Glue-filled sealed micro electro mechanical system (MEMS) automobile pressure sensor

Abstract

The utility model discloses a glue-filled sealed micro electro mechanical system (MEMS) automobile pressure sensor, which belongs to the technical field of automobile pressure sensors and comprises a shell, a plurality of first contact pins are arranged on the outer side wall of the shell, and a plurality of second contact pins matched with the first contact pins are arranged on one side, close to the first contact pins, in the shell. The second pin is arranged at the bottom of the shell; wherein the first contact pins and the second contact pins are connected in a one-to-one correspondence manner; the circuit unit is connected with the inner bottom wall of the shell through circuit unit bonding glue and is electrically connected with the second contact pin; the circuit unit pouring sealant is arranged in the inner cavity of the shell and is positioned at the top of the circuit unit; and the connecting wire harness is in plug-in connection with the first pin through a wire harness connector. According to the utility model, the silicon piezoresistive MEMS flip-chip bonding pressure chip and the electronic component are subjected to glue pouring protection, so that the pressure sensor can be suitable for a high-temperature, high-humidity and high-corrosion working environment, and is good in durability and long in service life.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of automobile pressure sensor, concretely relates to a micro - machine - electric system automobile pressure sensor of glue sealing. BACKGROUND

[0002] The pressure sensitive unit of the commonly used pressure sensor has ceramic capacitor, ceramic piezoresistance, sputtering film, glass micro melting, MEMS etc. The ceramic capacitor and ceramic resistance can only adopt O ring sealing, cannot be compatible with multiple pressure media, there is long-term failure leakage risk under certain media, and the packaging volume is large. The glass micro melting sinters the sensing chip on the diaphragm with glass, and the process is complex, and the equipment investment is large. The sputtering film sputters the pressure sensing module on the base, and the equipment investment is large, the cost is high, and it is not widely popularized. UTILITY MODEL CONTENTS

[0003] In order to solve the above problems, the utility model adopts the following technical scheme:

[0004] A micro - machine - electric system automobile pressure sensor of glue sealing, comprising:

[0005] The outer side wall of the shell is provided with a plurality of first pins, the inner bottom wall of the shell is provided with a plurality of second pins matched with the first pins, and the second pins are arranged at the bottom of the shell; wherein the first pins and the second pins are connected one by one.

[0006] The circuit unit is connected with the inner bottom wall of the shell through the circuit unit adhesive, and is electrically connected with the second pin;

[0007] The circuit unit potting adhesive is arranged in the inner cavity of the shell and located at the top of the circuit unit.

[0008] The connection wire harness is inserted with the first pin through the wire harness connector.

[0009] Further, the circuit unit comprises a pressure module, a conditioning chip, a circuit substrate and electronic components.

[0010] The pressure module, the conditioning chip and the electronic components are arranged on the circuit substrate, and the side of the circuit substrate close to the pressure module is connected with the inner bottom wall of the shell.

[0011] Further, the periphery of the pressure module is further surrounded by a fence, and the fence is further provided with a protective glue; for realizing the protection of the pressure module.

[0012] Further, the fence is a cofferdam glue.

[0013] Further, the pressure module comprises a silicon piezoresistive MEMS flip-chip pressure chip and a ceramic adapter plate, the ceramic adapter plate is connected with the circuit substrate, and the silicon piezoresistive MEMS flip-chip pressure chip is arranged on the ceramic adapter plate; wherein the tin ball at the bottom of the silicon piezoresistive MEMS flip-chip pressure chip is used for realizing structural support and electrical signal connection.

[0014] Beneficial effects:

[0015] 1. The silicon piezoresistive MEMS flip-chip pressure chip and the electronic components are protected by glue filling, so that the utility model is applicable to high-temperature, high-humidity and high-corrosion working environment, has good durability and long service life.

[0016] 2. The utility model realizes sealing through circuit unit adhesion + overall potting process, has small leakage rate and high reliability.

[0017] 3. The utility model realizes electrical signal connection with the outside through the direct plug-in mode of the shell and the connector, and has the advantage of simple assembly. DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is a whole structure schematic diagram in the utility model;

[0019] Figure 2 It is a shell structure schematic diagram in the utility model Figure One ;

[0020] Figure 3 It is a shell structure schematic diagram in the utility model Figure Two ;

[0021] Figure 4 It is a sectional view of the automobile pressure sensor in the utility model;

[0022] 1, shell; 2, wire harness connector; 3, first pin; 4, second pin; 5, circuit unit potting glue; 6, circuit unit; 7, pressure module. DETAILED DESCRIPTION

[0023] In order to make the purpose, features and advantages of the utility model more obvious and easy to understand, the technical scheme in the utility model embodiment will be described clearly and completely in combination with the drawings in the utility model embodiment. Obviously, the following described embodiments are only a part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the protection scope of the utility model.

[0024] Embodiment 1

[0025] ReferenceFigures 1-4 A micro-electro-mechanical system automobile pressure sensor sealed by glue injection, comprising:

[0026] A shell 1, an outer side wall of the shell 1 is provided with a plurality of first pins 3, a side of the shell 1 close to the first pins 1 is provided with a plurality of second pins 4 matched with the first pins 1, and the second pins 4 are arranged at the bottom of the shell 1; wherein the first pins 3 and the second pins 4 are connected one by one.

[0027] A circuit unit 6, the circuit unit 6 is connected with the inner bottom wall of the shell 1 through a circuit unit adhesive, and is electrically connected with the second pins 4;

[0028] A circuit unit sealing glue 5, the circuit unit sealing glue 5 is arranged in the inner cavity of the shell 1 and is located at the top of the circuit unit 6.

[0029] A connection wire harness, the connection wire harness is plugged with the first pins 3 through a wire harness connector 2.

[0030] In the embodiment, the first pins and the second pins are provided with three, and the connection wire harness is provided with three.

[0031] Preferably, the circuit unit 6 comprises a pressure module 7, a conditioning chip, a circuit substrate and electronic components;

[0032] The pressure module 7, the conditioning chip and the electronic components are respectively arranged on the circuit substrate, and a side of the circuit substrate close to the pressure module 7 is connected with the inner bottom wall of the shell 1.

[0033] In the embodiment, the pressure module 7, the conditioning chip and the electronic components are all welded to the circuit substrate through a reflow welding process.

[0034] Preferably, a surrounding fence is further arranged around the pressure module 7, and a protective glue is further arranged in the surrounding fence; for realizing protection of the pressure module 7.

[0035] Preferably, the surrounding fence is a cofferdam glue.

[0036] Preferably, the pressure module 7 comprises a silicon piezoresistive MEMS flip-chip pressure chip and a ceramic adapter plate, the ceramic adapter plate is connected with the circuit substrate, and the silicon piezoresistive MEMS flip-chip pressure chip is arranged on the ceramic adapter plate; wherein the tin balls at the bottom of the silicon piezoresistive MEMS flip-chip pressure chip are used for realizing structural support and electrical signal connection.

[0037] In the embodiment, the silicon piezoresistive MEMS flip-chip pressure chip is welded to the ceramic adapter plate through a reflow welding process.

[0038] Embodiment 2

[0039] An automatic adjustment system adopts a kind of glue filling sealing micro-electro-mechanical system automobile pressure sensor in embodiment 1, and the micro-electro-mechanical system automobile pressure sensor is provided with multiple, is respectively installed on the back seat back, the back seat back upper headrest, the front seat back and the vehicle seat;

[0040] Including rear seat adjustment unit and sound field adjustment unit;

[0041] Rear seat adjustment unit includes:

[0042] Pressure signal acquisition module, pressure signal acquisition module is connected with the micro-electro-mechanical system automobile pressure sensor of back seat back, back seat back upper headrest, front seat back and vehicle seat respectively, for preliminary acquisition of passenger's body information and passenger's pressure information on seat;Pressure signal acquisition module is also connected with rear ground pressure sensor;

[0043] Micro-control module, micro-control module is connected with pressure signal acquisition module, for logical judgment and control decision according to the information data sent by received pressure signal acquisition module;

[0044] Adjustment action execution module, the input end of adjustment action execution module is connected with micro-control module, and the output end of adjustment action execution module is connected with adjustment action execution mechanism;For according to the control signal sent by micro-control module, corresponding control instruction is sent to adjustment action execution mechanism, and adjustment action execution mechanism is controlled to carry out pre-adjustment and accurate adjustment to automobile rear seat;

[0045] Sound field adjustment unit includes:

[0046] Sound field center positioning module, sound field center positioning module is connected with the micro-electro-mechanical system automobile pressure sensor of vehicle seat, for real-time detection of pressure on automobile seat, when detecting that pressure changes, then according to pressure change signal, passenger distribution information in vehicle body is determined, and the position of sound field center is determined according to passenger distribution information;

[0047] Sound field adjustment control module, sound field adjustment control module is connected with sound field center positioning module, for vehicle navigation multimedia terminal according to sound field center position, control adjustment audio DSP each audio channel delay proportion information and send to each audio channel through DAC conversion, and each audio channel according to the analog audio signal of delay proportion control loudspeaker sound production.

[0048] Preferably, micro-control module includes:

[0049] Data storage module, connected with pressure signal acquisition module, for storing the data collected by pressure signal acquisition module;

[0050] The data processing module is connected with the data storage module; the data processing module is a model based on a convolutional neural network, and is used for giving a parameter matching scheme according to real-time parameters of pressure collected by the pressure signal collection module stored in the data storage module;

[0051] The training module is connected with the data processing module and the data storage module, and is used for selecting optimal matching parameters between the real-time parameters collected by the data collection module through a genetic algorithm to form a parameter matching scheme uploaded to the data processing module for training.

[0052] The data processing module is connected with the data storage module; the data processing module is a model based on a convolutional neural network, and is used for giving a parameter matching scheme according to real-time parameters of pressure collected by the pressure signal collection module stored in the data storage module;

[0053] In this embodiment, the process of collecting the passenger's body shape preliminary data including weight and height is as follows: the height of the passenger is determined by detecting the contact position between the head of the passenger and the headrest at the top of the seat back, and the middle position region of the headrest in the vertical direction is taken as a boundary region; if the position where the head of the passenger contacts the headrest is concentrated above the boundary region, it is determined that the height of the passenger is large. The pressure data between the knees of the passenger and the seat back of the front row and the number of times of triggering when the knees of the passenger contact the seat back of the front row are collected; the above data is summarized in the model of the convolutional neural network, and the optimal parameter matching scheme is matched, and the adjustment action execution mechanism automatically adjusts the most suitable posture of the rear seat.

[0054] Embodiment 3

[0055] This embodiment is further provided on the basis of embodiment 2.

[0056] The rear seat is provided with a massage switch, and the massage switch is one-to-one corresponding to the rear seat. The rear seat is also provided with a massage mechanism.

[0057] The main control system further includes a massage unit;

[0058] The massage unit includes:

[0059] The sensing module is connected with the micro-electro-mechanical system automobile pressure sensor of the rear seat back and the headrest above the rear seat back, and is also connected with the massage switch, and is used for sending an execution signal when the massage switch at the position is opened and the change of the pressure at the position is detected.

[0060] The execution massage module is connected with the sensing module and the massage mechanism, and is used for sending a corresponding control instruction to the massage mechanism according to the execution signal sent by the sensing module to control the massage mechanism to perform massage.

[0061] The above is only the preferred embodiment of the present application, and does not limit the technical scope of the present application in any way. Therefore, any slight modification, equivalent change and modification of the above embodiment according to the technical essence of the present application still belongs to the scope of the technical solution of the present application.

Claims

1. A microelectromechanical system (MEMS) automotive pressure sensor with potting sealant, characterized in that, include: The housing has a plurality of first pins on its outer side wall and a plurality of second pins that match the first pins on the side of the housing near the first pins, and the second pins are located at the bottom of the housing; wherein the first pins and the second pins are connected in a one-to-one correspondence. The circuit unit is connected to the inner bottom wall of the housing by a circuit unit adhesive and is electrically connected to the second pin. A circuit unit potting compound is disposed in the inner cavity of the housing and located at the top of the circuit unit; A connecting wire harness is connected to the first pin via a wire harness connector.

2. The microelectromechanical system (MEMS) automotive pressure sensor with potting seal according to claim 1, characterized in that, The circuit unit includes a pressure module, a conditioning chip, a circuit board, and electronic components; The pressure module, the conditioning chip, and the electronic components are respectively disposed on the circuit board, and the side of the circuit board near the pressure module is connected to the inner bottom wall of the housing.

3. The microelectromechanical system (MEMS) automotive pressure sensor with potting seal according to claim 2, characterized in that, The pressure module is also surrounded by a barrier, and a protective adhesive is installed inside the barrier to protect the pressure module.

4. The microelectromechanical system (MEMS) automotive pressure sensor with potting seal according to claim 3, characterized in that, The enclosure is made of cofferdam material.

5. A microelectromechanical system (MEMS) automotive pressure sensor with potting seal according to claim 2, characterized in that, The pressure module includes a silicon piezoresistive MEMS flip-chip pressure chip and a ceramic adapter plate. The ceramic adapter plate is connected to the circuit board, and the silicon piezoresistive MEMS flip-chip pressure chip is disposed on the ceramic adapter plate. The solder balls at the bottom of the silicon piezoresistive MEMS flip-chip pressure chip are used to achieve structural support and electrical signal connection.

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