Structure for feeding and discharging silicon wafer into and out of furnace
By incorporating a nitrogen fresh air system and a ceramic coating layer on the ceramic conveyor paddle, the problems of high friction and contamination during silicon wafer transport were solved, thus enabling safe silicon wafer transport.
Patent Information
- Application Number
- CN202423208070.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-25
- Publication Date
- 2025-11-21
- Estimated Expiration
- 2034-12-25
AI Technical Summary
In the prior art, silicon wafers are prone to microcracks due to high friction during the transfer process in the diffusion furnace, and their surfaces are easily contaminated by microparticles, leading to damage and contamination of the silicon wafers.
A nitrogen fresh air mechanism is set up on the moving path of the ceramic conveyor paddle to blow nitrogen gas onto the silicon wafer, while a ceramic coating layer is provided on the moving track to reduce friction.
It effectively prevents silicon wafers from being contaminated by microparticles during transport and reduces the possibility of microcracks and breakage.
Smart Images
Figure CN223580640U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to the technical field of semiconductor processing, especially relates to a silicon wafer in and out of furnace structure. BACKGROUND
[0002] In the semiconductor industry, the diffusion furnace used in the processing of silicon wafers is a key process equipment, which is mainly used for doping silicon wafers under high temperature conditions, so as to change and control the type, concentration and distribution of impurities in the semiconductor, so as to establish different electrical characteristic regions.
[0003] At present, the quartz boat carrying silicon wafers is usually sent into or out of the diffusion furnace through the ceramic conveying paddle, and since the friction between the ceramic conveying paddle and its track is large, it may cause the silicon wafers to crack, and before and after the process, since the silicon wafers are in contact with air for too long, the number of particles on the surface of the silicon wafers will increase, causing pollution. SUMMARY
[0004] Therefore, in view of the above technical problems, the utility model provides a silicon wafer in and out of furnace structure.
[0005] To solve the above technical problems, the utility model adopts the following technical scheme:
[0006] A silicon wafer in and out of furnace structure, which comprises a ceramic conveying paddle used for moving along a moving track to horizontally send silicon wafers into or out of a diffusion furnace, characterized in that it further comprises a nitrogen fresh air mechanism used for blowing nitrogen to the silicon wafers located on the ceramic conveying paddle, the nitrogen fresh air mechanism is arranged on at least one side of the moving path of the ceramic conveying paddle, and the blowing range thereof covers the entire moving path, and a ceramic coating layer is arranged on the moving track.
[0007] The utility model sets the nitrogen fresh air mechanism on the side of the moving path of the ceramic conveying paddle, the nitrogen fresh air mechanism can blow nitrogen to the silicon wafers located on the ceramic conveying paddle, so that the silicon wafers are not polluted by particles during the horizontal movement and transfer, and at the same time, the ceramic coating layer is arranged on the moving track of the ceramic conveying paddle, so as to reduce the friction with the ceramic conveying paddle, thereby reducing the possibility of cracking of the silicon wafers. BRIEF DESCRIPTION OF DRAWINGS
[0008] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model. DETAILED DESCRIPTION
[0009] The embodiments of the present application will be described below with reference to the accompanying drawings. It should be noted that the embodiments described in the present specification are not exhaustive, and do not represent the only embodiment of the present application. The following embodiments are only for the purpose of clearly illustrating the content of the present application, and are not a limitation on the embodiments. For those skilled in the art, based on the description of the embodiments, different forms of changes and modifications can be made, and any changes or modifications within the technical concept and content of the present application are within the protection scope of the present application.
[0010] As shown in Figure 1 , the present application provides a silicon wafer in-out furnace structure, which comprises an operation table 110, a ceramic conveying paddle 120 and a nitrogen fresh air mechanism 130.
[0011] The operation table 110 is used to place the Teflon boat and the quartz boat, and the silicon wafer is transferred between the Teflon boat and the quartz boat by manual or industrial robot, which is convenient for operation.
[0012] As shown in Figure 1 , the left side of the operation table 110 is connected with a side plate 111, and the top of the side plate 111 is connected with a top plate 112 located above the operation table 110. The top plate 112 can block the airflow in the workshop to avoid pollution to the silicon wafer.
[0013] The ceramic conveying paddle 120 is used to horizontally send the silicon wafer into or out of the diffusion furnace. The moving track 121 of the ceramic conveying paddle 120 is located on the right side of the side plate 111 and is fixed with the side plate 111. Under the drive of the boat pushing mechanism, the ceramic conveying paddle 120 can move horizontally forward and backward on the moving track 121. The moving track 121 determines the moving path of the ceramic conveying paddle 120. When the ceramic conveying paddle 120 moves horizontally to the front end of the moving track 121, the quartz boat loaded with the silicon wafer enters the diffusion furnace.
[0014] The moving track 121 is provided with a ceramic coating layer, which reduces the friction with the ceramic conveying paddle 120, thereby reducing the possibility of hidden cracks and broken pieces of the silicon wafer.
[0015] There are two nitrogen fresh air mechanisms 130. One nitrogen fresh air mechanism 130 is fixed on the side plate 111 and is used to blow nitrogen to the right on the silicon wafers located on the ceramic conveyor 120. The other nitrogen fresh air mechanism 130 is fixed on the top plate 112 and is used to blow nitrogen downward on the silicon wafers located on the ceramic conveyor 120. The blowing range of both nitrogen fresh air mechanisms 130 covers the entire moving path of the ceramic conveyor 120, so that the silicon wafers can be blown with nitrogen during the horizontal movement outside the diffusion furnace. At the same time, the table surface of the operating table 110 is also within the blowing range of the nitrogen fresh air mechanism 130, so that the silicon wafers can also be blown with nitrogen during the transfer between boats, thereby ensuring that the silicon wafers are not contaminated by microparticles during horizontal movement and transfer.
[0016] Understandably, one of the two nitrogen fresh air mechanisms 130 can be omitted, and only one side of the movement path of the ceramic conveyor paddle 120 can be purged.
[0017] The working principle of the silicon wafer loading and unloading structure in this embodiment is as follows:
[0018] When it comes out of the oven:
[0019] 1. Turn on the nitrogen fresh air system at 130 ten minutes in advance (to ensure air purification within the area);
[0020] 2: The ceramic conveyor paddle 120 moves from the front end of the moving track 121 ( Figure 1 The right end of the moving track 121 moves to the rear end ( Figure 1 (From the left end of the moving track 121), the quartz boat 2 carrying the silicon wafer is moved horizontally backward from the diffusion furnace to the initial position;
[0021] 3: After cooling down, place the quartz boat on the operating table 110.
[0022] 4. After completion, the silicon wafers are transferred to a Teflon boat and sent to the next process.
[0023] Steps 3 and 4 can be performed manually or by industrial robots.
[0024] When putting it into the furnace:
[0025] 1. Turn on the nitrogen fresh air system at 130 degrees Celsius ten minutes in advance;
[0026] 2: Place the Teflon boat carrying the silicon wafer on the operating table 110.
[0027] 3: Remove the silicon wafer from the Teflon boat and place it into the quartz boat, then move the quartz boat to the ceramic conveyor paddle 120;
[0028] Steps 2 and 3 can be performed manually or by industrial robots.
[0029] 4: The ceramic transfer paddle 120 moves from the rear end to the front end of the moving track 121, so that the quartz boat carrying the silicon wafer moves horizontally from the initial position to the diffusion furnace.
[0030] As can be seen from the above, the silicon wafer in-out furnace structure provided by the embodiments of the present application is provided with a nitrogen fresh air mechanism on the side of the moving path of the ceramic transfer paddle, the nitrogen fresh air mechanism can blow nitrogen to the silicon wafer located on the ceramic transfer paddle, so as to ensure that the silicon wafer will not be polluted by the micro-particles in the horizontal moving and transferring process, and the ceramic coating layer is arranged on the moving track of the ceramic transfer paddle, so as to reduce the friction with the ceramic transfer paddle, thereby reducing the possibility of the silicon wafer being cracked and broken.
[0031] Obviously, those skilled in the art should recognize that the above embodiments are only used to illustrate the present application, and are not used as the limitation of the present application, as long as the changes and variations of the above described embodiments are within the scope of the spirit of the present application, they will fall within the scope of the claims of the present application.
Claims
1. A structure for loading and unloading silicon wafers into and out of a diffusion furnace, comprising ceramic paddles for moving along a track to horizontally load and unload the wafers into and out of the furnace, characterized in that, The nitrogen fresh air mechanism is arranged on at least one side of the moving path of the ceramic transfer paddle and covers the whole moving path.
2. The structure for loading and unloading a silicon wafer into and out of a furnace according to claim 1, wherein An operation table for placing Teflon boats and quartz boats is arranged in the blowing range of the nitrogen fresh air mechanism.
3. The structure for loading and unloading a silicon wafer into and out of a furnace as recited in claim 2, wherein The operation table is provided with a side plate on the left or right side of the moving path, and the nitrogen fresh air mechanism for blowing nitrogen to the silicon wafer on the ceramic transfer paddle is fixed on the side plate.
4. The structure for loading and unloading a silicon wafer into and out of a furnace as defined in claim 3, wherein The top of the side plate is connected with a top plate above the operation table, and the nitrogen fresh air mechanism for blowing nitrogen downward to the silicon wafer on the ceramic transfer paddle is fixed on the top plate.
5. The structure for loading and unloading a silicon wafer into and out of a furnace as defined in claim 4, wherein The moving track of the ceramic transfer paddle is fixed on the side plate.