Device for pulling semiconductor electrode lead
By designing a semiconductor electrode lead pulling device that includes a cutting and unblocking mechanism, the problems of oxide film and contamination are solved, ensuring the solderability and operational stability of the leads and avoiding the effects of blockage.
Patent Information
- Application Number
- CN202422570328.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-24
- Publication Date
- 2025-11-25
- Estimated Expiration
- 2034-10-24
AI Technical Summary
After drawing semiconductor electrode leads, the oxide film on the lead surface affects solderability, and the raw materials are easily contaminated when exposed to air. Prolonged disuse may cause the soldering gun head to become clogged.
A device was designed that includes a work frame, a moving mechanism, a wire gun, a feeding pipe, a cutting mechanism, and a clearing mechanism. It uses a motor-driven bidirectional threaded rod and a cutter to cut off excess material and uses an electric push rod and a heating wire to clear blockages, thus preventing the cooling of raw materials from affecting normal operation.
It effectively removes excess material, prevents contamination and clogging, and ensures the reliability and normal operation of the leads.
Smart Images
Figure CN223588226U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of semiconductor lead, concretely to a device for pulling semiconductor electrode lead. BACKGROUND
[0002] Semiconductor device is the electron device that the conductivity is between the good conductor and insulator, uses the special electric characteristic of semiconductor material to complete the specific function, can be used to produce, control, receive, transform, amplify signal and carry out energy conversion. The electrode lead is the important component of the semiconductor as the connecting bridge of the electrode conduction, is the important component of the semiconductor.
[0003] After the work of pulling the semiconductor electrode lead is finished, if the raw material is left on the lead gun head, the plating layer (such as nickel layer) on the surface of the lead is easy to form the oxide film, reduces the affinity with the solder, thereby influences the solderability, in addition, if the raw material is exposed in the air for a long time, the dirt, oil stain and other pollutants in the air may be attached to the surface of the lead, also influences its performance and reliability, in addition, the raw material is softened by heating to reach the work demand of pulling the line, if the raw material is not used in time after heating, the gun head may be blocked, also brings certain trouble to the work. UTILITY MODEL CONTENT
[0004] The utility model aims at providing a device for pulling semiconductor electrode lead to solve the problems in the above background technology.
[0005] In order to realize the above-mentioned purpose, the utility model provides the following technical scheme: a device for pulling semiconductor electrode lead, including the work stand, the surface of the work stand is provided with the semiconductor placement area, the surface of the work stand is provided with the moving mechanism body, the surface of the moving mechanism body is provided with the wire pulling gun body for pulling the line, the other end of the wire pulling gun body is connected with the feeding pipe, one side of the surface of the work stand is fixed with the work table, the surface of the work table is provided with the through slot, the inner chamber of the work table is provided with the cutting mechanism, the inner chamber of the work table is provided with the dredging mechanism.
[0006] Preferably, the cutting mechanism includes the motor fixed in the inner chamber of the work table, the output shaft of the motor is connected with the bidirectional screw rod through the bevel gear transmission, the two sides of the surface of the bidirectional screw rod are all engaged with the engagement block, one side of the surface of the engagement block is fixed with the cutter.
[0007] Preferably, the motor is servo motor, and is internally provided with the band brake device.
[0008] Preferably, one side of the surface of the engagement block on the two sides is slidably provided with the limiting rod, the other end of the limiting rod is fixed in the inner chamber of the work table.
[0009] Preferably, the dredging mechanism comprises an electric push rod fixed in the inner cavity of the workbench, an output shaft of the electric push rod is fixed with a working shell, the inner cavity of the working shell is penetrated by a pin, and the inner cavity of the working shell is fixed with a heating wire.
[0010] Preferably, the inner cavity of the working shell is fixed with a heat insulation block, and the material of the heat insulation block is aerogel.
[0011] Compared with the prior art, the utility model has the beneficial effects as follows:
[0012] After the stay wire gun body work ends, the staff can use the cutting mechanism to cut and shear the excess material of the stay wire gun body, avoid that the material is exposed for too long and influences the next stay wire work, in addition, can under the action of the dredging mechanism, to the stay wire gun body dredging, avoid that the raw material cools in the gun head inside and influences the normal work of the stay wire gun body. BRIEF DESCRIPTION OF DRAWINGS
[0013] Figure 1 It is the three-dimensional structure schematic diagram in the utility model;
[0014] Figure 2 It is the three-dimensional structure schematic diagram in the utility model;
[0015] Figure 3 It is the three-dimensional structure schematic diagram in the utility model;
[0016] Figure 4 It is the three-dimensional structure schematic diagram in the utility model.
[0017] In the drawing: 1, work stand;2, semiconductor placement area;3, moving mechanism body;4, stay wire gun body;5, feed pipe;6, workbench;7, cutting mechanism;71, motor;72, bidirectional screw rod;73, engagement block;74, cutter;8, limit rod;9, through slot;10, dredging mechanism;101, electric push rod;102, working shell;103, pin;104, heating wire;11, heat insulation block. DETAILED DESCRIPTION
[0018] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.
[0019] Please refer to Figures 1-4As shown, a device for pulling the lead of a semiconductor electrode, comprising a workbench 1, the surface of the workbench 1 is provided with a semiconductor placement area 2, the surface of the workbench 1 is provided with a moving mechanism body 3, the surface of the moving mechanism body 3 is provided with a wire pulling gun body 4 for pulling the wire, the other end of the wire pulling gun body 4 is communicated with a feeding pipe 5, one side of the surface of the workbench 1 is fixedly provided with a workbench 6, the surface of the workbench 6 is provided with a through slot 9, the inner cavity of the workbench 6 is provided with a cutting mechanism 7, and the inner cavity of the workbench 6 is provided with a dredging mechanism 10, after the work of the wire pulling gun body 4 is completed, the staff can use the cutting mechanism 7 to cut and shear the excess material of the wire pulling gun body 4, so that the material is not exposed for a long time and affects the next wire pulling work, and in addition, the wire pulling gun body 4 can be dredged under the action of the dredging mechanism 10, so that the raw materials are not cooled in the gun head and affect the normal work of the wire pulling gun body 4.
[0020] The cutting mechanism 7 comprises a motor 71 fixed in the inner cavity of the workbench 6, the output shaft of the motor 71 is in transmission with a bidirectional threaded rod 72 through a bevel gear, both sides of the surface of the bidirectional threaded rod 72 are engaged with engagement blocks 73, and one side of the surface of the engagement blocks 73 is fixedly provided with cutters 74, in the embodiment, through the arrangement of the motor 71, the bidirectional threaded rod 72, the engagement blocks 73 and the cutters 74, under the action of the motor 71, the bidirectional threaded rod 72 rotates, and the engagement blocks 73 engaged on both sides of the bidirectional threaded rod 72 can drive the cutters 74 to move.
[0021] The motor 71 is a servo motor and is internally provided with a band brake device, in the embodiment, through the arrangement, the accuracy of the rotation of the motor 71 is improved, and the bidirectional threaded rod 72 can be stably stopped at a specified position.
[0022] One side of the surface of the two engagement blocks 73 is slidably provided with a limiting rod 8, the other end of the limiting rod 8 is fixed in the inner cavity of the workbench 6, in the embodiment, through the arrangement of the limiting rod 8, the movement of the two engagement blocks 73 is limited, and the stability of the movement of the engagement blocks 73 is improved.
[0023] The dredging mechanism 10 comprises an electric push rod 101 fixed in the inner cavity of the workbench 6, the output shaft of the electric push rod 101 is fixedly provided with a working shell 102, the inner cavity of the working shell 102 penetrates an insertion needle 103, and the inner cavity of the working shell 102 is fixedly provided with a heating wire 104, in the embodiment, through the arrangement of the electric push rod 101, the working shell 102, the insertion needle 103 and the heating wire 104, under the action of the electric push rod 101, the insertion needle 103 enters the action port of the wire pulling gun body 4, and under the action of the heating wire 104, the blocked raw materials of the wire pulling gun body 4 are melted.
[0024] The inner cavity of the working shell 102 is fixed with a heat insulation block 11, which is made of aerogel, and in the embodiment, the heat insulation block 11 is arranged to avoid the transmission of more heat to the electric push rod 101, thereby affecting the work of the electric push rod 101.
[0025] Working principle: in use, the worker can place the semiconductor on the surface of the semiconductor placement area 2, and can make the wire pulling gun body 4 perform wire pulling bonding work under the assistance of the moving mechanism body 3, and in the daily use of the wire pulling gun body 4, if the wire pulling gun body 4 stops being used, the surface of the wire pulling gun body 4 has unused raw materials, in order to avoid the surface from sticking dust, the worker can use the moving mechanism body 3 to make the wire pulling gun body 4 enter the through slot 9, then the worker can use the cutting mechanism 7 to make the bidirectional threaded rod 72 rotate under the action of the motor 71, and the engagement block 73 engaged with the bidirectional threaded rod 72 can make the two side cutters 74 clamp the gun head of the wire pulling gun body 4, thereby cutting off the excess raw materials, and if the raw materials are blocked, the electric push rod 101 can be driven to move by the action of the dredging mechanism 10, and the heating wire 104 is made to work, under the action of the high-temperature insertion needle 103, the gun cavity of the wire pulling gun body 4 is dredged, thereby avoiding the raw materials from blocking the wire pulling gun body 4 and affecting the normal use of the wire pulling gun body 4.
[0026] It should be noted that in this document, the terms such as first and second are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or equipment. Without more limitations, the element defined by the statement "including a" does not exclude the presence of another identical element in the process, method, article or equipment including the element.
[0027] Although the embodiments of the present application have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended claims and their equivalents.
Claims
1. A device for pulling the lead of a semiconductor electrode, comprising a workbench (1), characterized in that: The surface of the work frame (1) is provided with a semiconductor placement area (2), the surface of the work frame (1) is provided with a moving mechanism body (3), the surface of the moving mechanism body (3) is provided with a wire pulling gun body (4) for wire pulling, the other end of the wire pulling gun body (4) is communicated with a feeding pipe (5), one side of the surface of the work frame (1) is fixedly provided with a workbench (6), the surface of the workbench (6) is provided with a through slot (9), the inner cavity of the workbench (6) is provided with a cutting mechanism (7), and the inner cavity of the workbench (6) is provided with a dredging mechanism (10).
2. A device for pulling a semiconductor electrode lead as defined in claim 1, characterized in that: The cutting mechanism (7) comprises a motor (71) fixed in the inner cavity of the workbench (6), a bidirectional threaded rod (72) is in transmission with the output shaft of the motor (71) through bevel gears, both sides of the surface of the bidirectional threaded rod (72) are engaged with engaging blocks (73), and one side of the surface of the engaging blocks (73) is fixedly provided with a cutter (74).
3. A device for pulling a semiconductor electrode lead as defined in claim 2, characterized in that: The motor (71) is a servo motor and is internally provided with a band brake device.
4. The apparatus of claim 2 wherein: The surface of the engaging blocks (73) on both sides is slidably provided with a limiting rod (8), and the other end of the limiting rod (8) is fixed in the inner cavity of the workbench (6).
5. The apparatus of claim 1 wherein: The dredging mechanism (10) comprises an electric push rod (101) fixed in the inner cavity of the workbench (6), a working shell (102) is fixed to the output shaft of the electric push rod (101), a plug pin (103) penetrates the inner cavity of the working shell (102), and a heating wire (104) is fixed in the inner cavity of the working shell (102).
6. A device for pulling a semiconductor electrode lead as defined in claim 5, characterized in that: The inner cavity of the working shell (102) is fixedly provided with a heat insulation block (11), and the material of the heat insulation block (11) is aerogel.