Packaging frame used in cooperation with double switch devices

Abstract

The utility model provides a packaging frame used in cooperation with double switch devices, comprising two base islands, one side edge of each of the two base islands extends to form a first pin, the two base islands respectively extend to the outer side to form connecting ribs, and the extending direction of the connecting ribs is perpendicular to the extending direction of the first pin; each base island corresponds to one third base pin and one second base pin, and the first base pin of each base island and the second base pin and the third base pin corresponding to the base island are arranged on the two sides of the base island respectively. According to the utility model, the two edges of each base island are fixed by utilizing the structural design that the first pins extending outwards on the base islands are perpendicular to the extension direction of the connecting ribs, so that the positions of the base islands are prevented from deviating in the later chip connecting process, and meanwhile, the two base islands can be arranged side by side; therefore, the length-width ratio of each base island is more consistent with the length-width ratio of the chip to be installed, the area of the frame is reduced, and the packaging structure is more compact.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the field of chip packaging, especially a packaging frame for double switch device cooperation. BACKGROUND

[0002] In the chip packaging process, a single electronic device is mostly packaged in a single packaging structure. With the development of the electronic field, the function of products is becoming more and more complex, and multiple switch devices often need to be used in a circuit to achieve the required function requirements. At the same time, in order to meet the miniaturization of electronic products, the integration of devices in the circuit is gradually increasing. In order to meet the requirement of miniaturization of electronic products, the circuit in the circuit board needs to be simplified as much as possible, so that a single packaging device can play a more important role.

[0003] At present, some packaging structures can package multiple devices, but for the devices fixed on the frame in such packaging structures, in order to meet the heat dissipation requirement during work or reduce electromagnetic interference generated during use, the devices in the packaging are often required to be the same or mirror image pair. However, this limits the type of devices greatly, and cannot meet the packaging requirements when facing more complex requirements. Another part of the multi-chip packaging frame cannot guarantee the fixation of the base island when fixing and connecting the chips, which causes trouble for the connection of the chips. Or it is not convenient to set the pin position, so that it is not convenient to determine the connection relationship between each pin and the chip inside the packaging during the later use process, which causes trouble for the use and installation. CONTENT OF THE UTILITY MODEL

[0004] Therefore, the utility model aims at providing a packaging frame for multiple switch devices to cooperate with each other, so as to reduce the limitation of the type of chips during packaging and improve the flexibility of packaging.

[0005] To achieve the above-mentioned purpose, the technical scheme of the utility model is as follows:

[0006] A packaging frame for double switch device cooperation, comprising

[0007] Two base islands, the side edges of the two base islands extend outward to form first pins, and the two base islands respectively extend outward to form connecting ribs, and the extending direction of the connecting ribs is perpendicular to the extending direction of the first pins.

[0008] Two third pins and two second pins, each base island corresponds to a third pin and a second pin respectively, and the first pin of each base island is respectively arranged on the two sides of the base island corresponding to the second pin and the third pin.

[0009] Further, the first pin of each base island is arranged on the same side of the second pin and the third pin corresponding to the other base island.

[0010] Further, the first pin of each base island is arranged at the corner of the base island far away from the corner of another base island.

[0011] Further, the two connecting ribs of each base island are arranged at the two ends of the edge of the base island.

[0012] Further, the second pin, the first pin and the third pin each comprise a connecting part and a weak part, and the width of the weak part is smaller than the width of the connecting part.

[0013] Further, the area of the connecting part of the second pin is larger than the area of the connecting part of the third pin.

[0014] Further, the corner of one base island is provided with a recognition chamfer formed by half-etching.

[0015] Further, the base island, the third pin, the first pin and the second pin are provided with a conductive layer on one side surface.

[0016] Further, the base island, the third pin, the first pin and the second pin are provided with a package edge formed by half-etching on the edge of one side surface.

[0017] Further, the frame further comprises a base frame, a plurality of connecting strips are arranged in the base frame, and the connecting strips are arranged in a crisscross manner to divide the space in the base frame into a plurality of processing spaces, two base islands are arranged in each processing space, and the connecting rib, the third pin, the first pin and the second pin are connected to the connecting strips at the outer ends.

[0018] Compared with the prior art, the packaging frame for double-switch device cooperation has the following advantages:

[0019] The first pin of each base island is arranged in a direction perpendicular to the extension direction of the connecting rib, so that the two edges of each base island are fixed, thereby preventing the position of the base island from being deviated in the process of connecting the chip later, and the two base islands can be arranged side by side, so that the length-width ratio of each base island is more consistent with the length-width ratio of the chip to be installed, the area of the frame is reduced, and the packaging structure is more compact.

[0020] The second pin and the third pin of one base island are arranged on the same side as the first pin of another base island, so that the electronic devices on the base islands are wire-bonded, and the metal wires do not cross above another base island, thereby avoiding the influence of the magnetic field generated by the current in the metal wires on the operation of the devices on another base island.

[0021] The weak part is arranged at the outer end of the pin foot, so that the frame is segmented after packaging, and the curling phenomenon of the pin foot edge in the shearing process is prevented, and the strength of the package is affected. BRIEF DESCRIPTION OF DRAWINGS

[0022] The accompanying drawings, which form a part of this description, are included to provide a further understanding of the present application, and are incorporated in and constitute a part of this application. The embodiments of the present application, and their

[0023] Figure 1 It is a schematic diagram of the overall structure of the frame before segmentation;

[0024] Figure 2 It is an enlarged schematic diagram of the packaging frame structure;

[0025] Figure 3 It is a schematic diagram of the distribution of the electroplating layer of the packaging frame.

[0026] BRIEF DESCRIPTION OF DRAWINGS

[0027] 1-base frame; 11-connection strip; 12-rectangular space; 2-base island; 21-identification chamfer; 3-first pin; 31-wire part; 32-weak part; 4-second pin; 5-third pin; 6-connection rib; 7-conductive layer; 8-packaging edge. DETAILED DESCRIPTION

[0028] It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0029] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application. In addition, the terms "first", "second" and the like are only for the purpose of description and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features limited by "first", "second" and the like can explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise stated, the meaning of "a plurality of" is two or more.

[0030] In the description of the utility model, it is necessary to explain, unless another explicit provision and limitation, term "installation", "link", "connection" should do broad sense understanding, for example, can be fixed connection, also can be detachable connection, or integrally connected;Can be mechanical connection, also can be electrical connection;Can be directly connected, also can be indirectly connected through intermediate medium, can be two elements inside the communication.For ordinary skilled in the art, the above-mentioned terms can be understood by the specific meaning in the utility model through specific circumstances.

[0031] The utility model will be described in detail below in combination with the embodiment and reference to the drawings.

[0032] The utility model discloses a packaging frame for double switch device cooperation uses, including base frame 1, be equipped with base material in base frame 1, in this embodiment, the base material is copper sheet, through half etching process, etches multiple connecting strips 11 of base material, and connecting strip 11 cross arrangement, divide the inside space of base frame 1 into multiple rectangular space 12 of matrix distribution, every rectangular space 12 is equipped with two base islands 2 respectively, and the side edge of two base islands 2 extends the first pin 3 outward, and two base islands 2 respectively extend the connecting rib 6 outward, the extension direction of connecting rib 6 is perpendicular with the extension direction of first pin 3, and the outer end of first pin 3 and connecting rib 6 is connected with two connecting strips 11 respectively, and the included angle is arranged between two connecting strips 11 connected by it, and one base island 2 is supported by two different edges by connecting strip 11 and first pin 3, so that two base islands 2 can keep horizontal in the case of not connecting each other, to keep stable in the packaging process, prevent base island 2 from deviating or shaking, in every rectangular space 12, still be equipped with two third pins 5 and two second pins 4, and every base island 2 corresponds with a third pin 5 and a second pin 4 respectively, and the first pin 3 of every base island 2 and the second pin 4 and third pin 5 corresponding with the base island 2 are placed on the two sides of the base island 2, and the first pin 3 of every base island 2 is placed on the same side with the first pin 3 and third pin 5 corresponding with another base island 2, so that the electronic device fixed on base island 2 and first pin 3, second pin 4 and third pin 5 are connected by wire, prevent the wire from crossing another base island 2 in the wire connection process, influence packaging processing, the magnetic induction of current in the wire also avoids the influence of electronic device work, and the outer end of second pin 4 and third pin 5 is fixed with connecting strip 11 respectively.

[0033] The connecting rib 6 on each base island 2 is provided with a plurality of connecting ribs 6, and the plurality of connecting ribs 6 are distributed on one side edge of the base island 2. In the embodiment, the connecting rib 6 is provided with two connecting ribs 6, and the two connecting ribs 6 are respectively arranged at two ends of the side edge of the base island 2. The connecting rib 6 close to one end of the first pin 3 is connected with the corner of the first pin 3, so as to increase the support force point of the base island 2, and meanwhile, the too many connecting ribs 6 can avoid reducing the bonding strength of the encapsulation material in the packaging process, and causing the packaging to be loose. By arranging one of the connecting ribs 6 at the corner of the first pin 3, the bonding firmness of the base island 2 and the first pin 3 is improved. The first pin 3 extending from each base island 2 is arranged at the corner of the side edge of the base island 2 away from the other base island 2.

[0034] The second pin 4, the first pin 3 and the third pin 5 respectively comprise a connecting portion 31 and a weak portion 32. The width of the weak portion 32 is smaller than the width of the connecting portion 31. The area of the connecting portion 31 of the second pin 4 is larger than the area of the connecting portion 31 of the third pin 5, so as to facilitate the electrical connection between the solder window of the electronic device and the pin through the metal wire, and meanwhile, the strength of the outer end of the pin is reduced, so as to facilitate the segmentation of the packaging body after the packaging, and prevent the copper material from being curled due to the large strength in the shearing process, and affecting the packaging medium.

[0035] The corner of one base island 2 is provided with an identification chamfer 21 formed by half-etching, so as to facilitate the identification of the packaging body direction by the processing personnel.

[0036] The base island 2, the third pin 5, the first pin 3 and the second pin 4 are respectively provided with a conductive layer 7 on one side surface. The conductive layer 7 is a silver layer formed by electroplating, so as to facilitate the wire bonding electrical connection. The other side surface edge is formed by half-etching to form a packaging edge 8. In the packaging, the thickness of the packaging edge 8 is smaller than the thickness of the base material, so as to facilitate the combination of the packaging medium and the packaging edge 8, prevent the loosening of each pin or base island 2, and the unetched part of the surface is exposed outside the packaging body after the packaging, and is used for connecting with the circuit on the circuit board.

[0037] The above only describes the preferred embodiment of the present application, and is not used to limit the present application. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A packaging frame for use with dual switching devices, characterized in that: include Two base islands, with a first tube extending outward from one edge of each base island, and connecting ribs extending outward from each base island, the extending direction of the connecting ribs being perpendicular to the extending direction of the first tube. Two third pins and two second pins, each base island corresponds to one third pin and one second pin respectively, and the first pin of each base island is placed on both sides of the base island with the corresponding second and third pins.

2. The packaging frame for use with dual switching devices according to claim 1, characterized in that: The first pin extending from each base island is positioned on the same side as the second and third pins corresponding to the other base island.

3. The packaging frame for use with dual switching devices according to claim 1, characterized in that: The first prong extending from each base island is positioned at a corner away from the other base island.

4. The packaging frame for use with dual switching devices according to claim 1, characterized in that: Each base island has two connecting ribs, and the two connecting ribs are placed at both ends of the base island edge.

5. A packaging frame for use with dual switching devices according to claim 1, characterized in that: The second pin, the first pin, and the third pin each include a connecting portion and a weak portion, wherein the width of the weak portion is smaller than the width of the connecting portion.

6. A packaging frame for use with dual switching devices according to claim 5, characterized in that: The area of ​​the connection portion of the second pin is larger than the area of ​​the connection portion of the third pin.

7. A packaging frame for use with dual switching devices according to claim 1, characterized in that: One of the base islands has a chamfered edge formed by semi-etching at one of its corners.

8. A packaging frame for use with dual switching devices according to claim 1, characterized in that: The base island, the third pin, the first pin, and the second pin are electroplated with a conductive layer on one side surface.

9. A packaging frame for use with dual switching devices according to claim 1, characterized in that: The base island, the third pin, the first pin, and the second pin are partially etched to form a package edge, and the thickness of the package edge is less than the thickness of the base island.

10. A packaging frame for use with dual switching devices according to claim 1, characterized in that: It also includes a base frame, which has multiple connecting strips arranged in a crisscross pattern to divide the space within the base frame into multiple processing spaces. Each processing space contains two base islands, and the connecting ribs, the third pin, the first pin, and the second pin are respectively connected to the connecting strips at their outer ends.

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