Dipping mold and dipping machine

Abstract

The application provides a dipping mold and a dipping machine, which are mainly used for the dipping operation of a chip module. The dipping mold comprises a mold body, a baffle, a chip positioning groove and a circular turntable, and the dipping machine comprises a support, a medicine pool, a dipping table, a height adjusting device. The mold body is made of high-strength engineering plastic or aluminum alloy and has a square structure, and two rows of chip positioning grooves are uniformly arranged on the upper side of the mold body to ensure the accurate positioning of the chip module. The baffle is connected with the mold body through a hinge and a fixing piece to provide stable support. The circular turntable is designed with multiple grooves to improve the rotation stability and positioning accuracy. The medicine pool is arranged on the dipping table, the height adjusting device is arranged on the dipping table, and the support connects the dipping mold with the dipping table. Through the cooperative work of the mold body, the baffle, the positioning groove and the turntable, the dipping machine realizes the efficient dipping of the chip module, the dipping process is uniform and consistent, has good universality and compatibility, and can effectively prevent static interference.

Description

TECHNICAL FIELD

[0001] The utility model relates to digital electronic detonator manufacturing field especially relates to a dip medicine mould and dip medicine machine. BACKGROUND

[0002] In the traditional chip module production process, the rigid medicine head dipping process usually relies on manual work. The traditional manual dipping method is to use a dipping roller to adhere the medicine in the medicine tank to the roller surface, and then use manual work to contact the dipping roller with the chip row dipping head to complete the dipping. The efficiency of the traditional manual dipping process is too slow, which affects the overall work efficiency.

[0003] Patent application publication document CN220829148U discloses a kind of digital electronic detonator chip dipping head mould, which is composed of a mould body with a rectangular ring structure and two rows of magnets. On the top surface of the two long edges of the mould body, there is a row of chip positioning grooves. Between the two adjacent chip positioning grooves on the top surface of the two long edges of the mould body, there is a expansion joint. On the bottom surface of the two short edges of the mould body, there is a row of magnet positioning grooves. In each magnet positioning groove, there is a magnet fixed. This mould improves the qualified rate of dipping to some extent, thereby ensuring the quality of digital electronic detonator products.

[0004] However, although this mould has certain advantages in the rigid medicine head dipping process, its function still has certain limitations. Specifically, the use of magnets for positioning results in poor positioning accuracy and firmness. UTILITY MODEL CONTENTS

[0005] The technical problem to be solved by the present application is the poor positioning firmness of the existing dipping mould.

[0006] To solve the above problems, the present application provides a dipping mould, which comprises a mould body, a baffle and a circular turntable. A plurality of chip positioning grooves are arranged in a neat row. The baffle is installed on the mould body on both sides of the chip positioning groove. The distance between two adjacent baffles is less than the length of a single row of chip modules. The top surface of the circular turntable is connected to the bottom surface of the mould body, and the center of the circular turntable is aligned with the center of the mould body.

[0007] The dipping mould provided by the above-mentioned scheme of the present application realizes one-time dipping of the chip module through the mould body, baffle, chip positioning groove and circular turntable, significantly improves the dipping efficiency, and ensures the uniformity of dipping. The dipping mould can dip chip modules of different sizes and has good compatibility. It solves the problems of the existing technology, such as the inability to adapt to chip modules of different sizes, low efficiency and uneven dipping during the dipping process of chip modules, and poor applicability and efficiency in actual application.

[0008] In order to precisely match the shape and size of the chip module for each positioning groove, and ensure the stable positioning of the chip module during the dipping process, the chip positioning grooves are arranged in several columns on the mold body.

[0009] In order to prevent the chip module from moving during the dipping process, a baffle is installed on both sides of the chip positioning groove, and the number of baffles is equal to the number of columns of chip positioning grooves multiplied by 2-1.

[0010] In order to prevent the tool from generating static electricity, and ensure that it has good corrosion resistance and wear resistance, the mold body is made of aluminum alloy material which is not easy to generate static electricity.

[0011] In order to facilitate the adjustment and fixation of the chip position, one end of the baffle is installed on one edge of the mold body through a hinged manner, and the other end is fixed on the other edge of the mold body through a mounting member.

[0012] In order to adapt to different operation requirements, the baffles work together to achieve precise positioning and fixation of the chip, and the hinge turning direction of the baffles is designed as follows: the baffles located on the inner side of the mold body are up and down turning, and the baffles located on both sides of the mold body can be up and down turning or left and right turning.

[0013] In order to ensure the stability of the mold body on the turntable, the mold body is arranged on a circular turntable, and the top surface of the circular turntable is in close contact with the bottom surface of the mold body.

[0014] Based on the above-mentioned dipping mold, the utility model also provides a dipping machine, which further comprises a dipping table, a medicine pool arranged on the dipping table, and a support connecting the dipping mold and the dipping table. In order to store the dipping liquid to ensure the smooth progress of the dipping process, the dipping table is arranged, and the dipping table has a smooth and easy-to-clean surface.

[0015] In order to store the dipping liquid to ensure that the dipping liquid uniformly covers the chip module and improve the dipping effect, the medicine pool is arranged on the dipping table.

[0016] In order to ensure the stability of the dipping mold during the dipping process, and prevent the dipping from being unstable due to vibration and other reasons, the support connects the dipping mold and the dipping table.

[0017] In order to ensure that the top of the chip module is immersed in the dipping liquid, the liquid adheres to the front end of the bridge wire and the plastic block, and as the dipping liquid decreases, the height of the medicine pool is also accurately adjusted to ensure that the height of the dipping mold to the dipping liquid surface is not convenient, so as to achieve the dipping effect and avoid too much or too little liquid, and the height adjusting device is arranged on the dipping table.

[0018] In practical applications, the chip modules are inserted into the chip positioning grooves in sequence and fixed using the stop blocks. The mold is turned over, the chip modules are downward, and are fixed on the support of the dipping machine. The height adjusting device is started, and the medicine pool is slowly lifted, so that the top of the chip module is immersed in the liquid surface. The liquid medicine adheres to the front end of the chip bridge wire and the plastic block. The height adjusting device is started, and the medicine pool is slowly lowered. The dipping mold is removed, and another dipping mold is taken out to repeat the operation.

[0019] The technical effect of the present application is:

[0020] The dipping mold and the dipping machine provided by the present application solve the problems of dipping quality, efficiency, cost, etc. Through innovative design, the efficiency of the rigid medicine head dipping process is significantly improved, and the uniformity of dipping is effectively strengthened. The precise positioning and fixing mechanism in the mold design can ensure uniform distribution of liquid medicine for each chip module during the dipping process, improving the consistency and reliability of the product. The precise size design of the mold body and the stop bar, as well as the synergistic effect of several stop bars, ensures the precise positioning and fixing of chip modules of different sizes, enhances the compatibility of the mold, and makes it adaptable to changing production needs.

[0021] The dipping mold and the dipping machine provided by the present application have a simple design structure. The mold body is made of aluminum alloy material with good electrical conductivity and is not prone to static electricity, which significantly improves the applicability and efficiency of the mold in practical applications, provides good corrosion resistance and wear resistance, and helps prevent potential damage to chips caused by static electricity. The simple structure, easy manufacturing and low manufacturing cost have good economic efficiency. In addition, the groove design on the side of the circular turntable improves the rotational stability of the turntable and simplifies the operation steps in the dipping process. Overall, this dipping mold exhibits significant technical effects in improving production efficiency, ensuring product quality, simplifying operation procedures, and enhancing mold durability, effectively solving the problems of complex structure, low efficiency and uneven dipping in the prior art, and has high practical value and broad market application prospects. BRIEF DESCRIPTION OF DRAWINGS

[0022] Fig. 1 It is a perspective view of the dipping mold in the present application in the state of fixing the stop bar;

[0023] Fig. 2 It is a perspective view of the dipping mold in the present application in the state of opening the stop bar;

[0024] Fig. 3 It is a perspective view of the dipping mold in the present application in the state of inserting the chip module into the mold clamping groove in sequence and fixing;

[0025] Fig. 4 It is a perspective view of the dipping mold in the present application fixed on the magnetic disk support of the dipping machine;

[0026] Fig. 5 A three-dimensional view of a dipping mold of the present application is fixed on a magnetic disk support of a dipping machine to perform dipping.

[0027] Reference signs: 1, mold body; 2, chip positioning groove; 3, baffle; 4, mounting piece; 5, circular turntable; 6, chip module; 7, dipping machine; 701, support; 702, medicine pool; 703, dipping table; 704, height adjusting device. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0029] Figs. 1-3 An embodiment of a dipping mold provided by the present application is illustrated, Figs. 1-3 The illustrated dipping mold comprises a mold body 1, a baffle 3, a mounting piece 4, and a circular turntable 5. The mold body 1 is square-shaped, and a chip positioning groove 2 is arranged on the upper side of the mold body 1. The baffle 3 is arranged on both sides of the chip positioning groove 2 and mounted on the mold body 1. The distance between two adjacent baffles 3 is less than the length of a single row of chip modules 6. The circular turntable 5 is arranged on the bottom of the mold body 1. The top surface of the circular turntable 5 is connected with the bottom surface of the mold body 1, and the center of the circular turntable 5 is aligned with the center of the mold body.

[0030] In this embodiment, the mold body 1 is the core part of the dipping mold. The mold body 1 is made of aluminum alloy material with good electrical conductivity and is not prone to static electricity, and has good corrosion resistance and wear resistance. A plurality of chip positioning grooves 2 are arranged in a plurality of rows on the mold body 1 to ensure the consistency and uniformity of dipping. The number of baffles 3 is equal to the number of rows of chip positioning grooves 2 multiplied by 2 minus 1. One end of the baffle 3 is hingedly mounted on one edge of the mold body 1. The other end of the baffle 3 is mounted on the other edge of the mold body 1 through the mounting piece 4. The hinged turning direction of the baffle 3 on the inner side of the mold body 1 and the mold body 1 is upward and downward. The hinged turning direction of the baffles 3 on both sides of the mold body 1 and the mold body 1 is upward and downward or left and right. This facilitates the use of a plurality of baffles 3 to achieve precise positioning and fixation of the chip module 6. The side surface of the circular turntable 5 is provided with a groove to facilitate the rotation and positioning of the turntable during the dipping process and ensure the stability of the rotation of the turntable.

[0031] Fig. 2 The illustrated dipping mold is provided with the mounting piece 4 removed, and the baffles 3 are in an open state. The hinged turning direction of the baffle 3 on the inner side of the mold body 1 and the mold body 1 is upward and downward. The hinged turning direction of the baffles 3 on both sides of the mold body 1 and the mold body 1 is upward and downward or left and right.

[0032] Fig. 3In the application scenario of the dip medicine mold, the chip module 6 is inserted into the mold slot 2 in sequence, the stop bar 3 is closed, the stop bar 3 is fixed by the mounting piece 4, and the accurate positioning and fixing of the chip 6 are realized.

[0033] Fig. 4 and Fig. 5 In the application scenario of the dip medicine mold and the dip medicine machine, the dip medicine machine 7 comprises a support 701, a medicine pool 702, a dip medicine table 703, and a height adjusting device 704; the medicine pool 702 is arranged on the dip medicine table 703, and is designed to ensure that the dip medicine liquid uniformly covers the chip module 6 and improves the dip medicine effect; the height adjusting device 704 is arranged on the dip medicine table 703, ensures that the top of the chip module is immersed in the dip medicine liquid, and makes the liquid adhere to the front end of the bridge wire and the plastic block; as the dip medicine liquid decreases, the height of the medicine pool also increases, so that the height of the dip medicine mold to the dip medicine liquid surface is unchanged, the dip medicine effect is achieved, and too much or too little liquid is avoided; the support 701 connects the dip medicine mold and the dip medicine table 703, and ensures the stability of the dip medicine mold during the dip medicine process.

[0034] The medicine pool 702 is cleaned and the mixed medicine is poured into the dip medicine table 703. The circular turntable 5 is provided with a groove on the side, the dip medicine mold with the fixed chip module 6 is fixed on the support 701 of the dip medicine machine 7 by clamping the groove in the support 701, the support 701 is turned over, the dip medicine mold is turned over, the chip module 6 faces downward, the medicine pool 702 is slowly lifted to immerse the top of the chip module 6 in the liquid, the liquid is uniformly adhered to the top of the chip module 6, the medicine pool 702 is slowly lowered, the dip medicine mold is taken off, and another dip medicine mold is taken off to repeat the operation.

[0035] The above embodiment is only used to illustrate the technical scheme of the utility model, and is not limited thereto; although the utility model is described in detail with reference to the foregoing embodiment, those skilled in the art should understand that the technical scheme recorded in the foregoing embodiment can be modified, or part or all of the technical features can be replaced equivalently; and the modification or replacement does not make the essence of the corresponding technical scheme deviate from the scope of the technical scheme of the utility model embodiment.

Claims

1. A dipping mold for one-time dipping of a chip module (6), characterized in that, The utility model relates to a dip medicine mould, which comprises a mould body (1) and a plurality of chip positioning grooves (2) arranged in the mould body (1). The plurality of chip positioning grooves (2) are arranged in the mould body (1) in a plurality of rows.

2. The dip coating mold of claim 1, wherein The number of the baffle strips (3) is equal to the number of rows of the chip positioning grooves (2) multiplied by 2 minus 1.

3. The dip coating mold of claim 2, wherein The mould body (1) is made of aluminum alloy.

4. The dip coating mold of claim 1, wherein One end of the baffle strip (3) is hingedly connected to one edge of the mould body (1), and the other end of the baffle strip (3) is connected to the other edge of the mould body (1) through a mounting member (4).

5. The dip coating mold according to any one of claims 1 to 3, wherein The baffle strip (3) located on the inner side of the mould body (1) is hingedly connected to the mould body (1) in an up-down direction.

6. The dip-mold of claim 5 wherein, The baffle strip (3) located on the two sides of the mould body (1) is hingedly connected to the mould body (1) in an up-down direction or a left-right direction.

7. The dip-mold of claim 5 wherein, The mould body (1) is arranged on a circular turntable (5), and the top surface of the circular turntable (5) is connected to the bottom surface of the mould body (1).

8. The dip-mold of claim 1 wherein, The dip medicine mould also comprises a dip medicine table (703), a medicine pool (702) arranged on the dip medicine table (703), and a support (701) connecting the dip medicine mould and the dip medicine table.

9. A dipper (7) characterized in that, The dip medicine table (703) is also provided with a height adjusting device (704) for adjusting the height of the dip medicine mould to the height of the dip medicine liquid.

10. The dip machine (7) according to claim 9, characterized in that ​

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