-dimensional dimensions of the package structure. For ease of understanding, some arrangement schemes will be described below:

[0113] Same-floor layout:

[0114] When one or more of the following components are also disposed on the packaging substrate 120: a microcontroller chip 150, a filter circuit 140, a pressure sensor 160, and a pressure processing chip 170, they can be distributed around the multiple acquisition chips 110 as much as possible, for example... Figure 6 and Figure 7 As shown, in a top-down view, capacitors are distributed on the left side of the multiple acquisition chips 110, and microcontroller chips 150 are distributed on the right side of the multiple acquisition chips 110; for example... Figures 8 to 10 As shown, in a top-down view, capacitors are distributed on the left side of the multiple acquisition chips 110, while the microcontroller chip 150, pressure sensor 160, and pressure processing chip 170 are all distributed on the right side of the multiple acquisition chips 110. This arrangement scheme minimizes the increase in the width dimension of the package structure, while increasing the length dimension to meet the device requirements.

[0115] Of course, if it is desired that the length dimension b of the package structure does not increase, and the width dimension d of the package structure is increased to meet the device configuration, the microcontroller chip 150, filter circuit 140, pressure sensor 160, pressure processing chip 170, and acquisition chip 110 can be arranged along the width direction, such as... Figure 11 As shown, in a top view, the microcontroller chip 150, the filter circuit 140, the pressure sensor 160, and the pressure processing chip 170 are located above the acquisition chip 110.

[0116] While using a co-layer arrangement may increase the length or width of the package structure, it simplifies the packaging process and allows for a thinner package structure.

[0117] Layered layout (2.5D or 3D packaging):

[0118] When one or more of the following components—a microcontroller chip 150, a filter circuit 140, a pressure sensor 160, and a pressure processing chip 170—are also disposed on the packaging substrate 120, multiple components of the microcontroller chip 150, filter circuit 140, pressure sensor 160, and pressure processing chip 170 can be stacked on top of each other. For example, the pressure processing chip 170 can be mounted on the packaging substrate 120, and the pressure sensor 160 can be stacked on top of the pressure processing chip 170. Alternatively, multiple acquisition chips 110 can be stacked on top of other devices, thus avoiding obstruction and interference of the acquisition function of the acquisition chip 110 by other devices. Figure 12 and Figure 13 As shown, the microcontroller chip 150, pressure sensor 160, and pressure processing chip 170 are all located on the surface of the packaging substrate 120. Multiple acquisition chips 110 are stacked on top of these devices. Specifically, the acquisition chip 110 on the left is stacked above the pressure sensor 160 and pressure processing chip 170, and the acquisition chip 110 on the right is stacked above the microcontroller chip 150. The capacitors of the filter circuit 140 are distributed around the multiple acquisition chips 110. For example... Figure 14 As shown, the acquisition chip 110 on the left is stacked above the pressure sensor 160, the capacitor of the filter circuit 140, and the pressure processing chip 170, while the acquisition chip 110 on the right is stacked above the microcontroller chip 150.

[0119] When using a stacked arrangement, the length and / or width of the package structure can be minimized, but the height of the package structure may increase to some extent.

[0120] When a stacked arrangement is adopted, one or more of the microcontroller chip 150, filter circuit 140, pressure sensor 160, pressure processing chip 170, and acquisition chip 110 can be connected to the package substrate 120 by surface mounting or wire bonding. Specifically:

[0121] In some possible implementations, such as Figure 12 As shown, a first insulating layer is disposed between the stacked microcontroller chip 150 and the acquisition chip 110. The acquisition chip 110, which is stacked above the microcontroller chip 150, is connected to the packaging substrate 120 via wire bonding. The microcontroller chip 150 is connected to the packaging substrate 120 via surface mounting (of course, in other embodiments, such as...). Figure 13 As shown, the microcontroller chip 150 can also be electrically connected to the package substrate 120 via wire bonding. Alternatively, as... Figure 14 As shown, a first TSV via is provided on the microcontroller chip 150, and the acquisition chip 110 stacked on top of the microcontroller chip 150 has a first contact. The first contact is electrically connected to the packaging substrate 120 through the first TSV via.

[0122] In some possible implementations, such as Figure 12 As shown, a second insulating layer is disposed between the stacked pressure sensor 160 and the acquisition chip 110. The acquisition chip 110, which is stacked above the pressure sensor 160, is connected to the packaging substrate 120 via wire bonding. The pressure sensor 160 is connected to the packaging substrate 120 via surface mounting (of course, in other embodiments, such as...). Figure 13 As shown, the pressure sensor 160 can also be electrically connected to the package substrate 120 via wire bonding. Alternatively, as... Figure 14 As shown, a second TSV through-hole is provided on the pressure sensor 160, and the acquisition chip 110 stacked on top of the pressure sensor 160 has a second contact. The second contact is electrically connected to the packaging substrate 120 through the second TSV through-hole.

[0123] In some possible implementations, such as Figure 12 As shown, a third insulating layer is disposed between the stacked pressure processing chip 170 and the acquisition chip 110. The acquisition chip 110, which is stacked above the pressure processing chip 170, is connected to the packaging substrate 120 via wire bonding. The pressure processing chip 170 is connected to the packaging substrate 120 via surface mounting (of course, in other embodiments, such as...). Figure 13 As shown, the pressure processing chip 170 can also be electrically connected to the package substrate 120 via wire bonding. Alternatively, as... Figure 14 As shown, a third TSV via is provided on the pressure processing chip 170, and the acquisition chip 110 stacked on top of the pressure processing chip 170 has a third contact. The third contact is electrically connected to the packaging substrate 120 through the third TSV via.

[0124] In some possible implementations, the first contact, the second contact, and the third contact can be any of a solder ball, a micro bump, or a copper pillar.

[0125] In some possible implementations, when a pressure sensor 160 is provided on the packaging substrate 120, the pressure sensor 160 can be positioned close to the edge of the packaging substrate 120, such as... Figures 8 to 10 As shown, this allows the pressure sensor 160 to easily detect larger deformations, thereby generating stronger electrical signals, which helps with subsequent identification and response.

[0126] In some possible implementations, when an electrical connection between two devices is required, the distance between them can be minimized to reduce wiring distance. For example... Figures 8 to 10 As shown, the pressure processing chip 170 is located next to the pressure sensor 160, which shortens the wiring distance between the two.

[0127] In some possible implementations, such as Figures 5 to 14 As shown, the microcontroller chip 150, filter circuit 140, pressure sensor 160, pressure processing chip 170 and multiple acquisition chips 110 are all located on the same side surface of the packaging substrate 120.

[0128] In some possible implementations, such as Figure 1 As shown, multiple acquisition chips 110 and packages 130 are located on the front side of the package substrate 120, and signal contacts 121 electrically connected to the multiple acquisition chips 110 are provided on the back side of the package substrate 120. This allows the package structure to be directly mounted to the subsequent circuit board 210 through the signal contacts 121 to form an information acquisition module 20.

[0129] Based on the foregoing description, in a non-stacked layout scheme, the acquisition chip 110, microcontroller chip 150, pressure sensor 160, pressure processing chip 170, and filter circuit 140 can be packaged using a system-in-a-package (SIP).

[0130] Since the acquisition chip 110, microcontroller chip 150, pressure sensor 160, pressure processing chip 170 and filter circuit 140 can be packaged in the same package structure, the signal transmission speed, noise suppression and electromagnetic compatibility can be optimized, ensuring signal transmission quality and stability.

[0131] The microcontroller chip 150, filter circuit 140, pressure sensor 160, and pressure processing chip 170 shown above are all integrated within the package structure. Of course, in other embodiments, the microcontroller chip 150, filter circuit 140, pressure sensor 160, and pressure processing chip 170 can also be externally mounted relative to the package structure, such as on the circuit board 210 of the information acquisition module 20 or on the motherboard of the electronic device. For ease of understanding, they will be described separately below:

[0132] Another aspect of the embodiments of this application, such as Figure 15 As shown, an information acquisition module 20 is provided, including a circuit board 210 and an information acquisition packaging structure 10. The information acquisition packaging structure 10 includes one or more of the following: a microcontroller chip 150, a filter circuit 140, a pressure sensor 160, and a pressure processing chip 170, all enclosed in a package 130. The information acquisition packaging structure 10 is disposed on the circuit board 210, and multiple acquisition chips 110 of the information acquisition packaging structure 10 are electrically connected to the circuit board 210. A connector 220 may be provided on the circuit board 210, allowing the information acquisition packaging structure 10 to be electrically connected to the motherboard of an electronic device via the connector 220 on the circuit board 210.

[0133] Another aspect of the embodiments of this application, such as Figures 16 to 20 As shown, an information acquisition module 20 is provided, including a circuit board 210 and an information acquisition packaging structure 10. One or more of the following components—a microcontroller chip 150, a filter circuit 140, a pressure sensor 160, and a pressure processing chip 170—can be externally mounted on the circuit board 210. The information acquisition packaging structure 10 is disposed on the circuit board 210, and multiple acquisition chips 110 of the information acquisition packaging structure 10 are electrically connected to the circuit board 210. A connector 220 may be provided on the circuit board 210, thereby enabling the information acquisition packaging structure 10 to be electrically connected to the motherboard of an electronic device via the connector 220 on the circuit board 210.

[0134] In some possible implementations, such as Figures 16 to 20 As shown, the information acquisition module 20 also includes a filter circuit 140 disposed on the circuit board 210, and the filter circuit 140 is electrically connected to multiple acquisition chips 110 via the circuit board 210.

[0135] In some possible implementations, the information acquisition module 20 further includes a microcontroller chip 150 disposed on a circuit board 210. The microcontroller chip 150 is electrically connected to multiple acquisition chips 110 via the circuit board 210. The biometric information acquired by the multiple acquisition chips 110 is a biometric image, and the microcontroller chip 150 is used to stitch together the biometric images acquired by the multiple acquisition chips 110. When a filter circuit 140 and a microcontroller chip 150 are simultaneously disposed on the packaging substrate 120, the microcontroller chip 150 is electrically connected to the multiple acquisition chips 110 via the filter circuit 140. This facilitates improving the signal-to-noise ratio of the information received by the microcontroller chip 150.

[0136] In some possible implementations, the information acquisition module 20 also includes a pressure sensor 160 disposed on the circuit board 210. The pressure sensor 160 is electrically connected to the circuit board 210 and can sense the pressure state of the information acquisition packaging structure 10, thereby outputting an electrical signal characterizing the pressure state of the information acquisition packaging structure 10.

[0137] The pressure sensor 160 needs to output an electrical signal that characterizes the pressure state of the information acquisition packaging structure 10. Therefore, in sensing the pressure state of the information acquisition packaging structure 10: first, the target object presses on the information acquisition packaging structure 10, which in turn acts on the circuit board 210, causing it to deform. Thus, the pressure sensor 160, installed on the circuit board 210, can sense the deformation of the circuit board 210. Since the deformation of the circuit board 210 is related to the pressure state of the information acquisition packaging structure 10 (for example, when the information acquisition packaging structure 10 is pressed with different forces, the circuit board 210 deforms to different degrees; when the information acquisition packaging structure 10 is pressed for different durations, the circuit board 210 also deforms for different durations), the pressure sensor 160 can output the aforementioned electrical signal based on the deformation of the circuit board 210.

[0138] Referring to circuit board 210, the information acquisition package structure 10 and the pressure sensor 160 can be distributed on the same side of circuit board 210 (e.g., Figures 16 to 18 ) or different sides (e.g., opposite sides, such as Figures 19 to 20 ).

[0139] In some possible implementations, when the information acquisition package structure 10 and the pressure sensor 160 can be distributed on the same side of the circuit board 210, a receiving groove 11 is provided on the information acquisition package structure 10, and the pressure sensor 160 can be partially or completely placed in the receiving groove 11, for example... Figure 17 As shown in the top view, the information acquisition packaging structure 10 can shield the pressure sensor 160. This allows the receiving slot 11 of the information acquisition packaging structure 10 to accommodate the pressure sensor 160, which is beneficial for the miniaturization of the information acquisition module 20.

[0140] In some possible implementations, such as Figure 18 As shown, the information acquisition package structure 10 and the pressure sensor 160 are located on the same side of the circuit board 210. The information acquisition package structure 10 and the pressure sensor 160 are spaced apart on the circuit board 210, thus... Figure 18 As shown, the orthographic projection of the information acquisition packaging structure 10 on the circuit board 210 and the orthographic projection of the pressure sensor 160 on the circuit board 210 do not intersect.

[0141] In some possible implementations, such as Figure 19As shown, the information acquisition package structure 10 and the pressure sensor 160 are distributed on opposite sides of the circuit board 210. The information acquisition module 20 also includes a pressing pad 230. The pressing pad 230 and the pressure sensor 160 can be located on the same side of the circuit board 210, facilitating the information acquisition module 20 to press the switch module via the pressing pad 230. At this time, the pressure sensor 160 can output an electrical signal by sensing the deformation of the circuit board 210.

[0142] In some possible implementations, such as Figure 20 As shown, the information acquisition package structure 10 and the pressure sensor 160 are distributed on opposite sides of the circuit board 210, and the pressing pad 230 and the pressure sensor 160 are located on the same side of the circuit board 210. The pressing pad 230 and the pressure sensor 160 are spaced apart, so that the orthographic projection of the pressing pad 230 on the circuit board 210 and the orthographic projection of the pressure sensor 160 on the circuit board 210 do not intersect.

[0143] In some possible implementations, such as Figure 20 As shown, the information acquisition package structure 10 and the pressure sensor 160 are distributed on opposite sides of the circuit board 210, and the pressing pad 230 and the pressure sensor 160 are located on the same side of the circuit board 210. The pressing pad 230 and the pressure sensor 160 are stacked, and the pressing pad 230 is located on the side of the pressure sensor 160 that is away from the circuit board 210.

[0144] In some possible implementations, such as Figures 19 to 20 As shown, the circuit board 210 may include a first sub-board 211 and a second sub-board 212. The information acquisition packaging structure 10 is disposed on the first sub-board 211, and the pressure sensor 160 is disposed on the second sub-board 212.

[0145] In some possible implementations, such as Figures 19 to 20 As shown, the first sub-board 211 and the second sub-board 212 are stacked. The information acquisition packaging structure 10 is located on the side of the first sub-board 211 opposite to the second sub-board 212, and the pressure sensor 160 is located on the side of the second sub-board 212 opposite to the first sub-board 211. Thus, during the deformation of the circuit board 210 sensed by the pressure sensor 160: the information acquisition packaging structure 10 is compressed, causing the second sub-board 212 to deform via the first sub-board 211; the pressure sensor 160 can then sense the deformation of the second sub-board 212 and output an electrical signal.

[0146] In some possible implementations, the first sub-board 211 and the second sub-board 212 can be interconnected to form an integrated unit. For example... Figure 19 and Figure 20As shown, the circuit board 210 also includes a bending plate 213, which can be a flexible circuit board 210. The first sub-board 211 and the second sub-board 212 are electrically connected through the bending plate 213.

[0147] In some possible implementations, the first sub-board 211 and the second sub-board 212 may also be separated from each other and set up independently.

[0148] In some possible implementations, such as Figures 16 to 20 As shown, to ensure the information acquisition module 20 has good strength, a reinforcing sheet 240 can be added. For example... Figures 16 to 18 As shown, the reinforcing piece 240 is disposed on the surface of the circuit board 210 opposite to the information acquisition packaging structure 10. The reinforcing piece 240 can be bonded to the circuit board 210 with conductive adhesive, facilitating connection of the reinforcing piece 240 to the ground wire in the circuit board 210 via the conductive adhesive, thereby achieving grounding. Alternatively, as... Figures 19 to 20 As shown, the first sub-board 211 and the second sub-board 212 are respectively attached to the opposite two sides of the reinforcing sheet 240 with conductive adhesive. In this way, the reinforcing sheet 240 can be connected to the ground wire in the first sub-board 211 and the second sub-board 212 respectively through conductive adhesive to achieve grounding.

[0149] In some possible implementations, such as Figure 19 As shown, when the information acquisition module 20 also includes a pressing pad 230 and the orthographic projections of the pressing pad 230 and the pressure sensor 160 on the circuit board 210 do not intersect, a reinforcing sheet 240 distributed on the same side as the second sub-board 212 is also provided on the first sub-board 211, and the pressing pad 230 is provided on the reinforcing sheet 240.

[0150] In some possible implementations, the information acquisition module 20 also includes a pressure processing chip 170 disposed on the circuit board 210. The pressure processing chip 170 is electrically connected to the pressure sensor 160 and is used to convert the electrical signal into first identifiable information.

[0151] In some possible implementations, the acquisition chip 110 has an electrically connected acquisition unit and a processing unit. The acquisition unit is used to acquire biometric information, and the pressure sensor 160 is electrically connected to the processing unit. The processing unit is used to convert the electrical signal into first identifiable information and the biometric information into second identifiable information.

[0152] In some possible implementations, a conductive ring is fixedly disposed on the outer periphery of the information acquisition packaging structure 10, and a conductive sheet electrically connected to the conductive ring is also disposed on the circuit board 210. The conductive sheet is grounded through the ground wire in the circuit board 210. The conductive sheet can be the reinforcing sheet 240 in the aforementioned possible implementations, for example, the reinforcing sheet 240 is a metal sheet.

[0153] In some possible implementations, such as Figures 16 to 20 As shown, a connector 220 is also provided on the circuit board 210 to facilitate the electrical connection between the information acquisition module 20 and the external motherboard through the connector 220.

[0154] In some possible implementations, in the implementation without the reinforcing sheet 240, the circuit board 210 can be a rigid circuit board 210 so that the information acquisition module 20 has better strength.

[0155] In another aspect of this application, an electronic device is provided, including a motherboard and any of the aforementioned information acquisition modules 20, wherein the connector 220 of the information acquisition module 20 is electrically connected to the motherboard. Thus, the functionality of the electronic device can be enriched and the user experience optimized based on the aforementioned information acquisition module 20.

[0156] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An information acquisition and encapsulation structure, characterized in that, The device includes a packaging substrate on which multiple acquisition chips are disposed, and a package encapsulating the multiple acquisition chips is also disposed on the packaging substrate. The information acquisition package structure is pressed by a target object to compress the package. The multiple acquisition chips are all used to acquire the biometric information of the target object.

2. The information acquisition and encapsulation structure as described in claim 1, characterized in that, The plurality of acquisition chips are laid flat on the packaging substrate; And / or, the plurality of acquisition chips are arranged in a linear array or a rectangular array.

3. The information acquisition and encapsulation structure as described in claim 2, characterized in that, The multiple acquisition chips are arranged in a linear array, and the length direction of the acquisition chips is consistent with the arrangement direction.

4. The information acquisition and encapsulation structure as described in claim 1, characterized in that, Each of the acquisition chips has an effective acquisition area on its surface for acquiring the biometric information; The effective acquisition area and the outer surface of the package directly above the effective acquisition area have a first distance, and any two of the first distances are equal.

5. The information acquisition and encapsulation structure as described in claim 1, characterized in that, The acquisition chip has an effective acquisition area for acquiring the biometric information; In the plurality of acquisition chips, at least two acquisition chips have their effective acquisition areas arranged adjacent to each other.

6. The information acquisition and encapsulation structure as described in claim 1, characterized in that, The spacing between two adjacent acquisition chips is less than or equal to 0.1 mm.

7. The information acquisition and encapsulation structure as described in any one of claims 1 to 6, characterized in that, A filter circuit is also provided on the packaging substrate and encapsulated inside the packaging body. The filter circuit is electrically connected to the plurality of acquisition chips.

8. The information acquisition and encapsulation structure as described in claim 7, characterized in that, A microcontroller chip encapsulated within the package body is also disposed on the packaging substrate. The plurality of acquisition chips are electrically connected to the microcontroller chip via the filtering circuit. The biometric information is a biometric image. The microcontroller chip is used to stitch together the biometric images acquired by the plurality of acquisition chips. The microcontroller chip may be a packaged chip or an unpackaged chip.

9. The information acquisition and encapsulation structure as described in any one of claims 1 to 6, characterized in that, A pressure sensor, which is encapsulated inside the package, is also provided on the packaging substrate. The pressure sensor is used to output an electrical signal characterizing the pressure state of the package. The pressure sensor is either a packaged chip or an unpackaged chip.

10. The information acquisition and encapsulation structure as described in claim 9, characterized in that, A pressure processing chip is also disposed on the packaging substrate, and the pressure processing chip is encapsulated inside the package. The pressure processing chip is electrically connected to the pressure sensor and is used to convert the electrical signal into first identifiable information. The pressure processing chip may be a packaged chip or an unpackaged chip.

11. The information acquisition and encapsulation structure as described in claim 9, characterized in that, The acquisition chip has an acquisition unit and a processing unit that are electrically connected. The acquisition unit is used to acquire the biometric information. The pressure sensor is electrically connected to the processing unit. The processing unit is used to convert the electrical signal into first identifiable information and the biometric information into second identifiable information.

12. The information acquisition and encapsulation structure as described in claim 8, characterized in that, At least one of the acquisition chips is stacked on top of the microcontroller chip.

13. The information acquisition and encapsulation structure as described in claim 12, characterized in that, A first insulating adhesive layer is disposed between the stacked microcontroller chip and the acquisition chip, and the acquisition chip stacked on top of the microcontroller chip is connected to the packaging substrate by wire bonding. Alternatively, a first TSV via is provided on the microcontroller chip, and the acquisition chip stacked on top of the microcontroller chip has a first contact, which is electrically connected to the packaging substrate through the first TSV via.

14. The information acquisition and encapsulation structure as described in claim 9, characterized in that, At least one of the acquisition chips is stacked on top of the pressure sensor.

15. The information acquisition and encapsulation structure as described in claim 14, characterized in that, A second insulating adhesive layer is provided between the stacked pressure sensor and the acquisition chip, and the acquisition chip stacked on top of the pressure sensor is connected to the packaging substrate by wire bonding. Alternatively, a second TSV via is provided on the pressure sensor, and the acquisition chip stacked above the pressure sensor has a second contact, which is electrically connected to the packaging substrate through the second TSV via.

16. The information acquisition and encapsulation structure as described in claim 10, characterized in that, At least one of the acquisition chips is stacked on top of the pressure processing chip.

17. The information acquisition and encapsulation structure as described in claim 16, characterized in that, A third insulating adhesive layer is provided between the stacked pressure processing chip and the acquisition chip, and the acquisition chip stacked on top of the pressure processing chip is connected to the packaging substrate by wire bonding. Alternatively, a third TSV via is provided on the pressure processing chip, and the acquisition chip stacked above the pressure processing chip has a third contact, which is electrically connected to the packaging substrate through the third TSV via.

18. The information acquisition and encapsulation structure as described in claim 8, characterized in that, The microcontroller chip, the filter circuit, and the plurality of acquisition chips are all located on the same side surface of the packaging substrate, and the microcontroller chip and the filter circuit are located on opposite sides or on the same side of the plurality of acquisition chips.

19. An information acquisition module, characterized in that, The invention includes a circuit board and an information acquisition packaging structure as described in any one of claims 1 to 6, wherein the information acquisition packaging structure is disposed on the circuit board, and a plurality of acquisition chips of the information acquisition packaging structure are electrically connected to the circuit board.

20. The information acquisition module as described in claim 19, characterized in that, The information acquisition module also includes a filter circuit disposed on the circuit board, and the filter circuit is electrically connected to the plurality of acquisition chips.

21. The information acquisition module as described in claim 20, characterized in that, The information acquisition module also includes a microcontroller chip disposed on the circuit board. The microcontroller chip is electrically connected to the plurality of acquisition chips via the filtering circuit. The biometric information acquired by the plurality of acquisition chips is a biometric image. The microcontroller chip is used to stitch together the biometric images acquired by the plurality of acquisition chips.

22. The information acquisition module as described in claim 19, characterized in that, The information acquisition module also includes a pressure sensor disposed on the circuit board. The pressure sensor is electrically connected to the circuit board and is used to output an electrical signal characterizing the pressure state of the information acquisition packaging structure.

23. The information acquisition module as described in claim 22, characterized in that, The information acquisition module also includes a pressure processing chip disposed on the circuit board. The pressure processing chip is electrically connected to the pressure sensor and is used to convert the electrical signal into first identifiable information.

24. An information acquisition module, characterized in that, The invention includes a circuit board and an information acquisition packaging structure as described in any one of claims 7 to 18, wherein the information acquisition packaging structure is disposed on the circuit board, and a plurality of acquisition chips of the information acquisition packaging structure are electrically connected to the circuit board.

25. An electronic device, characterized in that, It includes a motherboard and an information acquisition module as described in any one of claims 19 to 24, wherein the information acquisition module is electrically connected to the motherboard.

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