Display device

Abstract

A display device includes: a display panel including a plurality of pixels; and a display circuit board transmitting a signal to the display panel, and including a first group of layers and a second group of layers sequentially stacked in a thickness direction. The display circuit board includes: a main body portion including a first group of layers and a second group of layers; a connecting portion extending from one side of the main body portion and including layers having the same structure as that of the first group of layers; a connector disposed on an upper portion of the connecting portion; and a reinforcing portion disposed on a lower portion of the connecting portion to overlap the connector in a plan view, and including a layer having the same structure as a structure of the second group of layers.

Description

[0001] Cross Reference to Related Applications

[0002] This application claims priority to Korean Patent Application No. 10-2023-0146996, filed on October 30, 2023, and all the benefits accruing therefrom, the contents of which are incorporated herein in their entirety by reference. TECHNICAL FIELD

[0003] Embodiments relate to a display apparatus and a method of manufacturing a display apparatus, and more particularly, to a display apparatus including a display circuit board having improved quality and a simplified manufacturing process, and a method of manufacturing a display apparatus. BACKGROUND

[0004] Recently, electronic devices are being widely used. Electronic devices are widely used in various forms such as a portable configuration and a fixed configuration. Such electronic devices include a display apparatus that provides visual information such as a still image or a moving image to a user and supports various functions.

[0005] With recent advances in miniaturization of components for driving a display apparatus, display apparatuses tend to become increasingly important in electronic devices, and structures that can be bent to a certain angle from a flat state are developed.

[0006] In general, a display apparatus includes a display layer disposed over a substrate. In such a display apparatus, at least a portion thereof is bent, so that visibility from different angles can be improved, or the area of a non-display region can be reduced. Specifically, some components such as a display circuit board can be arranged in a bent portion of a display apparatus. SUMMARY

[0007] A connector can be disposed (e.g., mounted) on a display circuit board. In this case, there is a need for a circuit board on which a connector can be disposed (e.g., mounted) and which can have relatively high quality and a simplified manufacturing process.

[0008] Embodiments include a display apparatus and a method of manufacturing a display apparatus in which a manufacturing process for a display circuit board is simplified, and the display apparatus has excellent quality.

[0009] However, this is merely illustrative embodiments, and the scope of the present disclosure is not limited thereto.

[0010] Additional features will be set forth in part in the description which follows, and in part will become apparent to those skilled in the art upon examination of the following description and drawings, or can be learned by practice of the presented embodiments of the disclosure.

[0011] In an embodiment of the disclosure, a display device includes a display panel including a plurality of pixels, and a display circuit board that transmits a signal to the display panel and includes a first group of layers and a second group of layers stacked in a thickness direction of the display circuit board, wherein the display circuit board includes a main portion including the first group of layers and the second group of layers, a connection portion extending from one side of the main portion and including layers having the same structure as a structure of the first group of layers, a connector disposed on an upper portion of the connection portion, and a reinforcement portion disposed on a lower portion of the connection portion to overlap the connector in a plan view and including layers having the same structure as a structure of the second group of layers.

[0012] The first group of layers of the main portion can be connected to the connection portion, and the second group of layers of the main portion can be disconnected from the connection portion and the reinforcement portion.

[0013] The reinforcement portion can be disconnected from the second group of layers of the main portion and disposed in an island shape.

[0014] In an embodiment, the reinforcement portion can include at least one conductive layer, and the at least one conductive layer can be exposed and connected to a ground.

[0015] In an embodiment, the reinforcement portion can include a first conductive layer disposed on the lower portion of the connection portion, a second conductive layer disposed on a lower portion of the first conductive layer, and an insulating film layer disposed between the first conductive layer and the second conductive layer.

[0016] In an embodiment, the reinforcement portion can further include a prepreg layer disposed on the first conductive layer.

[0017] In an embodiment, the display circuit board can further include a dam portion disposed under the reinforcement portion and defining an opening exposing at least a portion of the reinforcement portion.

[0018] In an embodiment, the main portion can further include a cover layer disposed on a lower portion of the second group of layers, and the dam portion can include a material that is the same as a material of the cover layer.

[0019] In an embodiment, the dam portion can be disposed in a ring shape along a periphery of the reinforcement portion.

[0020] In an embodiment, the dam portion can further include a rib disposed through the opening.

[0021] In an embodiment, the rib can be disposed in a grid pattern.

[0022] In an embodiment of the disclosure, a method of manufacturing a display apparatus includes forming a display circuit board and connecting the display circuit board to a display panel, wherein forming the display circuit board includes forming a stack structure including a main portion by sequentially stacking a first group of layers and a second group of layers in a thickness direction of the display circuit board, forming a connection portion connected to the main portion by removing the second group of layers from one side of the main portion, and forming a reinforcement portion by leaving a portion of the second group of layers overlapping a connector to be disposed (e.g., mounted) on the connection portion when the second group of layers is removed, the reinforcement portion being disposed on a lower portion of the connection portion.

[0023] In an embodiment, the method can further include disposing the connector on an upper portion of the connection portion.

[0024] In an embodiment, the second group of layers can be broken between the main portion and the reinforcement portion.

[0025] In an embodiment, the reinforcement portion can be broken from the second group of layers of the main portion and disposed in an island shape.

[0026] In an embodiment, the reinforcement portion can include at least one conductive layer, and the at least one conductive layer can be exposed and connected to a ground.

[0027] In an embodiment, the reinforcement portion can include a first conductive layer disposed on a lower portion of the connection portion, a second conductive layer disposed on a lower portion of the first conductive layer, and an insulating film layer disposed between the first conductive layer and the second conductive layer.

[0028] In an embodiment, the method can further include forming a dam portion defining an opening defined in a lower portion of the reinforcement portion and exposing at least a portion of the reinforcement portion.

[0029] In an embodiment, the dam portion and the cover layer can be formed by the same process, the cover layer being disposed on a lower portion of the main portion.

[0030] In an embodiment, the dam portion can be disposed in a ring shape along a periphery of the reinforcement portion.

[0031] Other features and advantages will become apparent from the following detailed description, taken in conjunction with the accompanying drawings, which illustrate, by way of example, the principles of the disclosure. BRIEF DESCRIPTION OF DRAWINGS

[0032] The above and other features and advantages of illustrative embodiments of the present disclosure will become more apparent by describing in detail exemplary embodiments thereof with reference made to the accompanying drawings in which:

[0033] Figure 1 is a schematic plan view of an embodiment of a portion of a display apparatus shown for ease of illustration in a state in which a connection circuit board is not bent;

[0034] Figure 2 is a schematic rear view of a part of the display device showing a state of the connection circuit board being bent;

[0035] Figure 3 is a schematic cross-sectional view of a part of the display device taken along the line III-III' of Figure 1

[0036] Figure 4 is a schematic side view of an embodiment of the display device;

[0037] Figure 5 is a schematic cross-sectional view of an embodiment of the display device taken along the line V-V' of Figure 2

[0038] Figure 6 is a schematic cross-sectional view of an embodiment of the display device similar to Figure 5

[0039] Figure 7 is a schematic bottom view of an embodiment of the display device showing a lower part of the reinforcing part in the VII direction and Figure 6 Figure 6

[0040] Figure 8 is a schematic bottom view of an embodiment showing a lower part of the reinforcing part similar to Figure 7

[0041] Figures 9 to 12 is a schematic view of an embodiment of a method of manufacturing the display device. DETAILED DESCRIPTION

[0042] Reference will now be made in detail to embodiments, which are illustrated in the accompanying drawings, wherein like reference numerals designate the same or similar elements throughout the several views. In this regard, the illustrated embodiments can have different forms and should not be construed as limited to the description set forth herein. Accordingly, the embodiments are described below, by reference to the drawings, only, to explain the features of the description. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. Throughout this disclosure, the expression “at least one of a, b, and c” means only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variations thereof.

[0043] ​​​​​​Since the present disclosure allows various changes and multiple embodiments, specific embodiments will be shown in the accompanying drawings and described in detail in the written description. Referring to the drawings for illustrating embodiments, in order to obtain a full understanding of the present disclosure, advantages of the present disclosure, and purposes accomplished by implementing the present disclosure. However, the present disclosure can be implemented in many different forms, and should not be interpreted as being limited to the embodiments set forth herein.

[0044] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. Like reference numerals in the drawings denote like elements, and repeated description thereof is omitted.

[0045] It will be understood that, although the terms "first", "second", etc. can be used herein to describe various elements, these elements should not be limited by these terms, and these elements are only used to distinguish one element from another.

[0046] As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0047] It will also be understood that the terms "comprise" and / or "comprising", when used herein, specify the presence of stated features or elements, but do not preclude the presence or addition of one or more other features or elements.

[0048] It will be understood that when a layer, region or element is referred to as being "formed on" another layer, region or element, it can be directly or indirectly formed on the other layer, region or element. That is, for example, an intervening layer, region or element can be present.

[0049] The sizes of the elements in the drawings can be exaggerated for the purpose of illustration. In other words, since the sizes and thicknesses of the elements in the drawings are arbitrarily shown for the purpose of illustration, the following embodiments are not limited thereto.

[0050] In the following examples, the x-axis, y-axis, and z-axis are not limited to the three axes of a rectangular coordinate system, and can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or can represent different directions that are not perpendicular to each other.

[0051] When a specific embodiment can be variously implemented, a specific process sequence can be performed differently from the described sequence. For example, two processes described in succession can be performed substantially simultaneously, or in an order opposite to the described sequence.

[0052] Figure 1 is a schematic plan view of an embodiment that is part of a display device. For ease of explanation, Figure 1 A state in which the connection circuit board is not bent is shown. Figure 2is a schematic rear view of an embodiment of a display apparatus. Figure 2 A state in which the connection circuit board is bent is shown.

[0053] Referring to Figure 1 and Figure 2 , the display apparatus 1 can display a moving image or a still image, and can be used as a display screen of various products (e.g., a portable electronic device such as a mobile phone, a smart phone, a tablet personal computer ("PC"), a mobile communication terminal, a personal digital assistant, an electronic book terminal, a portable multimedia player ("PMP"), a navigation device, or an ultra-mobile PC ("UMPC"), a television ("TV"), a laptop computer, a monitor, a billboard, an Internet of Things ("IoT") device, etc.). Also, in an embodiment, the display apparatus 1 can be used in a wearable device such as a smart watch, a watch phone, a glasses display, or a head-mounted display ("HMD"). Also, in an embodiment, the display apparatus 1 can be used as a display screen in an instrument cluster of a vehicle, a central information display ("CID") disposed (e.g., mounted) on a center fascia or a dashboard of a vehicle, an interior mirror display instead of a side mirror of a vehicle, or a car headrest monitor disposed for rear seat entertainment.

[0054] As shown in Figure 1 , the display apparatus 1 can have a shape that is substantially rectangular. As shown in Figure 1 , for example, the display apparatus 1 can have a quadrilateral planar shape, e.g., a rectangular planar shape having a short side extending in a first direction (e.g., an x direction or an -x direction) and a long side extending in a second direction (e.g., a y direction or a -y direction). In an embodiment, a portion in which the short side extending in the first direction (e.g., the x direction or the -x direction) intersects the long side extending in the second direction (e.g., the y direction or the -y direction) can have a right angle shape or a rounded shape with a certain curvature. The planar shape of the display apparatus 1 is not limited to a rectangle, and can be a polygon, a circle, or an ellipse.

[0055] The display apparatus 1 can include a display area DA and a peripheral area PA. In the display area DA, an image can be displayed. In the display area DA, a plurality of pixels PX can be arranged. The display apparatus 1 can provide an image by light emitted from the plurality of pixels PX. Each of the plurality of pixels PX can emit light through a display element. In an embodiment, each of the plurality of pixels PX can emit red light, green light, or blue light. In an embodiment, each of the plurality of pixels PX can emit red light, green light, blue light, or white light.

[0056] The peripheral area PA is an area in which no image is displayed, and can be a non-display area. The peripheral area PA can at least partially surround the display area DA. In an embodiment, for example, the peripheral area PA can surround the entire display area DA. In the peripheral area PA, a driver that supplies an electric signal to the plurality of pixels PX, a power supply line that supplies power to the plurality of pixels PX, and the like can be arranged. In an embodiment, for example, a scan driver that applies a scan signal to the plurality of pixels PX can be arranged in the peripheral area PA. Further, a data driver that applies a data signal to the plurality of pixels PX can be arranged in the peripheral area PA.

[0057] Figure 3 is a schematic cross-sectional view of a portion of the display device taken along line III-III' of Figure 1

[0058] Referring to Figure 3 and Figure 1 , the display device 1 can include a display panel 10. The display panel 10 can include a substrate 100, a display layer DSL, an encapsulation layer 300, a touch sensor layer TSL, and an optical function layer OFL. For ease of explanation, the touch sensor layer TSL and the optical function layer OFL are omitted in Figure 3 , which will be described in detail below with reference to Figure 4

[0059] The display layer DSL can be provided over the substrate 100. The display layer DSL can include a buffer layer 111, a pixel circuit layer PCL, and a display element layer DEL.

[0060] The substrate 100 can include glass or a polymeric resin such as polyether sulfone, polyarylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyimide, polycarbonate, cellulose triacetate, or cellulose acetate propionate. The substrate 100 including the polymeric resin can be flexible, rollable, or bendable. The substrate 100 can have a multi-layer structure including a barrier layer (not shown) and a base layer including the above polymeric resin.

[0061] The buffer layer 111 can include an inorganic insulating material such as silicon nitride (SiN x ), silicon oxynitride (SiON), or silicon oxide (SiO2), and can be one or more layers including the inorganic insulating material.

[0062] ​​A pixel circuit layer PCL can be provided over the buffer layer 111. The pixel circuit layer PCL can include transistors TFT included in a pixel circuit, and an inorganic insulating layer IIL, a first planarization layer 115, and a second planarization layer 116 provided below and / or above components of the transistors TFT. The inorganic insulating layer IIL can include a first gate insulating layer 112, a second gate insulating layer 113, and an interlayer insulating layer 114.

[0063] The transistors TFT can include a semiconductor layer A, and the semiconductor layer A can include polysilicon. In alternative embodiments, the semiconductor layer A can include amorphous silicon, oxide semiconductor, organic semiconductor, or the like. The semiconductor layer A can include a channel region, and source and drain regions on opposite sides of the channel region. The gate electrode G can overlap the channel region.

[0064] The gate electrode G can include a low-resistance metal material. The gate electrode G can include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), or titanium (Ti), and can be one or more layers including the above-described materials.

[0065] The first gate insulating layer 112 between the semiconductor layer A and the gate electrode G can include an inorganic insulating material such as SiO2, SiN x , SiON, aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), or zinc oxide (ZnO x ). The ZnO x may be ZnO and / or ZnO2.

[0066] The second gate insulating layer 113 can cover the gate electrode G. Similar to the first gate insulating layer 112, the second gate insulating layer 113 can include an inorganic insulating material such as SiO2, SiN x , SiON, Al2O3, TiO2, Ta2O5, HfO2, or ZnO x . The ZnO x may be ZnO and / or ZnO2.

[0067] An upper electrode CE2 of the storage capacitor Cst can be provided over the second gate insulating layer 113. The upper electrode CE2 can overlap the gate electrode G provided thereunder. In this case, the gate electrode G and the upper electrode CE2, which overlap each other with the second gate insulating layer 113 therebetween, can form the storage capacitor Cst of the pixel circuit. That is, the gate electrode G can serve as a lower electrode CE1 of the storage capacitor Cst. As described, the storage capacitor Cst can overlap the transistors TFT. In some embodiments, the storage capacitor Cst can not overlap the transistors TFT.

[0068] The upper electrode CE2 can include Al, platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), Mo, Ti, tungsten (W), and / or Cu, and can be one or more layers including the above-described materials.

[0069] The interlayer insulating layer 114 can cover the upper electrode CE2. The interlayer insulating layer 114 can include SiO2, SiN x , SiON, Al2O3, TiO2, Ta2O5, HfO2, ZnO x , etc. The ZnO x may be ZnO and / or ZnO2. The interlayer insulating layer 114 can be one or more layers including the above-described inorganic insulating materials.

[0070] The drain electrode D and the source electrode S can each be disposed on the interlayer insulating layer 114. The drain electrode D and the source electrode S can each include a material having good conductivity. The drain electrode D and the source electrode S can each include a conductive material including Mo, Al, Cu, or Ti, and can be one or more layers including the above-described materials. In an embodiment, the drain electrode D and the source electrode S can have a multi-layer structure of Ti / Al / Ti.

[0071] The first planarization layer 115 can cover the drain electrode D and the source electrode S. The first planarization layer 115 can include an organic insulating layer. The first planarization layer 115 can include an organic insulating material such as a general-purpose polymer such as polymethyl methacrylate ("PMMA") or polystyrene ("PS"), a polymer derivative having a phenol-based group, an acryl-based polymer, an imide-based polymer, an aryl ether-based polymer, an amide-based polymer, a fluorine-based polymer, a p-xylylene-based polymer, a vinyl alcohol-based polymer, or any combination thereof.

[0072] The connection electrode CML can be disposed on the first planarization layer 115. In this case, the connection electrode CML can be connected to the drain electrode D or the source electrode S through a contact hole in the first planarization layer 115. The connection electrode CML can include a material having good conductivity. The connection electrode CML can include a conductive material including Mo, Al, Cu, or Ti, and can be one or more layers including the above-described materials. In an embodiment, the connection electrode CML can have a multi-layer structure of Ti / Al / Ti.

[0073] The second planarization layer 116 can cover the connection electrode CML. The second planarization layer 116 can include an organic insulating layer. The second planarization layer 116 can include an organic insulating material such as a general-purpose polymer such as PMMA or PS, a polymer derivative having a phenol-based group, an acryl-based polymer, an imide-based polymer, an aryl ether-based polymer, an amide-based polymer, a fluorine-based polymer, a p-xylene-based polymer, a vinyl alcohol-based polymer, and any combination thereof.

[0074] The display element layer DEL can be disposed on the pixel circuit layer PCL. The display element layer DEL can include a display element DE. The display element DE can be an organic light emitting diode (“OLED”). A pixel electrode 211 of the display element DE can be electrically connected to the connection electrode CML through a contact hole in the second planarization layer 116.

[0075] The pixel electrode 211 can include a conductive oxide such as indium tin oxide (“ITO”), indium zinc oxide (“IZO”), ZnO, indium oxide (In2O3), indium gallium oxide (“IGO”), or aluminum zinc oxide (“AZO”). In an embodiment, the pixel electrode 211 can include a reflective film including Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, or any combination thereof. In another embodiment, the pixel electrode 211 can further include a film including ITO, IZO, ZnO, or In2O3 on / under the above-described reflective film.

[0076] A pixel definition layer 118 defining an opening 118OP exposing a central portion of the pixel electrode 211 can be disposed on the pixel electrode 211. The pixel definition layer 118 can include an organic insulating material and / or an inorganic insulating material. The opening 118OP can define an emission area (hereinafter, also referred to as an emission area) EA of light emitted from the display element DE. In an embodiment, for example, a width of the opening 118OP can correspond to a width of the emission area EA of the display element DE.

[0077] A spacer 119 can be disposed on the pixel definition layer 118. In a method of manufacturing a display apparatus, the spacer 119 can prevent damage to the substrate 100. A mask sheet can be used during manufacturing of a display panel, and in this case, defects such as damage to a portion of the substrate 100 or breakage of the substrate 100 caused by the mask sheet when a deposition material is deposited on the substrate 100, in which such defects are caused when the mask sheet enters the opening 118OP of the pixel definition layer 118 or is adhered to the pixel definition layer 118, can be prevented.

[0078] The spacer 119 can include an organic insulating material such as polyimide. In an alternative embodiment, the spacer 119 can include an inorganic insulating material such as SiN x or SiO2or both an organic insulating material and an inorganic insulating material.

[0079] In an embodiment, the spacer 119 can include a material different from that of the pixel-defining layer 118. In an alternative embodiment, in another embodiment, the spacer 119 can include the same material as that of the pixel-defining layer 118, and in this case, the pixel-defining layer 118 and the spacer 119 can be formed together by a mask process using a half-tone mask or the like.

[0080] The intermediate layer 212 can be provided over the pixel-defining layer 118. The intermediate layer 212 can include an emission layer 212b provided in the opening 118OP of the pixel-defining layer 118. The emission layer 212b can include a high molecular weight organic material or a low molecular weight organic material that emits light of a predetermined color.

[0081] The first functional layer 212a and the second functional layer 212c can be provided below and above the emission layer 212b. The first functional layer 212a can include, for example, a hole-transport layer ("HTL") or both an HTL and a hole-injection layer ("HIL"). The second functional layer 212c can be provided over the emission layer 212b and is optional. The second functional layer 212c can include an electron-transport layer ("ETL") and / or an electron-injection layer ("EIL"). The first functional layer 212a and / or the second functional layer 212c can each be a common layer formed to cover the entire substrate 100, like the counter electrode 213 described below.

[0082] The counter electrode 213 can include a conductive material having a relatively low work function. In an embodiment, for example, the counter electrode 213 can include a transparent (or semi-transparent) layer containing Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, lithium (Li), calcium (Ca), or any alloy thereof. In an alternative embodiment, the counter electrode 213 can further include a layer including ITO, IZO, ZnO, or In2O3over a transparent (or semi-transparent) layer including the above-described material.

[0083] In some embodiments, a cap layer (not shown) can be further provided over the counter electrode 213. The cap layer can include LiF, an inorganic material, and / or an organic material.

[0084] A packaging layer 300 can be disposed on the counter electrode 213. The packaging layer 300 can be disposed on and cover the display element layer DEL. The packaging layer 300 can include at least one inorganic packaging layer and at least one organic packaging layer, and in an embodiment, Figure 3 It is shown that the packaging layer 300 includes a first inorganic packaging layer 310, an organic packaging layer 320, and a second inorganic packaging layer 330 stacked in order.

[0085] The first inorganic packaging layer 310 and the second inorganic packaging layer 330 can each include one or more inorganic materials selected from Al2O3, TiO2, Ta2O5, HfO2, ZnO x , SiO2, SiN x , and SiON. The organic packaging layer 320 can include a polymer-based material. The polymer-based material can include an acrylic resin, an epoxy-based resin, a polyimide, a polyethylene, or the like. In an embodiment, the organic packaging layer 320 can include an acrylate. The organic packaging layer 320 can be formed by curing a monomer or applying a polymer. The organic packaging layer 320 can be transparent.

[0086] Although not shown on the packaging layer 300, the above-described touch sensor layer can be disposed, and an optical function layer can be disposed on the touch sensor layer.

[0087] Figure 4 is a schematic side view of an embodiment of a display device.

[0088] Referring to Figure 4 , the display device 1 can include a display panel 10, a cover window 20, a display driver 30, a display circuit board 40, a connection circuit board 50, a cushion layer CS, and a protection film PTF.

[0089] The display panel 10 can display information processed in the display device 1. In an embodiment, for example, the display panel 10 can display information about an execution screen of an application executed on the display device 1, or display user interface ("UI") information or graphical user interface ("GUI") information according to information about the execution screen.

[0090] The display panel 10 can include a display element. In an embodiment, for example, the display panel 10 can be an organic light emitting display panel using an organic light emitting diode, a micro light emitting diode ("LED") display panel using a micro LED, a quantum dot light emitting display panel using a quantum dot LED including a quantum dot emission layer, or an inorganic light emitting display panel using an inorganic LED including an inorganic semiconductor. Hereinafter, a case in which the display panel 10 is an organic light emitting display panel using an organic light emitting diode as a display element is described in detail.

[0091] The display panel 10 can include a substrate 100 and a multilayer film disposed over the substrate 100. In an embodiment, the display panel 10 can include the substrate 100, a display layer DSL, an encapsulation layer 300, a touch sensor layer TSL, and an optical functional layer OFL. In this case, a display area DA and a peripheral area PA can be defined in the substrate 100 and / or the multilayer film. In an embodiment, for example, the substrate 100 can be described to include the display area DA and the peripheral area PA. Further, the peripheral area PA can include a pad area PDA protruding from one side of the peripheral area PA.

[0092] The substrate 100 can include a polymeric resin such as polyether sulfone, polyarylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyimide, polycarbonate, cellulose triacetate, or cellulose acetate propionate. In an embodiment, the substrate 100 can have a multilayer structure including a barrier layer (not shown) and a base layer including the polymeric resin described above. The substrate 100 including the polymeric resin can be flexible, rollable, or bendable.

[0093] The display layer DSL can be disposed over the substrate 100. The display layer DSL can include a pixel circuit and a display element. In this case, each pixel circuit can be connected to each display element. The pixel circuit can include a thin film transistor and a storage capacitor. Accordingly, the display layer DSL can include a plurality of display elements, a plurality of thin film transistors, and a plurality of storage capacitors. Further, the display layer DSL can also include a plurality of insulating layers interposed therebetween.

[0094] The encapsulation layer 300 can be disposed over the display layer DSL. The encapsulation layer 300 can be disposed over and cover the display element. In an embodiment, the encapsulation layer 300 can include at least one inorganic encapsulation layer and at least one organic encapsulation layer. The at least one inorganic encapsulation layer can include one or more inorganic materials selected from Al2O3, TiO2, Ta2O5, ZnO, SiO2, SiN x and SiON. The at least one organic encapsulation layer can include a polymer-based material. The polymer-based material can include an acrylic resin, an epoxy-based resin, a polyimide, a polyethylene, etc. In an embodiment, the at least one organic encapsulation layer can include an acrylate.

[0095] The touch sensor layer TSL can be disposed over the encapsulation layer 300. The touch sensor layer TSL can sense coordinate information according to an external input (e.g., a touch event). The touch sensor layer TSL can include a sensor electrode and a touch line connected to the sensor electrode. The touch sensor layer TSL can sense an external input in a self-capacitance manner or a mutual-capacitance manner.

[0096] The touch sensor layer TSL can be formed on the encapsulation layer 300. In an alternative embodiment, after the touch sensor layer TSL is separately formed on a touch substrate, the touch sensor layer TSL can be coupled to the encapsulation layer 300 through an adhesive layer such as an optically clear adhesive ("OCA"). In an embodiment, the touch sensor layer TSL can be directly formed on the encapsulation layer 300, and in this case, an adhesive layer can not be interposed between the touch sensor layer TSL and the encapsulation layer 300.

[0097] The optical function layer OFL can be disposed above the touch sensor layer TSL. The optical function layer OFL can reduce the reflectance of light (external light) incident from the outside toward the display apparatus 1, and / or can improve the color purity of light emitted from the display apparatus 1. In an embodiment, the optical function layer OFL can include a retarder and a polarizer. The retarder can be of a film type or a liquid crystal coating type, and can include a λ / 2 retarder and / or a λ / 4 retarder. The polarizer can also be of a film type or a liquid crystal coating type. The film type can include a stretched synthetic resin film, and the liquid crystal coating type can include liquid crystals arranged in a predetermined arrangement. The retarder and the polarizer can also include a protective film.

[0098] In another embodiment, the optical function layer OFL can include a black matrix and a color filter. The color filter can be arranged in consideration of the colors of light respectively emitted from the pixels of the display apparatus 1. Each color filter can include a red, green, or blue pigment or dye. In an alternative embodiment, each color filter can include a quantum dot in addition to the above-described pigments or dyes. In an alternative embodiment, some of the color filters can not include the above-described pigments or dyes, and can include scattering particles such as TiO2.

[0099] In another embodiment, the optical function layer OFL can include a destructive interference structure. The destructive interference structure can include a first reflective layer and a second reflective layer arranged in different layers. First reflected light and second reflected light respectively reflected from the first reflective layer and the second reflective layer can destructively interfere with each other, and the reflectance of external light can accordingly be reduced.

[0100] The cover window 20 can be disposed above the display panel 10. The cover window 20 can protect the display panel 10. In an embodiment, the cover window 20 can be a flexible window. The cover window 20 can be easily bent by external force without generating cracks or the like, thereby providing protection for the display panel 10. The cover window 20 can include at least one of glass, sapphire, and plastic. The cover window 20 can be, for example, ultra-thin glass ("UTG") or colorless polyimide ("CPI"). In an embodiment, the cover window 20 can have a structure in which a flexible polymer layer is disposed on one surface of a glass substrate, or can include only a polymer layer.

[0101] The cover window 20 can be attached to the display panel 10 by an adhesive member. The adhesive member can be a colorless adhesive member such as an OCA. Also, the adhesive member can include a well-known adhesive material. Such an adhesive member can be formed on the upper portion of the display panel 10 in various ways; for example, a film-type adhesive member can be attached to the upper portion of the display panel 10, or a material-type adhesive member can be applied to the upper portion of the display panel 10.

[0102] The connection circuit board 50 can be connected to the display panel 10. An end portion of the connection circuit board 50 can be connected to the display panel 10 (e.g., the pad area PDA of the substrate 100). The pad area PDA of the substrate 100 can extend on one side of the peripheral area PA and include a plurality of pad portions that can be electrically connected to the connection circuit board 50.

[0103] In an embodiment, the connection circuit board 50 can be a flexible printed circuit board. In an embodiment, for example, the connection circuit board 50 can be an anisotropic conductive film. The connection circuit board 50 can have an end portion connected to the pad area PDA and be bent into a U-shape. Accordingly, the area of the peripheral area PA observed by a user can be reduced.

[0104] The display driver 30 can be disposed on the connection circuit board 50. The display driver 30 can receive a control signal and a power voltage and generate and output a signal and a voltage for driving the display panel 10. The display driver 30 can include an integrated circuit (“IC”). In an embodiment, the display driver 30 can be disposed on a surface of the connection circuit board 50 facing the cushion layer CS.

[0105] An opposite end portion of the connection circuit board 50 can be connected to the display circuit board 40. In an embodiment, for example, a pad portion of the connection circuit board 50 can contact a pad portion of the display circuit board 40 and thus be electrically connected to the pad portion of the display circuit board 40. Because the connection circuit board 50 is bent into a U-shape and extends to the rear surface of the display surface of the display panel 10, the display circuit board 40 can be disposed on the rear surface of the display surface of the display panel 10. In an embodiment, the display circuit board 40 can be attached to the cushion layer CS by an adhesive member.

[0106] The display circuit board 40 can be a flexible printed circuit board (“FPCB”) that can be bent, or a rigid printed circuit board (“PCB”) that is rigid and hardly bent. In an alternative embodiment, in some cases, for example, the display circuit board 40 can be a composite PCB including both a rigid PCB and an FPCB.

[0107] Although not shown, various drivers can be arranged on the display circuit board 40. In some embodiments, a touch sensor driver may be disposed on the display circuit board 40. For example, the touch sensor driver may include an IC. The touch sensor driver can be electrically connected via the display circuit board 40 to the sensor electrodes of the touch sensor layer TSL of the display panel 10.

[0108] In addition, a power supply can be separately installed on the display circuit board 40. The power supply can provide driving voltage for driving the pixels of the display panel 10 and the display driver 30.

[0109] The protective film PTF can be patterned and attached to the lower surface of the substrate 100. That is, the protective film PTF can be disposed between the substrate 100 and the padding layer CS.

[0110] In this embodiment, the cushioning layer CS may be disposed beneath the display panel 10 (particularly the substrate 100). The cushioning layer CS can prevent damage to the display panel 10 by absorbing external impacts. The cushioning layer CS may comprise polymer resins such as polyurethane, polycarbonate, polypropylene, or polyethylene, or elastic materials (e.g., sponges obtained by foaming rubber, urethane-based materials, or acryloyl-based materials).

[0111] Figure 5 It is along Figure 2 This is a schematic cross-sectional view of an embodiment of the display device, taken along line V-V'. For ease of explanation, the display circuit board 40 is mainly shown, and the display panel 10, etc., are omitted.

[0112] refer to Figure 2 and Figure 5 The display circuit board 40 may include at least one conductive layer and at least one insulating film layer. In an embodiment, the display circuit board 40 may include a main body portion 60, a connecting portion 70, and a reinforcing portion 90.

[0113] The main body 60 may include a first set of layers 61 and a second set of layers 62. The first set of layers 61 and the second set of layers 62 may be in the thickness direction of the display circuit board 40 (e.g., Figure 5 Stacked sequentially in the -z direction. That is, as... Figure 5 As shown, the first group of layers 61 can be disposed above the second group of layers 62. Each of the first group of layers 61 and the second group of layers 62 can have a multi-layer structure.

[0114] The first group of layers 61 can include at least one conductive layer and at least one insulating film layer. In an embodiment, the first group of layers 61 can include a first insulating film layer IF1, a first conductive layer CL1, and a second conductive layer CL2. The first conductive layer CL1 and the second conductive layer CL2 can be arranged on opposite sides of the first insulating film layer IF1. The first insulating film layer IF1 can maintain the rigidity of the display circuit board 40 and protect signals from the outside. Also, the first insulating film layer IF1 can prevent cracks from being generated in the first conductive layer CL1 and the second conductive layer CL2. The first insulating film layer IF1 can include polyimide.

[0115] The first conductive layer CL1 can be disposed on a surface (e.g., an upper surface (a surface in the +z direction) of the first insulating film layer IF1. The second conductive layer CL2 can be disposed on an opposite surface (e.g., a lower surface (a surface in the -z direction) of the first insulating film layer IF1. The first conductive layer CL1 and the second conductive layer CL2 can include a conductive material. In an embodiment, for example, the first conductive layer CL1 and the second conductive layer CL2 can include Cu. Figure 5 Figure 5 The first conductive layer CL1 and the second conductive layer CL2 can include a conductive material. In an embodiment, for example, the first conductive layer CL1 and the second conductive layer CL2 can include Cu.

[0116] In an embodiment, the first group of layers 61 of the display circuit board 40 can define a via (not shown) that electrically connects the first conductive layer CL1 to the second conductive layer CL2. In detail, the via can be an opening that passes through the first conductive layer CL1, the second conductive layer CL2, and the first insulating film layer IF1. An inner side surface of the via can be covered by a conductor such as a plating material. Accordingly, the conductor can electrically connect the first conductive layer CL1 on one side of the conductor and the second conductive layer CL2 on the opposite side of the conductor, thereby connecting signals from the first conductive layer CL1 and the second conductive layer CL2. Also, such a via can be provided in plural.

[0117] The second group of layers 62 can be disposed below the first group of layers 61. That is, the second group of layers 62 can be arranged closer to the display panel 10 and / or the cushion layer CS than the first group of layers 61 in the thickness direction of the display circuit board 40. The second group of layers 62 can include at least one conductive layer and at least one insulating film layer. In an embodiment, the second group of layers 62 can include a second insulating film layer IF2, a third conductive layer CL3, and a fourth conductive layer CL4. The third conductive layer CL3 and the fourth conductive layer CL4 can be arranged on both surfaces of the second insulating film layer IF2. The second insulating film layer IF2 can maintain the rigidity of the display circuit board 40 and protect signals from the outside. Also, the second insulating film layer IF2 can prevent cracks from being generated in the third conductive layer CL3 and the fourth conductive layer CL4. The second insulating film layer IF2 can include polyimide.

[0118] ​The third conductive layer CL3 can be provided on a surface (e.g., an upper surface (a surface in the +z direction of Figure 5 ) of the second insulating film layer IF2. The fourth conductive layer CL4 can be provided on an opposite surface (e.g., a lower surface (a surface in the -z direction of Figure 5 ) of the second insulating film layer IF2. The third conductive layer CL3 and the fourth conductive layer CL4 can include a conductive material. In an embodiment, for example, the third conductive layer CL3 and the fourth conductive layer CL4 can include Cu.

[0119] In an embodiment, the second set of layers 62 of the display circuit board 40 can define a via (not shown) that electrically connects the third conductive layer CL3 to the fourth conductive layer CL4. In detail, the via can be an opening that passes through the third conductive layer CL3, the fourth conductive layer CL4, and the second insulating film layer IF2. An inner side surface of the via can be covered by a conductor such as a plating material. Thus, the conductor can electrically connect the third conductive layer CL3 on one side of the conductor and the fourth conductive layer CL4 on an opposite side of the conductor, thereby connecting signals from the third conductive layer CL3 and the fourth conductive layer CL4. Further, such a via can be provided in a plurality.

[0120] It has been described that the first set of layers 61 includes the first insulating film layer IF1, the first conductive layer CL1, and the second conductive layer CL2, and the second set of layers 62 includes the second insulating film layer IF2, the third conductive layer CL3, and the fourth conductive layer CL4, but the present disclosure is not limited thereto. As described in detail below, the first set of layers 61 can refer to a structural layer that is continuously connected from the main body portion 60 to the connection portion 70. The second set of layers 62 can refer to a portion that is not connected to the connection portion 70 and is broken off. That is, the second set of layers 62 can refer to a portion of the structural layer that is not included in the connection portion 70 or is removed from the display circuit board 40. Thus, the first set of layers 61 can include more or less layers. Further, the second set of layers 62 can also include more or less layers. Hereinafter, for ease of explanation, the first set of layers 61 includes the first insulating film layer IF1, the first conductive layer CL1, and the second conductive layer CL2, and the second set of layers 62 includes the second insulating film layer IF2, the third conductive layer CL3, and the fourth conductive layer CL4.

[0121] An upper portion of the first set of layers 61 (in the -z direction of Figure 5 ) and a lower portion of the second set of layers 62 (in the +z direction of Figure 5The lower portion (in the +z direction) can be covered by a capping layer. That is, the exposed surface of the conductive layer of each of the first group of layers 61 and the second group of layers 62 can be covered by a capping layer. In an embodiment, the upper portion of the first group of layers 61 can be covered by a first capping layer CV1. In an embodiment, for example, the first capping layer CV1 can be disposed above the first conductive layer CL1. The lower portion of the second group of layers 62 can be covered by a second capping layer CV2. In an embodiment, the second capping layer CV2 can be disposed below the fourth conductive layer CL4. For example, the first capping layer CV1 and the second capping layer CV2 can protect the exposed conductive layer. Furthermore, in an embodiment, a third capping layer CV3 can be further disposed between the first group of layers 61 and the second group of layers 62, but this disclosure is not limited thereto. The third capping layer CV3 can be omitted. In an embodiment, the first capping layer CV1, the second capping layer CV2, and the third capping layer CV3 can each comprise polyimide.

[0122] The second layer 62 can be adhered to the first layer 61 via the prepreg layer PP. In other words, the prepreg layer PP can be between the second layer 62 and the first layer 61 to connect them. Furthermore, when the third cover layer CV3 is provided, the second layer 62 can be adhered to the third cover layer CV3 via the prepreg layer PP.

[0123] The connecting portion 70 can extend from one side of the main body portion 60. For example... Figure 2 and Figure 5 As shown, the connecting portion 70 can extend from the main body portion 60 and embed the connector 80 within the connecting portion 70. In an embodiment, the connecting portion 70 may include layers having the same structure as the first group of layers 61 of the main body portion 60. In an embodiment, for example, the connecting portion 70 may include a first conductive layer CL1, a first insulating film layer IF1, and a second conductive layer CL2 stacked sequentially. Each layer of the connecting portion 70 may be continuously connected to each layer of the first group of layers 61. The first conductive layer CL1 and the second conductive layer CL2 of the connecting portion 70 may be covered by a first cover layer CV1 and a third cover layer CV3, respectively, as with the first group of layers 61.

[0124] In this case, the connecting portion 70 may not include the layer corresponding to the second group of layers 62 of the main body portion 60. The connecting portion 70 can be disconnected from the second group of layers 62 of the main body portion 60. In other words, the layer removed from the connecting portion 70 in each layer of the display circuit board 40 can be limited to the second group of layers 62.

[0125] A portion of the first cover layer CV1 on the connection portion 70 can be removed, and thus the first conductive layer CL1 can be exposed. The connector 80 can be disposed on the exposed first conductive layer CL1 of the connection portion 70. The connector 80 can be electrically connected to the connection portion 70 and the main body portion 60 through the first conductive layer CL1. In detail, at least one terminal can be disposed on the exposed first conductive layer CL1 of the connection portion 70, and the connector 80 can be electrically connected to the first conductive layer CL1 of the connection portion 70 through the at least one terminal. Further, the connection portion 70 can be bent, which enables electrical connection between the connector 80 and a main circuit board (not shown) of an electrical device to which the display device 1 is coupled; thus, the display circuit board 40 can be electrically connected to the main circuit board.

[0126] Because the connector 80 is connected to the exposed first conductive layer CL1 of the connection portion 70 through the at least one terminal, the connection between the connection portion 70 and the connector 80 can be unstable when the connection portion 70 is bent. Thus, the reinforcing portion 90 can be disposed on a lower portion of the connection portion 70 on which the connector 80 is disposed, to secure rigidity of a portion of the connection portion 70 that overlaps the connector 80, even when the connection portion 70 is bent.

[0127] In a plan view, the reinforcing portion 90 can be disposed on a lower portion of the connection portion 70 to overlap the connector 80. That is, the connector 80 can be disposed on an upper portion of the connection portion 70 and the reinforcing portion 90 can be disposed on a lower portion of the connection portion 70, with the connection portion 70 between the connector 80 and the reinforcing portion 90. In an embodiment, the reinforcing portion 90 can include layers having the same structure as the structure of the second set of layers 62 of the main body portion 60. In an embodiment, for example, the reinforcing portion 90 can include a third conductive layer CL3, a second insulating film layer IF2, and a fourth conductive layer CL4, which are sequentially stacked.

[0128] Each layer of the reinforcing portion 90 can be discontinuous from each layer of the second set of layers 62 of the main body portion 60, and can be interrupted. That is, in a plan view, because the reinforcing portion 90 is disposed only in a region corresponding to the connector 80, the reinforcing portion 90 can be disconnected from the second set of layers 62 of the main body portion 60, and thus disposed in an island form. In this case, the reinforcing portion 90 can have a shape corresponding to a planar shape of the connector 80, and the shape of the reinforcing portion 90 can be, for example, rectangular, circular, or the like.

[0129] In an embodiment, the reinforcing portion 90 includes layers having the same structure as that of the display circuit board 40, particularly the second set of layers 62 of the main body portion 60, and thus the reinforcing portion 90 can be simply manufactured while ensuring rigidity of the connection portion 70. In an embodiment, for example, when stainless steel is used for the reinforcing portion 90, the layers of the second set of layers 62 among the layers of the first set of layers 61 and the second set of layers 62 are subjected to laser removal in the portion of the reinforcing portion 90 corresponding to the connection portion 70 to form the connection portion 70, and then, it is necessary to attach the reinforcing portion 90 including stainless steel to the lower portion of the connection portion 70 in the portion corresponding to the connector 80. In an embodiment, the layers of the second set of layers 62 can not be removed from the lower portion of the connector 80 to form the reinforcing portion 90. That is, during formation of the connection portion 70, the layers of the second set of layers 62 are not removed from the portion corresponding to the connector 80, and only the layers of the second set of layers 62 are removed from the portion not corresponding to the connector 80, so that the connection portion 70 and the reinforcing portion 90 can be formed at the same time. Thus, the manufacturing process can be simplified. Further, compared to when stainless steel is used for the reinforcing portion 90, it is possible to achieve a thickness reduction of the reinforcing portion 90 and cost savings in manufacturing by avoiding the use of expensive stainless steel.

[0130] In an embodiment, the lower portion of the reinforcing portion 90 can be electrically connected to the ground. In detail, the fourth conductive layer CL4, which is a lower conductive layer of the reinforcing portion 90, can be connected to the ground and serve as a ground layer. Further, the fourth conductive layer CL4 of the reinforcing portion 90 can be grounded to a ground area of an electronic device to which the display apparatus 1 is coupled. Thus, it is possible to improve the driving characteristics of the display apparatus 1 and the electronic device.

[0131] Further, in an embodiment, the reinforcing portion 90 can further include a prepreg layer PP. The reinforcing portion 90 can be attached to the lower portion of the connection portion 70, for example, the third cover layer CV3, by the prepreg layer PP. In an embodiment, the prepreg layer PP can be a layer in which a resin is impregnated with a reinforcing fabric. The prepreg layer PP can be in a gel form and attach the reinforcing portion 90 to the connection portion 70, and upon curing, the prepreg layer PP can provide the reinforcing portion 90 with relatively large rigidity. Thus, the reinforcing portion 90 can have greater rigidity compared to when the reinforcing portion 90 is attached to the connection portion 70 by a general adhesive layer. Further, the prepreg layer PP of the reinforcing portion 90 can be disposed in the same process, whereby the prepreg layer PP is disposed to adhere the first set of layers 61 and the second set of layers 62 of the main body portion 60, thereby simplifying the process.

[0132] Figure 6 is a schematic cross-sectional view of an embodiment of a display apparatus similar to Figure 5 Figure 7 is a view illustrating a portion of the display apparatus of FIG. 1 in a VII direction. Figure 6 ​embodiment of the lower portion of the reinforcing portion and shows Figure 6 a schematic bottom view of the display apparatus. Figure 8 is similar to Figure 7 a schematic bottom view of the embodiment of the lower portion of the reinforcing portion.

[0133] Referring to Figure 6 and Figure 7 The display circuit board 40 can further include a dam portion DM. The dam portion DM can be disposed on the lower portion of the reinforcing portion 90. The dam portion DM can be disposed under the fourth conductive layer CL4 that is the lower conductive layer of the reinforcing portion 90 and define an opening OP that exposes at least a portion of the fourth conductive layer CL4. In this case, in an embodiment, the dam portion DM can be a layer including the same material as the material of the second cover layer CV2 that covers the second set of layers 62 of the main body portion 60.

[0134] The dam portion DM can expose the fourth conductive layer CL4 of the reinforcing portion 90 to cause the fourth conductive layer CL4 to contact a ground region of an electronic device and reinforce the rigidity of the reinforcing portion 90. In an embodiment, in a plan view, the dam portion DM can be disposed as a closed loop along the periphery of the reinforcing portion 90. That is, the dam portion DM can be disposed in a ring shape along the periphery of the reinforcing portion 90 to define the opening OP. In this case, the dam portion DM can also prevent cracks from being generated in the conductive layer when being punched to form the outer periphery of the connecting portion 70 and the reinforcing portion 90.

[0135] Referring to Figure 8 The dam portion DM can further include a rib RB disposed through the opening OP. In this case, similar to the description provided above, the rib RB can be the same layer including the same material as the material of the second cover layer CV2. As Figure 8 indicated in , the rib RB can be disposed in a grid pattern. In an alternative embodiment, in another embodiment, a plurality of ribs RB can be disposed in parallel and extend in one direction. As described, the rib RB can expose the fourth conductive layer CL4 of the reinforcing portion 90 while reinforcing the rigidity of the reinforcing portion 90.

[0136] Figures 9 to 12 is a schematic view of an embodiment of a method of manufacturing a display apparatus.

[0137] Referring to Figure 9The structural layers of the first group 61 and the structural layers of the second group 62 can be stacked. In this case, the structural layers of the second group 62 can be attached to the structural layers of the first group 61 by the prepreg layer PP. In this case, a third cover layer CV3 can be provided between the first group 61 and the second group 62. That is, the first conductive layer CL1, the first insulating film layer IF1, the second conductive layer CL2, the third cover layer CV3, the prepreg layer PP, the third conductive layer CL3, the second insulating film layer IF2, and the fourth conductive layer CL4 can be sequentially stacked from the top to the bottom of the display circuit board 40 in the thickness direction of the display circuit board 40.

[0138] Reference Figure 10 A portion of the display circuit board 40 can be removed. In an embodiment, a portion of the display circuit board 40 can be laser-etched. In detail, for example, the structural layers of the second group 62 can be etched in some portions of the display circuit board 40, thereby forming the connection portion 70. In this case, in a portion in which the connector 80 is to be provided (e.g., mounted), the structural layers of the second group 62 can not be etched. That is, in a plan view, a portion of the second group 62 that overlaps the connector 80 to be provided (e.g., mounted) can remain unetched, and a portion of the second group 62 that does not overlap the connector 80 to be provided (e.g., mounted) can be etched, thereby forming the connection portion 70 and the reinforcement portion 90 at the same time, in which the second group 62 can be provided on the lower portion of the connection portion 70. In this case, the second group 62 can be laser-etched around the periphery of the reinforcement portion 90 while leaving a portion of the second group 62 that overlaps the connector 80 to be provided (e.g., mounted), and thus the reinforcement portion 90 can be formed in an island shape.

[0139] Reference Figure 11 The first cover layer CV1 and the second cover layer CV2 can be arranged to cover the upper conductive layer of the first group 61 and the lower conductive layer of the second group 62, respectively. In this case, the first cover layer CV1 can be provided to cover the upper conductive layer, e.g., the first conductive layer CL1, of the connection portion 70 and the main body portion 60. In addition, the first cover layer CV1 can expose a portion of the first conductive layer CL1 of the connection portion 70 to allow the connector 80 to be provided (e.g., mounted) on the connection portion 70 to contact the first conductive layer CL1. The second cover layer CV2 can be provided to cover the lower conductive layer, e.g., the fourth conductive layer CL4, of the main body portion 60.

[0140] The illustrated embodiments are described based on the case in which the second group 62 is etched and then the cover layer is provided, but the present disclosure is not limited thereto. In another embodiment, it can be understood that the cover layer can be first provided, and then the second group 62 can be etched.

[0141] Then, the display circuit board 40 can be punched to form Figure 1 and Figure 2 an outer periphery of the display circuit board 40. Further, the connector 80 can be provided (e.g., mounted) on the punched display circuit board 40.

[0142] Referring to Figure 12 As described above, when the second cover layer CV2 is provided, the dam portion DM can also be provided in the same process. In detail, the second cover layer CV2 and the dam portion DM can include the same material, such as polyimide. In an embodiment, both the second cover layer CV2 and the dam portion DM can be in a film form and attached to the fourth conductive layer CL4.

[0143] According to the embodiments, the quality of the display circuit board can be improved, and the manufacturing process thereof can be simplified.

[0144] Effects of the present disclosure are not limited to those stated herein and other effects can be clearly understood from the description by those having ordinary skill in the art based on the description of claims.

[0145] It should be understood that the embodiments described herein are to be considered in a descriptive sense only and not for purposes of limitation. Descriptions of features or aspects within each embodiment should typically be considered as being applicable in other similar embodiments. While embodiments have been described with reference to the figures, it will be understood by those skilled in the art that various changes can be made and equivalents can be substituted for elements thereof without departing from the spirit and scope of the application as defined in the following claims.

Claims

1. A display device, characterized in that, include: The display panel includes multiple pixels; as well as A display circuit board is configured to send signals to the display panel. The display circuit board includes: The first group of layers and the second group of layers are stacked sequentially in the thickness direction of the display circuit board; The main body includes the first group of layers and the second group of layers; The connecting portion extends from one side of the main body portion and includes a layer having the same structure as the first set of layers; A connector is disposed on the upper portion of the connecting part; and The reinforcing portion is disposed on the lower portion of the connecting portion to overlap with the connector in a plan view, and includes a layer having the same structure as the second set of layers.

2. The display device according to claim 1, characterized in that, The first set of layers of the main body is connected to the connecting portion, and the second set of layers of the main body is disconnected from the connecting portion and the reinforcing portion.

3. The display device according to claim 1, characterized in that, The reinforcing portion is disconnected from the second set of layers of the main body and is configured in an island shape.

4. The display device according to claim 1, characterized in that, The reinforcing portion includes at least one conductive layer, and the at least one conductive layer is exposed and connected to ground.

5. The display device according to claim 4, characterized in that, The reinforcement includes: A first conductive layer is disposed on the lower portion of the connection portion; A second conductive layer is disposed on the lower portion of the first conductive layer; and An insulating film layer is disposed between the first conductive layer and the second conductive layer.

6. The display device according to claim 5, characterized in that, The reinforcing portion also includes a prepreg layer disposed on the first conductive layer.

7. The display device according to claim 1, characterized in that, The display circuit board also includes a dam portion disposed below the reinforcing portion and defining an opening that exposes at least a portion of the reinforcing portion.

8. The display device according to claim 7, characterized in that, The main body also includes a cover layer disposed on the lower part of the second set of layers, and the dam part comprises the same material as the cover layer.

9. The display device according to claim 7, characterized in that, The dam section is arranged in a ring shape along the periphery of the reinforcing section.

10. The display device according to claim 7, characterized in that, The dam section also includes ribs that pass through the opening.

11. The display device according to claim 10, characterized in that, The ribs are arranged in a grid pattern.

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