Circuit board assembly and electronic equipment

Abstract

The embodiment of the utility model provides a circuit board assembly and electronic equipment, and relates to the technical field of electronic equipment, a first circuit board of the circuit board assembly is provided with a first surface and a second surface opposite to each other along a first direction, a second circuit board is provided with a third surface and a fourth surface opposite to each other along the first direction, and the third surface and the first surface face the same direction. The second circuit board and the first circuit board are arranged in a spaced mode in the second direction, the second direction is perpendicular to the first direction, the system-on-chip is arranged on the first face of the first circuit board, the first electronic device is arranged on the third face of the second circuit board, and the thickness of the first electronic device is smaller than that of the system-on-chip. According to the circuit board assembly, the space occupancy rate can be reduced, the space utilization rate in the electronic equipment is improved, and thinning of the electronic equipment is facilitated.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic equipment, and particularly relates to a circuit board assembly and electronic equipment. BACKGROUND

[0002] Electronic equipment generally includes a mobile phone, a tablet computer, a computer, a display or a vehicle-mounted computer, etc. The electronic equipment generally has a circuit board assembly inside. The circuit board assembly includes a circuit board and various electronic devices, such as a system-level chip, a capacitor, an inductor, etc., arranged on the circuit board. The electronic devices can be arranged on the same side or two sides of the circuit board.

[0003] However, the space occupation rate of the circuit board assembly in the related art is large, which leads to low space utilization rate inside the electronic equipment and affects thinning of the electronic equipment. CONTENT OF THE UTILITY MODEL

[0004] Embodiments of the present application provide a circuit board assembly and electronic equipment, which can improve the space utilization rate of the circuit board assembly, improve the space utilization rate inside the electronic equipment, and help thinning of the electronic equipment.

[0005] A first aspect of embodiments of the present application provides a circuit board assembly, which includes:

[0006] a first circuit board having a first surface and a second surface opposite to each other along a first direction, the first direction being a thickness direction of the circuit board assembly;

[0007] a second circuit board having a third surface and a fourth surface opposite to each other along the first direction, the third surface and the first surface being in the same direction, the second circuit board being arranged spaced apart from the first circuit board along a second direction, the second direction being perpendicular to the first direction;

[0008] a system-level chip arranged on the first surface of the first circuit board;

[0009] a first electronic device arranged on the third surface of the second circuit board, the thickness of the first electronic device being smaller than the thickness of the system-level chip.

[0010] The application provides a circuit board assembly, by setting two mutually separated first and second circuit boards, and setting a system-level chip on a first surface of the first circuit board and a first electronic device on a third surface of the second circuit board, the thickness of the system-level chip is greater than that of the first electronic device, compared with the prior art of setting the system-level chip and the first electronic device on the same circuit board, the space formed between the first electronic device and other components due to the large thickness of the system-level chip can be eliminated, the space between the circuit board assembly and other components in the electronic device in the thickness direction can be eliminated, the space occupancy of the circuit board assembly is reduced, the space utilization in the electronic device is improved, and the thinning of the electronic device is facilitated.

[0011] In a possible implementation, along the first direction, the fourth surface of the second circuit board is not higher than the second surface of the first circuit board.

[0012] In this way, only when the electronic devices are arranged on the first surface of the first circuit board and the third surface of the second circuit board, by setting the fourth surface of the second circuit board to be not higher than the second surface of the first circuit board, the maximum thickness of the electronic device can correspond to the region where the system-level chip is located on the first circuit board, the influence of the second circuit board and the first electronic device on the thickness of the electronic device is reduced, and the thinning of the electronic device is facilitated.

[0013] In a possible implementation, the circuit board assembly further includes:

[0014] a second electronic device arranged on the second surface of the first circuit board;

[0015] a third electronic device arranged on the fourth surface of the second circuit board;

[0016] Along the first direction, the third electronic device is not higher than the second electronic device in the surface direction of the first circuit board.

[0017] Compared with the prior art of setting the system-level chip, the first electronic device, the second electronic device and the third electronic device on the same circuit board, the thickness of the system-level chip is greater than that of the first electronic device, and the third electronic device is higher than the second electronic device.

[0018] The circuit board assembly of the present application, by disposing the system-level chip and the second electronic device on the first circuit board, and disposing the first electronic device and the third electronic device on the second circuit board, the gap between the first electronic device and other components in the electronic device in the first direction is eliminated, so that the second circuit board, the first electronic device and the third electronic device can be collectively lowered relative to the first circuit board, reducing the influence of the third electronic device on the thickness of the electronic device due to being higher than the second electronic device, thereby reducing the space occupancy of the circuit board assembly and facilitating the thinning of the electronic device.

[0019] In addition, by making the surface of the third electronic device away from the second circuit board not higher than the surface of the second electronic device away from the first circuit board, the maximum thickness of the circuit board assembly can be the area corresponding to the second electronic device and the system-level chip on the first circuit board, thereby eliminating the influence of the third electronic device on the thickness of the electronic device and facilitating the thinning of the electronic device.

[0020] In a possible implementation, in the first direction, the thickness of the second circuit board is less than the thickness of the first circuit board.

[0021] In this way, by making the thickness of the second circuit board less than the thickness of the first circuit board, the space occupancy of the second circuit board in the electronic device can be further reduced, and the influence of the second circuit board in the circuit board assembly on the thickness of the electronic device can be reduced.

[0022] In a possible implementation, the circuit board assembly further comprises a heat dissipation plate;

[0023] In the first direction, the first circuit board is disposed on the heat dissipation plate, and the system-level chip is located between the first circuit board and the heat dissipation plate.

[0024] In this way, in the first direction, by disposing the first circuit board on the heat dissipation plate and locating the system-level chip between the first circuit board and the heat dissipation plate, the heat dissipation plate can dissipate heat from the system-level chip and the first circuit board, improving the heat dissipation efficiency of the system-level chip and the first circuit board, avoiding overheating of the system-level chip and the first circuit board, ensuring the working stability of the system-level chip and the first circuit board, and ensuring the working stability of the circuit board assembly.

[0025] In a possible implementation, in the first direction, the second circuit board is disposed on the heat dissipation plate, and the first electronic device is located between the second circuit board and the heat dissipation plate.

[0026] In the first direction, by arranging the second circuit board on the heat dissipation plate and arranging the first electronic device between the second circuit board and the heat dissipation plate, heat dissipation can be performed on the first electronic device and the second circuit board through the heat dissipation plate, the heat dissipation efficiency of the first electronic device and the second circuit board is improved, the problem of overheating of the first electronic device and the second circuit board is reduced, the working stability of the first electronic device and the second circuit board is ensured, and the working stability of the circuit board assembly is further ensured.

[0027] In addition, by using the first circuit board and the second circuit board separated from each other, and arranging the system-level chip on the first circuit board and the first electronic device on the second circuit board, compared with the prior art of arranging the system-level chip and the first electronic device on the same circuit board, the space formed between the first electronic device and the heat dissipation plate due to the large thickness of the system-level chip can be eliminated, so that the first electronic device can be closer to the heat dissipation plate, and the heat dissipation effect of the heat dissipation plate on the first electronic device is further improved, and the problem of overheating of the first electronic device and the second circuit board is reduced.

[0028] In a possible implementation, the first circuit board and the second circuit board are electrically connected through a first flexible circuit board.

[0029] In this way, by connecting the first circuit board and the second circuit board through the first flexible circuit board, since the first flexible circuit board is thin and has a certain flexibility, the influence of the first flexible circuit board on the thickness of the electronic device can be ignored, so that the influence of the first flexible circuit board on the thickness of the electronic device can be avoided on the basis of ensuring the electrical connection between the first circuit board and the second circuit board.

[0030] A second aspect of the embodiment of the application provides an electronic device, which comprises:

[0031] A first frame;

[0032] A second frame rotatably connected with the first frame;

[0033] A circuit board assembly arranged in the first frame, wherein the circuit board assembly is the circuit board assembly described above;

[0034] A screen assembly arranged in the first frame and the second frame, wherein a part of the screen assembly located on the first frame is connected with the circuit board assembly;

[0035] A first battery arranged in the second frame.

[0036] The electronic device provided by the embodiment of the present application can realize folding of the screen assembly of the electronic device by rotatingly connecting the first frame and the second frame and arranging the screen assembly on the first frame and the second frame, thereby reducing the space occupancy of the electronic device and improving the portability of the electronic device.

[0037] In addition, the part of the screen assembly on the first frame is connected with the circuit board assembly, and the first battery is arranged on the second frame, so that the screen assembly can avoid occupying a large space in the second frame, and the width of the first battery in the second direction can be easily increased, the volume and capacity of the first battery are improved, and the endurance of the electronic device is improved.

[0038] In a possible implementation, the screen assembly comprises:

[0039] a screen arranged on the first frame and the second frame;

[0040] a control unit arranged on the first frame and located between the screen and the circuit board assembly, the control unit being configured to connect the circuit board assembly and the screen.

[0041] In this way, the control unit and the battery in the prior art are arranged in the first direction, which affects the thickness of the electronic device. The control unit is arranged on the first frame, so that the thickness of the electronic device on the second frame side is reduced without changing the thickness of the first battery, thereby helping to reduce the overall thickness of the electronic device and helping to thin the electronic device.

[0042] In a possible implementation, the control unit comprises a first chip and a second flexible circuit board.

[0043] The first chip and the second flexible circuit board are both located between the screen and the circuit board assembly.

[0044] One end of the first chip is connected with the screen, and the other end of the first chip is connected with one end of the second flexible circuit board, and the other end of the second flexible circuit board is connected with the second circuit board of the circuit board assembly.

[0045] In this way, the first chip is connected with the screen, and the second flexible circuit board connects the first chip and the circuit board assembly, so that the screen can be connected with the second circuit board through the first chip and the second flexible circuit board, and the control of the screen is facilitated. The thickness of the second flexible circuit board is relatively small, which can reduce the influence of the second flexible circuit board on the thickness of the electronic device, and facilitate the electrical connection between the first chip and the second circuit board.

[0046] In a possible implementation, the screen comprises:

[0047] a planar portion disposed on the first frame and the second frame;

[0048] a bending portion connected to a portion of the planar portion on the first frame;

[0049] The bending portion is located between the planar portion and the circuit board assembly in the first direction, and the first chip is disposed on the bending portion.

[0050] In this way, by disposing the bending portion of the screen on the first frame and connecting the first chip to the bending portion, the thickness of the electronic device on the second frame side can be reduced without affecting the thickness of the electronic device on the first frame side by the bending portion, while ensuring that the thickness of the first battery remains unchanged.

[0051] By bending a portion of the screen towards the inside of the first frame and connecting the first chip to the bending portion, the screen-to-body ratio of the planar portion of the screen can be increased, and the display effect of the electronic device can be improved.

[0052] In one possible implementation, the second circuit board has a main portion and an extension portion, and the extension portion and the bending portion of the screen both extend in a third direction;

[0053] The extension portion is connected to the bending portion;

[0054] The third direction is perpendicular to the first direction, and the third direction is perpendicular to the second direction.

[0055] In this way, by connecting the extension portion to the bending portion and extending the extension portion and the bending portion of the screen in the third direction, the connection area between the screen and the second circuit board can be increased, and the signal transmission stability and efficiency between the screen and the second circuit board can be improved.

[0056] In one possible implementation, the electronic device further includes a second battery;

[0057] The second battery is disposed on the first frame, and the second battery and the extension portion are arranged in the second direction.

[0058] In this way, by disposing the second battery in the first frame, the first battery and the second battery are simultaneously disposed in the electronic device, which can further increase the battery capacity in the electronic device and improve the endurance of the electronic device.

[0059] In one possible implementation, the electronic device further includes a first audio assembly;

[0060] The first audio assembly is disposed on the first frame;

[0061] In the second direction, the second battery and the frame of the first frame are spaced apart by the extension;

[0062] The first audio assembly has an acoustic cavity, and the acoustic cavity is located in the space.

[0063] In this way, compared with the prior art, the acoustic cavity of the audio assembly and the second battery are arranged in the third direction. The first audio assembly is arranged on the first frame, and the acoustic cavity of the first audio assembly is arranged in the space between the first frame and the second battery. The space in the space can be fully utilized, and since the acoustic cavity is arranged in the space, the space of the electronic device in the third direction can be avoided. The length of the second battery in the third direction can be increased, the volume and capacity of the second battery can be increased, and the total capacity of the battery of the electronic device and the endurance of the electronic device can be increased.

[0064] In a possible implementation, the electronic device further includes:

[0065] The first antenna assembly is arranged on the first frame and connected to the circuit board assembly.

[0066] The second antenna assembly is arranged on the second frame and connected to the circuit board assembly.

[0067] In this way, by arranging the first antenna assembly on the first frame, arranging the second antenna assembly on the second frame, and connecting the first antenna assembly and the second antenna assembly to the circuit board assembly, the mutual interference between the signals of the first antenna assembly and the signals of the second antenna assembly can be reduced, the working stability of the first antenna assembly and the second antenna assembly can be ensured, and the signal transmission stability of the antenna assembly of the electronic device can be improved.

[0068] In a possible implementation, the first antenna assembly includes:

[0069] The first antenna is arranged on the first frame and located on a side close to the second circuit board of the circuit board assembly.

[0070] The second chip is arranged on the second circuit board and located on a side close to the first antenna, and connected to the first antenna.

[0071] In this way, by arranging the first antenna on the side of the first frame close to the second circuit board, and arranging the second chip on the second circuit board close to the first antenna, the second chip is arranged closer to the first antenna, and the signal transmission stability and signal strength between the second chip and the first antenna can be improved.

[0072] In a possible implementation, the second antenna assembly includes:

[0073] The second antenna is disposed on the second frame;

[0074] A third circuit board is disposed on the second frame and connected to the first circuit board of the circuit board assembly;

[0075] The third chip is disposed on the third circuit board and connected to the second antenna.

[0076] In this way, the second antenna is placed on the second frame, and the third chip is placed on the third circuit board. The third circuit board is connected to the first circuit board, which enables the system-on-a-chip on the first circuit board to control the third circuit board. It also enables the signal of the second antenna to be transmitted to the system-on-a-chip on the first circuit board through the third chip and the third circuit board, thus realizing the control of the signal of the second antenna.

[0077] In one possible implementation, the second antenna assembly further includes:

[0078] The third flexible circuit board has one end connected to the third circuit board and the other end connected to the first circuit board.

[0079] In this way, by setting a third flexible circuit board to connect the first circuit board and the third circuit board, the third flexible circuit board has high flexibility and a certain degree of foldability, and is not easily bent or damaged, so as to maintain the normal electrical connection between the first circuit board and the third circuit board during the rotation and folding of the first frame and the second frame.

[0080] In one possible implementation, the second antenna assembly further includes a fourth flexible circuit board;

[0081] The third circuit board and the first battery are arranged at intervals along a third direction;

[0082] The second antenna and the first battery are arranged at intervals along the second direction, and the second antenna is connected to the third circuit board through the fourth flexible circuit board;

[0083] The third direction is perpendicular to the first direction, and the third direction is perpendicular to the second direction.

[0084] In this way, by arranging the third circuit board and the first battery at intervals along the third direction, the limitation of the width of the first battery along the second direction by the third circuit board can be avoided. Arranging the second antenna and the first battery at intervals along the second direction can ensure that there is a certain clearance between the first battery and the second antenna, thereby reducing the impact of the first battery on the signal transmission and reception of the second antenna.

[0085] In addition, the second antenna is connected to the third chip on the third circuit board by using a fourth flexible circuit board, the fourth flexible circuit board has a small thickness, and the thickness of the first battery is reduced, so that the thickness of the electronic device is reduced.

[0086] In a possible implementation, the electronic device further includes:

[0087] A cover plate, the circuit board assembly is located between the cover plate and the screen assembly.

[0088] Part of the cover plate is arranged on the first frame and covers the circuit board assembly, and the other part is arranged on the second frame and covers the first battery. BRIEF DESCRIPTION OF DRAWINGS

[0089] Figure 1 A structural schematic diagram of an electronic device provided by an embodiment of the present application;

[0090] Figure 2 A structural schematic diagram of an electronic device in the related art; Figure 1

[0091] A structural schematic diagram of an electronic device in the related art; Figure 3

[0092] A cross-sectional view of the electronic device in the related art at A-A; Figure 4 Figure 3 A cross-sectional view of the electronic device in the related art at B-B;

[0093] Figure 5 Figure 2 A cross-sectional view of the electronic device in the related art at B-B;

[0094] Figure 6 A partial cross-sectional view of the electronic device in the related art at B-B corresponding to the first frame side; Figure 2

[0095] Legend of reference signs:

[0096] 1-circuit board; 2-system level chip; 3-component; 4-heat dissipation plate;

[0097] 10-circuit board assembly; 20a-first frame; 20b-second frame; 30-screen assembly; 40a-first battery; 40b-second battery;

[0098] 50-rotation shaft; 60a-first audio assembly; 60b-second audio assembly; 70-first antenna assembly; 80-second antenna assembly; 90-cover plate;

[0099] ​​​31 - screen; 31a - flat portion; 31b - bent portion; 32 - control unit; 41 - interval; 61 - sound cavity; 71 - first antenna;

[0100] 72 - second chip; 81 - second antenna; 82 - third chip;

[0101] 100 - first circuit board;

[0102] 110 - first face; 120 - second face;

[0103] 200 - second circuit board;

[0104] 210 - third face; 220 - fourth face; 230 - main portion; 240 - extension portion;

[0105] 300 - system on chip; 300a - first chip;

[0106] 400 - first electronic device;

[0107] 410 - second electronic device; 420 - third electronic device;

[0108] 500 - heat sink;

[0109] 600 - first flexible circuit board;

[0110] 610 - second flexible circuit board; 620 - third flexible circuit board; 630 - fourth flexible circuit board;

[0111] 700 - third circuit board. DETAILED DESCRIPTION

[0112] The embodiments of the present application provide an electronic device, which includes but is not limited to a mobile phone (for example, a straight mobile phone or a foldable mobile phone), a tablet computer, a notebook computer, an ultra-mobile personal computer (UMPC for short), a handheld computer, a walkie-talkie, a network television, a television, a vehicle-mounted device, a netbook, a POS machine, a personal digital assistant (PDA for short), a wearable device (for example, a smart watch, a smart wristband, a virtual reality device, and the like) and a mobile or fixed terminal with a display device.

[0113] In the embodiments of the present application, a mobile phone is taken as an example of the above-mentioned electronic device, which can be a foldable mobile phone or a straight mobile phone, or a slide mobile phone, and the straight mobile phone is taken as an example for specific description.

[0114] ReferenceFigure 1 and Figure 2 The electronic device can be a foldable phone, and the electronic device can include a first frame 20a, a second frame 20b, a circuit board assembly 10, and a screen assembly 30.

[0115] The first frame 20a and the second frame 20b are capable of relative rotation, and the first frame 20a and the second frame 20b have at least two states, one of which is a state in which the first frame 20a and the second frame 20b are folded by rotation, and in this state, the electronic device is in a folded state. Another is a state in which the first frame 20a and the second frame 20b are relatively unfolded, and in this state, the electronic device is in an unfolded state.

[0116] The screen assembly 30 is disposed on the first frame 20a and the second frame 20b, and when the electronic device is in the unfolded state, the screen assembly 30 is unfolded with the first frame 20a and the second frame 20b, and when the electronic device is in the folded state, the screen assembly 30 is folded with the first frame 20a and the second frame 20b.

[0117] In other embodiments, the electronic device can also be a straight phone, and the electronic device has one frame, and the screen assembly 30 is disposed on the frame, and the circuit board assembly 10 is disposed in the frame.

[0118] With the continuous development of electronic devices, whether it is a foldable device or a straight phone, the functions of electronic devices are becoming more and more rich, and the number of parts inside electronic devices is also increasing. Under the dual restrictions of the requirement of rich functions of electronic devices and the thinning of electronic devices, the utilization rate of the internal space of electronic devices is also increasing. The circuit board assembly 10 will occupy a large space inside the electronic device.

[0119] However, the space occupation rate of the circuit board assembly in the above related technology is large, which leads to low space utilization rate inside the electronic device and affects the thinning of the electronic device.

[0120] Reference Figure 3 and Figure 4The main reason for the problem is that the circuit board assembly in the related art includes the circuit board 1 and a plurality of components 3, there is a height difference between the components 3, and the components with inconsistent heights are all mounted on two surfaces in the thickness direction of the circuit board 1. For example, in the related art, the thickness of the system-on-chip 2 is larger than the thickness of other components. If the circuit board 1 has the system-on-chip 2 and other components 3 mounted on the same surface, when the circuit board assembly is installed in the electronic device, the system-on-chip 2 will contact the parts in the electronic device (such as the heat sink 4 in the electronic device) before the other components 3, thereby causing a gap between the components 3 on the same surface of the circuit board 1 and other parts in the electronic device. And because the gap is between the circuit board 1 and the heat sink 4, the space in the electronic device cannot be utilized, and the space utilization rate of the electronic device is low, and the space occupation rate of the circuit board assembly is large.

[0121] Reference Figure 2 and Figure 5 To solve the above technical problems, the present application provides a circuit board assembly 10 and an electronic device. By arranging two mutually separated first circuit board 100 and second circuit board 200, and arranging the system-on-chip 300 on the first surface 110 of the first circuit board 100 and the first electronic component 400 on the third surface 210 of the second circuit board 200, the thickness of the system-on-chip 300 is greater than the thickness of the first electronic component 400. Compared with the prior art of arranging the system-on-chip 300 and the first electronic component 400 on the same circuit board, the gap between the first electronic component 400 and other parts caused by the large thickness of the system-on-chip 300 can be eliminated, and the gap between the circuit board assembly 10 and other parts in the electronic device in the thickness direction can be eliminated, the space occupation rate of the circuit board assembly 10 is reduced, the space utilization rate in the electronic device is improved, and the thinning of the electronic device is facilitated.

[0122] In order to make the above-mentioned purposes, features and advantages of the embodiments of the present application more obvious and easy to understand, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor are within the scope of protection of the present application.

[0123] In the related art, for a foldable mobile phone, the structure connected to the circuit board in the screen assembly is in the same frame as the battery, which affects the size of the battery, limits the volume of the battery in the electronic device, and is not conducive to improving the capacity of the battery and the endurance of the electronic device.

[0124] Reference Figure 1 and Figure 2 The embodiments of the present application also provide an electronic device, which can be a foldable phone or a straight phone. If the electronic device is a foldable phone, the electronic device can include a first frame 20a, a second frame 20b, a circuit board assembly 10, a screen assembly 30, and a first battery 40a.

[0125] In some embodiments, the electronic device can further include a cover plate 90. The circuit board assembly 10 is located between the cover plate 90 and the screen assembly 30. A part of the cover plate 90 is arranged on the first frame 20a and covers the circuit board assembly 10, and another part of the cover plate 90 is arranged on the second frame 20b and covers the first battery 40a.

[0126] Reference Figure 1 It can be understood that the first direction (such as the Z direction in Figure 1 ) in the following description can be the thickness direction of the electronic device, the second direction (such as the X direction in Figure 1 ) can be the width direction of the electronic device, and the third direction (such as the Y direction in Figure 1 ) can be the length direction of the electronic device.

[0127] The first frame 20a can be rotationally connected with the second frame 20b, and the screen assembly 30 can be arranged on the first frame 20a and the second frame 20b. The first frame 20a and the second frame 20b have at least two states. One of the states is a relative folding state of the first frame 20a and the second frame 20b, in which the electronic device is in a folded state. The other state is a relative unfolding state of the first frame 20a and the second frame 20b, in which the electronic device is in an unfolded state.

[0128] The screen assembly 30 is arranged on the first frame 20a and the second frame 20b. When the electronic device is in the unfolded state, the screen assembly 30 is unfolded with the first frame 20a and the second frame 20b. When the electronic device is in the folded state, the screen assembly 30 is folded with the first frame 20a and the second frame 20b.

[0129] Reference Figure 2 In some embodiments, the electronic device can further include a rotation shaft 50. When the electronic device is in the unfolded state, the first frame 20a and the second frame 20b are arranged apart along the second direction (such as the direction X in Figure 2 ), and the rotation shaft 50 is arranged between the first frame 20a and the second frame 20b, so that the first frame 20a and the second frame 20b can be rotationally connected through the rotation shaft 50.

[0130] The circuit board assembly 10 is arranged on the first frame 20a, and the part of the screen assembly 30 located on the first frame 20a can be connected with the circuit board assembly 10.

[0131] The first battery 40a can be arranged on the second frame 20b, and the first battery 40a can also be connected with the circuit board assembly 10, for example, the first battery 40a can be indirectly connected with the circuit board assembly 10 of the first frame 20a through the circuit board arranged on the second frame 20b.

[0132] The embodiment of the present application provides an electronic device, by rotatingly connecting the first frame 20a and the second frame 20b, and arranging the screen assembly 30 on the first frame 20a and the second frame 20b, the folding of the screen assembly 30 of the electronic device can be realized, the space occupancy of the electronic device is reduced, and the portability of the electronic device is improved.

[0133] In addition, compared with the arrangement mode of the related art, the part of the screen assembly 30 located on the first frame 20a is connected with the circuit board assembly 10, and the first battery 40a is arranged on the second frame 20b, so that the connection part of the screen assembly 30 and the circuit board assembly 10 can avoid occupying a large space in the second frame 20b, and the width of the first battery 40a in the second direction is facilitated to be increased, the volume and capacity of the first battery 40a are improved, and the endurance of the electronic device is improved.

[0134] Reference Figure 2 and Figure 5 In some modes of implementation, the screen assembly 30 can include a screen 31 and a control unit 32. The screen 31 is arranged on the first frame 20a and the second frame 20b, and the screen 31 can be a flexible screen 31, so as to facilitate the screen 31 to bend along with the folding and unfolding of the first frame 20a and the second frame 20b, so that the screen 31 can be ensured not to be damaged due to bending, and the durability of the screen 31 is improved.

[0135] The control unit 32 is arranged on the first frame 20a and located between the screen 31 and the circuit board assembly 10, and the control unit 32 is used for connecting the circuit board assembly 10 with the screen 31.

[0136] In some modes of implementation, the edge part of the screen 31 in the second direction can be connected with the control unit 32.

[0137] In this way, since the control unit and the battery in the prior art are arranged in the first direction, the thickness of the electronic device is affected. The control unit 32 is arranged on the first frame 20a, so that the thickness of the electronic device on the side of the second frame 20b is reduced without changing the thickness of the first battery 40a, thereby helping to reduce the overall thickness of the electronic device and helping to thin the electronic device.

[0138] Referring to Figure 2 and Figure 5 In some embodiments, the circuit board assembly 10 can include a first circuit board 100 and a second circuit board 200, the first circuit board 100 and the second circuit board 200 being electrically connected, and the first circuit board 100 being provided with a system chip 300.

[0139] Referring to Figure 2 and Figure 5 In some embodiments, the control unit 32 can include a first chip 300a and a second flexible circuit board 610. The first chip 300a and the second flexible circuit board 610 are both located between the screen 31 and the circuit board assembly 10.

[0140] One end of the first chip 300a is connected to the part of the screen 31 located in the first frame 20a, and the other end of the first chip 300a is connected to one end of the second flexible circuit board 610, and the other end of the second flexible circuit board 610 is connected to the second circuit board 200 in the circuit board assembly 10. In some embodiments, the first chip 300a can be a display touch chip.

[0141] In this way, by connecting the first chip 300a to the screen 31 and connecting the second flexible circuit board 610 to the first chip 300a and the circuit board assembly 10, the screen 31 can be connected to the second circuit board 200 through the first chip 300a and the second flexible circuit board 610, facilitating the control of the screen 31. The second flexible circuit board 610 has a relatively small thickness, which can reduce the impact of the second flexible circuit board 610 on the thickness of the electronic device, and facilitate the electrical connection between the first chip 300a and the second circuit board 200.

[0142] Referring to Figure 2 and Figure 5 In some embodiments, the screen 31 can include a flat part 31a and a bent part 31b. The flat part 31a is arranged on the first frame 20a and the second frame 20b, and the flat part 31a can serve as the main display area of the electronic device to provide display functions for the user. The bent part 31b is connected to the part of the flat part 31a located in the first frame 20a, and the bent part 31b can be arranged in the area close to the edge of the first frame 20a. In the first direction, the bent part 31b is located between the flat part 31a and the circuit board assembly 10, and the first chip 300a is arranged in the bent part 31b.

[0143] In this way, by arranging the bending portion 31b of the screen 31 on the first frame 20a and connecting the first chip 300a with the bending portion 31b, the thickness of the electronic device on the side of the second frame 20b can be reduced without affecting the thickness of the electronic device on the side of the first frame 20a, while ensuring that the thickness of the first battery 40a remains unchanged.

[0144] By bending a portion of the screen 31 towards the inside of the first frame 20a and connecting the first chip 300a with the bending portion 31b, the screen ratio of the planar portion 31a of the screen 31 can be increased, and the display effect of the electronic device can be improved.

[0145] Reference Figure 2 and Figure 5 In some embodiments, the second circuit board 200 of the circuit board assembly 10 has a main body portion 230 and an extension portion 240, the extension portion 240 and the bending portion 31b of the screen 31 both extend along a third direction (such as the Y direction in the figure), the extension portion 240 of the second circuit board 200 is connected with the bending portion 31b, the third direction is perpendicular to the first direction, and the third direction is perpendicular to the second direction. Figure 2

[0146] In this way, by connecting the extension portion 240 with the bending portion 31b, and by arranging the extension portion 240 and the bending portion 31b of the screen 31 to both extend along the third direction, the connection area between the screen 31 and the second circuit board 200 can be increased, and the signal transmission stability and efficiency between the screen 31 and the second circuit board 200 can be improved.

[0147] Reference Figure 2 and Figure 5 In some embodiments, the electronic device can further include a second battery 40b, the second battery 40b is arranged on the first frame 20a, and the second battery 40b is arranged along the second direction (such as the X direction in the figure) with the extension portion 240. In some embodiments, the second battery 40b and the main body portion 230 of the second circuit board 200 can also be arranged along the third direction. Figure 2

[0148] In this way, by arranging the second battery 40b in the first frame 20a, the first battery 40a and the second battery 40b can be arranged in the electronic device at the same time, which can further increase the battery capacity in the electronic device and improve the endurance of the electronic device.

[0149] Reference Figure 2 and Figure 2 ​​In some embodiments, the electronic device can further include a first audio component 60a disposed on the first frame 20a and connected to the circuit board assembly 10. The first audio component 60a can be configured to input and output audio signals.

[0150] In the second direction (e.g., the X direction), a space 41 is formed between the second battery 40b and the frame of the first frame 20a by the extension 240, and the first audio component 60a has an acoustic cavity 61 located in the space 41. Figure 2

[0151] In this way, compared with the prior art arrangement of arranging the acoustic cavity of the audio component and the battery along the length direction of the electronic device, the present application can make full use of the space in the space 41 by disposing the first audio component 60a on the first frame 20a and disposing the acoustic cavity 61 of the first audio component 60a in the space 41 between the first frame 20a and the second battery 40b. Since the acoustic cavity 61 is disposed in the space 41, the acoustic cavity 61 can avoid occupying the space in the third direction of the electronic device, which can help to increase the length of the second battery 40b in the third direction and increase the volume and capacity of the second battery 40b, thereby increasing the total capacity of the battery of the electronic device and the endurance of the electronic device.

[0152] In some embodiments, the electronic device can include multiple audio components, for example, the electronic device can further include a second audio component 60b disposed on the first frame 20a or the second frame 20b. The second audio component 60b can be connected to the circuit board disposed on the first frame 20a through the circuit board disposed on the second frame 20b.

[0153] Referring to Figure 2 , if the electronic device includes both the first audio component 60a and the second audio component 60b, the first audio component 60a and the second audio component 60b can be arranged in the third direction, for example, the first audio component 60a can be disposed on the bottom of the electronic device as shown in Figure 2 , and the second audio component 60b can be disposed on the top of the electronic device as shown in Figure 2 . The second audio component 60b can also be configured to receive and transmit audio signals.

[0154] Referring to Figure 2 , in some embodiments, the electronic device can further include a first antenna component 70 and a second antenna component 80.

[0155] ​The first antenna assembly 70 can be disposed on the first frame 20a, and the first antenna assembly 70 is connected with the circuit board assembly 10. The second antenna assembly 80 can be disposed on the second frame 20b, and the second antenna assembly 80 can also be connected with the circuit board assembly 10. In some examples, the second antenna assembly 80 can be connected with the circuit board assembly 10 through a circuit board disposed on the second frame 20b, and the circuit board can realize electrical connection and signal transmission between the second antenna assembly 80 and the circuit board assembly 10.

[0156] In this way, by disposing the first antenna assembly 70 on the first frame 20a, disposing the second antenna assembly 80 on the second frame 20b, and connecting the first antenna assembly 70 and the second antenna assembly 80 with the circuit board assembly 10, the mutual interference between the signals of the first antenna assembly 70 and the signals of the second antenna assembly 80 can be reduced, the working stability of the first antenna assembly 70 and the second antenna assembly 80 can be ensured, and the signal transmission stability of the antenna assembly of the electronic device can be improved.

[0157] In some embodiments, the signals received and transmitted by the first antenna assembly 70 and the signals received and transmitted by the second antenna assembly 80 can be different.

[0158] Reference Figure 2 In some embodiments, the first antenna assembly 70 can include a first antenna 71 and a second chip 72. In some examples, the first antenna 71 can be a cellular antenna.

[0159] The first antenna 71 is disposed on the first frame 20a close to one side of the second circuit board 200 of the circuit board assembly 10. When the first frame 20a and the second frame 20b are in the unfolded state, the first antenna 71 is located on the side of the first frame 20a away from the second frame 20b. The second chip 72 is disposed on the second circuit board 200 close to the side of the first antenna 71, and is connected with the first antenna 71.

[0160] In this way, by disposing the first antenna 71 on the side of the first frame 20a close to the second circuit board 200, and disposing the second chip 72 on the second circuit board 200 close to the first antenna 71, the second chip 72 is disposed closer to the first antenna 71, and the signal transmission stability and signal strength between the second chip 72 and the first antenna 71 can be improved.

[0161] Reference Figure 2In some embodiments, the second antenna assembly 80 can include a second antenna 81, a third circuit board 700, and a third chip 82. In some examples, the second antenna 81 can be a non-cellular antenna. The second antenna 81 can function as a WiFi antenna and be used to transmit and receive WiFi mobile hotspot signals. The second antenna 81 can also function as a global positioning system (GPS) antenna and be used to transmit and receive GPS signals. The second antenna 81 can also function as a satellite phone antenna and be used to transmit and receive satellite communication signals. The third chip 82 can be a non-cellular antenna control chip used to control the second antenna 81.

[0162] The second antenna 81 is disposed on the second frame 20b. When the first frame 20a and the second frame 20b are in the unfolded state, the second antenna 81 can be disposed on the side of the second frame 20b that is far away from the first frame 20a, so that the first antenna 71 and the second antenna 81 are far away from each other, and the mutual interference between the first antenna 71 and the second antenna 81 can be reduced.

[0163] The third circuit board 700 is disposed on the second frame 20b and is connected to the first circuit board 100 of the circuit board assembly 10. The third circuit board 700 can be disposed close to the top of the second frame 20b. The third chip 82 is disposed on the third circuit board 700 and is connected to the second antenna 81.

[0164] In this way, by disposing the second antenna 81 on the side of the second frame 20b that is far away from the first frame 20a, and disposing the third chip 82 on the third circuit board 700 that is connected to the first circuit board 100, the system-level chip 300 on the first circuit board 100 can control the third circuit board 700, and the signals of the second antenna 81 can be transmitted to the system-level chip 300 on the first circuit board 100 through the third chip 82 and the third circuit board 700, so that the control of the signals of the second antenna 81 is realized.

[0165] In some embodiments, the first battery 40a can be electrically connected to the third circuit board 700, so that the first battery 40a is electrically connected to the first circuit board 100 of the circuit board assembly 10 through the third circuit board 700.

[0166] Reference Figure 2 In some embodiments, the second antenna assembly 80 can further include a third flexible circuit board 620, one end of the third flexible circuit board 620 being connected to the third circuit board 700, and the other end of the third flexible circuit board 620 being connected to the first circuit board 100.

[0167] In this way, the first circuit board 100 and the third circuit board 700 are connected by the third flexible circuit board 620, the third flexible circuit board 620 has high flexibility and certain foldability, and is not easy to be damaged by bending, so that the normal electrical connection between the first circuit board 100 and the third circuit board 700 can be maintained during the rotation and folding of the first frame 20a and the second frame 20b.

[0168] Reference Figure 2 In some embodiments, the second antenna assembly 80 can further include a fourth flexible circuit board 630. If the third circuit board 700 is arranged apart from the first battery 40a along a third direction (for example, a Y direction in the figure), and the second antenna 81 is arranged apart from the first battery 40a along a second direction (for example, an X direction in the figure), the second antenna 81 is connected to the third circuit board 700 through the fourth flexible circuit board 630. The third direction is perpendicular to the first direction, and the third direction is perpendicular to the second direction. The second direction can be the width direction of the electronic device, and the third direction can be the length direction of the electronic device. Figure 5 Figure 6 In this way, by arranging the third circuit board 700 apart from the first battery 40a along the third direction, the width of the first battery 40a along the second direction can be avoided to be limited by the third circuit board 700, and the second antenna 81 is arranged apart from the first battery 40a along the second direction, so that the first battery 40a and the second antenna 81 have a certain clearance, and the influence of the first battery 40a on the signal transmission and reception of the second antenna 81 is reduced.

[0169] In addition, the second antenna 81 is connected to the third chip 82 on the third circuit board 700 by using the fourth flexible circuit board 630, the fourth flexible circuit board 630 has a small thickness, and the influence of the fourth flexible circuit board 630 on the thickness of the first battery 40a is reduced, so that the influence of the fourth flexible circuit board 630 on the thickness of the electronic device is reduced.

[0170] In addition, the second antenna 81 is connected to the third chip 82 on the third circuit board 700 by using the fourth flexible circuit board 630, the fourth flexible circuit board 630 has a small thickness, and the influence of the fourth flexible circuit board 630 on the thickness of the first battery 40a is reduced, so that the influence of the fourth flexible circuit board 630 on the thickness of the electronic device is reduced.

[0171] Reference Figure 5 , Figure 5 and Figure 5 The circuit board assembly 10 can include a first circuit board 100, a second circuit board 200, a system-level chip 300, and a first electronic device 400.

[0172] In some embodiments, if the electronic device can be a straight phone or a folding phone, the circuit board assembly 10 can be arranged in the straight phone or the folding phone. If the electronic device is a folding phone, the electronic device can include a first frame 20a and a second frame 20b, and the circuit board assembly 10 can be arranged in the first frame 20a.

[0173] ​The first circuit board 100 has a first direction (e.g.) Figure 6 The first surface 110 and the second surface 120 of the first circuit board 100 are opposite each other in the Z direction. The first direction is the thickness direction of the circuit board assembly 10, which is in the same direction as the thickness direction of the electronic device. Electronic devices can be disposed on both the first surface 110 and the second surface 120 of the first circuit board 100. The system-on-a-chip 300 can be disposed on the first surface 110 of the first circuit board 100. In some examples, the first surface 110 of the first circuit board 100 can face the screen assembly 30 of the electronic device, and the second surface 120 of the first circuit board 100 can face the cover plate 90 of the electronic device.

[0174] The second circuit board 200 has a third surface 210 and a fourth surface 220 opposite to each other along a first direction. The third surface 210 and the first surface 110 have the same orientation. The second circuit board 200 and the first circuit board 100 are aligned along a second direction (e.g., ...). Figure 5 The first direction is arranged at intervals in the X direction, and the second direction is perpendicular to the first direction. The second direction can be the width direction of the electronic device.

[0175] In some embodiments, the second circuit board 200 can be electrically connected to the first circuit board 100, and the second circuit board 200 and the first circuit board 100 can be displaced relative to each other. For example, the second circuit board 200 can move relative to the first circuit board 100 in a first direction so that the second circuit board 200 and the first circuit board 100 are offset from each other.

[0176] The first electronic device 400 can be disposed on the third surface 210 of the second circuit board 200, and the thickness of the first electronic device 400 is less than the thickness of the system-on-a-chip 300.

[0177] This application provides a circuit board assembly 10, which consists of two mutually separated first circuit boards 100 and second circuit boards 200. A system-on-a-chip (SoC) 300 is disposed on the first surface 110 of the first circuit board 100, and a first electronic device 400 is disposed on the third surface 210 of the second circuit board 200. The thickness of the SoC 300 is greater than the thickness of the first electronic device 400. Compared with the prior art, which uses a single circuit board, the circuit board assembly 10 of this application can eliminate the gap between the first electronic device 400 and other components caused by the larger thickness of the SoC 300, and can also eliminate the gap between the circuit board assembly 10 and other components in the electronic device in the thickness direction. This reduces the space occupancy rate of the circuit board assembly 10 and improves the space utilization rate inside the electronic device, which helps to reduce the thickness of the electronic device.

[0178] refer to Figure 5 and Figure 6 In some embodiments, along a first direction (e.g.) Figure 5In the second direction (Y direction), the fourth surface 220 of the second circuit board 200 is not higher than the second surface 120 of the first circuit board 100. For example, the fourth surface 220 of the second circuit board 200 is lower than the second surface 120 of the first circuit board 100, or the fourth surface 220 of the second circuit board 200 is flush with the second surface 120 of the first circuit board 100.

[0179] In this way, only when the electronic devices are arranged on the first surface 110 of the first circuit board 100 and the third surface 210 of the second circuit board 200, by making the fourth surface 220 of the second circuit board 200 not higher than the second surface 120 of the first circuit board 100, the maximum thickness of the electronic device can correspond to the area on the first circuit board 100 where the system-level chip 300 is located, thereby reducing the influence of the second circuit board 200 and the first electronic device 400 on the thickness of the electronic device, which can help to thin the electronic device.

[0180] In addition, by making the fourth surface 220 of the second circuit board 200 flush with the second surface 120 of the first circuit board 100, it can be avoided that a gap is formed between the circuit board assembly 10 and the cover plate 90 on the side of the circuit board assembly 10 facing the cover plate 90 due to the uneven height of the first circuit board 100 and the second circuit board 200.

[0181] Reference Figure 5 and Figure 2 In some embodiments, the circuit board assembly 10 can further include a second electronic device 410 and a third electronic device 420. The second electronic device 410 is arranged on the second surface 120 of the first circuit board 100, and the third electronic device 420 is arranged on the fourth surface 220 of the second circuit board 200. In the first direction (reference Figure 5 In the second direction (Z direction), the third electronic device 420 is away from the surface of the second circuit board 200, and is not higher than the second electronic device 410 away from the surface of the first circuit board 100.

[0182] In some examples, the third electronic device 420 away from the surface of the second circuit board 200 is lower than the second electronic device 410 away from the surface of the first circuit board 100, or the third electronic device 420 away from the surface of the second circuit board 200 is flush with the second electronic device 410 away from the surface of the first circuit board 100.

[0183] In some embodiments, the thickness of the second electronic device 410 and the thickness of the third electronic device 420 can be the same. Alternatively, the thickness of the second electronic device 410 and the thickness of the third electronic device 420 can be different, for example, the thickness of the third electronic device 420 can be greater than the thickness of the second electronic device 410.

[0184] The circuit board assembly 10 of this application, by placing the system-on-a-chip 300 and the second electronic device 410 on the first circuit board 100, and placing the first electronic device 400 and the third electronic device 420 on the second circuit board 200, eliminates the gap between the first electronic device 400 and other components in the electronic device in the first direction. This allows the second circuit board 200, the first electronic device 400 and the third electronic device 420 as a whole to be lowered relative to the first circuit board 100, reducing the impact of the third electronic device 420 being higher than the second electronic device 410 on the thickness of the electronic device. This reduces the space occupancy rate of the circuit board assembly 10 and helps to reduce the thickness of the electronic device.

[0185] Furthermore, by ensuring that the surface of the third electronic device 420 facing away from the second circuit board 200 is not higher than the surface of the second electronic device 410 facing away from the first circuit board 100, the maximum thickness of the circuit board assembly 10 can be achieved by making the area on the first circuit board 10 corresponding to the second electronic device 410 and the system-on-a-chip 300, thereby eliminating the influence of the third electronic device 420 on the thickness of the electronic device and contributing to the thinning of the electronic device.

[0186] refer to Figure 6 In some embodiments, along a first direction (e.g.) Figure 5 In the Z-direction, the thickness of the second circuit board 200 is less than the thickness of the first circuit board 100. In this way, by making the thickness of the second circuit board 200 less than the thickness of the first circuit board 100, the space occupancy rate of the second circuit board 200 inside the electronic device can be further reduced, and the impact of the second circuit board 200 in the circuit board assembly 10 on the thickness of the electronic device can be reduced.

[0187] By setting up a first circuit board 100 and a second circuit board 200 that are separated from each other, the thickness of the first circuit board 100 and the second circuit board 200 can be easily adjusted according to the type of electrical components on the first circuit board 100 and the second circuit board 200. Since the system-on-a-chip 300 has high requirements for the working environment, in order to give full play to the performance of the system-on-a-chip 300, the thickness of the first circuit board 100 corresponding to the system-on-a-chip 300 is relatively large. On the other hand, the electronic components on the second circuit board 200 have relatively low requirements for the circuit board. The second circuit board 200 can be made of a circuit board that is thinner than the first circuit board 100, thereby saving material costs and reducing the space occupancy rate of the circuit board assembly 10.

[0188] refer to Figure 6 and Figure 2 In some embodiments, the circuit board assembly 10 may further include a heat sink 500. Along the first direction (e.g.) Figure 5In the first direction, the first circuit board 100 is arranged on the heat dissipation plate 500, and the system-level chip 300 is located between the first circuit board 100 and the heat dissipation plate 500.

[0189] In some embodiments, the heat dissipation plate 500 can also dissipate heat for the second circuit board 200 and the first electronic device 400 arranged on the second circuit board 200, or dissipate heat for the screen assembly 30, or dissipate heat for other heat generating devices in the electronic device, so as to improve the overall heat dissipation performance of the electronic device.

[0190] In this way, in the first direction, by arranging the first circuit board 100 on the heat dissipation plate 500 and locating the system-level chip 300 between the first circuit board 100 and the heat dissipation plate 500, the system-level chip 300 and the first circuit board 100 can be dissipated by the heat dissipation plate 500, the heat dissipation efficiency of the system-level chip 300 and the first circuit board 100 is improved, the system-level chip 300 and the first circuit board 100 are prevented from overheating, the working stability of the system-level chip 300 and the first circuit board 100 is ensured, and the working stability of the circuit board assembly 10 is ensured.

[0191] Reference ​ In some embodiments, in the first direction, the second circuit board 200 is arranged on the heat dissipation plate 500, and the first electronic device 400 is located between the second circuit board 200 and the heat dissipation plate 500.

[0192] In this way, in the first direction, by arranging the second circuit board 200 on the heat dissipation plate 500 and locating the first electronic device 400 between the second circuit board 200 and the heat dissipation plate 500, the first electronic device 400 and the second circuit board 200 can be dissipated by the heat dissipation plate 500, the heat dissipation efficiency of the first electronic device 400 and the second circuit board 200 is improved, the problem of overheating of the first electronic device 400 and the second circuit board 200 is reduced, the working stability of the first electronic device 400 and the second circuit board 200 is ensured, and the working stability of the circuit board assembly 10 is further ensured.

[0193] In addition, by using the first circuit board 100 and the second circuit board 200 separated from each other, and arranging the system-level chip 300 on the first circuit board 100 and the first electronic device 400 on the second circuit board 200, compared with the prior art using one circuit board, the circuit board assembly 10 of the present application can eliminate the gap formed between the first electronic device 400 and the heat dissipation plate 500 due to the large thickness of the system-level chip 300, so that the first electronic device 400 can be closer to the heat dissipation plate 500, the heat dissipation effect of the heat dissipation plate 500 on the first electronic device 400 is further improved, and the problem of overheating of the first electronic device 400 and the second circuit board 200 is reduced.

[0194] Reference ​ and ​ In some embodiments, the first circuit board 100 and the second circuit board 200 are electrically connected by the first flexible circuit board 600.

[0195] In this way, by connecting the first circuit board 100 and the second circuit board 200 by the first flexible circuit board 600, since the first flexible circuit board 600 is thin and has a certain flexibility, the influence of the first flexible circuit board 600 on the thickness of the electronic device can be ignored, thereby avoiding the influence of the first flexible circuit board 600 on the thickness of the electronic device while ensuring the electrical connection between the first circuit board 100 and the second circuit board 200.

[0196] In addition, by connecting the first circuit board 100 and the second circuit board 200 by the first flexible circuit board 600, the relative displacement between the first circuit board 100 and the second circuit board 200 can be avoided, and the relative position of the first circuit board 100 and the second circuit board 200 in the first direction can be adjusted, so as to fully utilize the internal space of the electronic device and improve the utilization rate of the internal space of the electronic device.

[0197] Each embodiment or implementation in the specification is described in a progressive manner, and each embodiment focuses on the difference from other embodiments. The same or similar parts between the embodiments can be referred to each other.

[0198] Generally, the terms should be understood at least in part by context. For example, the term "one or more" as used herein, depending at least in part upon context, can be used to describe any feature, structure, or characteristic in a singular sense or can be used in a plural sense. Similarly, terms such as "a" and "the" can be construed to convey a singular usage or to convey a plural usage, depending at least in part upon context.

[0199] It should be readily understood that "on", "above", and "on top of" in the present disclosure should be interpreted in the broadest manner, such that "on" means not only "directly on" but also "on" with intervening features or layers therebetween, and "above" or "on top of" means not only "above" or "on top of" but also "above" or "on top of" with no intervening features or layers therebetween (i.e., directly on).

[0200] In addition, spatially relative terms, such as "beneath", "below", "lower", "above", "upper" and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientations depicted in the figures. The devices can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0201] Finally, it should be noted that the above-described embodiments are merely intended for describing and illustrating, but not limiting, the technical solutions of the present application; even though the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or equivalently replace some or all of the technical features thereof; and such modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A circuit board assembly (10), characterized by The circuit board assembly (10) comprises: a first circuit board (100) having a first surface (110) and a second surface (120) opposite to each other along a first direction, the first direction being a thickness direction of the circuit board assembly (10); a second circuit board (200) having a third surface (210) and a fourth surface (220) opposite to each other along the first direction, the third surface (210) and the first surface (110) being in the same direction, the second circuit board (200) being arranged apart from the first circuit board (100) along a second direction, the second direction being perpendicular to the first direction; a system on chip (300) arranged on the first surface (110) of the first circuit board (100); a first electronic device (400) arranged on the third surface (210) of the second circuit board (200), the first electronic device (400) having a thickness smaller than a thickness of the system on chip (300).

2. The circuit board assembly (10) according to claim 1, characterized in that The circuit board assembly (10) further comprises: a second electronic device (410) arranged on the second surface (120) of the first circuit board (100); a third electronic device (420) arranged on the fourth surface (220) of the second circuit board (200); along the first direction, the third electronic device (420) is arranged to face away from a surface of the second circuit board (200) and is arranged not higher than a surface of the second electronic device (410) facing away from the first circuit board (100).

3. The circuit board assembly (10) of claim 2, characterized in that along the first direction, the second circuit board (200) has a thickness smaller than a thickness of the first circuit board (100).

4. The circuit board assembly (10) of claim 1, characterized by The circuit board assembly (10) further comprises a heat dissipation plate (500); along the first direction, the first circuit board (100) is arranged on the heat dissipation plate (500), and the system on chip (300) is arranged between the first circuit board (100) and the heat dissipation plate (500).

5. The circuit board assembly (10) of claim 4, characterized in that along the first direction, the second circuit board (200) is arranged on the heat dissipation plate (500), and the first electronic device (400) is arranged between the second circuit board (200) and the heat dissipation plate (500).

6. The circuit board assembly (10) of claim 1, characterized by The first circuit board (100) and the second circuit board (200) are electrically connected by a first flexible circuit board (600).

7. An electronic device, comprising: The circuit board assembly (10) comprises: a first frame (20a); a second frame (20b) rotatably connected with the first frame (20a); a circuit board assembly (10) arranged on the first frame (20a), the circuit board assembly (10) being any one of the circuit board assemblies (10) of claims 1 to 6; a screen assembly (30) arranged on the first frame (20a) and the second frame (20b), a part of the screen assembly (30) on the first frame (20a) being connected with the circuit board assembly (10); a first battery (40a) arranged on the second frame.

8. The electronic device of claim 7, wherein, The screen assembly (30) comprises: a screen (31) arranged on the first frame (20a) and the second frame (20b); A control unit (32) is arranged on the first frame (20a) and located between the screen (31) and the circuit board assembly (10), and is configured to connect the circuit board assembly (10) and the screen (31).

9. The electronic device of claim 8, wherein, The control unit (32) comprises a first chip (300a) and a second flexible circuit board (610). The first chip (300a) and the second flexible circuit board (610) are both located between the screen (31) and the circuit board assembly (10). One end of the first chip (300a) is connected to the screen (31), and the other end of the first chip (300a) is connected to one end of the second flexible circuit board (610), and the other end of the second flexible circuit board (610) is connected to the second circuit board (200) of the circuit board assembly (10).

10. The electronic device of claim 9, wherein, The screen (31) comprises: A flat portion (31a) arranged on the first frame (20a) and the second frame (20b); A bent portion (31b) connected to the portion of the flat portion (31a) located on the first frame (20a); In the first direction, the bent portion (31b) is located between the flat portion (31a) and the circuit board assembly (10), and the first chip (300a) is arranged on the bent portion (31b).

11. The electronic device of claim 10, wherein, The second circuit board (200) has a main body portion (230) and an extension portion (240), and the extension portion (240) and the bent portion (31b) of the screen (31) both extend in a third direction; The extension portion (240) is connected to the bent portion (31b); The third direction is perpendicular to the first direction, and the third direction is perpendicular to the second direction.

12. The electronic device of claim 11, wherein, The electronic device further comprises a second battery (40b); The second battery (40b) is arranged on the first frame (20a), and the second battery (40b) is arranged along the second direction with the extension portion (240).

13. The electronic device of claim 12, wherein, The electronic device further comprises a first audio assembly (60a); The first audio assembly (60a) is arranged on the first frame (20a); In the second direction, a gap (41) is formed between the second battery (40b) and the frame of the first frame (20a) through the extension portion (240); The first audio assembly (60a) has an acoustic cavity (61), and the acoustic cavity (61) is located in the gap (41).

14. The electronic device of claim 7, wherein, The electronic device further comprises: A first antenna assembly (70) arranged on the first frame (20a) and connected to the circuit board assembly (10); A second antenna assembly (80) arranged on the second frame (20b) and connected to the circuit board assembly (10).

15. The electronic device of claim 14, wherein, The first antenna assembly (70) comprises: A first antenna (71) arranged on one side of the first frame (20a) close to the second circuit board (200) of the circuit board assembly (10); A second chip (72) is arranged on the second circuit board (200) near a side of the first antenna (71) and connected with the first antenna (71).

16. The electronic device of claim 14, wherein, The second antenna assembly (80) comprises: A second antenna (81) arranged on the second frame (20b); A third circuit board (700) arranged on the second frame (20b) and connected with the first circuit board (100) of the circuit board assembly (10); A third chip (82) arranged on the third circuit board (700) and connected with the second antenna (81).

17. The electronic device of claim 16, wherein, The second antenna assembly (80) further comprises: A third flexible circuit board (620) connected with the third circuit board (700) at one end and connected with the first circuit board (100) at the other end.

18. The electronic device of claim 16, wherein, The second antenna assembly (80) further comprises a fourth flexible circuit board (630); The third circuit board (700) and the first battery (40a) are arranged along a third direction; The second antenna (81) and the first battery (40a) are arranged along a second direction, and the second antenna (81) is connected with the third circuit board (700) through the fourth flexible circuit board (630); The third direction is perpendicular to the first direction, and the third direction is perpendicular to the second direction.

19. The electronic device of any of claims 7-18, wherein, The electronic device further comprises: A cover plate (90), and the circuit board assembly (10) is located between the cover plate (90) and the screen assembly (30); Part of the cover plate (90) is arranged on the first frame (20a) and covers the circuit board assembly (10), and the other part is arranged on the second frame (20b) and covers the first battery (40a).

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