High-power super server module

Abstract

The utility model relates to a high-power super server module which comprises an electronic equipment body, a radiator is arranged on one side of the electronic equipment body, a control console is arranged on one side of the radiator, and a cooling mechanism used for improving cooling performance is arranged on one side of the control console. The cooling mechanism comprises a lower cooling plate arranged on one side of the console, the left side and the right side of one side of the lower cooling plate are communicated with a coolant inlet and a coolant outlet respectively, and a first flow guide pipe and a second flow guide pipe are communicated between the first coolant inlet and the opposite side of the lower cooling plate and between the first coolant outlet and the opposite side of the lower cooling plate respectively. A GPU plate is arranged on one side of the lower cold plate, and an upper cold plate is arranged on one side of the GPU plate. According to the high-power super server module, good heat conduction efficiency is shown through the arranged cooling mechanism, the high-power super server module has high fluid fluidity and uniformity, the structure is compact, the space can be efficiently utilized, meanwhile, follow-up installation and maintenance are facilitated, and good production cost control and manufacturing feasibility are achieved.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation and cooling plate technology, specifically a high-power super server module. Background Technology

[0002] A heat dissipation plate is a device used for heat dissipation. It usually refers to a metal plate mounted above the heat source in a liquid cooling system. A liquid working fluid flows through the plate, and the heat is dissipated from the components through internal fluid circulation, achieving a high-efficiency heat dissipation effect. The advantages of a heat dissipation plate include high-efficiency heat dissipation performance, good thermal conductivity, and low noise level.

[0003] Traditional server module cooling systems suffer from high fluid flow resistance and uneven coolant distribution, resulting in poor cooling efficiency and heat transfer, especially when handling high power density components. Furthermore, their design is not compact enough, failing to efficiently utilize internal space and impacting the flexibility and scalability of the overall layout. Therefore, a high-power super server module is proposed to address these issues. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides a high-power super server module with advantages such as good heat transfer efficiency. It solves the problems of high fluid flow resistance and uneven coolant distribution in the cooling system of traditional server modules, which lead to poor cooling efficiency and heat transfer effect, especially when dealing with high power density components. At the same time, its design is not compact enough and fails to make efficient use of internal space, affecting the flexibility and scalability of the overall layout.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a high-power super server module, including an electronic device body, a heat sink on one side of the electronic device body, a control console on one side of the heat sink, and a cooling mechanism for improving cooling performance on one side of the control console;

[0006] The cooling mechanism includes a lower cooling plate located on one side of the control panel. A first coolant inlet and a first coolant outlet are respectively connected to the left and right sides of one side of the lower cooling plate. A first guide pipe and a second guide pipe are respectively connected between the first coolant inlet and the first coolant outlet and the side opposite to the lower cooling plate. A GPU board is located on one side of the lower cooling plate, and an upper cooling plate is located on one side of the GPU board. A second coolant inlet and a second coolant outlet are respectively connected to the left and right ends of one side of the upper cooling plate.

[0007] Furthermore, the lower cooling plate includes a lower cooling rib plate and a lower cooling flow channel plate.

[0008] Furthermore, the lower cooling rib plate includes a fixed frame and multiple I-shaped plates, with multiple cylinders connecting the left and right ends of the upper surface of the fixed frame and between adjacent plates.

[0009] Furthermore, the surface of the lower cooling channel plate is provided with a plurality of fixing grooves, which are evenly distributed on the surface of the lower cooling channel plate.

[0010] Furthermore, the upper cooling plate includes an upper cooling flow channel plate, an upper cooling flow channel baffle, and an upper cooling rib plate.

[0011] Furthermore, the No. 2 coolant inlet and the No. 2 coolant outlet are located at the left and right ends of one side of the upper cooling flow channel plate, respectively.

[0012] Compared with the prior art, the technical solution of this application has the following beneficial effects:

[0013] This high-power super server module demonstrates excellent heat transfer efficiency through its cooling mechanism, exhibits strong fluid flow and uniformity, has a compact structure that makes efficient use of space, facilitates subsequent installation and maintenance, and demonstrates good production cost control and manufacturing feasibility. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the cooling mechanism of this utility model;

[0015] Figure 2 This is a schematic diagram of the lower cooling plate structure of this utility model;

[0016] Figure 3 This is a schematic diagram of the lower cooling rib plate structure of this utility model;

[0017] Figure 4 This is a schematic diagram of the upper cold plate structure of this utility model;

[0018] Figure 5 This is a schematic diagram of the upper cooling channel plate structure of this utility model;

[0019] Figure 6 This is a schematic diagram of the upper cooling rib plate structure of this utility model.

[0020] In the diagram: 1 Electronic device body, 2 Heat sink, 3 Control console, 4 Cooling mechanism, 401 Lower cooling plate, 4011 Lower cooling fin plate, 4012 Lower cooling flow channel plate, 402 No. 1 coolant inlet, 403 No. 1 coolant outlet, 404 No. 1 guide pipe, 405 No. 2 guide pipe, 406 GPU board, 407 Upper cooling plate, 4071 Upper cooling flow channel plate, 4072 Upper cooling flow channel baffle, 4073 Upper cooling fin plate, 408 No. 2 coolant inlet, 409 No. 2 coolant outlet. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Please see Figures 1 to 6 In this embodiment, a high-power super server module includes an electronic device body 1, a heat sink 2 on one side of the electronic device body 1, a control console 3 on one side of the heat sink 2, and a cooling mechanism 4 for improving cooling performance on one side of the control console 3.

[0023] In this embodiment, the cooling mechanism 4 includes a lower cooling plate 401 disposed on one side of the control console 3. The left and right sides of one side of the lower cooling plate 401 are respectively connected to a first coolant inlet 402 and a first coolant outlet 403. The first coolant inlet 402 and the first coolant outlet 403 are respectively connected to a first guide pipe 404 and a second guide pipe 405 on the side opposite to the lower cooling plate 401. A GPU plate 406 is disposed on one side of the lower cooling plate 401, and an upper cooling plate 407 is disposed on one side of the GPU plate 406. The left and right ends of one side of the upper cooling plate 407 are respectively connected to a second coolant inlet 408 and a second coolant outlet 409.

[0024] The lower cooling plate 401 includes a lower cooling rib plate 4011 and a lower cooling flow channel plate 4012. The lower cooling rib plate 4011 includes a fixed frame and multiple plates with an I-shaped cross-section. Multiple cylinders are connected to the left and right ends of the upper surface of the fixed frame and between two adjacent plates. Multiple fixing grooves are opened on the surface of the lower cooling flow channel plate 4012. The multiple fixing grooves are evenly distributed on the surface of the lower cooling flow channel plate 4012.

[0025] It should be noted that the coolant enters the lower cooling fin plate 4011 from the lower cooling flow channel plate 4012 under the action of water pressure. The lower cooling flow channel plate 4012 adopts a parallel flow splitting method to reduce flow resistance and achieve uniform distribution of cold fluid, thereby enhancing heat exchange. In addition, the lower cooling flow channel plate 4012 also uses a fin design to further improve the heat exchange effect.

[0026] In this embodiment, the upper cooling plate 407 includes an upper cooling flow channel plate 4071 (coolant enters from the inlet; the upper cooling flow channel plate 4071 adopts a parallel flow splitting structure, which effectively reduces the flow resistance of coolant entering the flow channel and evenly distributes the cold fluid in the flow channel, further enhancing the heat exchange effect), an upper cooling flow channel baffle 4072, and an upper cooling fin plate 4073. The second coolant inlet 408 and the second coolant outlet 409 are located at the left and right ends of one side of the upper cooling flow channel plate 4071, respectively.

[0027] It should be noted that the outlet of the upper cooling flow channel plate 4071 is located in the middle. After the fluid passes through the upper cooling flow channel baffle 4072, it enters the upper cooling fin plate 4073. The upper cooling fin plate 4073 is designed with a sparse fin structure in the middle and a dense fin structure in the rear. This is because when the coolant flows, it first comes into contact with the middle part, and its temperature gradually increases. Therefore, increasing the density of the fins in the rear section can effectively improve the heat exchange efficiency.

[0028] The experimental results are as follows: With a 407 cooling plate flow rate of 5 L / min, an inlet water temperature of 40℃, and a total power of 40W*50+17W*25=2450W: the GPU chip's maximum temperature was 88.401℃, the average temperature was 84.152℃, and the temperature difference was 4.249℃; the MPC chip's maximum temperature was 58.002℃, the average temperature was 54.27℃, and the temperature difference was 3.732℃; the pressure drop was 21.31Kpa. With a 407 cooling plate flow rate of 10 L / min, an inlet water temperature of 40℃, and a total power of 400W*25+20W*40=10800W: the PCR chip's maximum temperature was 72.74℃, the average temperature was 67.047℃, and the temperature difference was 5.693℃. The highest temperature of the et chip is 67.429℃, the average temperature is 66.16℃, the temperature difference is 3.093℃, and the voltage drop is 19.311Kpa.

[0029] It is understandable that when the coolant flows through the upper cooling channel baffle 4072, it will be subjected to the combined effects of gravity and water pressure, resulting in an impact and forming a liquid jet. This phenomenon greatly enhances the heat exchange effect. The cooling mechanism 4 exhibits good heat transfer efficiency, strong fluid flow and uniformity, compact structure and efficient use of space, and also facilitates subsequent installation and maintenance, with good production cost control and manufacturing feasibility.

[0030] The working principle of the above embodiments is as follows:

[0031] The coolant enters through the inlet. The upper cooling channel plate 4071 adopts a parallel flow-dividing structure. This design effectively reduces the flow resistance of the coolant entering the channel and evenly distributes the cold fluid in the channel, further enhancing the heat exchange effect. The outlet of the upper cooling channel plate 4071 is located in the middle. After passing through the upper cooling channel baffle 4072, the fluid enters the upper cooling finned plate 4073. The upper cooling finned plate 4073 is designed with a sparse fin structure in the middle and a dense fin structure at the rear. This is because when the coolant flows, it first comes into contact with the middle part, where its temperature gradually increases. Therefore, the increased fins at the rear... The density of the fins can effectively improve the heat exchange efficiency. In addition, when the coolant flows through the upper cooling channel baffle 4072, it will be subjected to the combined action of gravity and water pressure, generating an impact and forming a liquid jet. This phenomenon greatly enhances the heat exchange effect. Under the action of water pressure, the coolant enters the lower cooling fin plate 4011 from the lower cooling channel plate 4012. The lower cooling channel plate 4012 adopts a parallel flow splitting method to reduce flow resistance and achieve uniform distribution of cold fluid, thereby enhancing heat exchange. In addition, the lower cooling channel plate 4012 also uses a fin design to further improve the heat exchange effect.

[0032] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0033] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-power super-server module comprising an electronic device body (1), characterized in that: The side of the electronic device body (1) is provided with a radiator (2), one side of the radiator (2) is provided with a control console (3), one side of the control console (3) is provided with a cooling mechanism (4) for improving cooling performance; The cooling mechanism (4) comprises a lower cold plate (401) provided on one side of the control console (3), and the left and right sides of one side of the lower cold plate (401) are respectively communicated with a first coolant inlet (402) and a first coolant outlet (403); the first coolant inlet (402) and the first coolant outlet (403) are respectively communicated with a first flow guide pipe (404) and a second flow guide pipe (405) between the opposite sides of the lower cold plate (401); one side of the lower cold plate (401) is provided with a GPU plate (406); one side of the GPU plate (406) is provided with an upper cold plate (407); the left and right ends of one side of the upper cold plate (407) are respectively communicated with a second coolant inlet (408) and a second coolant outlet (409).

2. The high-power super server module of claim 1, wherein: The lower cold plate (401) comprises a lower cold fin plate (4011) and a lower cold runner plate (4012).

3. The high-power super-server module of claim 2, wherein: The lower cold fin plate (4011) comprises a fixed frame and a plurality of plate blocks with an I-shaped cross section, and a plurality of cylinders are communicated between the left and right ends of the upper surface of the fixed frame and adjacent two plate blocks.

4. The high-power super server module of claim 2, wherein: The surface of the lower cold runner plate (4012) is provided with a plurality of fixing grooves, and the plurality of fixing grooves are uniformly distributed on the surface of the lower cold runner plate (4012).

5. The high-power super server module of claim 1, wherein: The upper cold plate (407) comprises an upper cold runner plate (4071), an upper cold runner partition plate (4072) and an upper cold fin plate (4073).

6. The high-power super-server module of claim 5, wherein: The second coolant inlet (408) and the second coolant outlet (409) are respectively located at the left and right ends of one side of the upper cold runner plate (4071).

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