Capacitor epoxy encapsulating equipment

Abstract

The utility model discloses capacitor epoxy encapsulating equipment, which comprises a base, a mounting rack and a mold disc, the mold disc is placed on the base, the mounting rack is arranged on one side of the base, a distributor is mounted at the top of the mounting rack and is connected with a storage box through a suction pipe, and the storage box is connected with the mold disc through the suction pipe. One end, located in the material storage box, of the material suction pipe is connected with the material suction pump, the distributing device is located over the placement position of the mold disc, a plurality of evenly-distributed discharging nozzles are arranged at the bottom of the distributing device, a plurality of evenly-distributed filling and sealing nozzles are arranged at the bottom of the distributing disc, each filling and sealing nozzle is provided with an electromagnetic valve, and the filling and sealing nozzles are aligned to mold grooves in the mold disc below. The sliding block is connected with a lead screw in a matched mode, and one end of the lead screw is in transmission connection with a motor. According to the utility model, through the arrangement of structures such as the material distribution disc and the material scraping plate, the capacitor on the mold disc can be encapsulated at one time, the consistency of the encapsulation glue amount is good, and compared with the prior art, the encapsulation efficiency is greatly improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of capacitor packaging, especially relates to a capacitor epoxy encapsulation equipment. BACKGROUND

[0002] Capacitor epoxy encapsulation refers to a process of using epoxy resin to encapsulate capacitors during the production process of capacitors. Before epoxy encapsulation, the capacitors need to be pretreated. This includes cleaning and drying the capacitors to remove impurities such as dust and oil stains on the surface, ensuring that the surface of the capacitor is dry and clean, which is conducive to the good combination of epoxy resin and the surface of the capacitor. The pretreated capacitors are placed in a mold, and then the prepared epoxy encapsulation material is poured into the mold to completely cover the capacitors. Alternatively, an automatic coating device is used to uniformly coat the encapsulation material on the outside of the capacitors. During the encapsulation process, it is necessary to ensure that the encapsulation material is uniformly filled and free of air bubbles to ensure the encapsulation quality.

[0003] The existing encapsulation equipment generally only has one pouring nozzle to align the capacitors for pouring glue, and the next batch of capacitors is replaced only after all the capacitors are poured with glue, which is low in production efficiency. To solve the above problems, the utility model provides a solution. UTILITY MODEL CONTENT

[0004] The utility model aims to provide a capacitor epoxy encapsulation equipment.

[0005] The above technical purpose of the utility model is realized by the following technical scheme:

[0006] A capacitor epoxy encapsulation equipment, comprising a base, a mounting frame and a mold disc, the mold disc is placed on the base, the mounting frame is arranged on one side of the base, a distributor is installed on the top of the mounting frame, the distributor is connected with a storage tank through a suction pipe, one end of the suction pipe in the storage tank is connected with a suction pump, the distributor is located directly above the placement position of the mold disc, a plurality of evenly distributed discharge nozzles are arranged on the bottom of the distributor, a distributor base is arranged below the distributor, one side of the distributor base is fixed on the mounting frame, a distributor disc is installed at the middle position of the distributor base, a plurality of evenly distributed distribution holes are arranged on the distributor disc, a plurality of evenly distributed pouring nozzles are arranged on the bottom of the distributor disc, an electromagnetic valve is installed on each pouring nozzle, the pouring nozzles are arranged to align the mold grooves on the mold disc below, a backflow groove is arranged on the distributor base outside the distributor disc, a backflow pipe is arranged at the bottom of the backflow groove, the backflow pipe is inserted into the storage tank at the bottom end, a scraping plate is arranged on the distributor disc and is attached to the distributor disc, a connecting rod is arranged at one end of the scraping plate, the connecting rod passes through a sliding slot on the distributor base and is connected with a sliding block, the sliding block is connected with a lead screw in a matched mode, and one end of the lead screw is connected with a motor in a transmission mode.

[0007] Further, the cloth tray and the cloth base are in a split structure, and the cloth tray is arranged on the cloth base.

[0008] Further, the number of the return pipes is multiple, and the multiple return pipes are arranged at the bottom of the return grooves in four directions outside the cloth tray, preferably four return pipes are arranged, and one return pipe is arranged in each direction.

[0009] Further, the base is provided with two perpendicular positioning blocks, and the two arc-shaped perpendicular positioning blocks are abutted and positioned with two adjacent edges of the square mold tray, the positioning blocks are used for positioning, fast connection is facilitated, and the positioning precision is high.

[0010] In conclusion, the utility model has the following beneficial effects: the utility model discloses the cloth tray and the scraping plate and other structures, can be encapsulated to the capacitor on the mold tray once, the glue consistency of encapsulation is good, compared with the prior art, the encapsulation efficiency is greatly improved. BRIEF DESCRIPTION OF DRAWINGS

[0011] Figure 1 It is the overall structure schematic view of the utility model;

[0012] Figure 2 It is the top view of the utility model;

[0013] Figure 3 It is the structure schematic view of the base;

[0014] Figure 4 It is the local enlarged view of the cloth tray.

[0015] In the drawing, 1, base; 2, mounting frame; 3, mold tray; 4, cloth base; 5, positioning block; 6, capacitor; 7, storage tank; 8, suction pump; 9, suction pipe; 10, cloth distributor; 11, discharging nozzle; 12, cloth tray; 13, encapsulation nozzle; 14, scraping plate; 15, sliding block; 16, sliding groove; 17, electromagnetic valve; 18, return pipe; 19, lead screw; 20, motor; 21, return groove; 22, mold groove; 23, cloth hole. DETAILED DESCRIPTION

[0016] The utility model will be further described in detail below in combination with the drawings, and the technical scheme in the embodiment of the utility model is clearly and completely described, obviously, the described embodiment is only a part of the embodiment of the utility model, not all the embodiment. Based on the embodiment in the utility model, all other embodiments obtained by the ordinary skill in the art without making creative labor belong to the scope of protection of the utility model.

[0017] As Figures 1-4As shown, a kind of capacitive epoxy encapsulation equipment, including base 1, mounting bracket 2 and mould tray 3, the mould tray 3 is placed on base 1, the mounting bracket 2 is set to one side of base 1, the top of mounting bracket 2 is equipped with distributor 10, the distributor 10 is connected with storage tank 7 by suction tube 9, one end in storage tank 7 of suction tube 9 is connected with suction pump 8, distributor 10 is located just above the placement position of mould tray 3, the bottom of distributor 10 is equipped with several evenly distributed discharge nozzle 11, the below of distributor 10 is equipped with distribution base 4, one side of distribution base 4 is fixed on mounting bracket 2, distribution base 4 is installed with distribution tray 12 in the middle position, the distribution tray 12 is equipped with evenly distributed distribution hole 23, the bottom of distribution tray 12 is equipped with several evenly distributed filling nozzle 13, one electromagnetic valve 17 is installed on each filling nozzle 13, filling nozzle 13 is aligned with the mould groove 22 on the below mould tray 3, the distribution base 4 outside distribution tray 12 is equipped with backflow groove 21, the bottom of backflow groove 21 is equipped with backflow pipe 18, the bottom end of backflow pipe 18 is inserted in storage tank 7, distribution tray 12 is equipped with scraping plate 14 adhered to it, one end of scraping plate 14 is equipped with connecting rod, connecting rod 14 passes through sliding slot 16 on distribution base 4 and is connected with sliding block 15, sliding block 15 is connected with lead screw 19, one end of lead screw 19 is drivingly connected with motor 20.

[0018] Further, the distribution tray 12 and distribution base 4 are split type structure, the distribution tray 12 is seated on the distribution base 4.

[0019] Further, the number of backflow pipe 18 is multiple, and the multiple backflow pipes 18 are distributed at the bottom of backflow groove 21 in four directions outside the distribution tray 12, preferably four backflow pipes 18 are arranged, and one backflow pipe 18 is arranged in each direction.

[0020] Further, as shown in Figure 3 The base 1 is equipped with two mutually perpendicular positioning blocks 5, and the two arc-shaped perpendicular positioning blocks 5 abut and position two adjacent edges of the square mould tray 3, positioning is achieved by using the positioning blocks 5, which is convenient and fast, and has high positioning accuracy.

[0021] Working principle: the mold disc 3 filled with capacitor 6 is placed on the base 1 and positioned by the positioning block 5, the suction pump 8 is started, the suction pump 8 transports the glue material composed of raw materials such as epoxy resin through the suction pipe 9 into the distributor 10, the distributor 10 sprinkles the glue material on the distribution disc 12, the glue material flows into the distribution hole 23, and then the scraper 14 moves back and forth to fill the distribution hole 23 and scrape the excess glue material into the reflux groove 21, at this time the suction pump 8 stops working, the excess glue material flows back to the storage tank 7 from the reflux pipe 18, then the battery valve 17 is controlled to open, the glue material in the distribution hole 23 falls from the pouring and sealing nozzle 13 to the position needing to be encapsulated of the capacitor 6, encapsulation is carried out, then the mold disc 3 is replaced, and the above work is repeated to encapsulate the next batch of products.

[0022] The specific embodiment is only an explanation of the utility model, and is not a limitation of the utility model. Those skilled in the art can make modifications to the embodiment without creative contribution according to the needs after reading the specification, but as long as the modifications are within the scope of the claims of the utility model, they are protected by the patent law.

Claims

1. A capacitive epoxy encapsulation device, comprising a base (1), a mounting frame (2) and a mold plate (3), the mold plate (3) is placed on the base (1), the mounting frame (2) is arranged on one side of the base (1), characterized in that: The top of the mounting frame (2) is provided with a distributing device (10), the distributing device (10) is connected with a storage tank (7) through a suction pipe (9), one end of the suction pipe (9) in the storage tank (7) is connected with a suction pump (8), the distributing device (10) is located directly above the placing position of a mold disc (3), the bottom of the distributing device (10) is provided with a plurality of evenly distributed discharge nozzles (11), the bottom of the distributing device (10) is provided with a distributing base (4), one side of the distributing base (4) is fixed on the mounting frame (2), a distributing disc (12) is installed at the middle position of the distributing base (4), the distributing disc (12) is provided with evenly distributed distributing holes (23), the bottom of the distributing disc (12) is provided with a plurality of evenly distributed filling nozzles (13), one electromagnetic valve (17) is installed on each filling nozzle (13), the filling nozzles (13) are arranged to be aligned with mold grooves (22) on the mold disc (3) below, the distributing base (4) outside the distributing disc (12) is provided with a backflow groove (21), the bottom of the backflow groove (21) is provided with a backflow pipe (18), the bottom end of the backflow pipe (18) is inserted into the storage tank (7), the distributing disc (12) is provided with a scraping plate (14) attached thereto, one end of the scraping plate (14) is provided with a connecting rod, the connecting rod passes through a sliding groove (16) on the distributing base (4) and is connected with a sliding block (15), the sliding block (15) is connected with a lead screw (19) in a matched mode, one end of the lead screw (19) is drivingly connected with a motor (20).

2. A capacitive epoxy encapsulation apparatus as claimed in claim 1, wherein: The distributing disc (12) and the distributing base (4) are in a split structure, and the distributing disc (12) is seated on the distributing base (4).

3. A capacitive epoxy encapsulation apparatus as claimed in claim 2, wherein: The backflow pipe (18) is in a plurality, and the plurality of backflow pipes (18) are distributed at the bottom of the backflow groove (21) in four directions outside the distributing disc (12).

4. A capacitive epoxy encapsulation apparatus as claimed in claim 3, wherein: The base (1) is provided with two perpendicular positioning blocks (5), and the two perpendicular positioning blocks (5) are in abutting position with two adjacent sides of the square mold disc (3).

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