Double-wafer resonator
By designing a dual-crystal resonator and using a ceramic base and metal cover to form a vacuum-sealed inner cavity, it is possible to provide multi-frequency source output and filtering functions in a small volume, solving the problems of single-frequency output and inconvenient installation in the existing technology.
Patent Information
- Application Number
- CN202422663103.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-01
- Publication Date
- 2025-11-18
- Estimated Expiration
- 2034-11-01
AI Technical Summary
In the existing technology, surface-mount crystal resonators can usually only output a single frequency signal, which is difficult to meet the needs of multiple frequency sources. They are also inconvenient to install in limited spaces and cannot achieve filtering functions.
Design a dual-crystal resonator that uses a ceramic substrate and a metal cover to form a vacuum-sealed inner cavity with multiple bosses and pads. Coated quartz crystals are fixed to the bosses with conductive adhesive. The electrode area is connected to the bosses through electrode leads to realize the electrical connection between the two coated quartz crystals and to achieve filtering function.
It enables the output of two or more frequency sources within a small volume, has filtering function, and is suitable for installation requirements with limited space.
Smart Images
Figure CN223567596U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the field of crystal resonator, more specifically it is a kind of double wafer resonator. BACKGROUND
[0002] Quartz crystal resonator is an important electronic component for stabilizing and selecting frequency, is called as the "heart" of electronic product, is widely used in aerospace, navigation, radar, communication, automotive electronics, medical treatment, security and protection and other fields of precision electronic equipment;In prior art, patch type crystal resonator is generally composed of plated quartz wafer, conductive glue, pedestal and cover plate, generally only one plated quartz wafer is placed inside one crystal resonator, and one frequency signal is output.
[0003] Double wafer resonator places two plated quartz wafers inside, and outputs two or more frequency signals;In practical application, if two or more frequency sources are needed by equipment, double wafer resonator is used, and the volume is smaller, so it is more convenient to install in limited space.
[0004] With the increase of data transmission and communication demand between mobile devices, more and more frequency bands are used for mobile data, in order to stabilize signal source frequency, avoid crosstalk and unnecessary noise signal, some frequencies need to be allowed to pass through or some frequencies need to be prevented from passing through, so filter resonator is needed to realize filtering effect.
[0005] Therefore, the pedestal design of the double wafer resonator can also be applied to crystal filter products, and when the frequency signals of several resonators produce correct acoustic (mechanical) coupling, the filter response is realized.
[0006] Therefore, it is necessary to develop a universal double wafer resonator pedestal. INVENTION CONTENTS
[0007] The utility model aims at overcoming the insufficient of above-mentioned background art, and provides a kind of double wafer resonator.
[0008] In order to realize the above-mentioned purpose, the technical scheme of the utility model is as follows: a double wafer resonator, characterized by: including ceramic pedestal, metal cover plate located at the top of ceramic pedestal, plated quartz wafer, the ceramic pedestal and metal cover plate constitute crystal resonator inner cavity, a plurality of bosses are arranged in ceramic pedestal, a plurality of pads are arranged at the bottom of ceramic pedestal, the plurality of pads and the plurality of bosses are one-to-one correspondence, and the pad is electrically connected with the corresponding boss.
[0009] The plated quartz wafer is located in the crystal resonator inner cavity, and the electrode area on the front surface of the plated quartz wafer is electrically connected with one boss, and the electrode area on the back surface is electrically connected with another boss.
[0010] In the above technical solution, the six bosses are arranged at intervals from left to right in the ceramic base, the first boss, the second boss and the third boss are arranged at intervals from left to right in the ceramic base, and the fourth boss, the fifth boss and the sixth boss are arranged at intervals from left to right in the ceramic base.
[0011] In the above technical solution, the two coated quartz wafers are fixed on the first boss, the second boss, the fourth boss and the fifth boss through conductive glue at four corners of one coated quartz wafer, and are fixed on the second boss, the third boss, the fifth boss and the sixth boss through conductive glue at four corners of the other coated quartz wafer.
[0012] In the above technical solution, the electrode area of the front surface and the electrode area of the back surface of the coated quartz wafer are both in the center of the coated quartz wafer, and the electrode area is suspended; the electrode area of the front surface is connected to one boss through an electrode lead, and the electrode area of the back surface is connected to another boss through an electrode lead.
[0013] In the above technical solution, the electrode lead connected to the electrode area of the front surface is point-surface glued between the coated quartz wafer, and the electrode lead connected to the electrode area of the back surface is point-bottom glued between the coated quartz wafer.
[0014] In the above technical solution, the ceramic base and the metal cover plate constitute a crystal resonator inner cavity which is a vacuum sealed cavity.
[0015] In the above technical solution, the first boss, the third boss, the fourth boss and the sixth boss are located at four corners of the ceramic base and are all square; the second boss is located between the first boss and the third boss, and the fifth boss is located between the fourth boss and the sixth boss, and the second boss and the fifth boss are both rectangular.
[0016] In the above technical solution, the size of the coated quartz wafer is 2.85mm*1.80mm, and the size of the ceramic base is 7.00mm*5.00mm.
[0017] In the above technical solution, the electrode area is provided with one electrode or a plurality of electrodes.
[0018] In the above technical solution, the metal cover plate is welded to the ceramic base by parallel sealing welding.
[0019] Compared with the prior art, the utility model has the following advantages:
[0020] 1) The ceramic base and the metal cover plate constitute a crystal resonator inner cavity, which has universality, can realize the carrying of one coated quartz wafer, and can also realize the carrying of two coated quartz wafers.
[0021] 2) The double wafer resonator of the utility model has small volume and can provide two or more frequency sources simultaneously.
[0022] 3) The utility model can realize filtering function. BRIEF DESCRIPTION OF DRAWINGS
[0023] Figure 1 It is the sectional view of the top surface of the utility model.
[0024] Figure 2 It is the schematic view of the bottom surface of the ceramic base.
[0025] Figure 3 It is the schematic view of the top surface of the utility model.
[0026] Figure 4 It is the internal structure of the utility model Figure 1 .
[0027] Figure 5 It is the internal structure of the utility model Figure 2 .
[0028] Figure 6 It is the internal structure of the utility model Figure 3 .
[0029] Figure 7 It is the internal structure of the utility model Figure 4 .
[0030] Figure 8 It is the internal structure of the utility model Figure 5 .
[0031] Figure 9 It is the electric principle of the resonator of the utility model Figure 1 .
[0032] Figure 10 It is the electric principle of the filter resonator of the utility model Figure 2 .
[0033] Wherein, 100 - ceramic base, 110 - boss, 111 - first boss, 112 - second boss, 113 - third boss, 114 - fourth boss, 115 - fifth boss, 116 - sixth boss, 120 - pad, 121 - first pad, 122 - second pad, 123 - third pad, 124 - fourth pad, 125 - fifth pad, 126 - sixth pad, 200 - metal cover plate, 300 - coated quartz wafer, 310 - electrode area, 320 - electrode lead, 400 - conductive glue.
[0034] Figures 1-8 The diagonal hatched area is the metallized area. DETAILED DESCRIPTION
[0035] The embodiments of the present application will be described in detail below with reference to the drawings, but they do not constitute a limitation on the present application, and are only examples. Meanwhile, the advantages of the present application will become more apparent and easier to understand through the description.
[0036] As shown in the drawings, the double-chip resonator comprises a ceramic base 100, a metal cover plate 200 on the top of the ceramic base 100, and a coated quartz chip 300, wherein the ceramic base 100 and the metal cover plate 200 form an inner cavity of the crystal resonator, the ceramic base 100 is provided with a plurality of bosses 110, the bottom of the ceramic base 100 is provided with a plurality of pads 120, the plurality of pads 120 correspond to the plurality of bosses 110 one by one, and the pads 120 are electrically connected to the corresponding bosses 110.
[0037] The coated quartz chip 300 is located in the inner cavity of the crystal resonator, the electrode area 310 on the front face of the coated quartz chip 300 is electrically connected to one boss 110, and the electrode area 310 on the back face is electrically connected to another boss 110.
[0038] The pads 120 are used for inputting power and outputting frequency signals.
[0039] The bosses 110 are six, the first boss 111, the second boss 112, and the third boss 113 are arranged at intervals from left to right in the ceramic base 100, the fourth boss 114, the fifth boss 115, and the sixth boss 116 are arranged at intervals from left to right in the ceramic base 100, and the first boss 111, the second boss 112, and the third boss 113 are arranged opposite to the fourth boss 114, the fifth boss 115, and the sixth boss 116.
[0040] The coated quartz chip 300 is two, the four corners of one coated quartz chip 300 are fixed on the first boss 111, the second boss 112, the fourth boss 114, and the fifth boss 115 through conductive glue 400, the four corners of the other coated quartz chip 300 are fixed on the second boss 112, the third boss 113, the fifth boss 115, and the sixth boss 116 through conductive glue 400, and the second boss 112 and the fifth boss 115 are shared by the two coated quartz chips 300.
[0041] The electrode areas 310 on the front face and the back face of the coated quartz chip 300 are both in the center of the coated quartz chip 300, and the electrode areas 310 are suspended; the electrode area 310 on the front face is connected to one boss 110 through an electrode lead 320, and the electrode area 310 on the back face is connected to another boss 110 through an electrode lead 320.
[0042] The electrode lead 320 connected with the electrode area 310 on the front surface is point-surface glued with the coated quartz wafer 300, and the electrode lead 320 connected with the electrode area 310 on the back surface is point-bottom glued with the coated quartz wafer 300.
[0043] The crystal resonator formed by the ceramic base 100 and the metal cover plate 200 has a vacuum sealed cavity.
[0044] The first, third, fourth and sixth protrusions 111, 113, 114 and 116 are located at the four corners of the ceramic base 100 and are square-shaped; the second protrusion 112 is located between the first and third protrusions 111 and 113, and the fifth protrusion 115 is located between the fourth and sixth protrusions 114 and 116, and the second and fifth protrusions 112 and 115 are rectangular-shaped.
[0045] The size of the coated quartz wafer 300 is 2.85mm x 1.80mm, and the size of the ceramic base 100 is 7.00mm x 5.00mm.
[0046] The electrode area 310 is provided with one electrode or several electrodes.
[0047] The metal cover plate 200 is welded to the ceramic base 100 by parallel sealing and welding.
[0048] The coated quartz wafer 300 is carried in the ceramic base 100 after vacuum coating, and the four corners of the coated quartz wafer 300 are placed on the protrusions 110, so that the electrode area 310 in the center of the coated quartz wafer 300 is suspended; the electrode lead 320 extends from the electrode area 310 to the edge of the coated quartz wafer 300, and after the conductive adhesive 400 is cured, it is fine-tuned to the target frequency, and finally the metal cover plate 200 is welded to the ceramic base 100 by parallel sealing and welding to form a complete double wafer resonator.
[0049] The quartz crystal resonator is a passive device, and the double wafer resonator is a device in which two crystal wafers generating resonance frequencies are packaged together; the working principle of the quartz crystal resonator is as follows: a pair or several pairs of electrodes with a certain shape and position are plated on the quartz wafer by vacuum plating method, and the mechanical wave is converted into a frequency signal under the action of the electric field by using the trapping theory and the inverse piezoelectric effect. When several frequency signals are correctly acoustically (mechanically) coupled, the filter response is realized.
[0050] In actual use, the third protrusion 113 and the third pad 123 are in communication with the fourth protrusion 114 and the fourth pad 124.
[0051] Figures 4-8 The present application shows various double wafer coated electrode designs, as well as loading and dispensing methods.
[0052] As Figure 4 shown, the electrode area 310 on the front side of one plated quartz wafer 300 is connected with the first boss 111 through the electrode lead 320, and the electrode area 310 on the back side is connected with the second boss 112 through the electrode lead 320; the electrode area 310 on the front side of another plated quartz wafer 300 is connected with the sixth boss 116 through the electrode lead 320, and the electrode area 310 on the back side is connected with the fifth boss 115 through the electrode lead 320.
[0053] As Figure 5 shown, the electrode area 310 on the front side of one plated quartz wafer 300 is connected with the first boss 111 through the electrode lead 320, and the electrode area 310 on the back side is connected with the fifth boss 115 through the electrode lead 320; the electrode area 310 on the front side of another plated quartz wafer 300 is connected with the sixth boss 116 through the electrode lead 320, and the electrode area 310 on the back side is connected with the second boss 112 through the electrode lead 320.
[0054] As Figure 6 shown, the electrode area 310 on the front side of one plated quartz wafer 300 is connected with the fourth boss 114 through the electrode lead 320, and the electrode area 310 on the back side is connected with the first boss 111 through the electrode lead 320; the electrode area 310 on the front side of another plated quartz wafer 300 is connected with the third boss 113 through the electrode lead 320, and the electrode area 310 on the back side is connected with the sixth boss 116 through the electrode lead 320.
[0055] As Figure 7 shown, the electrode area 310 on the front side of one plated quartz wafer 300 is connected with the fourth boss 114 through the electrode lead 320, and the electrode area 310 on the back side is connected with the fifth boss 115 through the electrode lead 320; the electrode area 310 on the front side of another plated quartz wafer 300 is connected with the third boss 113 through the electrode lead 320, and the electrode area 310 on the back side is connected with the second boss 112 through the electrode lead 320.
[0056] As Figure 8 shown, the electrode area 310 on the front side of one plated quartz wafer 300 is connected with the fourth boss 114 through the electrode lead 320, and the electrode area 310 on the back side is connected with the second boss 112 through the electrode lead 320; the electrode area 310 on the front side of another plated quartz wafer 300 is connected with the third boss 113 through the electrode lead 320, and the electrode area 310 on the back side is connected with the fifth boss 115 through the electrode lead 320.
[0057] Figure 4 and Figure 5 the electrical principle diagram as Figure 9As shown, Crystal 1 is a coated quartz crystal 300 (crystal resonator), Crystal 2 is another coated quartz crystal 300 (crystal resonator), Xtal1 and Xtal2 are the input and output terminals of one coated quartz crystal 300 (crystal resonator), and Xtal3 and Xtal4 are the input and output terminals of the other coated quartz crystal 300 (crystal resonator). The two coated quartz crystals 300 are connected to two input and output terminals respectively. This product can realize the output of two sets of frequency sources. The nominal output frequencies can be the same or different, and can be designed according to user needs.
[0058] Figures 6-8 The electrical schematic diagram is as follows Figure 10 As shown, Crystal 1 is a coated quartz crystal 300 (crystal resonator), Crystal 2 is another coated quartz crystal 300 (crystal resonator), Xtal 1 and Xtal 2 are the input and output terminals of the two coated quartz crystal 300 (crystal resonators), and GND is the ground terminal; the two coated quartz crystals 300 are connected to one input and output terminal; the filtering function is achieved through the combined action of the circuit.
[0059] All other unspecified parts belong to the prior art.
Claims
1. A bicrystalline resonator, characterized in that: The device includes a ceramic base (100), a metal cover plate (200) on top of the ceramic base (100), and a coated quartz wafer (300). The ceramic base (100) and the metal cover plate (200) constitute the inner cavity of the crystal resonator. Multiple bosses (110) are provided inside the ceramic base (100), and multiple pads (120) are provided at the bottom of the ceramic base (100). The multiple pads (120) correspond one-to-one with the multiple bosses (110), and the pads (120) are electrically connected to the corresponding bosses (110). The coated quartz wafer (300) is located inside the crystal resonator cavity. The electrode area (310) on the front side of the coated quartz wafer (300) is electrically connected to a boss (110), and the electrode area (310) on the back side is electrically connected to another boss (110).
2. A bicrystalline resonator according to claim 1, characterized in that: There are six protrusions (110). The first protrusion (111), the second protrusion (112), and the third protrusion (113) are arranged in the ceramic base (100) from left to right at intervals. The fourth protrusion (114), the fifth protrusion (115), and the sixth protrusion (116) are arranged in the ceramic base (100) from left to right at intervals. The first protrusion (111), the second protrusion (112), and the third protrusion (113) are arranged opposite to the fourth protrusion (114), the fifth protrusion (115), and the sixth protrusion (116).
3. A bicrystalline resonator according to claim 2, characterized in that: There are two coated quartz wafers (300). The four corners of one coated quartz wafer (300) are fixed to the first boss (111), the second boss (112), the fourth boss (114), and the fifth boss (115) by conductive adhesive (400). The four corners of the other coated quartz wafer (300) are fixed to the second boss (112), the third boss (113), the fifth boss (115), and the sixth boss (116) by conductive adhesive (400).
4. A bicrystalline resonator according to claim 3, characterized in that: The electrode regions (310) on both sides of the coated quartz wafer (300) are located in the center of the coated quartz wafer (300), and the electrode regions (310) are suspended. The electrode region (310) on the front side is connected to a boss (110) through an electrode lead (320), and the electrode region (310) on the back side is connected to another boss (110) through an electrode lead (320).
5. A bicrystalline resonator according to claim 4, characterized in that: Top adhesive is applied between the electrode lead (320) connected to the electrode area (310) on the front side and the coated quartz wafer (300), and bottom adhesive is applied between the electrode lead (320) connected to the electrode area (310) on the back side and the coated quartz wafer (300).
6. A bicrystalline resonator according to claim 1, characterized in that: The inner cavity of the crystal resonator, which is composed of the ceramic base (100) and the metal cover plate (200), is a vacuum-sealed cavity.
7. A bicrystalline resonator according to claim 2, characterized in that: The first protrusion (111), the third protrusion (113), the fourth protrusion (114), and the sixth protrusion (116) are located at the four corners of the ceramic base (100) and are all square; the second protrusion (112) is located in the middle of the first protrusion (111) and the third protrusion (113), and the fifth protrusion (115) is located in the middle of the fourth protrusion (114) and the sixth protrusion (116). The second protrusion (112) and the fifth protrusion (115) are both rectangular.
8. A bicrystalline resonator according to claim 1, characterized in that: The coated quartz wafer (300) has a size of 2.85mm × 1.80mm, and the ceramic base (100) has a size of 7.00mm × 5.00mm.
9. A bicrystalline resonator according to claim 1, characterized in that: The electrode region (310) is provided with one or more electrodes.
10. A bicrystalline resonator according to claim 1, characterized in that: The metal cover plate (200) is welded to the ceramic base (100) by parallel sealing welding.