Display panel and display device

Abstract

The utility model relates to a display panel and a display device, the display panel comprises a first substrate and a second substrate which are oppositely arranged, and the first substrate comprises a first substrate, a thin film transistor layer, a color resistance layer and an organic layer; the thin film transistor layer is arranged on one side, facing the second substrate, of the first substrate; the color resistance layer is arranged on the side, away from the first substrate, of the thin film transistor layer, the color resistance layer comprises a plurality of color resistance patterns, and parts of the color resistance patterns are configured to be blue color resistance; the organic layer is arranged on the side, away from the first substrate, of the thin film transistor layer and covers the color resistance layer; wherein the first substrate further comprises an inorganic isolation layer, the inorganic isolation layer is arranged between the color resistance layer and the organic layer, and the inorganic isolation layer is arranged at least corresponding to the position of the blue color resistance and isolates the blue color resistance from the organic layer.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display devices, in particular to a display panel and a display device. BACKGROUND

[0002] With the development of science and technology, liquid crystal display panels are applied more and more. In order to realize better color display of the liquid crystal display panel, a color resistance layer is added on the array substrate of the liquid crystal display panel at present, so that RGB three primary colors are realized on the array substrate, and the alignment operation of the array substrate and the filter substrate is avoided, so that the liquid crystal display device can better perform full-color display. The above-mentioned technology is called COA (Color Filter on array) technology. After adding the RGB color resistance layer on the array substrate, an organic layer is also arranged to cover the RGB color resistance layer, and the organic layer usually adopts PFA (English full name: Polyfluoroalkoxy, Chinese abbreviation: soluble polytetrafluoroethylene). In actual process, the PFA and the blue color resistance will interfere with each other, thereby reducing the blue light transmittance, and causing the display module to have white point defects. CONTENT OF THE UTILITY MODEL

[0003] The display panel and the display device provided by the embodiments of the present application can avoid the mutual influence of the organic layer and the blue color resistance in the process, improve the blue light transmittance, and improve the yellowish white point defect of the display panel during display.

[0004] In order to achieve the above-mentioned purpose, according to the first aspect of the present application, a display panel is provided, the display panel comprises a first substrate and a second substrate arranged oppositely, the first substrate comprises:

[0005] a first substrate;

[0006] a thin film transistor layer arranged on a side of the first substrate facing the second substrate;

[0007] a color resistance layer arranged on a side of the thin film transistor layer away from the first substrate, the color resistance layer comprises a plurality of color resistance patterns, and part of the plurality of color resistance patterns are configured as blue color resistances; and

[0008] an organic layer arranged on a side of the thin film transistor layer away from the first substrate, and covering the color resistance layer;

[0009] The first substrate further comprises an inorganic isolation layer arranged between the color resistance layer and the organic layer, the inorganic isolation layer is arranged at least corresponding to the position of the blue color resistance, and the inorganic isolation layer isolates the blue color resistance and the organic layer.

[0010] In an embodiment, in a thickness direction of the display panel, a thickness of the blue color resist is greater than a thickness of the color resist pattern adjacent to the blue color resist, and on a side facing the second substrate, the blue color resist is protrudingly arranged compared to a height of the color resist pattern adjacent to the blue color resist.

[0011] The inorganic isolation layer is arranged on a side of the blue color resist facing the second substrate, and covers a surface and / or a side surface of the protruding portion of the blue color resist.

[0012] In an embodiment, in a thickness direction of the display panel, a thickness of the blue color resist is less than a thickness of the color resist pattern adjacent to the blue color resist, and on a side facing the second substrate, the blue color resist is recessedly arranged compared to a height of the color resist pattern adjacent to the blue color resist.

[0013] The inorganic isolation layer is arranged on a side of the blue color resist facing the second substrate, and fills the recessed position.

[0014] In an embodiment, the inorganic isolation layer is arranged on a side of the color resist layer facing away from the thin film transistor layer, and covers the entire color resist layer.

[0015] In an embodiment, a peripheral side portion of the inorganic isolation layer is bent and extended to form an extension portion on a side facing the first substrate, and the extension portion covers the peripheral side portion of the color resist layer.

[0016] In an embodiment, the inorganic isolation layer is arranged as a SiOX isolation layer or a SiNX isolation layer.

[0017] In an embodiment, a thickness of the inorganic isolation layer is arranged to be

[0018] In an embodiment, a transmittance of the inorganic isolation layer is greater than 90%.

[0019] In an embodiment, the second substrate includes a second substrate and a light shielding layer, the light shielding layer is arranged on a side of the second substrate facing the first substrate, the light shielding layer includes a plurality of light shielding portions, in a thickness direction of the display panel, the light shielding portions are arranged corresponding to positions between adjacent two color resist patterns.

[0020] The thin film transistor layer includes a plurality of thin film transistors arranged in an array, in a thickness direction of the display panel, the thin film transistors correspond to the positions of the light shielding portions.

[0021] According to a second aspect of the present application, a display device is provided, including the display panel as described above.

[0022] In the display panel provided by the embodiment of the present application, the display panel comprises a first substrate and a second substrate arranged oppositely, the first substrate comprises a first substrate, a thin film transistor layer, a color resistance layer and an organic layer arranged in layers, the color resistance layer comprises a plurality of color resistance patterns, and part of the plurality of color resistance patterns are configured as blue color resistances; in actual manufacturing process, the organic layer is arranged to affect the blue color resistances, and the blue light transmittance is low, so that the display panel has a yellowish white point defect when displaying; and the inorganic isolation layer is arranged between the color resistance layer and the organic layer, the inorganic isolation layer is arranged at least at the positions corresponding to the blue color resistances, and the inorganic isolation layer isolates the blue color resistances and the organic layer, so that the organic layer and the blue color resistances can be prevented from affecting each other in the manufacturing process, the blue light transmittance is improved, and the yellowish white point defect of the display panel when displaying is improved.

[0023] Other features and advantages of the present application will be described in detail in the following specific embodiments. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiment description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0025] In order to more completely understand the present application and its beneficial effects, the following will be described in conjunction with the drawings, wherein the same reference numerals in the following description represent the same parts.

[0026] Figure 1 A film layer diagram of the display panel provided by the prior art;

[0027] Figure 2 A first film layer diagram of the display panel provided by the embodiment of the present application;

[0028] Figure 3 A second film layer diagram of the display panel provided by the embodiment of the present application;

[0029] Figure 4 A third film layer diagram of the display panel provided by the embodiment of the present application;

[0030] Figure 5 A fourth film layer diagram of the display panel provided by the embodiment of the present application;

[0031] Figure 6 A fifth film layer diagram of the display panel provided by the embodiment of the present application;

[0032] Figure 7 A component diagram of the blue color resistance provided by the embodiment of the present application;

[0033] Figure 8 Light transmittance contrast diagram of the organic layer (improving heat resistance) provided in the embodiments of the present application. DETAILED DESCRIPTION

[0034] The technical solutions in the embodiments of the present application will be clearly and completely described with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all the other embodiments obtained by a person of ordinary skill in the art without creative effort belong to the protection scope of the present application.

[0035] In a first aspect, the embodiments of the present application provide a display panel 100. Please refer to Figure 2 to Figure 6 The display panel 100 includes a first substrate 1 and a second substrate 2 arranged oppositely, the first substrate 1 includes a first substrate 11, a thin film transistor layer 12, a color resistance layer 13 and an organic layer 14; the thin film transistor layer 12 is arranged on a side of the first substrate 11 facing the second substrate 2; the color resistance layer 13 is arranged on a side of the thin film transistor layer 12 away from the first substrate 11, the color resistance layer 13 includes a plurality of color resistance patterns 131, and part of the plurality of color resistance patterns 131 is configured as blue color resistance 13c; the organic layer 14 is arranged on a side of the thin film transistor layer 12 away from the first substrate 11, and the organic layer 14 covers the color resistance layer 13; wherein the first substrate 1 further includes an inorganic isolation layer 15, the inorganic isolation layer 15 is arranged between the color resistance layer 13 and the organic layer 14, the inorganic isolation layer 15 is arranged at least corresponding to the position of the blue color resistance 13c, and the inorganic isolation layer 15 isolates the blue color resistance 13c and the organic layer 14.

[0036] In the prior art, please refer to Figure 1 In order to realize better color display of the liquid crystal display panel 100', the current liquid crystal display panel 100' increases a color resistance layer 13' on the array substrate, so that RGB three primary colors are realized on the array substrate 1', and the alignment operation of the array substrate 1' and the filter substrate 2' is avoided, so that the liquid crystal display device can better perform full-color display. The above-mentioned technology is called COA (Color Filter on array) technology. After increasing the RGB color resistance layer 13' on the array substrate 1', an organic layer 14' is arranged to cover the RGB color resistance layer 13', and the organic layer 14' usually adopts PFA (English full name: Polyfluoroalkoxy, Chinese abbreviation: soluble polytetrafluoroethylene).

[0037] Generally, the color resist layer 13' includes a red color resist 13a', a green color resist 13b', and a blue color resist 13c'. The material of the blue color resist 13c' is composed of pigments, dispersants, dispersion resins, resins, monomers, initiators, and additives, etc. That is, the material of the blue color resist 13c' is an organic material. In the process of manufacturing the color resist layer 13' and the organic layer 14', the blue color resist 13c' and the organic layer 14' are both prone to bond breaking and oxidation under a heating environment, and the positions of bond breaking and oxidation will absorb blue light, thereby reducing the blue light transmittance. Meanwhile, the organic layer 14' is composed of resins, monomers, initiators, and additives, etc. In the process of manufacturing the organic layer 14', the organic layer 14' will generate acidic substances when exposed to light, and the acidic substances will make the pigments and dispersants of the blue color resist 13c' yellow, thereby absorbing blue light and further reducing the blue light transmittance, so that the display panel 100' will appear yellowish when displaying.

[0038] In the embodiments provided in the present application, the first substrate 1 is provided with an inorganic isolation layer 15, the inorganic isolation layer 15 is arranged between the color resist layer 13 and the organic layer 14, the inorganic isolation layer 15 is arranged at least at the position corresponding to the blue color resist 13c, and the inorganic isolation layer 15 isolates the blue color resist 13c and the organic layer 14. The inorganic isolation layer 15 is used to isolate the blue color resist 13c. In the process of manufacturing the organic layer 14', the acidic substances generated by the organic layer 14' when exposed to light will be blocked by the inorganic isolation layer 15, so as not to affect the blue color resist 13c, thereby improving the blue light transmittance. Meanwhile, the inorganic isolation layer 15 isolates the blue color resist 13c. In the process of manufacturing the organic layer 14', the influence of the heating environment on the blue color resist 13c can be reduced, thereby reducing bond breaking and oxidation, further improving the blue light transmittance, and improving the yellowish display of the display panel 100.

[0039] The arrangement of the inorganic isolation layer 15 is not limited in the present application. The inorganic isolation layer 15 can only cover the blue color resist 13c, or the inorganic isolation layer 15 can cover the entire color resist layer 13.

[0040] Please refer to Figure 2 In the first embodiment of the present application, in the thickness direction F1 of the display panel 100, the thickness of the blue color resist 13c is equal to the thickness of the color resist pattern 131 adjacent to the blue color resist 13c. The inorganic isolation layer 15 is arranged on the side of the color resist layer 13 away from the thin film transistor layer 12 and at the position corresponding to the blue color resist 13c. The inorganic isolation layer 15 isolates the blue color resist 13c and the organic layer 14.

[0041] In the first embodiment, the inorganic isolation layer 15 only covers the blue color resist 13c, thereby isolating the blue color resist 13c and the organic layer 14. During the process of the organic layer 14, the acidic substance generated by the exposure of the organic layer 14 is blocked by the inorganic isolation layer 15, thereby not affecting the blue color resist 13c, and thus the blue light transmittance can be improved. Meanwhile, the inorganic isolation layer 15 isolates the blue color resist 13c, thereby reducing the influence of the heating environment on the blue color resist 13c during the process of the organic layer 14, and thus the bond breaking and oxidation are reduced, the blue light transmittance is further improved, and the white point yellowing defect of the display panel 100 during display is improved.

[0042] Referring to Figure 3 In the second embodiment of the present application, in the thickness direction F1 of the display panel 100, the thickness of the blue color resist 13c is greater than that of the color resist pattern 131 adjacent thereto, and on the side facing the second substrate 2, the blue color resist 13c is protrudingly arranged compared with the color resist pattern 131 adjacent thereto. The inorganic isolation layer 15 is arranged on the side of the blue color resist 13c facing the second substrate 2, and covers the protruding part of the blue color resist 13c.

[0043] The difference between the first embodiment and the second embodiment of the present application is that, in the second embodiment, the thickness of the blue color resist 13c is greater than that of the color resist pattern 131 adjacent thereto, and on the side facing the second substrate 2, the blue color resist 13c is protrudingly arranged compared with the color resist pattern 131 adjacent thereto. The inorganic isolation layer 15 is arranged on the side of the blue color resist 13c facing the second substrate 2, and the inorganic isolation layer 15 covers the top and the side of the blue color resist 13c. In this way, the blue color resist 13c and the organic layer 14 can be completely isolated, thereby improving the blue light transmittance, and thus the white point yellowing defect of the display panel 100 during display is improved.

[0044] Referring to Figure 4 In the third embodiment of the present application, in the thickness direction F1 of the display panel 100, the thickness of the blue color resist 13c is less than that of the color resist pattern 131 adjacent thereto, and on the side facing the second substrate 2, the blue color resist 13c is recessedly arranged compared with the color resist pattern 131 adjacent thereto. The inorganic isolation layer 15 is arranged on the side of the blue color resist 13c facing the second substrate 2, and fills the recessed position.

[0045] The difference between the third embodiment of the present application and the second embodiment is that, in the third embodiment, the thickness of the blue color resist 13c is less than the thickness of the color resist pattern 131 adjacent to the blue color resist 13c, and the blue color resist 13c is recessed compared to the color resist pattern 131 adjacent to the blue color resist 13c on the side facing the second substrate 2; the inorganic isolation layer 15 is arranged on the side of the blue color resist 13c facing the second substrate 2 and fills the recessed position; in this way, not only can the blue color resist 13c be completely separated from the organic layer 14, thereby improving the blue light transmittance and further improving the white point yellowing defect of the display panel 100 during display, but also the inorganic isolation layer 15 can improve the flatness of the surface of the color resist layer 13 on the side facing the second substrate 2, which is beneficial to subsequent film layer manufacturing.

[0046] Please refer to Figure 5 In the fourth embodiment of the present application, the inorganic isolation layer 15 is arranged on the side of the color resist layer 13 away from the thin film transistor layer 12 and covers the entire color resist layer 13. The difference between the fourth embodiment and the above embodiments is that, in the fourth embodiment, the inorganic isolation layer 15 covers the entire color resist layer 13, so that the blue color resist 13c can be completely separated from the organic layer 14, thereby improving the blue light transmittance and further improving the white point yellowing defect of the display panel 100 during display; at the same time, the inorganic isolation layer 15 arranged on the entire surface is simpler in process than the patterned inorganic isolation layer 15.

[0047] Please refer to Figure 6 In the fifth embodiment of the present application, the side of the inorganic isolation layer 15 is bent and extended to form an extension on the side facing the first substrate 11, and the extension covers the side of the color resist layer 13. In the fourth embodiment, the side of the inorganic isolation layer 15 extends to cover the side of the color resist layer 13, so that the entire color resist layer 13 is completely separated from the organic layer 14, thereby improving the blue light transmittance and improving the white point yellowing defect of the display panel 100 during display.

[0048] The material of the inorganic isolation layer 15 is not limited in the present application, and the material of the inorganic isolation layer 15 includes but is not limited to SiO X and SiN X That is, the inorganic isolation layer 15 is arranged as a SiO X isolation layer or a SiN X isolation layer. Preferably, the material of the inorganic isolation layer 15 is arranged as SiO2 or SiN.

[0049] In order to ensure the isolation effect of the inorganic isolation layer 15 on the blue color resist 13c and the organic layer 14, the inorganic isolation layer 15 must have a certain thickness, but the inorganic isolation layer 15 is too thick, which will affect the light transmittance; therefore, in an embodiment, the thickness of the inorganic isolation layer 15 is set to In this way, the light transmittance is not greatly affected, and the isolation effect of the inorganic isolation layer 15 on the blue color resist 13c and the organic layer 14 can be ensured.

[0050] The present application does not specifically limit the thickness of the inorganic isolation layer 15, and the thickness of the inorganic isolation layer 15 can be set to and the like.

[0051] It can be known that the increase of the film layer will affect the light transmittance, in order to avoid the setting of the inorganic isolation layer 15 affecting the light transmittance, the inorganic isolation layer 15 needs to use high-transmittance material; the transmittance of the inorganic isolation layer 15 is greater than 90%.

[0052] It should be noted that in addition to increasing the inorganic isolation layer 15 to isolate the blue color resist 13c and the organic layer 14 to improve the blue light transmittance, the present application also improves the blue light transmittance by improving the process.

[0053] As described above, when the color resist layer 13 and the organic layer 14 are made, in a heating environment, the blue color resist 13c and the organic layer 14 are prone to bond breaking and oxidation, and the positions of bond breaking and oxidation will absorb blue light, thereby reducing the blue light transmittance.

[0054] Generally, the process of the blue color resist 13c is as follows: the substrate is cleaned, then EUV (English full name: Extreme Ultraviolet, Chinese abbreviation: extreme ultraviolet) photolithography technology is used, then a blue coating layer is coated, the coating layer is pre-baked, and after exposure and development, high-temperature treatment (OVEN treatment) is used. In the process of making the blue color resist 13c, the pre-baking and OVEN treatment steps need to be heated, and the heating environment will make the blue color resist 13c prone to bond breaking and oxidation.

[0055] In an embodiment, by reducing the heating time or heating temperature in the pre-baking and OVEN treatment steps, the risk of bond breaking and oxidation of the blue color resist 13c can be reduced, thereby improving the blue light transmittance. The present application does not specifically limit the heating time and heating temperature. Preferably, the heating temperature in the pre-baking and OVEN treatment steps can be reduced from 230°C of the prior art to 150°C-200°C. The heating time in the pre-baking and OVEN treatment steps is shortened from 20 min of the prior art to 10 min-15 min.

[0056] And after the color resist layer 13, the organic layer 14, pixel electrode layer, support column 4 and alignment layer will be made in turn; in the subsequent process, the heating time and heating temperature of each film layer can be reduced, thereby reducing the influence of the heating environment on the blue color resist 13c and the organic layer 14.

[0057] In an embodiment, the heating temperature of the organic layer 14 is set to 190-230℃, and the heating time is set to 20-30min; the heating temperature of the pixel electrode layer is set to 210-230℃, and the heating time is set to 30-60min; the heating temperature of the support column 4 is set to 220-230℃, and the heating time is set to 20-30min; the heating temperature of the alignment layer is set to 220-230℃, and the heating time is set to 20-40min. The following table is the W Y thermal variation.

[0058] Process [WC X ]]> [WC Y ]]> Delta W Y ]] Blue color resist 0.305 0.327 / Organic layer (conventional) 0.3ll 0.348 0.015 Organic layer (temperature reduction) 0.305 0.328 0.001

[0059] It should be noted that in the CIE XYZ color space, the Y value represents the brightness or the luminosity of a color; the thermal variation refers to the degree of change of the optical properties (such as transmittance, reflectance, etc.) of the material when heated; ΔW Y refers to the blue light transmittance variation when the blue color resist 13c is heated; as can be seen from the above table, after the organic layer 14 process is cooled, the blue light transmittance variation can be basically ignored, thereby improving the blue light transmittance and improving the white point yellowing defect of the display panel 100 when displaying.

[0060] Since the alignment layer is arranged on the first substrate 1, the material of the alignment layer is usually PI (English full name: Polyimide, Chinese abbreviation: Polyimide), which is used to guide the arrangement of liquid crystal molecules; in the traditional LCD manufacturing process, a layer of polyimide (PI) is coated on the glass substrate as the orientation layer, and the liquid crystal molecules are arranged in a specific direction through rubbing treatment. In order to simplify the production process and improve the production efficiency, the "PI less" technology is introduced in the prior art, that is, the PI layer is removed, and the liquid crystal molecules do not need to be oriented by PI. The "PI less" technology is the prior art, which will not be described in detail here. The following table is the W Y thermal variation.

[0061] Process [WC X ]]> [WC Y ]]> Delta W Y ]] Blue color resist 0.305 0.330 / PI layer 0.317 0.351 0.021 PI less 0.315 0.346 0.016

[0062] As described above, ΔW YΔW refers to the blue light transmittance variation amount of the blue color resist 13c when heated; from the above table, it can be seen that after adopting the PI less technology, the blue light transmittance variation amount is significantly reduced, thereby improving the blue light transmittance and improving the white point yellowing defect of the display panel 100 during display.

[0063] Meanwhile, since the pre-baking treatment and OVEN treatment steps need to be heated during the manufacturing process of the blue color resist 13c, the heating environment can cause the blue color resist 13c to be prone to bond breaking and oxidation, and therefore the heat resistance and acid resistance of the blue color resist 13c can be improved to improve the blue light transmittance.

[0064] In addition, when the organic layer 14 is manufactured on the color resist, the process of the organic layer 14 is as follows: the substrate is cleaned, then the organic coating layer is coated, the coating layer is pre-baked, then after exposure and development, the organic layer 14 is bleached, and finally high-temperature treatment (OVEN treatment) is adopted. During the manufacturing process of the organic layer 14, the pre-baking treatment and OVEN treatment steps need to be heated, and the heating environment can cause the blue color resist 13c to be prone to bond breaking and oxidation; at the same time, the organic layer 14 can produce acidic substances under the heating environment, and the acidic substances can cause the pigments and dispersants of the blue color resist 13c to yellow, thereby absorbing blue light and further reducing the blue light transmittance, so that the white point yellowing defect of the display panel 100 during display can occur.

[0065] Please refer to Figure 7 The material of the blue color resist 13c is composed of pigments, dispersants, dispersion resins, resins, monomers, initiators, and additives; the surface of the pigments is wrapped with dispersants and dispersion resins to make the pigments more uniformly dispersed, but the dispersants in the pigments are prone to yellowing under acid. By replacing the high-acid-resistant and high-heat-resistant dispersant in the color paste during the preparation process of the blue color resist 13c, and improving the dispersion process and reducing the free dispersant, the heat resistance and acid resistance of the blue color resist 13c are improved, and the white point yellowing defect during display is improved. The following table shows the W Y thermal variation amount after improving the heat resistance and acid resistance of the blue color resist 13c.

[0066] Improvement direction Delta W Y ]] Conventional 0.011 Improve acid resistance 0.007 Improve acid resistance and heat resistance 0.004 Improve acid resistance, heat resistance and improve dispersion process 0.000

[0067] As mentioned above, ΔW Y ΔW refers to the blue light transmittance variation amount of the blue color resist 13c when heated; from the above table, it can be seen that after adopting the PI less technology, the blue light transmittance variation amount is significantly reduced, thereby improving the blue light transmittance and improving the white point yellowing defect of the display panel 100 during display.

[0068] It can be known that the organic layer 14 is composed of resin, monomer, initiator and additive, etc. During the manufacturing process of the organic layer 14, both the pre-baking treatment and the OVEN treatment steps need heating. The heating environment can make the blue color resist 13c prone to bond breaking and oxidation, and the positions of bond breaking and oxidation can absorb blue light, thereby reducing the blue light transmittance. In an embodiment, functional groups with good heat resistance, such as phenyl, cyano, etc. can be introduced into the resin; and an antioxidant can be added to the additive, thereby absorbing free radicals during heating, preventing free radicals from attacking organic matter, making the organic matter bond breaking and oxidizing, and further reducing the bond breaking and oxidation, further improving the blue light transmittance, and improving the white point yellowing defect of the display panel 100 during display. Please refer to Figure 8 , Figure 8 for the light transmittance comparison chart of the organic layer 14 before and after improving the heat resistance.

[0069] In an embodiment of the present application, the display panel 100 is provided as an LCD (English full name: Liquid Crystal Display, Chinese abbreviation: liquid crystal display). Please refer to Figure 2 , the display panel 100 further comprises a liquid crystal layer 3 disposed between the first substrate 1 and the second substrate 2, and a support column 4 disposed between the first substrate 1 and the second substrate 2, and the support column 4 is used to maintain the cell thickness of the liquid crystal layer 3. The first substrate 1 can be provided as an array substrate, and the second substrate 2 can be provided as an opposite substrate disposed opposite to the array substrate.

[0070] In an embodiment, the plurality of color resist patterns 131 of the color resist layer 13 includes a red color resist 13a, a green color resist 13b and a blue color resist 13c.

[0071] Further, the second substrate 2 includes a second substrate 21 and a light shielding layer 22, the light shielding layer 22 is disposed on the side of the second substrate 21 facing the first substrate 1, the light shielding layer 22 includes a plurality of light shielding portions 221, the light shielding portions 221 are disposed corresponding to the positions between adjacent two color resist patterns 131 in the thickness direction F1 of the display panel 100; the thin film transistor layer 12 includes a plurality of thin film transistors 121 arranged in an array, the thin film transistors 121 correspond to the positions of the light shielding portions 221 in the thickness direction F1 of the display panel 100.

[0072] In an embodiment, the display panel 100 further comprises an upper polarizing plate 5 and a lower polarizing plate 6, the upper polarizing plate 5 is disposed on the side of the second substrate 2 away from the first substrate 1, and the lower polarizing plate 6 is disposed on the side of the first substrate 1 away from the second substrate 2.

[0073] In a second aspect, the embodiments of the present application provide a display device. The display device comprises the display panel 100; it should be noted that the display panel 100 is arranged as the display panel 100 described above, that is, the display panel 100 comprises all the technical features of the display panel 100 described above, and the display device comprises all the embodiments of the display panel 100 described above, and thus has all the technical effects of the embodiments described above, which will not be repeated here.

[0074] The display device can be a television, a computer display, a smart phone, a tablet computer, and the like, which will not be specifically limited here.

[0075] In the description of the present application, the terms "first", "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0076] In the above embodiments, the description of each embodiment is focused on, and the parts not described in detail in a certain embodiment can be referred to the related description of other embodiments.

[0077] The embodiments of the present application, the embodiments and the related technical features can be combined, replaced with each other without conflict.

[0078] The above is only the preferred embodiments of the present application, and does not limit the present application in any form, but any simple modification, equivalent change and modification made according to the technical essence of the present application without departing from the technical solution of the present application, all still belong to the scope of the technical solution of the present application.

Claims

1. A display panel, characterized in that, The display panel includes a first substrate and a second substrate disposed opposite to each other, the first substrate comprising: First substrate; A thin-film transistor layer is disposed on the side of the first substrate facing the second substrate; A color resist layer is disposed on the side of the thin-film transistor layer opposite to the first substrate, the color resist layer comprising a plurality of color resist patterns, a portion of the plurality of color resist patterns being configured as blue color resist; and, An organic layer is disposed on the side of the thin-film transistor layer opposite to the first substrate, and the organic layer covers the color resist layer; The first substrate further includes an inorganic isolation layer, which is disposed between the color resist layer and the organic layer. The inorganic isolation layer is disposed at least at the position corresponding to the blue color resist and isolates the blue color resist from the organic layer.

2. The display panel as described in claim 1, characterized in that, In the thickness direction of the display panel, the thickness of the blue color resist is greater than the thickness of the adjacent color resist pattern, and on the side facing the second substrate, the blue color resist is positioned at a height that protrudes from the adjacent color resist pattern. The inorganic isolation layer is disposed on the side of the blue color resist facing the second substrate, and covers the surface and / or side of the relatively protruding portion of the blue color resist.

3. The display panel as described in claim 1, characterized in that, In the thickness direction of the display panel, the thickness of the blue color resist is less than the thickness of the adjacent color resist pattern, and on the side facing the second substrate, the blue color resist is recessed at a height relative to the adjacent color resist pattern. The inorganic isolation layer is disposed on the side of the blue color resist facing the second substrate and fills the recessed position.

4. The display panel as described in claim 1, characterized in that, The inorganic isolation layer is disposed on the side of the color resist layer opposite to the thin film transistor layer and covers the entire surface of the color resist layer.

5. The display panel as described in claim 4, characterized in that, The peripheral portion of the inorganic isolation layer is bent and extended toward the first substrate to form an extension portion, and the extension portion covers the peripheral portion of the color resist layer.

6. The display panel as described in any one of claims 2 to 5, characterized in that, The inorganic isolation layer is configured as SiO₂. X isolation layer or SiN X Isolation layer.

7. The display panel as described in any one of claims 2 to 5, characterized in that, The thickness of the inorganic isolation layer is set to 8. The display panel as described in any one of claims 2 to 5, characterized in that, The transmittance of the inorganic isolation layer is greater than 90%.

9. The display panel as claimed in claim 1, characterized in that, The second substrate includes a second substrate and a light-shielding layer. The light-shielding layer is disposed on the side of the second substrate facing the first substrate. The light-shielding layer includes a plurality of light-shielding portions. In the thickness direction of the display panel, the light-shielding portions are disposed at positions corresponding to the positions between two adjacent color resist patterns. The thin-film transistor layer includes a plurality of thin-film transistors arranged in an array, and the thin-film transistors correspond to the positions of the light-shielding portion in the thickness direction of the display panel.

10. A display device, characterized in that, Includes the display panel as described in any one of claims 1 to 9.

Images