Integrated multi-path transmitting and receiving integrated laser assembly

Abstract

The utility model discloses an integrated multi-path transmitting and receiving integrated laser assembly, and belongs to the technical field of optical communication. A multi-path receiving and transmitting integrated laser assembly comprises a shell, a cover plate is installed on the upper portion of the shell, a chip substrate is fixedly installed in the shell, multiple sets of receiving modules and multiple sets of transmitting modules are electrically connected to the chip substrate, one side of each receiving module is coupled with a receiving optical fiber, and one side of each transmitting module is coupled with a transmitting optical fiber. A refrigerator is installed in the shell, a plurality of metal pins are arranged on the outer side of the shell, and the metal pins extend into the shell and are electrically connected with the chip substrate base plate and the refrigerator respectively. The multiple groups of receiving modules and the multiple groups of transmitting modules are arranged in the shell, so that the device can receive and transmit optical signals at the same time, the integration level of the device is increased, heat dissipation is carried out through the refrigerator, and the situation that operation of the receiving modules and the transmitting modules is affected due to heat accumulation is avoided.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of optical communication, in particular to an integrated multi-channel transceiver integrated laser assembly. BACKGROUND

[0002] The optical communication laser assembly is the core of the optical communication system, responsible for converting electrical signals into optical signals to ensure efficient transmission of information.

[0003] According to the search, the existing Chinese patent CN117741877A discloses a multi-channel airtight optical emission module. The device does not need to make holes, grooves or shorten the design of the PCBA, supports multiple optical port connections, has high optical device reliability and high integration, and the circuit connection from the DSP to the optical chip is short, and can be used in high-speed optical modules such as 400G / 800G.

[0004] The above-mentioned device can only realize multi-channel optical emission, and it is difficult to realize an integrated assembly of multi-channel optical emission and multi-channel optical reception due to isolation and heat dissipation problems. In a specific environment, the two are usually used together and occupy a large space. In view of this, an integrated multi-channel transceiver integrated laser assembly is proposed. Content of the utility model

[0005] 1. Technical problem to be solved

[0006] The purpose of the present application is to provide an integrated multi-channel transceiver integrated laser assembly to solve the problems raised in the background art.

[0007] 2. Technical solution

[0008] The present application is realized by the following technical solution:

[0009] An integrated multi-channel transceiver integrated laser assembly comprises a shell, a cover plate is installed on the upper part of the shell, a chip substrate is fixedly installed inside the shell, a plurality of receiving modules and a plurality of transmitting modules are electrically connected to the chip substrate, a receiving optical fiber is coupled to one side of the receiving module, a transmitting optical fiber is coupled to one side of the transmitting module, a refrigerator is installed inside the shell, a plurality of metal pins are provided on the outer side of the shell, and the plurality of metal pins are extended into the shell and are respectively electrically connected to the chip substrate and the refrigerator.

[0010] As an optional solution of the technical solution of the present application, the receiving module comprises a receiving chip, the receiving chip is electrically connected to the chip substrate, and the receiving chip is coupled to the receiving optical fiber.

[0011] As an optional scheme of the technical scheme of the present application file, the transmitting module comprises a transmitting chip, a lens and an isolator, the transmitting chip is electrically connected with the chip substrate, the lens is installed between the transmitting chip and the isolator, and the isolator is installed between the lens and the transmitting optical fiber.

[0012] As an optional scheme of the technical scheme of the present application file, the chip substrate, the receiving module and the transmitting module are all tiled to the upper surface of the refrigerator.

[0013] As an optional scheme of the technical scheme of the present application file, two refrigerators are provided, the two refrigerators are respectively arranged below the multiple groups of receiving modules and the multiple groups of transmitting modules, temperature sensors are arranged above the two refrigerators, and the two temperature sensors are both installed on the chip substrate.

[0014] As an optional scheme of the technical scheme of the present application file, the bottom surface of the shell is made of gold-plated metal, the refrigerator is a TEC refrigerator, and the lower surface of the refrigerator is tiled on the gold-plated metal bottom surface of the shell.

[0015] As an optional scheme of the technical scheme of the present application file, the receiving chip and the receiving optical fiber are coupled in the vertical plane, and the receiving optical fiber emits light.

[0016] As an optional scheme of the technical scheme of the present application file, the shell is a cuboid with a size of 60mm*38mm*7mm, and the receiving module and the transmitting module are both provided with four groups.

[0017] As an optional scheme of the technical scheme of the present application file, a plurality of connecting ears are fixedly connected to the outside of the shell.

[0018] 3. Beneficial effects

[0019] Compared with the prior art, the beneficial effects of the present application are:

[0020] 1) The present application sets multiple groups of receiving modules and multiple groups of transmitting modules in the shell, so that the device can simultaneously receive and transmit optical signals, increase the integration of the device, and dissipate heat through the refrigerator to avoid heat accumulation and affect the operation of the receiving module and the transmitting module.

[0021] 2) The present application sets two temperature sensors and a refrigerator to control the temperature of the receiving module and the transmitting module respectively, which can increase the accuracy of temperature control and improve the effect of heat dissipation, thereby prolonging the service life of the device. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 It is a whole structure schematic diagram of an integrated multi-channel transceiver integrated laser assembly.

[0023] Figure 2 is a schematic view of a shell structure of an integrated multi-channel transceiver integrated laser assembly;

[0024] Figure 3 is a schematic view of a transmitting module of an integrated multi-channel transceiver integrated laser assembly;

[0025] Figure 4 is a schematic view of a receiving module of an integrated multi-channel transceiver integrated laser assembly;

[0026] In the figure: 1, shell; 2, cover plate; 3, receiving module; 301, receiving chip; 4, transmitting module; 401, transmitting chip; 402, lens; 403, isolator; 5, receiving optical fiber; 6, transmitting optical fiber; 7, refrigerator; 8, metal pin; 9, chip substrate; 10, temperature sensor; 11, connecting lug. DETAILED DESCRIPTION

[0027] The technical solutions of the present application will be described in detail below with reference to the accompanying drawings.

[0028] Please refer to Figure 1 The present application provides an integrated multi-channel transceiver integrated laser assembly, which comprises a shell 1, a cover plate 2 is installed on the upper part of the shell 1, a chip substrate 9 is fixedly installed inside the shell 1, a plurality of groups of receiving modules 3 and a plurality of groups of transmitting modules 4 are electrically connected on the chip substrate 9, a receiving optical fiber 5 is coupled to one side of the receiving module 3, a transmitting optical fiber 6 is coupled to one side of the transmitting module 4, a refrigerator 7 is installed inside the shell 1, a plurality of metal pins 8 are provided on the outer side of the shell 1, the plurality of metal pins 8 all extend into the inside of the shell 1 and are respectively electrically connected with the chip substrate 9 and the refrigerator 7.

[0029] Preferably, the shell 1 is a rectangular solid with a size of 60mm*38mm*7mm, a plurality of connecting lugs 11 are fixedly connected to the outer side of the shell 1, which facilitates the user to fix the device through screws and the connecting lugs 11; the receiving module 3 and the transmitting module 4 are each provided with 4 groups, so that the device can simultaneously receive or transmit 4 channels of optical signals; the internal components of the device are bonded inside the shell 1 by using lead-free solder and glue, which increases the reliability of the device; the power supply for the plurality of groups of receiving modules 3, the plurality of groups of transmitting modules 4 and the refrigerator 7 is realized by means of the metal pins 8, wherein the metal pins 8 are gold-plated metal pins.

[0030] As Figure 2As shown, the refrigerator 7 is provided with two, two refrigerator 7 is arranged below a plurality of groups of receiving module 3 and a plurality of groups of emitting module 4, two temperature sensors 10 are arranged above two refrigerator 7, two temperature sensors 10 are installed on the chip substrate 9; preferably, the temperature sensor 10 adopts a thermistor; the bottom surface of the shell 1 adopts a gold plated metal, the refrigerator 7 is a TEC refrigerator, the lower surface of the refrigerator 7 is laid on the gold plated metal bottom surface of the shell 1, the chip substrate 9, the receiving module 3 and the emitting module 4 are laid on the upper surface of the refrigerator 7. The temperature of the receiving module 3 and the emitting module 4 is collected by two temperature sensors 10 respectively, the independent control of two refrigerator 7 is realized, the precision of temperature control is increased, the heat dissipation effect is increased, and the long-term stable operation of the device is ensured.

[0031] As shown in Figure 3 The emitting module 4 includes an emitting chip 401, a lens 402 and an isolator 403, the emitting chip 401 is electrically connected with the chip substrate 9, the lens 402 is installed between the emitting chip 401 and the isolator 403, and the isolator 403 is installed between the lens 402 and the emitting fiber 6. The current supplies power to the emitting chip 401 through the metal pin 8 and the chip substrate 9, the emitting chip 401 emits light, the light is shaped through the lens 402, and then coupled into the emitting fiber 6 through the isolator 403, and the emitting fiber 6 is connected to the receiving device through the LC / FC joint.

[0032] As shown in Figure 4 The receiving module 3 includes a receiving chip 301, the receiving chip 301 is electrically connected with the chip substrate 9, and the receiving chip 301 is coupled with the receiving fiber 5. The current supplies power to the receiving chip 301 through the metal pin 8 and the chip substrate 9; when working, the receiving chip 301 receives the optical signal in the receiving fiber 5, the receiving chip 301 converts the optical signal into an electrical signal through its own function, and outputs the electrical signal through the metal pin 8. Preferably, the receiving chip 301 and the receiving fiber 5 are coupled in the vertical plane, the receiving fiber 5 emits light at 45 degrees, and the distance between the receiving fiber 5 and the sensitive surface of the receiving chip 301 is short, which greatly reduces the light loss, thereby realizing the effect of improving the optical isolation.

Claims

1. An integrated multi-channel transceiver laser assembly, characterized in that: The device includes a housing (1), a cover plate (2) installed on the upper part of the housing (1), a chip substrate (9) fixedly installed inside the housing (1), multiple sets of receiving modules (3) and multiple sets of transmitting modules (4) electrically connected to the chip substrate (9), a receiving optical fiber (5) coupled to one side of the receiving module (3), a transmitting optical fiber (6) coupled to one side of the transmitting module (4), a cooler (7) installed inside the housing (1), and multiple metal pins (8) provided on the outside of the housing (1). The multiple metal pins (8) extend into the inside of the housing (1) and are electrically connected to the chip substrate (9) and the cooler (7) respectively.

2. The integrated multi-channel transceiver laser assembly according to claim 1, characterized in that: The receiving module (3) includes a receiving chip (301), which is electrically connected to the chip substrate (9) and coupled to the receiving optical fiber (5).

3. The integrated multi-channel transceiver laser assembly according to claim 1, characterized in that: The transmitting module (4) includes a transmitting chip (401), a lens (402) and an isolator (403). The transmitting chip (401) is electrically connected to the chip substrate (9). The lens (402) is installed between the transmitting chip (401) and the isolator (403). The isolator (403) is installed between the lens (402) and the transmitting optical fiber (6).

4. The integrated multi-channel transceiver laser assembly according to claim 1, characterized in that: The chip substrate (9), the receiving module (3) and the transmitting module (4) are all laid flat on the upper surface of the cooler (7).

5. The integrated multi-channel transceiver laser assembly according to claim 4, characterized in that: There are two coolers (7), which are respectively located below the multiple sets of receiving modules (3) and multiple sets of transmitting modules (4). A temperature sensor (10) is provided above each of the two coolers (7), and the two temperature sensors (10) are installed on the chip substrate (9).

6. The integrated multi-channel transceiver laser assembly according to claim 1, characterized in that: The bottom surface of the housing (1) is made of gold-plated metal, and the cooler (7) is a TEC cooler. The lower surface of the cooler (7) is laid flat on the gold-plated metal bottom surface of the housing (1).

7. The integrated multi-channel transceiver laser assembly according to claim 2, characterized in that: The receiving chip (301) is coupled to the receiving optical fiber (5) in a vertical plane, and the receiving optical fiber (5) emits light at a 45-degree angle.

8. The integrated multi-channel transceiver laser assembly according to claim 1, characterized in that: The housing (1) is a cuboid with dimensions of 60mm*38mm*7mm, and both the receiving module (3) and the transmitting module (4) are provided with 4 sets.

9. The integrated multi-channel transceiver laser assembly according to claim 1, characterized in that: Multiple connecting ears (11) are fixedly connected to the outer side of the housing (1).

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