Novel high-stability inductor and electronic equipment

Abstract

The utility model relates to the technical field of magnetic devices, and discloses a novel high-stability inductor and electronic equipment, and the novel high-stability inductor comprises a magnetic main body, a flat winding coil, a lead frame and a conductive material layer; the flat winding coil is arranged in the magnetic main body, patch connectors are respectively led out from the upper end and the lower end of the flat winding coil, and the lead frame is connected to the bottom end of the magnetic main body and is concavely arranged to form an accommodating part; the patch connector protrudes out of the outer wall of the bottom end of the magnetic body, then is attached to the interior of the containing part and is electrically connected with the containing part, and the conductive material layer is connected to the side, away from the magnetic body, of the lead frame and covers the containing part and the patch connector. The connection strength and reliability of the device are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of magnetic devices, in particular to a novel high-stability inductor and electronic equipment. BACKGROUND

[0002] With the rapid development of automotive electronics technology, vehicle-mounted devices have higher requirements for the performance and reliability of components, and inductors, as one of the key electronic components, are widely used in vehicle-mounted power management systems, signal filtering and energy storage scenes. The vehicle-mounted environment has characteristics such as strong vibration, large acceleration, and drastic temperature change, which makes the inductor need to withstand extreme mechanical impact and thermal shock during use. The inductor device in the related art has a planar bottom electrode structure, which is connected to external devices by surface mount technology (SMT). The inductor device has small size and is convenient for high-density installation. However, the connection strength of the inductor device with the patch structure is low, and the bonding force between the inductor device and the PCB after welding is weak, which can cause quality problems such as loosening of the device structure, vibration and falling of the structural parts, and the like. Therefore, the inductor device needs to be changed. CONTENT OF THE INVENTION

[0003] In view of this, the present application provides a novel high-stability inductor and electronic equipment to improve the above problems.

[0004] To achieve the above purpose, according to the first aspect, the technical scheme adopted is:

[0005] A novel high-stability inductor, comprising: a magnetic main body, a flat winding coil, a lead frame, and a conductive material layer; the flat winding coil is arranged in the magnetic main body, and the upper / lower ends of the flat winding coil are respectively provided with a patch connector; the lead frame is connected to the bottom end of the magnetic main body and is recessed to form a receiving portion; the patch connector protrudes from the outer wall of the bottom end of the magnetic main body and is attached to the receiving portion and electrically connected to the receiving portion; and the conductive material layer is connected to one side of the lead frame away from the magnetic main body and covers the receiving portion and the patch connector.

[0006] The present application further provides that: one side of the lead frame is provided with a side edge terminal portion, and the side edge terminal portion is bent from the bottom end of the magnetic main body to the side surface of the magnetic main body.

[0007] The present application further provides that: an epoxy resin adhesive layer is coated between the side edge terminal portion and the side surface of the magnetic main body.

[0008] The application is further provided that the patch joint comprises a vertical lead part and a horizontal patch part, the vertical lead part is led out from the upper / lower end of the flat winding coil along a first direction, the end of the vertical lead part away from the flat winding coil extends to the end of the horizontal patch part close to the accommodating part, and the horizontal patch part is arranged in the accommodating part at the bottom end of the magnetic body, wherein the first direction is the extension direction of the upper and lower ends of the magnetic body.

[0009] The application is further provided that the accommodating part and the horizontal patch part are arranged along a second direction at the bottom end of the magnetic body, and the horizontal patch part is fixed in the accommodating part by laser welding, wherein the second direction is perpendicular to the first direction.

[0010] The application is further provided that the patch joint further comprises a fixed connection part, the fixed connection part is embedded in the magnetic body and arranged opposite to the vertical lead part along the first direction, and the fixed connection part is integrally connected with the other end of the horizontal connection part.

[0011] The application is further provided that the accommodating part is designed as a groove structure and is embedded in the magnetic body from the bottom end of the magnetic body.

[0012] The application is further provided that the lead frames are symmetrically arranged at intervals at the bottom end of the magnetic body, and the conductive material layers on the lead frames are located in the same plane.

[0013] The application is further provided that the conductive material layer comprises at least one of a copper material layer, a silver material layer, a gold material layer, a nickel material layer, or a tin material layer.

[0014] According to a second aspect, the technical scheme adopted is:

[0015] An electronic device comprising the novel high-stability inductor according to any one of the above embodiments.

[0016] In summary, compared with the prior art, the application discloses a novel high-stability inductor and an electronic device, the inductor comprises a magnetic body, a flat winding coil, a lead frame, and a conductive material layer, wherein the flat winding coil is arranged in the magnetic body, the lead frame is connected at the bottom end of the magnetic body and recessed to form an accommodating part, the patch joint of the flat winding coil protrudes out of the outer wall of the bottom end of the magnetic body and is fitted in the accommodating part and electrically connected with the accommodating part, and the conductive material layer is connected to the side of the lead frame away from the magnetic body and covers the accommodating part and the patch joint. That is, through the above arrangement, the connection strength of the patch joint with the lead frame and the conductive material layer is enhanced through the accommodating part, thereby improving the structural connection strength of the inductor itself and the connection strength of the inductor with the external environment. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Fig. 1 This is a three-dimensional structural diagram of the novel high-stability inductor of this application;

[0019] Fig. 2 This is a structural diagram of the novel high-stability inductor with a hidden conductive material layer as described in this application;

[0020] Fig. 3 This is a structural diagram of the novel high-stability inductor with a hidden magnetic core and conductive material layer as described in this application. Detailed Implementation

[0021] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0022] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, components, features, and elements with the same names in different embodiments of this application may have the same meaning or different meanings, the specific meaning of which must be determined by its interpretation in that specific embodiment or further in conjunction with the context of that specific embodiment.

[0023] It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit this application.

[0024] In the following description, the suffixes such as "module", "part", or "unit" used for components are merely intended for facilitating explanation of the present application, and are by no means specific thereto. Thus, "module", "part", or "unit" can be used interchangeably.

[0025] In the description of the present application, it should be noted that the terms "upper", "lower", "left", "right", "inner", "outer", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are merely for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third" are only for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0026] The technical solutions shown in the present application will be described in detail below through specific embodiments. It should be noted that the description order of the following embodiments is not limited as the priority order of the embodiments.

[0027] Please refer to Figs. 1-3 The novel high-stability inductor of the present application includes a magnetic main body 1, a flat winding coil 2, a lead frame 3, and a conductive material layer 4.

[0028] In the specific implementation process, the flat winding coil 2 is arranged in the magnetic main body 1, and the upper / lower ends of the flat winding coil 2 are respectively provided with a patch connector 5. The lead frame 3 is connected to the bottom end of the magnetic main body 1 and is recessed to form a receiving portion 31. The patch connector 5 protrudes from the outer wall of the bottom end of the magnetic main body 1 and is attached to the receiving portion 31 and electrically connected to the receiving portion 31. The conductive material layer 4 is connected to the side of the lead frame 3 away from the magnetic main body 1 and covers the receiving portion 31 and the patch connector 5.

[0029] Therefore, the novel high-stability inductor of the present application enhances the mechanical support force of the connection part and the bonding force between the connection parts by attaching the patch connector 5 to the receiving portion 31. After the conductive material layer 4 covers the receiving portion 31 and the patch connector 5, the connection strength of the overall structure of the inductor is ensured. The physical protection of the patch connector 5 by the recessed receiving portion 31 significantly reduces the stress damage of the device caused by vibration and impact, ensuring the operation reliability of the inductor. Through the attachment design of the patch connector 5 and the receiving portion 31, the contact resistance between the flat winding coil 2 and the lead frame 3 and the conductive material layer 4 can be reduced, thereby improving the conductivity of the inductor and ensuring the stability of signal transmission and energy storage.

[0030] It is understandable that the conductive material layer 4, after covering the receiving portion 31 and the surface mount connector 5, is used for the electrical connection between the inductor and the external environment (such as the PCB board). Optionally, the conductive material layer 4 can be connected to the receiving portion 31 and the surface mount connector 5 by a soldering process.

[0031] In one embodiment, a side terminal portion 32 is provided on one side of the lead frame 3. The side terminal portion 32 is bent from the bottom end of the magnetic body 1 to the side of the magnetic body 1. An epoxy resin adhesive layer is coated between the side terminal portion 32 and the side of the magnetic body 1.

[0032] Therefore, the bending design of the lead frame 3 extends the structural connection range from the single bottom end of the magnetic body 1 to the side, greatly increasing its contact area with the magnetic body 1. The epoxy resin layer further enhances the mechanical bonding strength, ensuring the connection strength between the inductor and the external environment. On the other hand, the side design of the side terminal part 32 can also provide an observation standard when the inductor is soldered to the external environment (such as PCB pads). Especially in SMT (Surface Mount Technology) process applications, this can expose the inductor solder joints on the side, clearly showing the solder climb height, which is convenient for inspection by automated optical inspection (AOI) equipment after mounting. This reduces the difficulty of detecting soldering defects, helps to improve product consistency and reliability, improves inspection efficiency, and ensures the overall quality of the inductor.

[0033] It should be noted that this embodiment constructs an XYZ spatial coordinate system, in order to... Fig. 1 For example, the X-axis direction can be regarded as the first direction, the Y-axis direction as the second direction, and the Y-axis direction as the third direction. The first direction can also be regarded as the extension direction of the upper and lower ends of the magnetic body 1, that is, the direction perpendicular to the end face of the upper and lower ends of the magnetic body 1. Here, the upper and lower ends of the magnetic body 1 are the top and bottom ends of the magnetic body 1. The second direction can also be regarded as the extension direction of the left and right sides of the magnetic body 1, and the third direction can also be regarded as the extension direction of the front and rear ends of the magnetic body 1. Of course, this embodiment is not limited to this. XYZ can also be any other direction that is perpendicular to each other in space in actual needs, which will not be elaborated here.

[0034] The patch connector 5 of this application includes a vertical lead portion 51 and a horizontal patch portion 52. The vertical lead portion 51 is led out from the upper / lower end of the flat winding coil 2 along a first direction. The end of the vertical lead portion 51 away from the flat winding coil 2 extends to the accommodating portion 31 and is integrally connected to one end of the horizontal patch portion 52. The horizontal patch portion 52 is disposed in the accommodating portion 31 at the bottom end of the magnetic body 1.

[0035] That is, the combination of the vertical lead part 51 and the horizontal patch part 52 can ensure the large-area effective connection of the horizontal patch part 52 and the accommodating part 31, ensure the stability of the device under extreme conditions such as vibration and thermal change, and the extension of the vertical lead part 51 along the first direction can also ensure that the patch joint 5 occupies a small space in the magnetic body 1, avoiding redundant structures and the electromagnetic interference problems that may be caused by complex wiring design.

[0036] Optionally, the accommodating part 31 and the horizontal patch part 52 are arranged along the second direction at the bottom end of the magnetic body 1, and the horizontal patch part 52 is attached in the accommodating part 31 and fixed with the accommodating part 31 by laser welding. Arranging along the second direction ensures the large-area connection of the accommodating part 31 and the horizontal patch part 52, that is, a larger welding contact area helps to improve the welding strength of the accommodating part 31 and the horizontal patch part 52, reduces the risk of false welding or poor contact, and at the same time, a larger area of welding connection can effectively reduce the electrical contact resistance, improve the working efficiency and performance of the inductor, and reduce the heat or power loss caused by excessive resistance.

[0037] The patch joint 5 further comprises a fixed connection part 53, which is embedded in the magnetic body 1 and arranged opposite to the vertical lead part 51 along the first direction, and the fixed connection part 53 is integrally connected with the other end of the horizontal connection part.

[0038] The design of the fixed connection part 53 provides additional mechanical support for the patch joint 5 in the magnetic body 1, effectively avoiding possible mechanical displacement or loosening of the patch joint 5, and the integration of the fixed connection part 53 with the vertical lead part 51 and the horizontal patch part 52 helps to disperse the mechanical stress of the connection components to more areas, avoiding local overload, and the fixed connection part 53 is embedded in the magnetic body 1, enhancing the mechanical impact resistance of the device, especially in vehicle-mounted or other high-vibration environments, which can effectively withstand external vibration impact without causing connection rupture or failure, to ensure device reliability.

[0039] In the specific implementation process, the accommodating part 31 is designed as a groove structure and is embedded in the magnetic body 1 from the bottom end of the magnetic body 1, so that the patch joint 5 and the bottom end of the magnetic body 1 form a stable electrical and mechanical combination part, improving the impact resistance of the overall structure.

[0040] In addition, the lead frame 3 is symmetrically arranged at intervals at the bottom end of the magnetic body 1, and the conductive material layer 4 on the lead frame 3 is located in the same plane to ensure that the contact surface of the conductive material layer 4 and the PCB board is flat, avoiding poor welding (such as false welding or poor contact) due to unevenness during welding, improving the welding quality, also helping to maintain consistent contact pressure during welding, avoiding the problem of poor contact caused by uneven or asymmetric welding points, and ensuring firm and reliable welding.

[0041] The conductive material layer 4 comprises at least one of a copper material layer, a silver material layer, a gold material layer, a nickel material layer, or a tin material layer.

[0042] It should be noted that the magnetic body 1 is designed in a rectangular body structure and is integrally pressed from a magnetic material. Therefore, the rectangular body structure of the magnetic body 1 can effectively save space when arranged on a PCB, facilitate close arrangement with other components, improve the integration of the circuit board, simplify the mold design, facilitate automated production and standardized manufacturing, and reduce production costs. In addition, the integrally pressed magnetic material eliminates the structure splicing point, avoids the problems of loosening, cracking or falling off of the magnetic body 1 due to uneven force or long-term use at the splicing point, and makes the magnetic body 1 have higher anti-vibration and anti-impact capability. In addition, the integrally pressed magnetic material can realize uniform distribution of magnetic performance, reduce magnetic loss, optimize the magnetic flux distribution of the inductor, and improve the overall performance of the inductor.

[0043] The application also discloses an electronic device comprising the novel high-stability inductor according to any one of the above embodiments. For other working principles and processes of the electronic device, refer to the above description of the novel high-stability inductor.

[0044] The novel high-stability inductor and the electronic device are described in detail above. The principles and implementation manners of the application are described by using specific examples. It should be noted that the descriptions of the various embodiments in the application are each focused on. The parts not described or recorded in a certain embodiment can be referred to the relevant description of other embodiments.

[0045] The above is only the preferred embodiment of the application, and does not limit the patent scope of the application. The technical features of the technical solutions of the application can be combined arbitrarily. In order to make the description simple, the above-mentioned various technical features of the embodiments are not described in all possible combinations. Any equivalent structure or equivalent flow conversion, or direct or indirect application in other related technical fields, as long as the combination of technical features does not exist contradictory, are also included in the patent protection scope of the application.

Claims

1. A novel high-stability inductor, characterized in that, include: The magnetic body comprises a flat winding coil, a lead frame, and a conductive material layer. The flat winding coil is disposed within the magnetic body, and patch connectors are respectively led out from the upper and lower ends of the flat winding coil. The lead frame is connected to the bottom end of the magnetic body and has a recessed receiving portion. The patch connectors protrude from the outer wall of the bottom end of the magnetic body and are attached to the receiving portion and electrically connected to the receiving portion. The conductive material layer is connected to the side of the lead frame away from the magnetic body and covers the receiving portion and the patch connectors.

2. The novel high-stability inductor as described in claim 1, characterized in that, The conductor frame has a side terminal portion on one side, which is bent from the bottom end of the magnetic body to the side of the magnetic body.

3. The novel high-stability inductor as described in claim 2, characterized in that, An epoxy resin adhesive layer is coated between the side terminal portion and the side surface of the magnetic body.

4. The novel high-stability inductor as described in claim 1, characterized in that, The patch connector includes a vertical lead portion and a horizontal patch portion. The vertical lead portion is led out from the upper / lower end of the flat winding coil along a first direction. The end of the vertical lead portion away from the flat winding coil extends to a position close to the receiving portion and is integrally connected to one end of the horizontal patch portion. The horizontal patch portion is disposed in the receiving portion at the bottom end of the magnetic body. The first direction is the extension direction of the upper and lower ends of the magnetic body.

5. The novel high-stability inductor as described in claim 4, characterized in that, The accommodating portion and the horizontal patch portion are arranged along the second direction at the bottom end of the magnetic body, and the horizontal patch portion is attached to the accommodating portion and fixed to the accommodating portion by laser welding, wherein the second direction is perpendicular to the first direction.

6. The novel high-stability inductor as described in claim 4, characterized in that, The patch connector further includes a fixing connection portion, which is embedded in the magnetic body and arranged opposite to the vertical lead portion along the first direction, and the other end of the fixing connection portion is integrally connected to the other end of the horizontal connection portion.

7. The novel high-stability inductor as described in claim 1, characterized in that, The receiving part is designed as a groove structure and is embedded in the magnetic body from the bottom end of the magnetic body.

8. The novel high-stability inductor as described in claim 1, characterized in that, The lead frame is symmetrically arranged at intervals at the bottom of the magnetic body, and the conductive material layers on the lead frame are all located on the same plane.

9. The novel high-stability inductor as described in claim 8, characterized in that, The conductive material layer includes at least one of a copper material layer, a silver material layer, a gold material layer, a nickel material layer, or a tin material layer.

10. An electronic device, characterized in that, Including the novel high-stability inductor as described in any one of claims 1 to 9.

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