Jig for pasting 3M glue on flexible circuit board

By designing a fixture for applying 3M adhesive to flexible circuit boards, using the fixture base plate and unloading plate for positioning, and combining it with the false pressure operation of the silicone buffer pad, the problems of inaccurate alignment and air bubbles when applying 3M adhesive to flexible circuit boards were solved, thus improving the reliability and pass rate of the products.

CN223567859UActive Publication Date: 2025-11-18BOLO COUNTY JINGHUI ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202422826605.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-20
Publication Date
2025-11-18
Estimated Expiration
2034-11-20

AI Technical Summary

Technical Problem

In existing technologies, the alignment of 3M adhesive on flexible circuit boards is inaccurate. After the release paper is removed, the adhesive tape is easily lifted and air bubbles are generated, which affects product reliability and yield.

Method used

A 3M adhesive bonding fixture for flexible circuit boards was designed, comprising a fixture base plate, a fixture unloading plate, and a silicone buffer pad. The fixture effectively limits and applies false pressure to the flexible circuit board through positioning holes and buffer pads, ensuring the stability of the adhesive bonding process.

Benefits of technology

It improves the alignment accuracy of applying 3M adhesive to flexible circuit boards, reduces production difficulty, ensures product reliability and pass rate, and avoids the formation of air bubbles.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a jig for pasting 3M glue on a flexible circuit board, which comprises a jig bottom plate, a jig unloading plate and a silica gel cushion pad, the jig unloading plate is arranged at the upper end of the jig bottom plate, the flexible circuit board is arranged between the silica gel cushion pad and the jig unloading plate, the jig bottom plate is of a rectangular structure, and a product corresponding area is arranged in the middle of the jig bottom plate. The four corners, located on the periphery of the product corresponding area, of the jig bottom plate are each provided with a bottom plate jig positioning hole, the product corresponding area is provided with a plurality of bottom plate device avoiding holes, the jig bottom plate is provided with a row of bottom plate product positioning holes, the jig discharging plate is of a rectangular structure, and the middle of the jig discharging plate is provided with a product containing area. The jig discharging plate is further provided with a discharging plate jig positioning hole, a discharging plate device avoiding hole and a discharging plate product positioning hole, a plurality of cushion pad device avoiding holes are formed in the middle of the silica gel cushion pad, and the silica gel cushion pad is further provided with a cushion pad jig positioning hole and a cushion pad product positioning hole. The device is simple in structure and convenient to operate, the production difficulty is reduced, and the product percent of pass is improved.
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Description

TECHNICAL FIELD

[0001] The utility model relates to the flexible circuit board production field especially relates to a flexible circuit board pastes 3M glue fixture. BACKGROUND

[0002] With the change of the times, the continuous development and progress of science and technology, the multilayer flexible circuit board has been increasing, all kinds of strange shapes, the production process requirement is higher and higher, the processing difficulty is increasing, the customer's reliability requirement for the product is very high, the size of the product is very strict, at present, the SMT device is assembled after the device is punched and formed after pasting 3M glue, the position deviation of the product produced by manual alignment is larger, the 3M glue is easy to take up when tearing the separation paper after punching, many bubbles after the customer tears off the 3M glue separation paper, which seriously affects the reliability of customer use, the product may also cause short circuit, fire and other problems during use, which has been affecting and disturbing us, seriously affecting the production progress and the qualified rate, and causing great quality hidden trouble for customer use. CONTENT OF THE UTILITY MODEL

[0003] In order to solve the problem of inaccurate alignment of pasting 3M glue and easy to take up the adhesive tape after tearing the separation paper and easy to produce bubbles in the prior art, the utility model provides a flexible circuit board pastes 3M glue fixture.

[0004] The utility model provides a kind of flexible circuit board pastes 3M glue fixture, including jig base plate, jig unloading plate and silica gel buffer pad, the jig unloading plate is installed on jig base plate upper end, silica gel buffer pad and the flexible circuit board are installed between the jig unloading plate, the jig base plate is rectangular structure, and product corresponding area is equipped in middle part, one bottom plate jig positioning hole is respectively equipped at the four corners of the periphery of the product corresponding area on the jig base plate, the product corresponding area is equipped with a plurality of bottom plate device avoidance hole adapted to the lower end device of the flexible circuit board, a row of bottom plate product positioning hole is respectively equipped at the both ends of the product corresponding area on the jig base plate, the jig unloading plate is rectangular structure, and product placement area is equipped in middle part, the jig unloading plate is also equipped with unloading plate jig positioning hole, unloading plate device avoidance hole and unloading plate product positioning hole corresponding to the position of the bottom plate jig positioning hole, the position of bottom plate device avoidance hole and the position of bottom plate product positioning hole respectively, the middle part of silica gel buffer pad is equipped with a plurality of buffer pad device avoidance hole adapted to the upper end device of the flexible circuit board, and the silica gel buffer pad is also equipped with buffer pad jig positioning hole and buffer pad product positioning hole corresponding to the position of the bottom plate jig positioning hole and the position of bottom plate product positioning hole respectively.

[0005] As a further improvement of the utility model, a plurality of laser coordinate positioning holes are further provided on the periphery of the silica gel buffer pad.

[0006] As a further improvement of the utility model, the jig base plate is a glass fiber plate, and the thickness of the jig base plate is 4mm.

[0007] As a further improvement of the utility model, the jig base plate is a glass fiber plate, and the thickness of the jig base plate is 4mm.

[0008] As a further improvement of the utility model, the jig base plate is a glass fiber plate, and the thickness of the jig base plate is 4mm.

[0009] As a further improvement of the utility model, the jig base plate is a glass fiber plate, and the thickness of the jig base plate is 4mm.

[0010] As a further improvement of the utility model, the jig base plate is a glass fiber plate, and the thickness of the jig base plate is 4mm.

[0011] As a further improvement of the utility model, the jig base plate is a glass fiber plate, and the thickness of the jig base plate is 4mm.

[0012] The utility model discloses a flexible circuit board 3M glue pasting jig, which comprises a jig base plate and a jig unloading plate. BRIEF DESCRIPTION OF DRAWINGS

[0013] Fig. 1 It is the use state reference drawing of the utility model kind of flexible circuit board 3M glue pasting jig;

[0014] Fig. 2 It is the structure schematic drawing of the jig base plate of the utility model kind of flexible circuit board 3M glue pasting jig;

[0015] Fig. 3 It is the structure schematic drawing of the jig unloading plate of the utility model kind of flexible circuit board 3M glue pasting jig;

[0016] Fig. 4 It is the structure schematic drawing of the silica gel buffer pad of the utility model kind of flexible circuit board 3M glue pasting jig.

[0017] Reference: 1 - fixture bottom plate; 2 - fixture unloading plate; 3 - silica gel buffer pad; 4 - flexible circuit board; 5 - 3M glue; 6 - lower end component; 7 - upper end component; 11 - bottom plate fixture positioning hole; 12 - bottom plate product positioning hole; 13 - bottom plate component avoiding hole; 21 - unloading plate fixture positioning hole; 22 - unloading plate product positioning hole; 23 - unloading plate component avoiding hole; 31 - buffer pad fixture positioning hole; 32 - buffer pad product positioning hole; 33 - buffer pad component avoiding hole; 34 - laser coordinate positioning hole. DETAILED DESCRIPTION

[0018] In the description of the present application, it should be understood that, if there is a description of orientation, for example, the orientation or position relationship indicated by the upper, lower, front, rear, left, right and the like, the orientation description can be based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element indicated must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0019] In the description of the present application, if there is a description of quantity, the meaning of several is one or more, the meaning of multiple is more than two, greater than, less than, more than, etc. are understood as not including the number, above, below, within, etc. are understood as including the number. If the first, second is described, it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or implicitly indicating the order of indicated technical features.

[0020] In the description of the present application, unless otherwise explicitly limited, the words such as setting, installing, connecting, etc. should be broadly understood, and the person skilled in the art can reasonably determine the specific meaning of the above words in the present application in combination with the specific content of the technical scheme.

[0021] As Figs. 1 to 4The utility model discloses a kind of 3M glue jigs of flexible circuit board, including jig bottom plate 1, jig unloading plate 2 and silica gel buffer pad 3, jig bottom plate 1 plays the supporting role, the jig unloading plate 2 is installed on jig bottom plate 1 upper end, jig unloading plate 2 is used to facilitate taking material, the silica gel buffer pad 3 is installed flexible circuit board 4 between the jig unloading plate 2, silica gel buffer pad 3 can play the role of false pressure buffering protection, the flexible circuit board 4 is multiple, and it is spliced into a flexible circuit board 4 splicing board, the jig bottom plate 1 is rectangular structure, and product corresponding area is equipped in middle part, the jig bottom plate 1 is located on the four corners of the product corresponding area periphery upper end and is equipped with one bottom plate jig positioning hole 11, the product corresponding area is equipped with a plurality of bottom plate device avoidance hole 13 with the lower end device of the flexible circuit board 4 adaptation, the jig bottom plate 1 is located on the product corresponding area both ends and is equipped with a row of bottom plate product positioning hole 12, the jig unloading plate 2 is rectangular structure, and product placing area is equipped in middle part, the jig unloading plate 2 is also equipped with unloading plate jig positioning hole 21, unloading plate device avoidance hole 23 and unloading plate product positioning hole 22 respectively corresponding with the bottom plate jig positioning hole 11 position, bottom plate device avoidance hole 13 position and bottom plate product positioning hole 12 position, the unloading plate device avoidance hole 23 and bottom plate device avoidance hole 13 are used to avoid flexible circuit board 4 lower end component 6, the silica gel buffer pad 3 middle part is equipped with a plurality of buffer pad device avoidance hole 33 with the upper end device of the flexible circuit board 4 adaptation, the buffer pad device avoidance hole 33 is used to avoid flexible circuit board 4 upper end component 7, the silica gel buffer pad 3 is also equipped with buffer pad jig positioning hole 31 and buffer pad product positioning hole 32 respectively corresponding with the bottom plate jig positioning hole 11 position and bottom plate product positioning hole 12 position.

[0022] When using, first, positioning needle is installed in bottom plate jig positioning hole 11 and bottom plate product positioning hole 12 respectively, then, jig unloading plate 2 is installed on jig bottom plate 1 upper end, at this time, unloading plate jig positioning hole 21 and the unloading plate product positioning hole 22 on jig unloading plate 2 are sleeved on corresponding positioning needle, then, flexible circuit board 4 splicing board is sleeved on jig unloading plate 2 upper end according to positioning hole, then, 3M glue 5 is pasted on product according to specified position, then, silica gel buffer pad 3 is covered on flexible circuit board 4 pasted with 3M glue 5, finally, the jig is put into false pressure machine false pressure, and bubble of 3M glue 5 is completely driven out, to prevent tearing off type paper when glue is taken up.

[0023] The utility model passes through setting jig bottom plate 1 and jig unloading plate 2 to carry out effective location to flexible line board, effectively solve the problem of inaccurate assembly alignment, and its simple structure, convenient operation can guarantee the stable quality of pasting 3M glue 5, reduce the production difficulty, improve the reliability of product, through the jig, the product after pasting glue can be operated false pressure, so as to discharge bubble, guarantee product pass rate.

[0024] In this invention, the silicone buffer pad 3 is further provided with multiple laser coordinate positioning holes 34 on its periphery for laser positioning.

[0025] In this utility model, the fixture base plate 1 is a fiberglass board, and the thickness of the fixture base plate 1 is 4mm.

[0026] In this utility model, the jig unloading plate 2 is a fiberglass board, and the thickness of the jig unloading plate 2 is 1.6mm.

[0027] In this invention, the jig unloading plate 2 is 10-20mm larger on one side than the jig base plate 1, making it easier to remove the jig unloading plate 2.

[0028] In this utility model, the positioning hole 21 of the unloading plate fixture and the positioning hole 22 of the unloading plate product are larger than the positioning hole 11 of the bottom plate fixture and the positioning hole 12 of the bottom plate product, which facilitates the loading of the unloading plate.

[0029] In this invention, the outer edges of both the fixture base plate 1 and the fixture unloading plate 2 are provided with chamfered structures to prevent scratching of operators.

[0030] In this invention, the flexible circuit board 4 is provided with adhesive positioning holes, which can ensure the accurate position of adhesive application and further ensure the yield of the product.

[0031] This utility model has a simple structure, is easy to operate, reduces production difficulty, and improves the product qualification rate.

[0032] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of the present invention, and all such modifications and substitutions should be considered within the protection scope of the present invention.

Claims

1. A fixture for applying 3M adhesive to flexible circuit boards, characterized in that: The fixture includes a base plate, a jig unloading plate, and a silicone buffer pad. The unloading plate is mounted on the upper part of the base plate. A flexible circuit board is installed between the silicone buffer pad and the unloading plate. The base plate is rectangular and has a product corresponding area in the center. A base plate jig positioning hole is located at each of the four corners of the product corresponding area. The product corresponding area has multiple base plate component clearance holes adapted to the lower components of the flexible circuit board. A row of base plate product positioning holes is located at both ends of the product corresponding area. The jig unloading plate has a rectangular structure with a product placement area in the middle. The jig unloading plate also has unloading plate jig positioning holes, unloading plate component clearance holes, and unloading plate product positioning holes that correspond to the positions of the base plate jig positioning holes, the base plate component clearance holes, and the base plate product positioning holes, respectively. The silicone buffer pad has multiple buffer pad component clearance holes in the middle that are adapted to the upper components of the flexible circuit board. The silicone buffer pad also has buffer pad jig positioning holes and buffer pad product positioning holes that correspond to the positions of the base plate jig positioning holes and the base plate product positioning holes, respectively.

2. The 3M adhesive bonding fixture for flexible circuit boards according to claim 1, characterized in that: The silicone buffer pad is also provided with multiple laser coordinate positioning holes on its outer perimeter.

3. The 3M adhesive bonding fixture for flexible circuit boards according to claim 2, characterized in that: The fixture base plate is made of fiberglass board, and the thickness of the fixture base plate is 4mm.

4. The 3M adhesive bonding fixture for flexible circuit boards according to claim 3, characterized in that: The jig unloading plate is made of fiberglass board and has a thickness of 1.6 mm.

5. The 3M adhesive bonding fixture for flexible circuit boards according to claim 4, characterized in that: The unloading plate of the fixture is 10-20mm larger on one side than the base plate of the fixture.

6. The 3M adhesive bonding fixture for flexible circuit boards according to claim 5, characterized in that: The positioning holes of the unloading plate fixture and the product positioning holes of the unloading plate are respectively larger than the positioning holes of the base plate fixture and the product positioning holes of the base plate.

7. The 3M adhesive bonding fixture for flexible circuit boards according to claim 6, characterized in that: Both the base plate of the fixture and the unloading plate of the fixture have chamfered edges.

8. The 3M adhesive bonding fixture for flexible circuit boards according to claim 1, characterized in that: The flexible circuit board is provided with adhesive positioning holes.