Device for remotely delivering waste etching liquid and / or regenerated etching sub-liquid of circuit board

Abstract

The utility model discloses a device for remotely delivering circuit board waste etching liquid and / or regenerated etching sub-liquid, which comprises a regenerated etching sub-liquid receiving tank, a waste etching liquid storage tank, a regenerated etching sub-liquid storage tank and a waste etching liquid receiving tank, the regenerated etching sub-liquid receiving tank and the etching waste liquid storage tank are respectively connected with an etching machine in a production workshop through pipelines, and the etching waste liquid receiving tank and the regenerated etching sub-liquid storage tank are respectively connected with the etching waste liquid copper recovery cyclic regeneration etching sub-liquid equipment at the distance through pipelines; the regenerated etching sub-liquid receiving tank is connected with the distant regenerated etching sub-liquid storage tank through a remote delivery pipeline, and the etching waste liquid storage tank is connected with the distant etching waste liquid receiving tank through a remote delivery pipeline which is provided with two or more than two booster pumps in a segmented manner. According to the utility model, the problem of safety risk existing in a solution remote delivery device between the etching machine and the etching waste liquid copper recovery cyclic regeneration etching sub-liquid equipment at present can be solved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the process technical field of circuit board etching waste liquid recycling, and particularly relates to a device for remotely delivering circuit board etching waste liquid and / or regenerated etching sub-liquid. BACKGROUND

[0002] In the etching production process of the circuit board, the operating workers continuously put the circuit board needing to be etched with copper into the etching machine for processing and treatment of etching copper. With the workers continuously putting the copper plate for etching, the copper ion concentration of the etching working liquid in the etching machine is increased and the etching rate is slowed down. In order to maintain the performance stability of the etching working liquid, it is necessary to timely add the etching sub-liquid to the etching machine to maintain the original performance of the etching liquid. In the acidic etching process, the main components of the etching sub-liquid are a mixed solution of hydrochloric acid and chlorides, and in the alkaline etching process, the main components of the etching sub-liquid are a mixed solution of ammonia and ammonium chloride. Because the production of the etching sub-liquid will cause the etching working liquid to overflow out of the machine, it is called etching waste liquid in the industry.

[0003] The main components of the acidic etching waste liquid are hydrochloric acid and copper chloride. Currently, people often adopt electrolysis to recover the metal copper and / or use the waste liquid and oxalic acid to recover copper salt. After the extraction of the metal copper and / or the copper salt, the remaining acid solution can be directly or newly adjusted to be used as the regenerated etching sub-liquid and put back into the etching machine for recycling. The main components of the alkaline etching waste liquid are ammonia, ammonium chloride and copper ammonium chloride double salt. The existing recovery process is to use the extraction and electrolysis process to obtain the metal copper or directly use the electrolysis method to obtain the metal copper or use the neutralization and precipitation method to obtain the copper salt. After the extraction of the metal copper and / or the copper salt, the remaining ammonia alkaline solution can be directly or adjusted to be used as the regenerated etching sub-liquid for recycling. Through the treatment of the recovery process equipment, the environmental pollution can be reduced and the production cost can be reduced in recycling.

[0004] The planning and design of the circuit board production plant are generally to separate the production workshop and the waste liquid treatment workshop by a long distance. The etching line is generally placed in the etching production workshop, and the waste liquid copper recovery and recycling etching sub-liquid equipment is generally set in the waste liquid treatment workshop, or some manufacturers also set the waste liquid copper recovery and recycling etching sub-liquid equipment and the etching machine in the same workshop but with a long distance. Therefore, the treatment of the etching waste liquid and the recycling of the etching regenerated sub-liquid both need to be remotely delivered. To solve the remote delivery, the current method is to use a high-power pump and a thick-diameter conveying pipeline to increase the equipment investment cost. Although the equipment is optimized and improved, according to the existing technology, the solution delivered by a long distance will still be easily broken and leaked due to the large impact pressure of the liquid flow, causing the safety production accident of the chemical corrosion liquid.

[0005] The utility model discloses to the safety problem of remote delivery of etching waste liquid from the production workshop to the etching waste liquid copper recovery and cyclic regeneration etching sub-liquid equipment for environmental protection treatment or the remote return of regenerated etching sub-liquid to the etching machine in the production workshop for recycling, application novel remote delivery device reduces the security loophole of equipment. Utility model content

[0006] The utility model discloses a kind of new devices for remote delivery of circuit board etching waste liquid and / or etching regenerated sub-liquid, to solve the security risk problem existing in the solution remote delivery device between current etching machine and etching waste liquid copper recovery and cyclic regeneration etching sub-liquid equipment.

[0007] The utility model discloses the purpose by the following improved device technical scheme is realized:

[0008] A kind of device for remote delivery of circuit board etching waste liquid and / or regenerated etching sub-liquid, characterized in that: including regenerated etching sub-liquid receiving tank, etching waste liquid storage tank, regenerated etching sub-liquid storage tank and etching waste liquid receiving tank, wherein regenerated etching sub-liquid receiving tank and etching waste liquid storage tank are connected with etching machine in production workshop by pipeline or pipeline with infusion pump respectively, etching waste liquid receiving tank and regenerated etching sub-liquid storage tank are connected with etching waste liquid copper recovery and cyclic regeneration etching sub-liquid equipment at a distance by pipeline or pipeline with infusion pump respectively, regenerated etching sub-liquid receiving tank and regenerated etching sub-liquid storage tank at a distance are connected by remote delivery pipeline with two or more than two booster pumps installed in section respectively, and etching waste liquid storage tank and etching waste liquid receiving tank at a distance are connected by remote delivery pipeline with two or more than two booster pumps installed in section respectively.

[0009] The number of remote delivery pipeline or the number of etching machine and each tank connection pipeline or the number of etching waste liquid copper recovery and cyclic regeneration etching sub-liquid equipment and each tank connection pipeline is not limited in the device.

[0010] The receiving tank is set in the solution outflow port of some end of remote delivery pipeline, and requires that the solution flowing out of pipeline is flowed into tank, then it is called receiving tank.

[0011] The circuit board etching machine is the etching machine of present market product.

[0012] According to the prior art, the copper recovery and recycling etching sub-liquid equipment for the acid etching waste liquid includes electrolytic copper recovery and recycling etching sub-liquid equipment, oxalic acid copper salt recovery and recycling etching sub-liquid equipment, and electrolytic and oxalic acid combined copper and / or copper salt recovery and recycling etching sub-liquid equipment; the copper recovery and recycling etching sub-liquid equipment for the alkaline etching waste liquid includes extraction metal copper and / or copper salt recovery and recycling etching sub-liquid equipment, direct electrolytic metal copper recovery and recycling etching sub-liquid equipment and neutralization precipitation copper salt recovery and recycling etching sub-liquid equipment.

[0013] The tank materials are glass fiber reinforced plastic tank, high polymer resin tank, anticorrosive material lined tank, stainless steel tank and titanium metal tank, and the selection of the materials is based on the chemical properties of the loaded solution and the process performance requirements of corrosion resistance.

[0014] The materials of the pipes connected with the remote delivery pipeline or the etching machine and the pipes connected with the tanks of the copper recovery and recycling etching sub-liquid equipment are stainless steel, anticorrosive material lined steel pipe, high polymer resin material pipe, titanium pipe and glass fiber reinforced plastic pipe.

[0015] The infusion pump and the booster pump are market products, and the pump meets the process performance requirements of corrosion resistance for the pumped liquid, and the variable frequency pump that can change the flow rate can be selected according to the working condition change.

[0016] The remote delivery pipeline is provided with at least one pipe pressure gauge.

[0017] The booster pump of the remote delivery pipeline is provided with a motor detection ammeter, and the booster pump stops working when the current value is not in the normal range.

[0018] At least one or more pipe flow meters are installed on the remote delivery pipeline to monitor the solution flow condition in the remote delivery pipeline and ensure safety production.

[0019] A liquid level meter is installed in the tank connected with the remote delivery pipeline to control the solution.

[0020] The device can ensure safe delivery of the remote delivery solution.

[0021] The utility model can also be improved as follows: add overflow buffer groove, set up the overflow buffer groove respectively at the etching waste liquid output port of etching machine and / or the regeneration etching sub-liquid output port of etching waste liquid copper recovery and cyclic regeneration etching sub-liquid equipment, and make the solution controllable flow between the grooves.

[0022] The utility model can also be improved as follows: add solid-liquid separator, and the solid-liquid separator is used for solid-liquid separation of the remote delivery solution, and reduces solid accumulation in the pipeline and damage to the pump.

[0023] The utility model can also be improved as follows: add sensor in the remote delivery pipeline or etching waste liquid receiving groove or etching waste liquid storage groove, regeneration etching sub-liquid receiving groove or regeneration etching sub-liquid storage groove, and the sensor is at least one of acidimeter, thermometer, pH meter, ORP meter, liquid level meter, densimeter, solution flow detection meter and chlorine gas detector.In the process program and production safety, auxiliary control is made.

[0024] The utility model can also be improved as follows: the operation method of the booster pump on the remote delivery pipeline is from the near flow to the remote place according to the liquid flow direction, and the booster pump is started from the most remote booster pump, then the booster pump of the second remote place is started, and finally the booster pump of the nearest place is started, when the booster pump is stopped, the booster pump of the nearest place is stopped first, then the booster pump of the second nearest place is stopped, and finally the booster pump of the most remote place is stopped, and the improved operation method can reduce the pipeline pressure.

[0025] The utility model can also be improved as follows: add tail gas environmental protection treatment groove, and reduce the chemical corrosion liquid overflow tail gas pollution in the flow.

[0026] The utility model can also be improved as follows: the installation of the pipeline avoids the pipeline elbow connection mode less than or equal to the vertical 90 angle, so that the solution in the pipeline flows smoothly.

[0027] Compared with the prior art, the utility model has the following beneficial effects:

[0028] 1、 the utility model installs booster pump on the remote delivery pipeline in sections, avoids using high-power pump, and causes the safety problem of pipeline leakage corrosion liquid caused by easy pipe breakage.

[0029] 2、The device can reduce the damage caused by the direct large impact of solution flow to the equipment after use. BRIEF DESCRIPTION OF DRAWINGS

[0030] Figure 1 It is a structural principle schematic view of the device for remotely delivering the circuit board etching waste liquid and / or regenerated etching sub-liquid of the embodiment 1 of the utility model;

[0031] Figure 2 It is a structural principle schematic view of the device for remotely delivering the circuit board etching waste liquid and / or regenerated etching sub-liquid of the embodiment 2 of the utility model;

[0032] Figure 3 It is a structural principle schematic view of the device for remotely delivering the circuit board etching waste liquid and / or regenerated etching sub-liquid of the embodiment 3 of the utility model;

[0033] Figure 4 It is Figure 3 It is an enlarged view of the figure in the A block in the figure;

[0034] Figure 5 It is Figure 3 It is an enlarged view of the figure in the B block in the figure.

[0035] REFERENCE SIGNS:

[0036] 1, 1-1, 1-2-etching machine; 2-etching waste liquid storage tank; 3-etching waste liquid receiving tank; 4-regenerated etching sub-liquid storage tank; 5-regenerated etching sub-liquid receiving tank; 6-1, 6-2, 6-3, 6-4, 6-5, 6-6, 6-7, 6-8-boosting pump; 7-1, 7-2, 7-3, 7-4-remote delivery pipeline; 8-1, 8-2, 8-3, 8-4-pipeline pressure gauge; 9-1, 9-2, 9-3, 9-4-motor detection ammeter; 10-1, 10-2, 10-3, 10-4, 10-5, 10-6, 10-7-sensor; 11-program logic controller; 12-temporary storage tank; 13-solid-liquid separator; 14-cold and hot temperature exchanger; 15-vacuum jet; 16-spraying tower; 17-1, 17-2-overflow buffer tank; 18-tail gas environmental protection treatment tank; 19-valve; 20-1, 20-2, 20-3, 20-4, 20-5, 20-6-ordinary pump; 21-etching working liquid; 22-etching waste liquid; 23-etching regenerated sub-liquid; 23-oxidized gas produced by recovery machine; 24-agitator; 25-etched circuit board; 26-etching waste liquid copper recovery and recycling regenerated etching sub-liquid equipment; 27-1, 27-2, 27-3, 27-4-pipeline flow meter. DETAILED DESCRIPTION

[0037] The technical solution of this utility model will be described in detail below with reference to specific embodiments, so that those skilled in the art can better understand and implement it.

[0038] In the following embodiments, the etching waste copper recovery and recycling equipment, temporary storage tank, and solid-liquid separator used are all products manufactured by Foshan Yegao Environmental Protection Equipment Manufacturing Co., Ltd., Guangdong Province. Sensors, PLCs, etching machines, valves, pumps, ammeters, pressure gauges, heat exchangers, and chemical raw materials are all commercially available products. Besides those listed above, those skilled in the art can also choose other products with similar performance to those listed in this utility model, based on conventional selection, to achieve the purpose of this utility model. Example

[0039] like Figure 1 The image shows an embodiment 1 of a device for remotely discharging circuit board etching waste liquid and / or regenerated etching sub-liquid according to the present invention. It includes an etching waste liquid storage tank 2, an etching waste liquid receiving tank 3, a regenerated etching sub-liquid storage tank 4, a regenerated etching sub-liquid receiving tank 5, four booster pumps 6-1, 6-2, 6-3, and 6-4 installed on remote discharging pipelines, two remote discharging pipelines 7-1 and 7-2, and two ordinary pumps 20-1 and 20-2. In use, the device is connected to an etching machine 1 and an etching waste liquid copper recovery and recycling equipment 26 for regenerating etching sub-liquid.

[0040] In this embodiment, the etching working solution 21 in the etching machine 1 is an acidic etching solution for circuit boards, and its main components are a mixture of hydrochloric acid and copper chloride.

[0041] The etching waste copper recycling and regeneration etching sub-liquid equipment 26 in this embodiment is an acid etching waste copper recycling and etching sub-liquid regeneration equipment using the electrolytic method.

[0042] The etching waste liquid outlet of etching machine 1 is connected to the etching waste liquid inlet of etching waste liquid storage tank 2 via a pipeline. The etching waste liquid outlet of etching waste liquid storage tank 2 is connected to the etching waste liquid inlet of etching waste liquid receiving tank 3 via a remote delivery pipeline 7-2. The etching waste liquid outlet of etching waste liquid receiving tank 3 is connected to the etching waste liquid inlet of etching waste liquid copper recycling and regeneration etching sub-liquid device 26 via a pipeline. The regenerated etching sub-liquid outlet of etching waste liquid copper recycling and regeneration etching sub-liquid device 26 is connected to the regenerated etching sub-liquid inlet of regenerated etching sub-liquid storage tank 4 via a pipeline. The regenerated etching sub-liquid outlet of regenerated etching sub-liquid storage tank 4 is connected to the regenerated etching sub-liquid inlet of regenerated etching sub-liquid receiving tank 5 via a remote delivery pipeline 7-1. The regenerated etching sub-liquid outlet of regenerated etching sub-liquid receiving tank 5 is connected to the regenerated etching sub-liquid inlet of etching machine 1 via a pipeline.

[0043] Two booster pumps 6-4, 6-2 are installed on the remote delivery pipeline 7-1 in segments, i.e. the installation positions of the two booster pumps 6-4, 6-2 are separated by a set distance and installed at different segment positions, thereby segmentally propelling the liquid in the remote delivery pipeline 7-1. Two booster pumps 6-1, 6-3 are installed on the remote delivery pipeline 7-2 in segments, i.e. the installation positions of the two booster pumps 6-4, 6-2 are separated by a set distance and installed at different segment positions, thereby segmentally propelling the liquid in the remote delivery pipeline 7-2. By installing booster pumps in segments, the problem of pipeline breakage and leakage of corrosive liquid caused by using high-power pumps can be well avoided.

[0044] In addition, the common pump 20-2 is arranged on the pipeline connecting the etching waste liquid output port of the etching waste liquid receiving tank 3 and the etching waste liquid input port of the etching waste liquid copper recovery and recycling regeneration etching sub-liquid device 26, and the common pump 20-1 is arranged on the pipeline connecting the regenerated etching sub-liquid output port of the regenerated etching sub-liquid receiving tank 5 and the regenerated etching sub-liquid input port of the etching machine 1.

[0045] The operation steps of the circuit board etching waste liquid and / or regenerated etching sub-liquid remote delivery device are as follows:

[0046] 1. Etching working liquid is respectively fed into the etching machine 1, etching waste liquid is fed into the etching waste liquid storage tank 2 and the etching waste liquid receiving tank 3, regenerated etching sub-liquid is fed into the regenerated etching sub-liquid storage tank and the regenerated etching sub-liquid receiving tank, and etching waste liquid is fed into the etching waste liquid copper recovery and recycling regeneration etching sub-liquid device 26.

[0047] 2. The booster pumps 6-3 and 6-2 are started first, and then the booster pumps 6-1 and 6-4 are started, so that the solution in the remote delivery pipelines 7-1, 7-2 flows smoothly, and the etching machine 1, the etching waste liquid copper recovery and recycling regeneration etching sub-liquid device 26 and other common pumps 20-1, 20-2 are started.

[0048] 3. The etching circuit board 25 is continuously fed into the etching machine, the etching waste liquid produced is continuously flowed into the etching waste liquid receiving tank 3 through the remote delivery pipeline 7-2, and the etching waste liquid is continuously fed into the etching waste liquid copper recovery and recycling regeneration etching sub-liquid device 26 to produce regenerated etching sub-liquid, which is transported back to the etching machine 1 through the remote delivery pipeline 7-1 for recycling.

[0049] 4. The operation of the device is manually monitored to ensure normal production. Embodiment

[0050] As Figure 2As shown, it is the embodiment 2 of the device for remotely delivering line board etching waste liquid and / or regenerated etching sub-liquid, which comprises an etching waste liquid storage tank 2, an etching waste liquid receiving tank 3, a regenerated etching sub-liquid storage tank 4, a regenerated etching sub-liquid receiving tank 5, six booster pumps 6-1, 6-2, 6-3, 6-4, 6-5, 6-6 installed on remote delivery pipelines, two remote delivery pipelines 7-1, 7-2, six sensors 10-1, 10-2, 10-3, 10-4, 10-5, 10-6, a solid-liquid separator 13, two overflow buffer tanks 17-1, 17-2, a vacuum jet device 15, a tail gas environmental protection treatment tank 18, six ordinary pumps 20-1, 20-2, 20-3, 20-4, 20-5, 20-6, and the device is connected with an etching machine 1 and an etching waste liquid copper recovery and regenerated etching sub-liquid equipment 26.

[0051] The etching working liquid 21 in the etching machine 1 of the embodiment is a line board alkaline etching liquid, and the main components are a mixed liquid of ammonia, ammonium chloride and cupric ammonium chloride.

[0052] The etching waste liquid copper recovery and regenerated etching sub-liquid equipment 26 of the embodiment is an alkaline etching waste liquid direct electrolysis method for recovering metal copper and regenerating etching sub-liquid equipment. Oxygen is precipitated in the anode tank area of the electrolytic tank during the electrolytic treatment of the etching waste liquid.

[0053] The sensors 10-1, 10-2, 10-5 and 10-6 of the embodiment are liquid level meters, and the sensors 10-3 and 10-4 are solution flow detection meters.

[0054] The vacuum jet device 15 of the embodiment is used for sucking oxygen precipitated in the operation and treatment process of the etching waste liquid copper recovery and regenerated etching sub-liquid equipment.

[0055] The etching waste liquid output of the etching machine 1 is connected with the etching waste liquid input of the overflow buffer tank 17-1 through a pipeline, the etching waste liquid output of the overflow buffer tank 17-1 is connected with the etching waste liquid input of the etching waste liquid storage tank 2 through a pipeline, a common pump 20-1 and a solid-liquid separator 13 are arranged on the pipeline, the etching waste liquid output of the etching waste liquid storage tank 2 is connected with the etching waste liquid input of the etching waste liquid receiving tank 3 through a remote delivery pipeline 7-1, the etching waste liquid output of the etching waste liquid receiving tank 3 is connected with the etching waste liquid input of the etching waste liquid copper recovery and recycling regeneration etching sub-liquid equipment 26 through a pipeline, a common pump 20-3 is arranged on the pipeline, the regenerated etching sub-liquid output of the etching waste liquid copper recovery and recycling regeneration etching sub-liquid equipment 26 is connected with the regenerated etching sub-liquid storage tank 4 through a vacuum jet 15, the overflow port of the etching waste liquid copper recovery and recycling regeneration etching sub-liquid equipment 26 is connected with the overflow buffer tank 17-2, the etching waste liquid output of the overflow buffer tank 17-2 is connected with the regenerated etching sub-liquid storage tank 4 through a pipeline, a common pump 20-5 is arranged on the pipeline, the regenerated etching sub-liquid output of the regenerated etching sub-liquid storage tank 4 is connected with the regenerated etching sub-liquid input of the regenerated etching sub-liquid receiving tank 5 through a remote delivery pipeline 7-2, the regenerated etching sub-liquid output of the regenerated etching sub-liquid receiving tank 5 is connected with the regenerated etching sub-liquid input of the etching machine 1 through a pipeline, and a common pump 20-2 is arranged on the pipeline.

[0056] Three booster pumps 6-1, 6-3 and 6-4 are arranged on the remote delivery pipeline 7-1 in sections, and the liquid in the remote delivery pipeline 7-1 is pushed in sections, three booster pumps 6-6, 6-5 and 6-2 are arranged on the remote delivery pipeline 7-2 in sections, and the liquid in the remote delivery pipeline 7-2 is pushed in sections. By arranging the booster pumps in sections, the safety problem of pipeline leakage and corrosion caused by using a high-power pump can be well avoided.

[0057] In addition, sensors 10-4 and 10-3 are arranged on the remote delivery pipelines 7-1 and 7-2 respectively.

[0058] The gas generated by the etching machine 1, the etching waste liquid storage tank 2, the etching waste liquid receiving tank 3, the regenerated etching sub-liquid storage tank 4 and the regenerated etching sub-liquid receiving tank 5 will be treated through the tail gas environmental protection treatment tank 18.

[0059] The operation steps of the line board etching waste liquid and / or regenerated etching sub-liquid remote delivery device of the embodiment are as follows:

[0060] 1, etching working liquid 21 is respectively input into the etching machine 1, etching waste liquid is input into the etching waste liquid storage tank 2 and the etching waste liquid receiving tank 3, regenerated etching sub-liquid is input into the regenerated etching sub-liquid storage tank 4 and the regenerated etching sub-liquid receiving tank 5, and etching waste liquid is input into the etching waste liquid copper recovery and recycling regeneration etching sub-liquid equipment 26.

[0061] 2, First start booster pump 6-2 and 6-4, immediately start booster pump 6-3 and 6-5, finally start booster pump 6-1 and 6-6, make the solution in the remote delivery pipe 7-1, 7-2 flow smoothly, start etching machine 1 and etching waste liquid copper recovery and regeneration of etching sub-liquid equipment 26 and other ordinary pump 20-1, 20-2, 20-3, 20-4, 20-5, 20-6.

[0062] 3, continuously into the etching machine 1 etching circuit board 25, the output of etching waste liquid continuously through the remote delivery pipe 7-1 into the etching waste liquid receiving tank 3, the sensor 10-4 (solution flow detection meter) installed on the remote delivery pipe 7-1 has signal output for normal, another etching waste liquid to etching waste liquid copper recovery and regeneration of etching sub-liquid equipment 26 into the output of regenerated etching sub-liquid, its regenerated etching sub-liquid is transported back to the regenerated etching sub-liquid receiving tank 5 through the remote delivery pipe 7-2 for recycling, the sensor 10-3 (solution flow detection meter) installed on the remote delivery pipe 7-2 has signal output for normal.

[0063] 4, artificial monitoring device operation to make the production normal. Embodiment

[0064] As Figure 3 shown, it is an embodiment 3 of the device for remote delivery of etching waste liquid and / or regenerated etching sub-liquid of the utility model. It contains etching waste liquid storage tank 2, etching waste liquid receiving tank 3, regenerated etching sub-liquid storage tank 4, regenerated etching sub-liquid receiving tank 5, eight booster pumps 6-1, 6-2, 6-3, 6-4, 6-5, 6-6, 6-7, 6-8 installed on the remote delivery pipe, four remote delivery pipes 7-1, 7-2, 7-3, 7-4, four pipe pressure gauges 8-1, 8-2, 8-3, 8-4, four motor detection ammeters 9-1, 9-2, 9-3, 9-4, seven sensors 10-1, 10-2, 10-3, 10-4, 10-5, 10-6, 10-7, program logic controller 11 (PLC), cold and hot temperature exchanger 14, two overflow buffer tank 17-1, 17-2, one agitator 24, four pipe flow meters 27-1, 27-2, 27-3, 27-4, six ordinary pumps 20-1, 20-2, 20-3, 20-4, 20-5, 20-6. The device of this embodiment is connected with two etching machines 1-1, 1-2 and etching waste liquid copper recovery and regeneration of etching sub-liquid equipment 26.

[0065] The etching working liquid 21 in the etching machine 1 of this embodiment is a circuit board acidic etching liquid, and the main component is a mixture of hydrochloric acid and copper chloride, which also contains iron chloride additive.

[0066] The equipment for recovering and regenerating copper from etching waste liquid in this embodiment is an acidic etching waste liquid oxalic acid method for recovering copper salts and regenerating etching solution. It utilizes the reaction of copper chloride in the etching waste liquid with oxalic acid to generate copper oxalate precipitate. The reactants are then separated into solid and liquid components to obtain copper oxalate filter residue and an acidic filtrate containing hydrochloric acid, a small amount of copper chloride, and ferric chloride. After impurity removal, the acidic filtrate is directly or after preparation to become regenerated etching solution, which is then recycled back into the etching machine.

[0067] In this embodiment, sensors 10-1, 10-2, 10-4, and 10-5 are level gauges, 10-3 is a thermometer, 10-6 is an acid meter for detecting the acidity of the regenerated etching solution, and 10-7 is a hydrometer for detecting the copper ion concentration of the regenerated etching solution.

[0068] In this embodiment, the etching waste liquid outlets of the two etching machines 1-1 and 1-2 are connected to the etching waste liquid inlet of the etching waste liquid storage tank 2 after passing through overflow buffer tanks 17-1 and 17-2, respectively. The etching waste liquid outlet of the etching waste liquid storage tank 2 is connected to the etching waste liquid inlet of the etching waste liquid receiving tank 3 through two remote delivery pipes 7-1 and 7-2. The etching waste liquid outlet of the etching waste liquid receiving tank 3 is connected to the etching waste liquid inlet of the etching waste liquid copper recovery and recycling etching sub-liquid equipment 26 through a pipe. The regenerated etching solution outlet of the copper recycling and regeneration equipment 26 is connected to the regenerated etching solution storage tank 4 via an overflow buffer tank 17-3. The regenerated etching solution outlet of the storage tank 4 is connected to the regenerated etching solution inlet of the receiving tank 5 via two remote delivery pipes 7-3 and 7-4. The regenerated etching solution outlet of the receiving tank 5 is connected to the regenerated etching solution inlet of the two etching machines 1-1 and 1-2 via two pipes respectively.

[0069] Two booster pumps, 6-1 and 6-6, are installed in sections on remote delivery pipeline 7-1 to propel the liquid in pipeline 7-1 in stages. Similarly, two booster pumps, 6-2 and 6-5, are installed in sections on remote delivery pipeline 7-2 to propel the liquid in pipeline 7-2 in stages. Two booster pumps, 6-8 and 6-4, are installed in sections on remote delivery pipeline 7-3 to propel the liquid in pipeline 7-3 in stages. Finally, two booster pumps, 6-7 and 6-3, are installed in sections on remote delivery pipeline 7-4 to propel the liquid in pipeline 7-4 in stages. This segmented installation of booster pumps effectively avoids the safety issues associated with using high-power pumps, which could lead to pipe rupture and leakage of corrosive liquids.

[0070] The operation steps of the device for remotely discharging circuit board etching waste liquid and / or regenerated etching sub-liquid in this embodiment are as follows:

[0071] 1. Power supply to the device, so that the automatic control system according to the data measured by each detector sends the program logic controller 11 for processing and controls the device to run.

[0072] 2. The etching machine 1-1, 1-2 is respectively put into the etching working solution, the etching waste liquid storage tank 2 and the etching waste liquid receiving tank 3 are put into the etching waste liquid, the regenerated etching sub-liquid storage tank 4 and the regenerated etching sub-liquid receiving tank 5 are put into the regenerated etching sub-liquid, and the etching waste liquid copper recovery and recycling etching sub-liquid equipment 26 is put into the etching waste liquid.

[0073] 3. First start the booster pump 6-3, 6-4, 6-5, 6-6, then start the booster pump 6-1, 6-2, 6-7, 6-8, make the solution in the remote delivery pipeline 7-1, 7-2, 7-3, 7-4 flow smoothly, start the etching machine 1 and the etching waste liquid copper recovery and recycling etching sub-liquid equipment 26 and other ordinary pumps 20-1, 20-2, 20-3, 20-4, 20-5, 20-6.

[0074] 4. Continuously put the etching circuit board 25 into the etching machine 1, the produced etching waste liquid is continuously put into the etching waste liquid receiving tank 3 through the remote delivery pipeline 7-1 and 7-2, and the etching waste liquid is continuously put into the etching waste liquid copper recovery and recycling etching sub-liquid equipment 26 to produce regenerated etching sub-liquid, which is transported back to the etching machine 1 through the remote delivery pipeline 7-3 and 7-4 for recycling.

[0075] 5. In the running process, the pipeline pressure gauges 8-1, 8-2, 8-3, 8-4 and motor detection ammeters 9-1, 9-2, 9-3, 9-4 installed on the remote delivery pipeline 7-1, 7-2, 7-3, 7-4 are detected in real time, and the detection data of other sensors are transmitted to the program logic controller 11 for processing, and the device runs according to the pre-program when the detection data is in the normal range.

Claims

1. A device for remotely discharging circuit board etching waste liquid and / or regenerated etching sub-liquid, characterized in that: It includes a regenerated etching solution receiving tank, an etching waste liquid storage tank, a regenerated etching solution storage tank, and an etching waste liquid receiving tank. The regenerated etching solution receiving tank and the etching waste liquid storage tank are connected to the etching machine in the production workshop through pipelines or pipelines with pumps. The etching waste liquid receiving tank and the regenerated etching solution storage tank are connected to a remote etching waste copper recycling and regenerating etching solution equipment through pipelines or pipelines with pumps. The regenerated etching solution receiving tank and the remote regenerated etching solution storage tank, as well as the etching waste liquid storage tank and the remote etching waste liquid receiving tank, are connected by remote delivery pipelines with two or more booster pumps installed in sections.

2. The device for remotely delivering circuit board etching waste liquid and / or regenerated etching sub-liquid according to claim 1, characterized in that: At least one pipeline pressure gauge is installed on the remote delivery pipeline.

3. The device for remotely discharging circuit board etching waste liquid and / or regenerated etching sub-liquid according to claim 1, characterized in that: An ammeter for motor detection is added to the booster pump installed on the remote delivery pipeline.

4. The device for remote delivery of circuit board etching waste liquid and / or regenerated etching sub-liquid according to claim 1, characterized in that: At least one pipeline flow meter is installed on the remote delivery pipeline.

5. The device for remotely delivering circuit board etching waste liquid and / or regenerated etching sub-liquid according to claim 1, characterized in that: The device for remotely delivering circuit board etching waste liquid and / or regenerated etching sub-liquid is equipped with an overflow buffer tank. The overflow buffer tank is installed at the etching waste liquid outlet of the etching machine and / or at the regenerated etching sub-liquid outlet of the etching waste liquid copper recycling and regeneration etching sub-liquid equipment.

6. The device for remotely discharging circuit board etching waste liquid and / or regenerated etching sub-liquid according to claim 1, characterized in that: Level gauges are installed in the grooves connecting the inlets and outlets at both ends of the remote delivery pipeline.

7. The device for remotely delivering circuit board etching waste liquid and / or regenerated etching sub-liquid according to claim 1, characterized in that: The device for remotely delivering circuit board etching waste liquid and / or regenerated etching sub-liquid is equipped with a solid-liquid separator, which is used to separate the solution delivered remotely.

8. The device for remotely delivering circuit board etching waste liquid and / or regenerated etching sub-liquid according to claim 1, characterized in that: A gas-liquid mixer is added to at least one of the etching waste liquid receiving tank, etching waste liquid storage tank, regenerated etching sub-liquid receiving tank, and regenerated etching sub-liquid storage tank.

9. The device for remotely discharging circuit board etching waste liquid and / or regenerated etching sub-liquid according to claim 1, characterized in that: The device for remotely delivering circuit board etching waste liquid and / or regenerated etching sub-liquid is equipped with an exhaust gas environmental protection treatment tank.

10. The apparatus for remotely discharging circuit board etching waste liquid and / or regenerated etching sub-liquid according to claim 1, characterized in that: The etching waste liquid copper recovery and recycling equipment is at least one of the following: electrolytic copper recovery and etching waste liquid regeneration equipment, oxalic acid copper salt recovery and etching waste liquid regeneration equipment, a combination of electrolytic and oxalic acid methods for copper and / or copper salt recovery and etching waste liquid regeneration equipment, extraction method for metallic copper and / or copper salt recovery and etching waste liquid regeneration equipment, direct electrolytic method for metallic copper recovery and etching waste liquid regeneration equipment, and neutralization precipitation method for copper salt recovery and etching waste liquid regeneration equipment.

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