Display module and display equipment

Abstract

The utility model discloses a display module and a display device, and belongs to the technical field of display, the display module comprises a substrate, a reflective layer and a shading layer, and a plurality of pixel units arranged on the substrate are used for emitting light and displaying pictures. The first light-transmitting holes formed in the reflective layer and the second light-transmitting holes formed in the shading layer are used for transmitting light emitted by the pixel units to the outside, the reflective layer and the shading layer are arranged on the substrate in a stacked mode, the surface of the reflective layer can reflect the light emitted by the pixel units, the light emitted by the pixel units is mixed again, the display brightness is improved, and the display effect is improved. The shading layer is used for shading the substrate and improving the display contrast.

Description

TECHNICAL FIELD

[0001] The utility model relates to display technical field especially relates to a display module and display equipment. BACKGROUND

[0002] The part of the soldering pad is not covered by the LED light emitting chip after the current LED light emitting chip is soldered on the PCB board, the soldering tin paste used in soldering will become silver color and cover the surface of the soldering pad after melting, and the silver soldering tin paste has the light reflection characteristic, which affects the display contrast of the display screen.

[0003] For this, the common solution is to coat black in the area between the LED light emitting chips on the PCB board, so as to cover the PCB board bottom color and improve the display contrast. However, the black coating uniformity of this scheme is not easy to control, especially the capillary phenomenon will appear, that is, the black ink or glue will climb to the side of the LED light emitting chip, which will cause the side of the LED light emitting chip to watch the different brightness and cause the screen to be full of flowers, and the black ink or glue will cover the light emission of the LED light emitting chip, which reduces the brightness of the display screen. SUMMARY

[0004] In order to overcome the defects of the prior art, the purpose of the utility model is to provide a display module and display equipment, so as to solve the problems of low contrast and brightness of the current LED display screen.

[0005] The purpose of the utility model is realized by adopting the following technical scheme:

[0006] A display module comprises a substrate, a light reflection layer and a light shielding layer.

[0007] A plurality of pixel units are arranged on the substrate.

[0008] The light reflection layer and the light shielding layer are arranged in layers on the substrate, and the surface of the light reflection layer can reflect light.

[0009] The light reflection layer is provided with a plurality of first light transmission holes, and the light shielding layer is provided with a plurality of second light transmission holes, the number of the pixel units, the first light transmission holes and the second light transmission holes is consistent, and the positions of the pixel units, the first light transmission holes and the second light transmission holes are one-to-one corresponding.

[0010] The light emitted by the pixel units is transmitted to the outside through the first light transmission holes and the second light transmission holes.

[0011] Preferably, a packaging adhesive layer is further included, the light shielding layer, the light reflection layer, the packaging adhesive layer and the substrate are arranged in layers in sequence, and the pixel units are located in the packaging adhesive layer.

[0012] Preferably, the projection shape of the light reflection layer and the light shielding layer on the substrate is consistent.

[0013] Preferably, a matte layer is further included and arranged in a stack with the light-shielding layer, and the light-shielding layer is located between the matte layer and the light-reflecting layer.

[0014] Preferably, a partition wall is further included and arranged between two adjacent pixel units.

[0015] Preferably, the surface of the partition wall is capable of reflecting light.

[0016] Preferably, the partition wall is connected with the light-reflecting layer.

[0017] Preferably, the encapsulation layer is provided with a groove between two adjacent pixel units, and an inner wall surface of the groove is coated with a light-reflecting coating.

[0018] Preferably, the light-shielding layer is located between the light-reflecting layer and the substrate.

[0019] To solve the same technical problem, the utility model provides a display device, including display module as above.

[0020] Compared with the prior art, the utility model has the beneficial effects that:

[0021] The plurality of pixel units arranged on the substrate are used for emitting light and displaying a picture, the first light-transmitting hole arranged on the light-reflecting layer and the second light-transmitting hole arranged on the light-shielding layer are used for transmitting the light emitted by the pixel units to the outside, the light-reflecting layer and the light-shielding layer are arranged in a stack on the substrate, the surface of the light-reflecting layer can reflect the light emitted by the pixel units, the light emitted by the pixel units is mixed again, the display brightness is improved, and the light-shielding layer is used for shielding the substrate, thereby improving the display contrast. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 It is a top view schematic diagram of the display module of the utility model;

[0023] Figure 2 It is a top view schematic diagram of the display module of the utility model;

[0024] Figure 3 It is a sectional view schematic diagram of the display module of the embodiment 1 of the utility model;

[0025] Figure 4 It is a sectional view schematic diagram of the display module of the embodiment 2 of the utility model;

[0026] Figure 5 It is a sectional view schematic diagram of the display module of the embodiment 3 of the utility model;

[0027] In the figure: 10, substrate; 11, pixel unit; 111, lamp bead; 20, light reflection layer; 21, first light transmission hole; 30, light shielding layer; 31, second light transmission hole; 40, encapsulation adhesive layer; 41, groove; 411, light reflection coating; 50, matte layer; 51, third light transmission hole; 60, isolation wall. DETAILED DESCRIPTION

[0028] For the convenience of understanding the present application, the present application will be described more fully below with reference to the accompanying drawings. The preferred embodiments of the present application are shown in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0029] It should be noted that when an element is referred to as being "fixed" to another element, it can be directly on the other element or there can be an intervening element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or there can be an intervening element. The terms "vertical", "horizontal", "left", "right", and similar expressions used herein are for illustrative purposes only.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terminology used in the description of the present application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0031] Embodiment 1

[0032] In combination Figures 1 to 3 As shown, the display module of the present application is schematically shown, including a substrate 10, a light reflection layer 20 and a light shielding layer 30.

[0033] As Figure 1 And Figure 2 The substrate 10 is provided with a plurality of pixel units 11, and the plurality of pixel units 11 are arranged in a matrix. Each pixel unit 11 includes a plurality of lamp beads 111 with different light emitting colors. By adjusting the brightness ratio of each lamp bead 111, mixed light is achieved to emit light of different colors. Generally, three lamp beads 111 can be provided, with red, green and blue light emitting colors. Of course, four lamp beads 111 can also be provided, with red, green, blue and white light emitting colors, which can improve the display brightness.

[0034] The light reflection layer 20 and the light shielding layer 30 are stacked on the substrate 10, the light reflection layer 20 is provided with a plurality of first light transmission holes 21, the light shielding layer 30 is provided with a plurality of second light transmission holes 31, the number of the pixel units 11, the first light transmission holes 21 and the second light transmission holes 31 is consistent and they are arranged one by one in correspondence, that is, each pixel unit 11 is provided with a first light transmission hole 21 and a second light transmission hole 31 in the light emitting direction, so that the light emitted by the pixel unit 11 can pass through the first light transmission hole 21 and the second light transmission hole 31 to be transmitted to the outside. For example, Figure 2 and Figure 3 If the first light transmission hole 21 and the second light transmission hole 31 are circular, the centers of the two are aligned; for example, Figure 1 and Figure 3 If the first light transmission hole 21 and the second light transmission hole 31 are rectangular, the centers of the two are aligned.

[0035] As shown in Figure 3 , the surface of the light reflection layer 20 can reflect light, and the light shielding layer 30 is used to block light. When the light emitted by the pixel unit 11 scatters to the light reflection layer 20, the light reflection layer 20 reflects the light to make the light generally towards the main optical axis direction of the pixel unit 11, which can improve the display brightness. The light shielding layer 30 can cover the silver tin paste or other patterns on the substrate 10, so as to prevent the surface of the substrate 10 from reflecting light and reducing the display contrast. This makes the user think that the display module is darker when observing the display module (especially when the pixel unit 11 is not emitting light), which can make the display module display darker pictures, thereby improving the display contrast.

[0036] More specifically, the display module further comprises a matte layer 50 and an encapsulation layer 40, the matte layer 50, the light shielding layer 30, the light reflection layer 20, the encapsulation layer 40 and the substrate 10 are stacked in sequence, wherein the pixel unit 11 is located in the encapsulation layer 40, and the encapsulation layer 40 is transparent, so the light emitted by the pixel unit 11 can penetrate the encapsulation layer 40. The encapsulation layer 40 is used to improve the waterproof performance of the pixel unit 11 and isolate water vapor.

[0037] Based on the above structure, the light scattered by the pixel unit 11 is reflected by the light reflection layer 20 and passes through the second light transmission hole 31 of the light shielding layer 30 to be transmitted to the outside. The light shielding layer 30 is located on the side of the light reflection layer 20 away from the pixel unit 11. The light shielding layer 30 not only can shield the silver tin paste or other patterns on the substrate 10 to the outside to improve the display contrast, but also can shield a small amount of light transmitted inside the light reflection layer 20 (a small amount of light emitted by the pixel unit 11 will inevitably be transmitted to the inside of the light reflection layer 20 instead of being reflected by the light reflection layer 20) to the inside, so as to ensure that the light emitted by the pixel unit 11 is transmitted from the second light transmission hole 31 to the outside as much as possible, which can greatly improve the display precision of the display module and make the edges of the picture displayed by the display module more sharp.

[0038] The surface of the matte layer 50 is provided with a concave-convex texture, which can reflect light from the outside to different directions, reducing the reflection of light in a single direction, which is conducive to improving the visual effect of the display module and reducing the impact of external light reflection on the user. More specifically, the matte layer 50 is provided with a plurality of third light transmission holes 51, the number of the third light transmission holes 51 is consistent with the number of the second light transmission holes 31, and the positions are one-to-one corresponding. The light emitted by the pixel unit 11 is transmitted to the outside through the first light transmission hole 21, the second light transmission hole 31 and the third light transmission hole 51. The matte layer 50 provided with the third light transmission hole 51 will not block the light emitted by the pixel unit 11. This structure reduces the reflection of external light by the display module without blocking the light emitted by the pixel unit 11, so that the display module has both high display clarity and low reflectivity.

[0039] In this embodiment, the projection shapes of the light reflection layer 20 and the light shielding layer 30 on the substrate 10 are consistent, so the shapes and sizes of the first light transmission hole 21 and the second light transmission hole 31 are also consistent. In this way, the hole wall of the second light transmission hole 31 or the lower surface of the light shielding layer 30 (the lower surface of the light shielding layer 30 is attached to the light reflection layer 20) will not block the light reflected by the hole wall of the first light transmission hole 21. Of course, in other optional embodiments, the opening area of the second light transmission hole 31 is smaller than the opening area of the first light transmission hole 21, that is, part of the light reflected by the hole wall of the first light transmission hole 21 will irradiate the lower surface of the light shielding layer 30 around the second light transmission hole 31. In this way, it can be ensured that there is no reflection of the substrate 10, or due to production factors, the opening area of the first light transmission hole 21 is smaller than the opening area of the second light transmission hole 31, part of the upper surface of the light reflection layer 20 is exposed (the upper surface of the light reflection layer 20 is attached to the lower surface of the light shielding layer 30), which causes the light reflection layer 20 to reflect light unexpectedly and reduces the contrast of the display module.

[0040] In addition, the light reflection layer 20 can be manufactured by existing spraying, printing, silk-screen printing or evaporation, sputtering and the like. When manufactured by spraying, printing or silk-screen printing, existing light reflection ink can be used as the manufacturing material, and when manufactured by evaporation or sputtering, aluminum or silver can be used as the manufacturing material. The light shielding layer 30 can be manufactured by existing spraying, printing, silk-screen printing or evaporation, sputtering and the like. When manufactured by spraying, printing or silk-screen printing, existing black glue or black ink can be used as the manufacturing material, and when manufactured by evaporation or sputtering, black metal such as black copper, black nickel or black gold can be used as the manufacturing material. The matte layer 50 can be manufactured by existing nano-matte material spraying or using matte PET (polyethylene terephthalate).

[0041] The manufacturing method of the display module of the present embodiment is as follows:

[0042] Step S1, the substrate 10 is subjected to SMT (Surface Mounted Technology) patch processing, and a leadless or short-lead surface-mounted component is mounted on the surface of the substrate 10.

[0043] Step S2, each lamp bead 111 in the pixel unit 11 is subjected to die bonding processing, specifically, tin paste or other flux is arranged on the surface of the substrate 10, the lamp bead 111 is arranged on the surface of the substrate 10 through die bonding, and the lamp bead 111 and the substrate 10 are fixed through laser welding or reflow soldering.

[0044] Step S3, a packaging glue layer 40 is manufactured to realize mold packaging, and the thickness of the packaging glue layer 40 is 50-100 microns higher than that of the lamp bead 111 in the pixel unit 11.

[0045] Step S4, a reflective layer 20 is manufactured on the surface of the packaging glue layer 40, which can be manufactured by existing spraying, printing, silk printing, evaporation, sputtering and the like, and existing reflective ink can be used as a manufacturing material when spraying, printing and silk printing are used, and aluminum or silver can be used as a manufacturing material when evaporation and sputtering are used.

[0046] Step S5, a light-shielding layer 30 is manufactured on the surface of the reflective layer 20, which can be manufactured by existing spraying, printing, silk printing, evaporation, sputtering and the like, and existing black glue or black ink can be used as a manufacturing material when spraying, printing and silk printing are used, and black metal such as black copper, black nickel, black gold and the like can be used as a manufacturing material when evaporation and sputtering are used.

[0047] Step S6, a nano-matte material is sprayed or a matte PET is pasted on the surface of the light-shielding layer 30 to form a matte layer 50.

[0048] Step S7, the process edge of one or more of the packaging glue layer 40, the reflective layer 20, the light-shielding layer 30 and the matte layer 50 is cut.

[0049] Step S8, the edge of the display module is sprayed with black metal to prevent moisture.

[0050] Embodiment 2

[0051] As Figure 4The difference between the embodiment and the embodiment 1 is that the display module of the embodiment further comprises a partition wall 60, the partition wall 60 is arranged between two adjacent pixel units 11, in the embodiment, the partition wall 60 is arranged perpendicularly to the substrate 10, and in other optional embodiments, the partition wall 60 can have an included angle with the substrate 10, and both can realize the isolation of the light bleeding phenomenon between the two adjacent pixel units 11, that is, the light emitted by one of the pixel units 11 scatters to the other pixel unit 11, affecting the light emitted by the other pixel unit 11. Based on the above structure, the display module of the embodiment displays a picture with more pure color and a more sharp edge of the display picture.

[0052] The partition wall 60 is located in the encapsulation adhesive layer 40, and the partition wall 60 is preferably made of existing high-thixotropic reflective glue (high-thixotropic reflective glue mixed with high-refractive glass beads or other existing materials that can realize reflection), which makes the surface of the partition wall 60 also reflect light. The partition wall 60 can not only isolate the light bleeding phenomenon between the two adjacent pixel units 11, but also reflect the light emitted by the pixel unit 11 on one side, so that the light of the multiple lamp beads 111 in the pixel unit 11 is further mixed, and the display brightness of the pixel unit 11 is improved.

[0053] In the embodiment, one end of the partition wall 60 is connected with the reflective layer 20, and the cross sections of the two form a T-shaped structure, and the connection of the two can prevent the light emitted by one pixel unit 11 from affecting the color of the light emitted by another adjacent pixel unit 11, and isolate the light bleeding phenomenon. Moreover, the connection of the partition wall 60 and the reflective layer 20 can enhance the connection stability between the reflective layer 20 and the encapsulation adhesive layer 40, and the partition wall 60 with the same reflective property can reflect the light emitted by the pixel unit 11 together with the reflective layer 20, thereby improving the display brightness of the display module.

[0054] The manufacturing method of the display module of the embodiment is as follows:

[0055] Step S1, SMT (Surface Mounted Technology) patch processing is performed on the substrate 10, and a surface-mounted component without pins or short lead is mounted on the surface of the substrate 10.

[0056] Step S2, each lamp bead 111 in the pixel unit 11 is fixedly processed, specifically, tin paste or other flux is arranged on the surface of the substrate 10, the lamp bead 111 is fixedly arranged on the surface of the substrate 10, and the lamp bead 111 and the substrate 10 are fixed by laser welding or reflow welding.

[0057] Step S3, manufacturing the isolation wall 60, using a dispenser to spray high thixotropic reflective glue between two adjacent pixel units 11, the height difference between the end of the isolation wall 60 and the height of the lamp bead 111 in the pixel unit 11 is 0-50 microns.

[0058] Step S4, manufacturing the encapsulation glue layer 40 to realize mold encapsulation, the thickness of the encapsulation glue layer 40 is 50-100 microns higher than the lamp bead 111 in the pixel unit 11.

[0059] Step S5, manufacturing the reflective layer 20 on the surface of the encapsulation glue layer 40, which can be manufactured by existing spraying, printing, silk printing or evaporation, sputtering, etc. When using spraying, printing, silk printing, existing reflective ink can be used as the manufacturing material, and when using evaporation, sputtering, aluminum or silver can be used as the manufacturing material.

[0060] Step S6, manufacturing the light shielding layer 30 on the surface of the reflective layer 20, which can be manufactured by existing spraying, printing, silk printing or evaporation, sputtering, etc. When using spraying, printing, silk printing, existing black glue or black ink can be used as the manufacturing material, and when using evaporation, sputtering, black metal such as black copper, black nickel, black gold, etc. can be used as the manufacturing material.

[0061] Step S7, spraying nano-matt material or pasting matt PET on the surface of the light shielding layer 30 to form the matt layer 50.

[0062] Step S8, cutting the process edge of one or more of the encapsulation glue layer 40, the reflective layer 20, the light shielding layer 30 and the matt layer 50.

[0063] Step S9, spraying black metal on the edge of the display module to prevent moisture.

[0064] Embodiment 3

[0065] As Figure 5 , the difference between this embodiment and embodiment 1 is that the encapsulation glue layer 40 is provided with a groove 41 between two adjacent pixel units 11, and the inner wall surface of the groove 41 is coated with a reflective coating 411, which can reflect the light emitted by the pixel unit 11 and improve the display brightness of the display module. It can be understood that when the inner wall surface of the groove 41 is coated with the reflective coating 411, the groove 41 is similar to the isolation wall 60 in embodiment 2, and they have the same effect. The difference is that the groove 41 in this embodiment does not necessarily fill with solid material, which reduces the weight and simplifies the construction steps.

[0066] In addition, the inner side walls of the groove 41 can be arranged to be inclined to each other, or can be arranged to be perpendicular to each other.

[0067] The manufacturing method of the display module of this embodiment is as follows:

[0068] Step S1, the substrate 10 is subjected to SMT (Surface Mounted Technology) patch processing, and a pinless or short pin surface mounted component is mounted on the surface of the substrate 10.

[0069] Step S2, each lamp bead 111 in the pixel unit 11 is subjected to die bonding processing, specifically, tin paste or other flux is arranged on the surface of the substrate 10, the lamp bead 111 is arranged on the surface of the substrate 10 through die bonding, and the lamp bead 111 and the substrate 10 are fixed through laser welding or reflow soldering.

[0070] Step S3, a packaging glue layer 40 is manufactured to realize mold packaging, and the thickness of the packaging glue layer 40 is 50-100 microns higher than the lamp bead 111 in the pixel unit 11.

[0071] Step S4, a groove 41 structure is manufactured, the groove 41 is cut out between two adjacent pixel units 11 in the packaging glue layer 40 using a dicing machine or a CNC (Computer Numerical Control) machine tool, the width of the groove 41 is 20-50 microns, the depth of the groove 41 is less than the packaging glue layer 40, and the inner wall surface of the groove 41 is sprayed with an existing reflective coating 411.

[0072] Step S5, the surface of the packaging glue layer 40 is polished and flattened.

[0073] Step S6, a reflective layer 20 is manufactured on the surface of the packaging glue layer 40, which can be manufactured by existing spraying, printing, silk printing, evaporation, sputtering, etc., and existing reflective ink can be used as a manufacturing material when spraying, printing, and silk printing are used, and aluminum or silver can be used as a manufacturing material when evaporation and sputtering are used.

[0074] Step S7, a light shielding layer 30 is manufactured on the surface of the reflective layer 20, which can be manufactured by existing spraying, printing, silk printing, evaporation, sputtering, etc., and existing black glue or black ink can be used as a manufacturing material when spraying, printing, and silk printing are used, and black metal such as black copper, black nickel, black gold, etc. can be used as a manufacturing material when evaporation and sputtering are used.

[0075] Step S8, nano-matte material is sprayed on the surface of the light shielding layer 30 or matte PET is pasted to form a matte layer 50.

[0076] Step S9, the process edge of one or more of the packaging glue layer 40, the reflective layer 20, the light shielding layer 30, and the matte layer 50 is cut.

[0077] Step S10, the edge of the display module is sprayed with black metal to prevent moisture.

[0078] Embodiment 4

[0079] The difference between the present embodiment and Embodiment 1 is that the light shielding layer 30 is located between the light reflecting layer 20 and the substrate 10, the light shielding layer 30 can directly shield the light reflecting components or structures on the substrate 10, the light shielding layer 30 can be a plate material with the second light transmission hole 31, the light shielding layer 30 is arranged on the substrate 10, and the light reflecting layer 20 is manufactured on the surface of the light shielding layer 30.

[0080] Embodiment 5

[0081] The present embodiment provides a display device, which comprises a box body and the display module as described above, a plurality of display modules are spliced with each other to form a display sub-screen with a larger display area, and the box body is used for mounting the plurality of display modules spliced with each other.

[0082] In summary, the plurality of pixel units 11 arranged on the substrate 10 are used for emitting light and displaying a picture, the first light transmission hole 21 arranged on the light reflecting layer 20 and the second light transmission hole 31 arranged on the light shielding layer 30 are used for transmitting the light emitted by the pixel units 11 to the outside, the light reflecting layer 20 and the light shielding layer 30 are arranged in layers on the substrate 10, the surface of the light reflecting layer 20 can reflect the light emitted by the pixel units 11, the light emitted by the pixel units 11 is mixed again, the display brightness is improved, and the light shielding layer 30 is used for shielding the substrate 10, thereby improving the display contrast.

[0083] The above description is only the embodiment of the present application, and does not limit the patent range of the present application, and any equivalent structure or equivalent process transformation according to the content of the present application specification and drawings, or direct or indirect application in other related technical fields, are also included in the patent protection range of the present application.

Claims

1. A display module, characterized in that, Includes a substrate, a reflective layer, and a light-shielding layer; The substrate is provided with multiple pixel units; The reflective layer and the light-shielding layer are stacked on the substrate, and the surface of the reflective layer can reflect light. The reflective layer has multiple first light-transmitting holes, and the light-shielding layer has multiple second light-transmitting holes. The number of pixel units, first light-transmitting holes, and second light-transmitting holes are the same, and their positions are arranged in a one-to-one correspondence. The light emitted by the pixel unit passes through the first light-transmitting hole and the second light-transmitting hole to be transmitted to the outside.

2. The display module according to claim 1, characterized in that, It also includes an encapsulating adhesive layer, wherein the light-shielding layer, the reflective layer, the encapsulating adhesive layer and the substrate are stacked in sequence, and the pixel unit is located within the encapsulating adhesive layer.

3. The display module according to claim 1, characterized in that, The reflective layer and the light-shielding layer have the same projection shape on the substrate.

4. The display module according to claim 2, characterized in that, It also includes a matte layer stacked on top of the light-shielding layer, wherein the light-shielding layer is located between the matte layer and the reflective layer.

5. The display module according to claim 1, characterized in that, It also includes a partition wall, which is disposed between two adjacent pixel units.

6. The display module according to claim 5, characterized in that, The surface of the isolation wall is capable of reflecting light.

7. The display module according to claim 5, characterized in that, The isolation wall is connected to the reflective layer.

8. The display module according to claim 2, characterized in that, The encapsulating adhesive layer has a groove located between two adjacent pixel units, and the inner wall of the groove is coated with a reflective coating.

9. The display module according to claim 1, characterized in that, The light-shielding layer is located between the reflective layer and the substrate.

10. A display device, characterized in that, Includes the display module as described in any one of claims 1 to 9.

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