Flexible circuit board substrate

Abstract

The utility model discloses a flexible circuit board substrate in the technical field of circuit boards, which comprises a substrate, a plurality of welding holes are uniformly formed in the top of the substrate in a penetrating manner, a conducting layer is arranged in the substrate, a bottom end insulation filling layer is arranged at the bottom of the conducting layer, and a bottom end bonding layer is bonded at the top of the bottom end insulation filling layer. The bottom end insulation filling layer is bonded with the bottom of the conductive layer through the bottom end bonding layer, and the top end insulation filling layer is arranged on the top of the conductive layer. According to the flexible circuit board substrate, the bottom end insulation filling layer, the top end insulation filling layer, the corresponding bottom end bonding layer and the corresponding top end bonding layer are arranged, so that the insulation performance of the flexible circuit board substrate is effectively improved, direct contact between the conductive layer and other components is prevented, and the safety of electronic equipment is improved. Due to the design of the conducting layer, the flexible circuit board substrate has excellent conductivity, and the requirements of high-performance electronic equipment for signal transmission and power supply can be met.

Description

TECHNICAL FIELD

[0001] The utility model relates to a circuit board technical field, concretely is a kind of flexible circuit board substrate. BACKGROUND

[0002] Circuit board is a kind of substrate for connecting and supporting electronic components, with conductive circuit and the mounting position of electronic components printed on it. It is an indispensable component in electronic equipment, carrying signal transmission and power supply between electronic components.

[0003] Circuit board is a kind of substrate for connecting and supporting electronic components, with conductive circuit and the mounting position of electronic components printed on it. It is an indispensable component in electronic equipment, carrying signal transmission and power supply between electronic components. With the rapid development of modern electronic technology, flexible circuit board is increasingly widely used in electronic equipment due to its bendable, lightweight, small size and other advantages. However, the existing flexible circuit board substrate still has deficiencies in terms of electrical conductivity, insulation performance and structural strength, which cannot meet the needs of high-performance electronic equipment. Therefore, it is particularly important to develop a flexible circuit board substrate with excellent electrical conductivity, good insulation performance and high structural strength. SUMMARY

[0004] The utility model aims at providing a kind of flexible circuit board substrate to solve the problems raised in the above background.

[0005] To achieve the above object, the utility model provides the following technical scheme: a kind of flexible circuit board substrate, including substrate, the top of the substrate is uniformly penetrated and is equipped with a plurality of welding holes, the inside of the substrate is provided with conductive layer, the bottom of the conductive layer is provided with bottom end insulating filling layer, the top of the bottom end insulating filling layer is bonded with bottom end bonding layer, the bottom end insulating filling layer is bonded with the bottom of conductive layer by bottom end bonding layer, the top of the conductive layer is provided with top end insulating filling layer, the bottom of the top end insulating filling layer is bonded with top end bonding layer, the top end insulating filling layer is bonded with the top of conductive layer by top end bonding layer.

[0006] As a further scheme of the utility model: the substrate is also provided with a cladding layer, the cladding layer is uniformly cladded in the outer wall of bottom end insulating filling layer and top end insulating filling layer, to enhance the overall structural strength of substrate.

[0007] As a further scheme of the utility model: the conductive layer is intermittently connected with welding hole, to ensure that the connection between conductive layer and welding hole is stable and cannot cause short circuit.

[0008] Compared with the prior art, the utility model discloses the beneficial effect is: in the utility model, through setting up bottom end insulating filling layer and top end insulating filling layer and corresponding bottom end bonding layer and top end bonding layer, effectively improved the insulating performance of flexible circuit board substrate, prevented the direct contact between conductive layer and other components, thereby improved the security of electronic equipment. The design of conductive layer makes the flexible circuit board substrate have excellent conductive performance, can satisfy the demand of high -performance electronic equipment to signal transmission and power supply. The setting of cladding layer enhances the overall structural strength of the substrate, makes the flexible circuit board substrate still can keep stable performance under the complex environment such as bending, distortion. The design of welding hole makes the flexible circuit board substrate more convenient and fast when connecting with other electronic components, improves production efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0009] Fig. 1 It is the main view structural schematic drawing of a kind of flexible circuit board substrate of the utility model;

[0010] Fig. 2 It is the enlarged schematic view of the section structure of substrate in a kind of flexible circuit board substrate of the utility model;

[0011] Fig. 3 It is the structure enlarged schematic view of place A in a kind of flexible circuit board substrate of the utility model 2;

[0012] Fig. 4 It is the structure schematic view of conductive layer in a kind of flexible circuit board substrate of the utility model.

[0013] In the drawing: 1, substrate;11, cladding layer;12, bottom end insulating filling layer;13, bottom end bonding layer;14, conductive layer;15, top end bonding layer;16, top end insulating filling layer;2, welding hole. DETAILED DESCRIPTION

[0014] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.

[0015] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a particular order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than that illustrated or described herein, and the objects distinguished by "first", "second", etc. are generally a class, not limited to the number of objects, for example, the first object can be one or more. In addition, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / ", generally indicates that the front and rear associated objects are in a "or" relationship.

[0016] In the description of the present application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0017] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "setting" should be understood broadly, for example, it can be fixedly connected, set, or detachably connected, set, or integrally connected, set. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0018] Please refer to Figs. 1-4 In the embodiment of the present application, a flexible circuit board substrate includes a substrate 1, and a plurality of welding holes 2 are uniformly and vertically provided on the top of the substrate 1. The substrate 1 is internally provided with a conductive layer 14, which is made of a metal material with high conductivity, such as copper, silver, etc. The bottom of the conductive layer 14 is provided with a bottom end insulating filling layer 12, which is made of a material with good insulating properties, such as epoxy resin, etc. The top of the bottom end insulating filling layer 12 is bonded with a bottom end bonding layer 13, and the bottom end insulating filling layer 12 is bonded together with the bottom of the conductive layer 14 through the bottom end bonding layer 13. The top of the conductive layer 14 is provided with a top end insulating filling layer 16, which is also made of a material with good insulating properties. The bottom of the top end insulating filling layer 16 is bonded with a top end bonding layer 15, and the top end insulating filling layer 16 is bonded together with the top of the conductive layer 14 through the top end bonding layer 15.

[0019] Further, the substrate 1 is further provided with an overcoat layer 11, which uniformly covers the outer walls of the bottom end insulation filling layer 12 and the top end insulation filling layer 16.

[0020] In addition, the conductive layer 14 is intermittently connected with the welding hole 2. In specific implementation, the conductive channel corresponding to the welding hole 2 can be formed on the conductive layer 14 by means of laser drilling, mechanical drilling and the like, so as to ensure the stable connection between the conductive layer 14 and the welding hole 2 and prevent short circuit.

[0021] The bottom end adhesive layer 13 and the top end adhesive layer 15 are both special adhesive glue for circuit devices, and the bottom end insulation filling layer 12 and the top end insulation filling layer 16 can be made of soft material, such as silica gel material, plastic material, polyethylene material and the like.

[0022] In the utility model, the design of the conductive layer 14 is one of the keys. The conductive layer 14 not only needs to have excellent conductive performance, but also needs to form good connection with the welding hole 2. Therefore, in specific implementation, appropriate conductive material and connection process can be selected according to actual demand.

[0023] In addition, the setting of the bottom end insulation filling layer 12 and the top end insulation filling layer 16 is also one of the important innovation points of the utility model. The two insulation filling layers not only can effectively isolate the direct contact between the conductive layer 14 and other components, but also can improve the overall insulation performance of the flexible circuit board substrate. Meanwhile, the setting of the bottom end adhesive layer 13 and the top end adhesive layer 15 ensures the firm connection between the insulation filling layer and the conductive layer.

[0024] In summary, the utility model provides a flexible circuit board substrate with excellent conductive performance, good insulation performance and higher structural strength, which is suitable for various application scenarios of high-performance electronic devices

[0025] The working principle of the utility model is as follows: in use, the flexible circuit board substrate is connected with other electronic components through the welding hole 2. Due to the setting of the conductive layer 14, the flexible circuit board substrate can efficiently transmit signals and power. Meanwhile, the setting of the bottom end insulation filling layer 12, the top end insulation filling layer 16 and the overcoat layer 11 effectively improves the insulation performance and structural strength of the flexible circuit board substrate, so that the flexible circuit board substrate can still maintain stable performance in complex environment.

[0026] It should be noted that, in the present document, the terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can also include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by "comprises a", "comprising", or "includes a", does not, without more constraints, preclude the existence of additional identical elements in the process, method, article, or apparatus that comprises the element. Furthermore, it should be noted that the scope of the methods and apparatus of the present embodiments are not limited by the order of the steps or the order of the components, as described in the examples, but can include performing the steps in different order, or performing the steps concurrently, or in reverse order, or omitting one or more steps, or adding one or more steps, or adding, omitting, or combining various features of the examples described. Also, features described in relation to one example can be combined in other examples.

[0027] The embodiments of the present application described above are merely illustrative, and the present application is not limited to the above-described specific embodiments, which are merely illustrative, but not restrictive. Those skilled in the art can make many forms under the inspiration of the present application without departing from the purpose of the present application and the scope protected by the claims, which all belong to the protection of the present application.

Claims

1. A flexible wiring board substrate comprising a substrate (1), characterized by: The top of the substrate (1) is uniformly provided with a plurality of welding holes (2), the inside of the substrate (1) is provided with a conductive layer (14), the bottom of the conductive layer (14) is provided with a bottom end insulating filling layer (12), the top of the bottom end insulating filling layer (12) is bonded with a bottom end bonding layer (13), the bottom end insulating filling layer (12) is bonded with the bottom of the conductive layer (14) through the bottom end bonding layer (13), the top of the conductive layer (14) is provided with a top end insulating filling layer (16), the bottom of the top end insulating filling layer (16) is bonded with a top end bonding layer (15), and the top end insulating filling layer (16) is bonded with the top of the conductive layer (14) through the top end bonding layer (15).

2. The flexible wiring board substrate according to claim 1, wherein: The substrate (1) is also provided with an overcoat layer (11) uniformly covering the outer walls of the bottom end insulating filling layer (12) and the top end insulating filling layer (16).

3. The flexible circuit board substrate of claim 1, wherein: The conductive layer (14) is intermittently connected with the welding holes (2).

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