Chip heat insulation and cooling system of aircraft
By designing the sandwich structure and state switching of the chip skin, and utilizing coolant and vacuum insulation, the problem of poor heat dissipation of chips in supersonic aircraft was solved, achieving efficient heat dissipation and insulation effects.
Patent Information
- Application Number
- CN202423215303.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-25
- Publication Date
- 2025-11-25
- Estimated Expiration
- 2034-12-25
AI Technical Summary
In supersonic environments, the heat dissipation performance of aircraft chips in existing technologies is poor, and the heat diffusion of the skin causes the aluminum plate to lose its heat dissipation function.
The chip skin is designed as a sandwich structure, with cooling pipes between the inner layer and the sandwich layer for cooling. Cooling is carried out through the gap during subsonic speeds, and vacuum insulation is applied to the gap during supersonic speeds. Liquid cooling and vacuum insulation are achieved by combining components such as a liquid supply unit, pipeline control valves, and vacuum pumps.
It effectively provides liquid cooling at subsonic speeds and reduces heat dissipation from the outer skin layer at supersonic speeds, thereby improving the chip's heat dissipation efficiency and thermal insulation effect.
Smart Images
Figure CN223598713U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to the chip heat insulation technical field under extreme condition especially relates to a chip heat insulation cooling system of aircraft. BACKGROUND
[0002] Chip is the important part of aircraft control, and the temperature will rise in the working process of chip, therefore, need cooling to chip.
[0003] The cooling of chip usually adopts the aluminum plate with high heat dissipation coefficient and directly contacts with chip, and utilizes the aluminum plate to carry out heat dissipation cooling.
[0004] But, in the supersonic speed environment, because the surface temperature of skin is high, the temperature of skin will rapidly spread to the aluminum plate, leads to the temperature rise of aluminum plate, loses the heat dissipation function, leads to the poor heat dissipation of chip. UTILITY MODEL CONTENTS
[0005] In view of above -mentioned analysis, the utility model aims at providing a chip heat insulation cooling system of aircraft to solve the poor heat dissipation performance of chip in supersonic speed aircraft in prior art.
[0006] The utility model discloses a purpose mainly is realized through the following technical schemes.
[0007] The utility model provides a chip heat insulation cooling system of aircraft, including chip skin,
[0008] Chip skin includes skin inner layer, skin interlayer and skin outer layer, and chip, skin inner layer, skin interlayer and skin outer layer are sequentially set from inside to outside.
[0009] Cooling liquid passes through the cooling liquid passage between the skin inner layer and the skin interlayer.
[0010] The skin interlayer and the skin outer layer have a gap therebetween.
[0011] When the aircraft is in a subsonic state, the gap is filled with cooling liquid. When the aircraft is in a supersonic state, the gap is in a vacuum state.
[0012] Further, the chip heat insulation cooling system further includes a liquid supply unit.
[0013] Further, the chip heat insulation cooling system further includes a pipeline control valve.
[0014] Further, the chip heat insulation cooling system further includes a gap control valve.
[0015] Further, the outlet of the cooling pipeline and the outlet of the gap are connected with the inlet of the liquid supply unit.
[0016] Further, the chip heat insulation cooling system further comprises a vacuum pump, and the air inlet of the vacuum pump is connected with the air outlet of the gap.
[0017] Further, the chip heat insulation cooling system further comprises a vacuum control valve, and the vacuum control valve is arranged on the connecting pipeline between the vacuum pump and the cooling pipeline.
[0018] Further, the inner wall of the skin sandwich layer is provided with a cooling groove, and the skin inner layer covers the opening of the cooling groove, and the cooling groove and part of the skin inner layer form the cooling pipeline.
[0019] Further, the cross section of the cooling pipeline is triangular or rectangular.
[0020] Further, the shape of the cooling pipeline is zigzag or back-shaped.
[0021] Compared with the prior art, the chip heat insulation cooling system of the aircraft provided by the utility model has at least one of the following beneficial effects:
[0022] A) the chip heat insulation cooling system of the aircraft provided by the utility model, the skin is designed as a sandwich structure, the cooling pipeline is arranged between the skin inner layer and the skin sandwich layer, and the cooling liquid in the cooling pipeline is used for liquid cooling of the chip.
[0023] B) the chip heat insulation cooling system of the aircraft provided by the utility model, the gap is arranged between the skin sandwich layer and the skin outer layer, the gap has two states of heat dissipation and heat insulation, when the aircraft is in a subsonic state, the chip mainly dissipates heat, the cooling liquid flows in the gap, the cooling liquid in the gap and the cooling liquid in the cooling pipeline jointly perform liquid cooling on the chip, when the aircraft is in a supersonic state, the chip dissipates heat and also considers heat insulation with the skin outer layer, the gap is vacuumized to form a vacuum state, the gap serves as a heat insulation layer, and the heat diffused from the skin outer layer to the chip is reduced.
[0024] In the utility model, the above technical solutions can be combined with each other to realize more optional combination solutions. Other features and advantages of the utility model will be described in the subsequent description, and some advantages can become apparent from the description or can be understood by implementing the utility model. The purpose and other advantages of the utility model can be realized and obtained through the contents specially pointed out in the description examples and the drawings. DRAWINGS
[0025] The drawings are only used for the purpose of showing the specific embodiments and are not considered as limitations of the utility model, and the same reference signs represent the same parts in the whole drawings.
[0026] Fig. 1 The structure schematic view of the chip heat insulation and cooling system of the aircraft is provided in the first embodiment of the utility model, wherein the cross section shape of the cooling pipeline is triangular.
[0027] Fig. 2 The structure schematic view of the chip heat insulation and cooling system of the aircraft is provided in the first embodiment of the utility model, wherein the cross section shape of the cooling pipeline is rectangular.
[0028] Reference signs:
[0029] 1-chip; 2-skin inner layer; 3-skin interlayer; 4-skin outer layer; 5-cooling pipeline; 6-gap; 7-liquid supply unit; 8-pipeline control valve; 9-gap control valve; 10-vacuum pump; 11-vacuumizing control valve. DETAILED DESCRIPTION
[0030] The preferred embodiments of the utility model will be described in detail below with reference to the drawings, wherein the drawings constitute a part of the utility model, and are used together with the embodiments of the utility model to explain the principles of the utility model, and are not used to limit the scope of the utility model.
[0031] Embodiment one
[0032] The embodiment provides a chip heat insulation and cooling system of an aircraft, referring to Figs. 1-2 , comprising a chip skin, wherein the chip skin comprises a skin inner layer 2, a skin interlayer 3 and a skin outer layer 4, the chip 1, the skin inner layer 2, the skin interlayer 3 and the skin outer layer 4 are sequentially sleeved from inside to outside, the cooling pipeline 5 is arranged between the skin inner layer 2 and the skin interlayer 3, the cooling liquid is passed in the cooling pipeline 5, the gap 6 is arranged between the skin interlayer 3 and the skin outer layer 4. When the aircraft is in a subsonic state, the cooling liquid is passed in the gap 6; when the aircraft is in a supersonic state, the gap 6 is in a vacuum state.
[0033] Compared with the prior art, the chip heat insulation and cooling system of the aircraft provided in the embodiment, on the one hand, the chip skin is designed as a sandwich structure (i.e. the skin inner layer 2, the skin interlayer 3 and the skin outer layer 4), the cooling pipeline 5 is arranged between the skin inner layer 2 and the skin interlayer 3, and the chip 1 is cooled by the cooling liquid in the cooling pipeline 5.
[0034] In another aspect, a gap 6 is provided between the skin sandwich layer 3 and the skin outer layer 4, and the gap 6 has two states of heat dissipation and heat insulation. When the aircraft is in a subsonic state, the chip 1 should mainly dissipate heat, and the gap 6 is filled with cooling liquid. The cooling liquid in the gap 6 and the cooling liquid in the cooling pipeline 5 together effectively cool the chip 1 by liquid cooling. When the aircraft is in a supersonic state, the chip 1 should consider heat insulation with the skin outer layer 4 in addition to heat dissipation. The gap 6 is evacuated to form a vacuum state, and the gap 6 serves as a heat insulation layer to reduce the heat diffused from the skin outer layer 4 to the chip 1.
[0035] It can be understood that in order to be able to realize the injection of the cooling liquid, the chip heat insulation and cooling system of the aircraft further comprises a liquid supply unit 7. The liquid outlet of the liquid supply unit 7 is connected with the liquid inlet of the cooling pipeline 5 and the liquid inlet of the gap 6, respectively. The cooling liquid is supplied to the cooling pipeline 5 and the gap 6 through the liquid supply unit 7.
[0036] In order to be able to control the communication or disconnection of the connecting pipeline of the liquid supply unit 7 and the cooling pipeline 5 and the gap 6, the chip heat insulation and cooling system of the aircraft further comprises a pipeline control valve 8 and a gap control valve 9. The pipeline control valve 8 is arranged on the connecting pipeline of the liquid supply unit 7 and the cooling pipeline 5. The gap control valve 9 is arranged on the connecting pipeline of the liquid supply unit 7 and the gap 6. In this way, the communication or disconnection of the connecting pipeline of the liquid supply unit 7 and the cooling pipeline 5 is controlled by the pipeline control valve 8, and the communication or disconnection of the connecting pipeline of the liquid supply unit 7 and the gap 6 is controlled by the gap control valve 9, so as to ensure smooth liquid supply of the liquid supply unit 7.
[0037] In order to be able to realize the recycling of the cooling liquid, the liquid outlet of the cooling pipeline 5 and the liquid outlet of the gap 6 are connected with the liquid inlet of the liquid supply unit 7, respectively. The liquid supply unit 7 and the cooling pipeline 5 form a circulation loop, and the liquid supply unit 7 and the gap 6 form a circulation loop.
[0038] In order to be able to realize the evacuation of the gap 6, the chip heat insulation and cooling system of the aircraft further comprises a vacuum pump 10. The air inlet of the vacuum pump 10 is connected with the air outlet of the gap 6. The vacuum state of the gap 6 is realized by the vacuum pump 10.
[0039] In order to be able to control the communication or disconnection of the connecting pipeline of the vacuum pump 10 and the gap 6, the chip heat insulation and cooling system of the aircraft further comprises a vacuum control valve 11. The vacuum control valve is arranged on the connecting pipeline of the vacuum pump 10 and the cooling pipeline 5. In this way, the communication or disconnection of the connecting pipeline of the vacuum pump 10 and the gap 6 is controlled by the vacuum control valve 11, so as to be able to ensure the evacuation of the gap 6 by the vacuum pump 10.
[0040] In order to be able to reduce the processing difficulty of the cooling pipeline 5, the inner wall of the skin sandwich layer 3 is provided with a cooling groove, and the skin inner layer 2 covers the opening of the cooling groove. The cooling groove and part of the skin inner layer 2 form the cooling pipeline 5.
[0041] Exemplarily, the cross-sectional shape of the cooling pipeline 5 is triangular (see Fig. 1 ) or rectangular (see Fig. 2 ).
[0042] In order to improve the distribution density of the cooling pipeline 5, and further improve the cooling effect, the shape of the above-mentioned cooling pipeline 5 is zigzag or back-shaped.
[0043] The above is only a preferred specific embodiment of the present application, but the protection scope of the present application is not limited to this, any person skilled in the art can easily think of changes or replacements within the technical range disclosed by the present application, which should be covered within the protection scope of the present application.
Claims
1. A chip heat isolation and cooling system for an aircraft, comprising: The chip skin comprises a skin inner layer, a skin interlayer and a skin outer layer, and the chip, the skin inner layer, the skin interlayer and the skin outer layer are sequentially sleeved from inside to outside. A cooling pipeline is arranged between the skin inner layer and the skin interlayer, and cooling liquid is passed through the cooling pipeline. The skin interlayer and the skin outer layer have a gap therebetween. When the aircraft is in a subsonic state, the gap is filled with cooling liquid, and when the aircraft is in a supersonic state, the gap is in a vacuum state. The chip heat insulation and cooling system further comprises a liquid supply unit, and the liquid outlet of the liquid supply unit is connected with the liquid inlet of the cooling pipeline and the liquid inlet of the gap, respectively.
2. The core thermal isolation and cooling system of claim 1, wherein, The chip heat insulation and cooling system further comprises a pipeline control valve, which is arranged on the connecting pipeline between the liquid supply unit and the cooling pipeline.
3. The core thermal isolation and cooling system of claim 2, wherein, The chip heat insulation and cooling system further comprises a gap control valve, which is arranged on the connecting pipeline between the liquid supply unit and the gap.
4. The core thermal isolation and cooling system of claim 2, wherein, The liquid outlet of the cooling pipeline and the liquid outlet of the gap are respectively connected with the liquid inlet of the liquid supply unit.
5. The aircraft core insulation cooling system of claim 2, wherein, The chip heat insulation and cooling system further comprises a vacuum pump, and the air inlet of the vacuum pump is connected with the air outlet of the gap.
6. The aircraft core insulation cooling system of claim 1, wherein, The chip heat insulation and cooling system further comprises an evacuation control valve, which is arranged on the connecting pipeline between the vacuum pump and the cooling pipeline.
7. The aircraft core insulation cooling system of claim 6, wherein, The inner wall of the skin interlayer is provided with a cooling groove, and the skin inner layer covers the opening of the cooling groove.
8. The aircraft core insulation cooling system of claim 1, wherein, The cross-sectional shape of the cooling pipeline is triangular or rectangular.
9. The aircraft core thermal management system of claim 1, wherein, The shape of the cooling pipeline is zigzag or back-shaped.
10. The aircraft core thermal management system of claim 1, wherein,