High-heat-dissipation DFN packaging structure with positioning structure

Abstract

The utility model discloses a high heat dissipation DFN packaging structure with a positioning structure, which comprises a mounting plate, the outer wall of the mounting plate is movably connected with pins, and the top of the mounting plate is provided with a mounting groove. According to the device, a limiting frame, a positioning groove, a sliding groove, a first spring, a movable column, a connecting plate, a fixing shell and a fixing block are arranged and used in cooperation, so that a worker can rapidly position and install the fixing shell, and the worker can package a chip more rapidly; according to the packaging device, the chip packaging efficiency is improved when a worker uses the packaging device, the working efficiency is improved when the worker uses the packaging device, and through the use of the limiting frame, the worker can limit the chip when installing the fixing shell, so that the chip does not move randomly during installation, and the working efficiency is improved. Therefore, workers do not need to be distracted when installing the fixing shell, and the working efficiency of the workers when using the device is further improved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the field of DFN package structure direction, specifically relates to a high heat dissipation DFN package structure with positioning structure. BACKGROUND

[0002] DFN / QFN platform is the latest surface mount package technology. The mounting pad, solder resist layer and stencil style design of printed circuit board (PCB) and assembly process need to follow the corresponding principles. DFN / QFN platform has multifunctionality, which can connect one or more semiconductor devices in lead-free package. As shown in Figure 1 The flexibility of this package is shown.

[0003] The DFN package structure is a chip package structure, but the general DFN package structure needs to use auxiliary tools for installation when used by workers, so that the working efficiency of workers is reduced during installation, and the general DFN package structure will appear displacement when installing the chip, and the general DFN package structure cannot be quickly disassembled when used by workers, so that the working efficiency of workers is reduced during disassembly.

[0004] Therefore, how to provide a high-heat-dissipation DFN package structure with positioning structure has become a problem to be solved by people in the field. INVENTION CONTENTS

[0005] The utility model aims at the prior art device a kind of high-heat-dissipation DFN package structure with positioning structure, to solve the problems presented in the above background art.

[0006] To solve the above technical problems, the utility model provides the following technical scheme: a high-heat-dissipation DFN package structure with positioning structure, including mounting plate, the outer wall of the mounting plate is movably connected with pin, and the top of mounting plate is provided with mounting slot, the inner bottom of mounting slot is movably connected with limiting frame, and the inner wall of limiting frame is movably connected with chip, the inner side wall of mounting slot is provided with positioning slot, and the inner side wall of positioning slot is provided with sliding slot.

[0007] The utility model further illustrates that the inner side wall of sliding slot is movably connected with first spring, and one end of first spring is movably connected with movable column, and the outer wall of movable column is movably connected with the inner wall of sliding slot.

[0008] The utility model further illustrates that the outer wall of movable column is movably connected with connecting plate, and the inner wall of mounting slot is movably connected with fixed shell.

[0009] The utility model further illustrates that one side of fixed shell is movably connected with fixed block, and the outer wall of fixed block is movably connected with the inner wall of positioning slot.

[0010] The utility model further illustrates that the top of fixed shell is equipped with the heat dissipation hole, and the bottom of fixed shell is movably connected with fixed column.

[0011] The utility model further illustrates that the inner bottom of mounting groove is equipped with positioning circular groove, and the inner bottom of positioning circular groove is movably connected with second spring, and the inner wall of positioning circular groove is movably connected with the outer surface of fixed column.

[0012] Compared with the prior art, the utility model has the beneficial effects that:

[0013] (1) through the mutual cooperation of limiting frame, positioning groove, sliding groove, first spring, movable column, connecting plate, fixed shell and fixed block, the staff can quickly position and install the fixed shell, the staff can be more quickly when packaging the chip, the efficiency of the staff when using the device to package the chip is improved, the working efficiency of the staff when using the device is improved, and through the use of limiting frame, the staff can position the chip when installing the fixed shell, so that the chip does not move when installing, so that the staff can not be distracted when installing the fixed shell, and the working efficiency of the staff when using the device is further improved.

[0014] (2) through the mutual cooperation of heat dissipation hole, fixed column, positioning circular groove and second spring, the staff can quickly disassemble the fixed shell, the staff can quickly disassemble the device, the working efficiency of the staff when using the device is further improved, and through the use of heat dissipation hole, the chip can be quickly cooled when running, and the stability of the chip when running in the device is improved. BRIEF DESCRIPTION OF DRAWINGS

[0015] The accompanying drawings are included to provide a further understanding of the utility model, and constitute a part of the specification, and are used to explain the utility model together with embodiments of the utility model, and do not constitute the limitation to the utility model. In the drawings:

[0016] Figure 1 It is the whole structure schematic diagram of the utility model;

[0017] Figure 2 It is the limiting frame and chip connecting structure display drawing of the utility model;

[0018] Figure 3 It is the fixed shell and fixed block connecting structure display drawing of the utility model;

[0019] Figure 4 It is the first spring and movable column connecting structure display drawing of the utility model;

[0020] Figure 5 is the installation plate and pin connection structure display figure of the utility model;

[0021] In the figure: 1, installation plate, 2, pin, 3, installation slot, 4, limit frame, 5, chip, 6, positioning slot, 7, sliding slot, 8, first spring, 9, movable column, 10, connecting plate, 11, fixed shell, 12, fixed block, 13, heat dissipation hole, 14, fixed column, 15, positioning circular groove, 16, second spring. DETAILED DESCRIPTION

[0022] The utility model discloses technical scheme further non-restrictive detailed description in combination with preferred embodiment and its drawing. Obviously, the described embodiment is only a part of embodiment of the utility model, not all embodiments. Based on the embodiment in the utility model, all other embodiments obtained by the ordinary skill in the art without making creative labor belong to the range of the utility model protection.

[0023] Embodiment 1

[0024] Please refer to Figures 1-5 As shown in the figure, a high-heat-dissipation DFN packaging structure with positioning structure includes installation plate 1, the outer wall of installation plate 1 is movably connected with pin 2, and the top of installation plate 1 is provided with installation slot 3, the inner bottom of installation slot 3 is movably connected with limit frame 4, and the inner wall of limit frame 4 is movably connected with chip 5, the inner side wall of installation slot 3 is provided with positioning slot 6, and the inner side wall of positioning slot 6 is provided with sliding slot 7.

[0025] The inner side wall of sliding slot 7 is movably connected with first spring 8, one end of first spring 8 is movably connected with movable column 9, the outer wall of movable column 9 is movably connected with the inner wall of sliding slot 7, the outer wall of movable column 9 is movably connected with connecting plate 10, the inner wall of installation slot 3 is movably connected with fixed shell 11, so that workers can quickly position and install fixed shell 11, so that workers can be more quickly encapsulated when encapsulating chip 5, so that the efficiency of workers is improved when using the device to encapsulate chip 5, and the working efficiency of workers is improved when using the device.

[0026] In the embodiment, through the cooperation of the limiting frame 4, the positioning groove 6, the sliding groove 7, the first spring 8, the movable column 9, the connecting plate 10, the fixed shell 11 and the fixed block 12, the staff can quickly position and install the fixed shell 11, the staff can be more quickly when packaging the chip 5, the efficiency of the staff when using the device to package the chip 5 is improved, the working efficiency of the staff when using the device is improved, and through the use of the limiting frame 4, the staff can position the chip 5 when installing the fixed shell 11, so that the chip 5 does not move when installing, so that the staff can not be distracted when installing the fixed shell 11, and the working efficiency of the staff when using the device is further improved.

[0027] Embodiment 2

[0028] As Figures 1-5 shown, on the basis of embodiment 1, the utility model provides a technical scheme, one side of fixed shell 11 is connected with fixed block 12, and the outer wall of fixed block 12 is movably connected with the inner wall of positioning groove 6, the top of fixed shell 11 is provided with heat dissipation hole 13, and the bottom of fixed shell 11 is movably connected with fixed column 14.

[0029] The inner bottom of mounting groove 3 is provided with positioning circular groove 15, the inner bottom of positioning circular groove 15 is movably connected with second spring 16, and the inner wall of positioning circular groove 15 is movably connected with the outer surface of fixed column 14, so that the staff can be more quickly when disassembling fixed shell 11, so that the staff can quickly disassemble the device, and the working efficiency of the staff when using the device is further improved.

[0030] In the embodiment, through the cooperation of the heat dissipation hole 13, the fixed column 14, the positioning circular groove 15 and the second spring 16, the staff can be more quickly when disassembling the fixed shell 11, so that the staff can quickly disassemble the device, and the working efficiency of the staff when using the device is further improved, and through the use of the heat dissipation hole 13, the chip 5 can be quickly cooled when running, and the stability of the chip 5 when running in the device is improved.

[0031] The working principle of the high-heat-dissipation DFN packaging structure with the positioning structure will be described below.

[0032] When the staff installs the chip 5 using the device, first, the chip 5 is placed into the limiting frame 4 inside the installation slot 3, preventing the staff from moving when installing the fixed shell 11; when the fixed shell 11 is installed, the staff first moves the movable column 9 through the connecting plate 10 to press the first spring 8, so that the movable column 9 does not block the fixed block 12 from entering the positioning slot 6; at the same time, the fixed column 14 at the bottom of the fixed shell 11 enters the inside of the positioning circular groove 15 to press the second spring 16; when the fixed shell 11 is in place, the staff can release the connecting plate 10, the first spring 8 resets the movable column 9 and fixes the fixed block 12; when the staff needs to disassemble the fixed shell 11, only needs to move the movable column 9 through the connecting plate 10, so that the fixed block 12 is not blocked, the second spring 16 will pop out the fixed shell 11, so that the device can be quickly disassembled.

[0033] In the description of the present application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", etc. indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application, and do not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation, therefore cannot be understood as a limitation on the present application.

[0034] Finally, it should be pointed out that: the above examples are only used to illustrate the technical solutions of the present application, and are not limited. Although the present application has been described in detail with reference to the foregoing examples, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing examples, or make equivalent substitutions for part of the technical features, and these modifications or substitutions do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A high heat dissipating DFN package structure with positioning structure, comprising a mounting plate (1), characterized in that: The outer wall of the mounting plate (1) is movably connected with a pin (2), and the top of the mounting plate (1) is provided with a mounting groove (3), the inner bottom of the mounting groove (3) is movably connected with a limiting frame (4), the inner wall of the limiting frame (4) is movably connected with a chip (5), the inner side wall of the mounting groove (3) is provided with a positioning groove (6), and the inner side wall of the positioning groove (6) is provided with a sliding groove (7).

2. The high-heat-dissipation DFN package structure with a positioning structure according to claim 1, wherein: The inner side wall of the sliding groove (7) is movably connected with a first spring (8), one end of the first spring (8) is movably connected with a movable column (9), and the outer wall of the movable column (9) is movably connected with the inner wall of the sliding groove (7).

3. The high-heat-dissipation DFN package structure with a positioning structure according to claim 2, characterized in that: The outer wall of the movable column (9) is movably connected with a connecting plate (10), and the inner wall of the mounting groove (3) is movably connected with a fixed shell (11).

4. The high-heat-dissipation DFN package structure with a positioning structure according to claim 3, characterized in that: One side of the fixed shell (11) is movably connected with a fixed block (12), and the outer wall of the fixed block (12) is movably connected with the inner wall of the positioning groove (6).

5. The high-heat-dissipation DFN package structure with a positioning structure according to claim 4, wherein: The top of the fixed shell (11) is provided with a heat dissipation hole (13), and the bottom of the fixed shell (11) is movably connected with a fixed column (14).

6. The high-heat-dissipation DFN package structure with a positioning structure according to claim 1, wherein: The inner bottom of the mounting groove (3) is provided with a positioning circular groove (15), the inner bottom of the positioning circular groove (15) is movably connected with a second spring (16), and the inner wall of the positioning circular groove (15) is movably connected with the outer surface of the fixed column (14).

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