Heat dissipation devices and electronic equipment

Abstract

This application provides a heat dissipation device and electronic device, including: a condenser having an internally vacuumed and sealed cavity; a liquid pipe containing a liquid working fluid, one end of which is connected to the condenser; a compensation chamber having an internally vacuumed and sealed cavity, through which the liquid pipe passes and communicates with the compensation chamber, and a liquid-absorbing core covering the surface of the liquid pipe within the compensation chamber; an evaporator having an internally vacuumed and sealed cylindrical structure, comprising a vapor channel, a first capillary core, and a second capillary core stacked sequentially from the outer wall surface of the cylindrical structure to the central axis, the other end of which penetrates a portion of the evaporator, and the second capillary core covering a portion of the surface of the liquid pipe; a gas pipe, one end of which is connected to the vapor channel, and the other end of which is connected to the condenser; and a heat-conducting plate covering the outer surface of the evaporator. The heat dissipation device and electronic device provided in this application embodiment at least improve the heat dissipation efficiency of electronic devices.

Description

Technical Field

[0001] This application relates to the field of thermal engineering, and in particular to a heat dissipation device and electronic device. Background Technology

[0002] With the rapid development of electronics and power technologies, heat dissipation of electronic components has become one of the key issues restricting the operating speed and output power of electronic devices. The reliability and lifespan of electronic devices are closely related to their operating temperature. The higher the integration level of the chip, the more heat it generates. If this heat cannot be dissipated in time, the reliability of the electronic device will be greatly reduced, and it may even fail to operate normally.

[0003] Due to the limitations of the internal structure of electronic devices, it is not convenient to use the method of heat dissipation for each heat-generating electronic component in place, or when there are a large number of heat-generating electronic components, the traditional method of heat dissipation in place is not suitable. Therefore, there is a need to provide a more efficient heat dissipation device to improve the heat dissipation efficiency of electronic devices. Summary of the Invention

[0004] This application provides a heat dissipation device and an electronic device, which at least helps to improve the heat dissipation efficiency of the electronic device.

[0005] According to some embodiments of this application, one aspect of this application provides a heat dissipation device, including: a condenser having an internally vacuumed and sealed cavity; a liquid pipe containing a liquid working fluid that vaporizes upon heating and condenses upon cooling, one end of the liquid pipe being connected to the condenser; a compensation chamber having an internally vacuumed and sealed cavity, the liquid pipe penetrating and communicating with the compensation chamber, the compensation chamber containing a liquid-absorbing core covering the surface of the liquid pipe; an evaporator having an internally vacuumed and sealed cylindrical structure, the evaporator including a vapor channel, a first capillary core, and a second capillary core stacked sequentially from the outer wall surface of the cylindrical structure to the central axis, the other end of the liquid pipe penetrating a portion of the evaporator, and the second capillary core wrapping a portion of the surface of the liquid pipe, wherein the second capillary core is connected to the liquid-absorbing core; a gas pipe, one end of the gas pipe being connected to the vapor channel, and the other end of the gas pipe being connected to the end of the condenser away from the liquid pipe; and a heat-conducting plate covering the outer surface of the evaporator.

[0006] In some embodiments, the heat-conducting plate includes: a heat spreader, one side surface of which is used to contact a heat source; and a saddle, located on the other side surface of the heat spreader, the saddle having a circular perforation through which an evaporator is placed within the saddle.

[0007] In some embodiments, the equivalent thermal conductivity of the heat exchanger is 3000–10000 W / (mK).

[0008] In some embodiments, the diameter of the pores of the first capillary is smaller than the diameter of the pores of the second capillary.

[0009] In some embodiments, the heat dissipation device further includes a secondary heat dissipation device, which includes a first sub-liquid pipe, a secondary evaporator, a sub-gas pipe, a secondary condenser, and a second sub-liquid pipe connected in sequence. The first sub-liquid pipe is connected to the end of the liquid pipe near the condenser, and the second sub-liquid pipe is connected to the end of the liquid pipe near the compensation chamber.

[0010] In some embodiments, the secondary heat dissipation device is connected in parallel with the liquid pipe, or the secondary heat dissipation device is connected in series with the liquid pipe.

[0011] In some embodiments, there are multiple secondary heat dissipation devices, which are connected in sequence, and the first sub-liquid pipe of an adjacent secondary heat dissipation device is connected to the second sub-liquid pipe of another secondary heat dissipation device.

[0012] In some embodiments, there are multiple secondary heat dissipation devices, and the first sub-liquid pipe of each secondary heat dissipation device is connected to the end of the liquid pipe near the condenser, and the second sub-liquid pipe of each secondary heat dissipation device is connected to the end of the liquid pipe near the compensation chamber.

[0013] In some embodiments, the condenser has a plate-like structure.

[0014] In some embodiments, the sheet structure of the condenser includes a continuously bent multi-layered sub-sheet structure.

[0015] In some embodiments, the condenser has multiple heat dissipation fins.

[0016] In some embodiments, the condenser further includes auxiliary heat sinks, which are welded onto the surface of the heat sink fins in the direction of liquid flow.

[0017] In some embodiments, the condenser further includes a liquid cooling plate that covers the outer surface of the condenser cavity.

[0018] In some embodiments, the compensation chamber and the evaporator are an integral structure, or the compensation chamber and the evaporator are separate structures.

[0019] In some embodiments, the contact angle between the liquid working fluid and the first capillary wick, the second capillary wick, or the liquid absorption wick is less than 40°.

[0020] In some embodiments, the material of the second capillary core is the same as that of the liquid-absorbing core.

[0021] In some embodiments, the heat dissipation device further includes a plurality of heat sources, each of which is in contact with a heat-conducting plate.

[0022] According to some embodiments of this application, another aspect of this application provides an electronic device that uses a heat dissipation device according to any of the above embodiments for heat dissipation.

[0023] The technical solution provided in this application has at least the following advantages:

[0024] The heat dissipation device provided in this application includes a condenser, a liquid pipe, a compensation chamber, an evaporator, and a gas pipe connected in sequence. The liquid pipe contains a liquid working fluid that vaporizes upon heating and condenses upon cooling, thus forming a closed-loop cooling system. The outer surface of the evaporator is covered with a heat-conducting plate. When the heat-conducting plate is in contact with a heat source, the outer surface temperature of the evaporator is high. Therefore, the liquid working fluid in the liquid pipe of the evaporator vaporizes as it permeates through the second and first capillary wicks to the outer wall of the cylindrical structure. Driven by the capillary force of the second and first capillary wicks, the liquid working fluid in the liquid pipe is continuously transported into the evaporator. The vaporized fluid flows to the condenser via the gas pipe. Further, after reaching the condenser, the vaporized fluid cools to a liquid state due to the condensing effect of the condenser. As the subsequent vaporized fluid continues to advance, it promotes the flow of the liquid working fluid through the liquid pipe to the compensation chamber. The liquid suction wick in the compensation chamber provides capillary force to the liquid working fluid, preventing it from flowing back into the condenser, thereby further supplying liquid working fluid to the evaporator.

[0025] Through the repeated vaporization and condensation of the liquid working fluid in the heat dissipation device, circulation of the liquid working fluid within the device can be achieved. Since the evaporator has a cylindrical structure, the liquid working fluid in the liquid pipe, driven by the capillary forces of the second and first capillary wicks, can achieve unidirectional flow of the gaseous working fluid. Due to the pressure difference generated by the capillary wicks, the gaseous working fluid can only flow towards the condenser along the gas pipe, eliminating the need for external driving force to drive the circulation process. Furthermore, the heat-conducting plate covering the outer surface of the evaporator increases the contact area between the evaporator and the heat source, thereby transferring the high heat flux density from the heat source to the cylindrical evaporator, reducing the heat flux density in the heat source. The heat-conducting plate can be configured according to the shape of the heat source to match the cylindrical evaporator structure, eliminating the need to modify the evaporator structure for different heat source shapes. Attached Figure Description

[0026] One or more embodiments are illustrated by way of example with corresponding pictures in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Unless otherwise stated, the pictures in the accompanying drawings do not constitute a limitation on scale. In order to more clearly illustrate the technical solutions in the embodiments of this application or in the conventional technology, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of the structure of a first heat dissipation device provided in an embodiment of this application;

[0028] Figure 2 This is a schematic diagram of the structure of a second heat dissipation device provided in an embodiment of this application;

[0029] Figure 3 This is a three-dimensional structural diagram of a heat dissipation device provided in an embodiment of this application;

[0030] Figure 4 This is a schematic diagram of the structure of a third heat dissipation device provided in an embodiment of this application;

[0031] Figure 5 This is a schematic diagram of the structure of a fourth heat dissipation device provided in an embodiment of this application;

[0032] Figure 6 This is a cross-sectional schematic diagram of an evaporator provided in one embodiment of this application;

[0033] Figure 7 This is a schematic diagram of the structure of a heat-conducting plate provided in one embodiment of this application;

[0034] Figure 8 This is a schematic diagram of the structure of a fifth heat dissipation device provided in an embodiment of this application;

[0035] Figure 9 This is a schematic diagram of the structure of a sixth heat dissipation device provided in an embodiment of this application;

[0036] Figure 10 This is a schematic diagram of the structure of a secondary heat dissipation device provided in an embodiment of this application;

[0037] Figure 11 This application provides a schematic diagram of a structure connecting multiple secondary heat dissipation devices to liquid pipes according to an embodiment of the present application.

[0038] Figure 12 A schematic diagram of another structure for connecting multiple secondary heat dissipation devices to liquid pipes, provided in an embodiment of this application;

[0039] Figure 13 This application provides a schematic diagram of a structure in which multiple heat sources are in contact with a heat-conducting plate, according to one embodiment of the present application.

[0040] Figure 14 This is a schematic diagram of a structure in which multiple heat sources are in contact with a secondary evaporator, according to an embodiment of this application. Detailed Implementation

[0041] According to some embodiments of this application, one aspect of this application provides a heat dissipation device, which at least helps to improve the heat dissipation efficiency of electronic devices.

[0042] The embodiments of this application will now be described in detail with reference to the accompanying drawings. However, those skilled in the art will understand that many technical details have been provided in the embodiments of this application to facilitate a better understanding of the application. However, the technical solutions claimed in this application can be implemented even without these technical details and various variations and modifications based on the following embodiments.

[0043] Figure 1 This is a schematic diagram of the structure of a first heat dissipation device provided in an embodiment of this application. Figure 2 This is a schematic diagram of the structure of a second heat dissipation device provided in an embodiment of this application. Figure 3 This is a three-dimensional structural diagram of a heat dissipation device provided in an embodiment of this application. Figure 4 This is a schematic diagram of the structure of a third heat dissipation device provided in an embodiment of this application. Figure 5 This is a schematic diagram of the structure of a fourth heat dissipation device provided in an embodiment of this application. Figure 6 This is a cross-sectional schematic diagram of an evaporator provided in one embodiment of this application. Figure 7 This is a schematic diagram of the structure of a heat-conducting plate according to an embodiment of this application. Figure 8 This is a schematic diagram of the structure of a fifth heat dissipation device provided in an embodiment of this application. Figure 9 This is a schematic diagram of the structure of the sixth heat dissipation device provided in an embodiment of this application. Figure 10 This is a schematic diagram of a secondary heat dissipation device provided in an embodiment of this application. Figure 11 This is a schematic diagram of a structure in which multiple secondary heat dissipation devices are connected to liquid pipes, according to an embodiment of this application. Figure 12 This is a schematic diagram illustrating the connection between multiple secondary heat dissipation devices and liquid pipes according to an embodiment of this application. Figure 13 This is a schematic diagram of a structure in which multiple heat sources are in contact with a heat-conducting plate, according to an embodiment of this application. Figure 14 This is a schematic diagram illustrating a structure in which multiple heat sources are in contact with a secondary evaporator, according to an embodiment of this application. The heat dissipation device provided in this embodiment will be described in detail below with reference to the accompanying drawings:

[0044] refer to Figures 1 to 14The heat dissipation device includes: a condenser 101, which has an internally vacuumed and sealed cavity; a liquid pipe 102, which contains a liquid working fluid 112 that vaporizes upon heating and condenses upon cooling, one end of which is connected to the condenser 101; a compensation chamber 103, which has an internally vacuumed and sealed cavity, through which the liquid pipe 102 passes and communicates with the compensation chamber 103, and within the compensation chamber 103 is a liquid-absorbing core 113 covering the surface of the liquid pipe 102; and an evaporator 104, which is an internally vacuumed and sealed cylindrical structure, comprising a cylindrical... A vapor channel 114, a first capillary wick 124, and a second capillary wick 134 are sequentially stacked on the outer wall of the column structure along the central axis. The other end of the liquid pipe 102 passes through part of the evaporator 104, and the second capillary wick 134 wraps around part of the surface of the liquid pipe 102. The second capillary wick 134 is connected to the liquid suction core 113. A gas pipe 105 is connected at one end to the vapor channel 114 and at the other end to the end of the condenser 101 away from the liquid pipe 102. A heat-conducting plate 106 covers the outer surface of the evaporator 104.

[0045] The heat dissipation device provided in this application embodiment includes a condenser 101, a liquid pipe 102, a compensation chamber 103, an evaporator 104, and a gas pipe 105 connected in sequence. The liquid pipe 102 contains a liquid working medium 112 that vaporizes upon heating and condenses upon cooling, thus forming a closed-loop cooling system. The outer surface of the evaporator 104 is covered with a heat-conducting plate 106. When the heat-conducting plate 106 is in contact with a heat source, the outer surface temperature of the evaporator 104 is high. Therefore, the liquid working medium 112 in the liquid pipe 102 of the evaporator 104 vaporizes when it sequentially permeates the second capillary wick 134 and the first capillary wick 124 to the outer wall of the cylindrical structure. Driven by the capillary force of the second capillary wick 134 and the first capillary wick 124, the liquid working medium 112 in the liquid pipe 102 is continuously transported to the evaporator 104, and the vaporized medium is then transported via the gas pipe 105. Pipe 105 flows into condenser 101; further, after the vaporized substance reaches condenser 101, due to the condensing effect of condenser 101, the vaporized substance is cooled to a liquid working substance 112 state. As the subsequent vaporized substance continues to advance, it promotes the liquid working substance 112 to flow through liquid pipe 102 to compensation chamber 103. The liquid suction core 113 in compensation chamber 103 provides capillary force to the liquid working substance 112, so that the liquid working substance 112 cannot flow back into condenser 101, thereby further supplying liquid working substance 112 into evaporator 104.

[0046] Through the repeated vaporization and condensation process of the liquid working medium 112 in the heat dissipation device, circulation of the liquid working medium 112 within the heat dissipation device can be achieved. Since the evaporator 104 has a cylindrical structure, the liquid working medium 112 in the liquid pipe 102, driven by the capillary force of the second capillary wick 134 and the first capillary wick 124, can achieve unidirectional flow of the gas working medium. Due to the pressure difference generated by the capillary wicks, the gas working medium can only flow along the gas pipe 105 towards the condenser 101, without the need for external driving force to drive the circulation process. Furthermore, the heat-conducting plate 106 covering the outer surface of the evaporator 104 can increase the contact area between the evaporator 104 and the heat source, thereby transferring the high heat flux density from the heat source to the cylindrical evaporator 104, reducing the heat flux density in the heat source. The heat-conducting plate 106 can be configured according to the shape of the heat source to match the cylindrical evaporator 104, eliminating the need to modify the structure of the evaporator 104 for different heat source shapes.

[0047] It is understandable that, due to the high temperature of the evaporator 104, some of the vaporized fluid may be pressurized and flow back into the compensation chamber 103. Therefore, the compensation chamber 103 can serve as a buffer device between the liquid pipe 102 and the evaporator 104 to prevent the vaporized fluid and the liquid working fluid 112 from colliding in the liquid pipe 102.

[0048] In some embodiments, reference Figure 2 and Figure 3 The condenser 101 may have multiple heat dissipation fins 111. The heat dissipation fins 111 can increase the heat dissipation area of ​​the vaporized fluid in the condenser 101, which is beneficial to promoting the condensation of the vaporized fluid into a liquid working fluid 112.

[0049] It should be noted that, in Figure 2 Taking the example of 8 heat dissipation fins 111 on the condenser 101, this does not constitute a limitation on the number of heat dissipation fins 111 on the condenser 101. In some embodiments, the number of heat dissipation fins 111 on the condenser 101 can be 5, 10, or 16, etc., and the specific number of heat dissipation fins 111 on the condenser 101 can be set according to the actual situation.

[0050] In some embodiments, auxiliary heat sinks can be welded between the heat dissipation fins. The auxiliary heat sinks can be made of thin sheets with good thermal conductivity by bending, and welded to the surface of the heat dissipation fins in the direction of coolant flow to further increase the heat dissipation area and improve the cooling efficiency of the condenser.

[0051] In some embodiments, the condenser may be a plate-like structure, which can increase the external surface area of ​​the condenser cavity and improve the heat dissipation capacity of the condenser. In some embodiments, the plate-like structure may be a single-layer structure; in other embodiments, refer to... Figure 3The sheet structure of condenser 101 may include a multi-layered sub-sheet structure 131 that is continuously bent, which can further increase the cooling area of ​​condenser 101 and improve the condensing effect of condenser.

[0052] It should be noted that, in Figure 3 In this example, the sheet structure of the condenser 101 includes three continuously bent sub-sheet structures 131, which does not constitute a limitation on the number of sub-sheet structures 131. In some embodiments, the sheet structure of the condenser may include four, five, or ten continuously bent sub-sheet structures, etc.

[0053] Understandably, reference Figure 3 When the condenser 101 has a plate-like structure, the heat dissipation fins 111 can be vertically arranged on the surface of the plate-like structure, which can better improve the heat dissipation effect of the condenser 101.

[0054] In some embodiments, reference Figure 5 The condenser 101 also includes a liquid cooling plate 121, which covers the outer surface of the cavity of the condenser 101. The liquid cooling plate 121 can improve the condensation effect of the condenser 101, thereby making it easier to cool the vaporized fluid delivered to the condenser 101 through the gas pipe 105 to the state of liquid working fluid 112.

[0055] It should be noted that, in Figure 5 In this example, the liquid cooling plate 121 only covers a portion of the outer surface of the cavity of the condenser 101, which does not constitute a limitation on the positional relationship between the liquid cooling plate 121 and the cavity of the condenser 101. In some embodiments, the liquid cooling plate 121 may cover the entire outer surface of the cavity of the condenser 101.

[0056] For the liquid tube 102, since the heat dissipation device is pressurized to lower the boiling point of the liquid working fluid 112, which is beneficial to improving the vaporization and condensation rate of the liquid working fluid 112, the liquid tube 102 can be made of high-strength materials such as copper, aluminum alloy, or stainless steel. The liquid working fluid 112 in the liquid tube 102 can be a condensing fluid such as water, ethanol, acetone, or alternative Freon. To facilitate the penetration of the liquid working fluid 112 into the wick 113, the second capillary wick 134, or the first capillary wick 124, a liquid working fluid with good wettability can be used. The wettability can be determined by the contact angle between the liquid working medium 112 and the absorbent core 113, the second capillary core 134 or the first capillary core 124. If the contact angle is greater than or equal to 40°, the liquid working medium 112 cannot penetrate into the absorbent core 113, the second capillary core 134 or the first capillary core 124. Therefore, the contact angle must be less than 40°, for example, the contact angle can be 5° or 10°.

[0057] The compensation chamber 103 is connected to the liquid pipe 102 and has a liquid-absorbing core 113 covering the surface of the liquid pipe 102. The compensation chamber 103 can serve as a buffer device between the evaporator 104 and the liquid pipe 102.

[0058] In some embodiments, the liquid-absorbing core 113 may be composed of multiple layers of welded and stacked metal wire mesh. Due to the abundant pores in the metal wire mesh and itself, a good liquid adsorption effect can be achieved. In some embodiments, the liquid-absorbing core 113 may also be a porous liquid-absorbing core manufactured by powder sintering process. This liquid-absorbing core 113 relies on the capillary force generated by its internal and surface micropores to adsorb the liquid working fluid 112.

[0059] It should be noted that, in Figures 1 to 4 In these embodiments, the compensation chamber 103 and the evaporator 104 are each considered as independent structures. In other embodiments, refer to... Figure 5 The compensation chamber 103 and the evaporator 104 can also be an integrated structure.

[0060] In some embodiments, the material of the suction core 113 can be the same as that of the second capillary core 134, so that the suction core 113 and the second capillary core 134 can be formed in the same process step. In other embodiments, the materials of the suction core 113 and the second capillary core 134 can be different to prevent the gaseous working fluid in the evaporator 104 from flowing back into the compensation chamber 103.

[0061] For the evaporator 104, the evaporator 104 has a cylindrical structure. The liquid pipe 102 passes through part of the evaporator 104, and the surface of the liquid pipe 102 is sequentially covered with a second capillary 134 and a first capillary 124. The liquid working medium 112 in the liquid pipe 102 can be directly adsorbed by the second capillary 134 on the outer surface of the liquid pipe 102 and transferred to the first capillary 124, and further vaporized in the vapor channel 114.

[0062] Both the second capillary 134 and the first capillary 124 can be composed of multiple layers of welded and stacked metal wire mesh. Due to the abundant porosity of the metal wire mesh, a good liquid adsorption effect can be achieved. In some embodiments, both the second capillary 134 and the first capillary 124 can be porous capillary wicks manufactured using a powder sintering process.

[0063] In some embodiments, the diameter of the pores in the first capillary wick 124 is smaller than the diameter of the pores in the second capillary wick 134. It is understood that the capillary force of the capillary wick is inversely proportional to the diameter of its pores, and the resistance encountered by the liquid working medium 112 during reflux is also inversely proportional to the diameter of the capillary wick pores; that is, the smaller the diameter of the capillary wick pores, the stronger the capillary force and the greater the reflux resistance of the liquid working medium 112. Therefore, setting the diameter of the pores in the first capillary wick 124 to be smaller than the diameter of the pores in the second capillary wick 134 facilitates the unidirectional flow of the liquid working medium 112 from the liquid pipe 102 through the second capillary wick 134 to the first capillary wick 124, preventing the reflux of the liquid working medium 112. Furthermore, a smaller diameter of the pores in the first capillary wick 124 increases the heating area of ​​the liquid working medium 112, thereby promoting the vaporization of the liquid working medium 112, which then flows through the vapor channel 114 into the gas pipe 105.

[0064] Understandably, reference Figure 6 The second capillary wick 134 covers the surface of the liquid tube 102, thereby facilitating the adsorption of the liquid working medium 112 within the liquid tube 102 in multiple directions. The first capillary wick 124 covers the surface of the second capillary wick 134, allowing the liquid working medium 112 to further diffuse towards the outer wall of the cylindrical structure. This gradually increases the contact area between the liquid working medium 112 and the external heat source, resulting in a faster vaporization rate. Consequently, the liquid working medium 112 flows to the gas tube 105 via the vapor channel 114 near the outer wall of the cylindrical structure. Some of the liquid working medium 112 may vaporize due to heat during its flow from the second capillary wick 134 to the first capillary wick 124, potentially forming multiple vapor pores 144 within the second capillary wick 134.

[0065] In some embodiments, reference Figure 7 The heat-conducting plate 106 includes: a heat spreader 116, one side of which is used to contact a heat source; and a saddle 126, located on the other side of the heat spreader 116. The saddle 126 has a circular perforation 136, through which an evaporator (not shown) passes and is placed inside the saddle 126. In this way, the heat source can be contacted through the flat plate structure of the heat spreader 116, thereby transferring heat to the saddle 126, and then to the evaporator via the saddle 126. By designing saddles 126 and heat spreaders 116 of different shapes, the cylindrical evaporator can be adapted to different heat dissipation environments without requiring structural modifications to the evaporator for different heat dissipation scenarios.

[0066] In some embodiments, the saddle 126 can be made of copper, aluminum, or a copper-aluminum alloy. In some embodiments, the equivalent thermal conductivity of the heat spreader 116 can be 3000–10000 W / (mK), for example, the thermal conductivity of the heat spreader 116 can be 3000 W / (mK), 4560 W / (mK), 5000 W / (mK), 8500 W / (mK), or 10000 W / (mK). The higher the thermal conductivity of the heat spreader 116, the better the thermal conductivity and the lower the thermal resistance. For the gas pipe 105, since the heat dissipation device is pressurized to lower the boiling point of the liquid working fluid 112, it is beneficial to improve the vaporization and condensation rate of the liquid working fluid 112. The gas pipe 105 can be made of high-strength materials such as copper, aluminum alloy, or stainless steel.

[0067] In some embodiments, reference Figure 8 and Figure 9 The heat dissipation device may further include a secondary heat dissipation device 107, which includes a first sub-liquid pipe 117, a secondary evaporator 127, a sub-gas pipe 137, a secondary condenser 147, and a second sub-liquid pipe 157 connected in sequence. The first sub-liquid pipe 117 is connected to the end of the liquid pipe 102 near the condenser 101, and the second sub-liquid pipe 157 is connected to the end of the liquid pipe 102 near the compensation chamber 103.

[0068] refer to Figure 8 In some embodiments, the secondary heat dissipation device 107 may be connected in series with the liquid pipe 102; see reference. Figure 9 In other embodiments, the secondary heat dissipation device 107 may also be connected in parallel with the liquid pipe 102. The secondary heat dissipation device 107 can be adapted to situations where multiple heat sources are located in different positions, and the secondary heat dissipation device 107 can be driven by its own circulation system to promote cooling. When the secondary heat dissipation device 107 is provided, the power consumption of the heat source corresponding to the secondary heat dissipation device 107 should be lower than the power consumption of the heat source corresponding to the heat dissipation device, so as to maintain the driving capability of the heat dissipation device greater than that of the secondary heat dissipation device 107.

[0069] For the secondary heat dissipation device 107, refer to Figure 10 The secondary evaporator 127 in the secondary heat dissipation device 107 can adopt a flat plate structure, in which internal flow boiling occurs. The flat plate structure of the secondary evaporator 127 can be connected to the first sub-liquid pipe 117 and the sub-gas pipe 137 at both ends respectively. The secondary condenser 147 in the secondary heat dissipation device 107 can have multiple fins to improve the condensation effect of the secondary condenser 147.

[0070] In some embodiments, reference Figure 11The number of secondary heat dissipation devices 107 can be multiple, and these devices are connected sequentially. The first sub-liquid pipe 117 of adjacent secondary heat dissipation devices 107 is connected to the second sub-liquid pipe 157 of another secondary heat dissipation device 107. In other words, multiple secondary heat dissipation devices 107 are connected in series, with the end devices connected to both ends of the liquid pipe 102. This allows the heat dissipation device to simultaneously drive multiple secondary heat dissipation devices 107 to dissipate heat from multiple heat sources at different locations. It is understood that, referring to the connection method of a single secondary heat dissipation device 107 to the liquid pipe 102, multiple secondary heat dissipation devices 107 connected in series can be connected in parallel or in series with the liquid pipe 102, for example, referring to... Figure 11 In (a), multiple secondary heat dissipation devices 107 connected in series are connected in parallel with the liquid pipe 102, or refer to reference. Figure 11 In (b), multiple secondary heat dissipation devices 107 connected in series are connected in series with liquid pipe 102.

[0071] In some embodiments, reference Figure 12 The number of secondary heat dissipation devices 107 can be multiple. The first sub-liquid pipe 117 of each secondary heat dissipation device 107 is connected to the end of the liquid pipe 102 near the condenser 101, and the second sub-liquid pipe 157 of each secondary heat dissipation device 107 is connected to the end of the liquid pipe 102 near the compensation chamber 103. That is, multiple secondary heat dissipation devices 107 are connected in parallel, and each secondary heat dissipation device 107 is connected to both ends of the liquid pipe 102. In this way, multiple secondary heat dissipation devices 107 can be driven simultaneously to dissipate heat from multiple heat sources at different locations. It can be understood that, referring to the connection method of a single secondary heat dissipation device 107 to the liquid pipe 102 described above, multiple secondary heat dissipation devices 107 can all be connected in parallel with the liquid pipe 102, or connected in parallel. For example, referring to... Figure 12 In (a), multiple secondary heat dissipation devices 107 can all be connected in parallel with the liquid pipe 102, or refer to Figure 12 In (b), multiple secondary heat dissipation devices 107 can all be connected in series with liquid pipe 102, that is, liquid pipe 102 serves as the main liquid pipe of the first sub-liquid pipe 117 and the second sub-liquid pipe 157 of multiple secondary heat dissipation devices 107.

[0072] It should be noted that, in Figure 11 and Figure 12 In this example, three secondary heat dissipation devices 107 are used as an example, which does not constitute a limitation on the number of secondary heat dissipation devices 107. In some embodiments, the number of secondary heat dissipation devices 107 may be two, five, or eight, etc. In order to ensure that the driving capability of the heat dissipation device is sufficient to drive multiple secondary heat dissipation devices 107, the power consumption of the heat source corresponding to each secondary heat dissipation device 107 should be lower than the power consumption of the heat source corresponding to the heat dissipation device.

[0073] In some embodiments, reference Figure 13 The heat dissipation device may further include multiple heat sources 108, each of which is in contact with the heat-conducting plate 106. In this way, multiple heat sources 108 in the same location can share the same evaporator 104 for heat dissipation, thereby improving the heat dissipation capacity of the evaporator 104.

[0074] refer to Figure 14 It is understandable that the surface of the secondary evaporator 127 of the secondary heat dissipation device 107 can also contact multiple heat sources 108 at the same time, thereby improving the heat dissipation capacity of the secondary evaporator 127.

[0075] According to some embodiments of this application, another aspect of this application provides an electronic device that uses the heat dissipation device of any of the above embodiments to dissipate heat, thereby improving the heat dissipation efficiency of the electronic device.

[0076] In some embodiments, an electronic device refers to a device composed of electronic components such as integrated circuits, transistors, and vacuum tubes, which functions using electronic technology (including) software. This includes electronic computers and robots, numerical control (NC) or programmable control (CNC) systems controlled by electronic computers. Examples of electronic devices include computers, air conditioners, refrigerators, washing machines, microwave ovens, printers, fax machines, or all-in-one machines.

[0077] The heat dissipation device and electronic device provided in this application embodiment include a condenser 101, a liquid pipe 102, a compensation chamber 103, an evaporator 104, and a gas pipe 105 connected in sequence. The liquid pipe 102 contains a liquid working medium 112 that vaporizes upon heating and condenses upon cooling, thus forming a closed-loop cooling system. The outer surface of the evaporator 104 is covered with a heat-conducting plate 106. When the heat-conducting plate 106 is in contact with a heat source, the outer surface temperature of the evaporator 104 is high. Therefore, the liquid working medium 112 in the liquid pipe 102 of the evaporator 104 vaporizes when it sequentially permeates the second capillary wick 134 and the first capillary wick 124 to the outer wall of the cylindrical structure. Driven by the capillary force of the second capillary wick 134 and the first capillary wick 124, the liquid working medium 112 in the liquid pipe 102 is continuously transported to the evaporator 104, and the vaporized medium is then transported via the gas pipe 105. Pipe 105 flows into condenser 101; further, after the vaporized substance reaches condenser 101, due to the condensing effect of condenser 101, the vaporized substance is cooled to a liquid working substance 112 state. As the subsequent vaporized substance continues to advance, it promotes the liquid working substance 112 to flow through liquid pipe 102 to compensation chamber 103. The liquid suction core 113 in compensation chamber 103 provides capillary force to the liquid working substance 112, so that the liquid working substance 112 cannot flow back into condenser 101, thereby further supplying liquid working substance 112 into evaporator 104.

[0078] Through the repeated vaporization and condensation process of the liquid working medium 112 in the heat dissipation device, circulation of the liquid working medium 112 within the heat dissipation device can be achieved. Since the evaporator 104 has a cylindrical structure, the liquid working medium 112 in the liquid pipe 102, driven by the capillary force of the second capillary wick 134 and the first capillary wick 124, can achieve unidirectional flow of the gas working medium. Due to the pressure difference generated by the capillary wicks, the gas working medium can only flow along the gas pipe 105 towards the condenser 101, without the need for external driving force to drive the circulation process. Furthermore, the heat-conducting plate 106 covering the outer surface of the evaporator 104 can increase the contact area between the evaporator 104 and the heat source, thereby transferring the high heat flux density from the heat source to the cylindrical evaporator 104, reducing the heat flux density in the heat source. The heat-conducting plate 106 can be configured according to the shape of the heat source to match the cylindrical evaporator 104, eliminating the need to modify the structure of the evaporator 104 for different heat source shapes.

[0079] Those skilled in the art will understand that the above embodiments are specific implementations of this application, and in practical applications, various changes can be made in form and detail without departing from the spirit and scope of this application.

Claims

1. A heat dissipation device, characterized in that, include: A condenser having an internally vacuumed and sealed cavity; A liquid tube containing a liquid working fluid that vaporizes when heated and condenses when cooled, with one end of the liquid tube connected to the condenser; A compensation chamber having an internally vacuumed and sealed cavity, through which a liquid tube passes and communicates with the compensation chamber, and within the compensation chamber is a liquid-absorbing core covering the surface of the liquid tube; An evaporator is a cylindrical structure with an internal vacuum and is sealed. The evaporator includes a vapor channel, a first capillary core, and a second capillary core stacked sequentially from the outer wall of the cylindrical structure to the central axis. The other end of the liquid tube penetrates part of the evaporator, and the second capillary core covers part of the surface of the liquid tube. The second capillary core is connected to the liquid-absorbing core. The diameter of the pores of the first capillary core is smaller than the diameter of the pores of the second capillary core. The material of the second capillary core is different from the material of the liquid-absorbing core. A gas pipe, one end of which is connected to the steam passage, and the other end of which is connected to the end of the condenser away from the liquid pipe; A heat-conducting plate that covers the outer surface of the evaporator.

2. The heat dissipation device according to claim 1, characterized in that, The heat-conducting plate includes: A heat spreader, one side surface of which is used to contact a heat source; A saddle is located on the other side surface of the heat exchange plate. The saddle has a circular cutout, and the evaporator is placed inside the saddle through the circular cutout.

3. The heat dissipation device according to claim 2, characterized in that, The equivalent thermal conductivity of the heat spreader is 3000-10000 W / (mK).

4. The heat dissipation device according to claim 1, characterized in that, It also includes a secondary heat dissipation device, which comprises a first sub-liquid pipe, a secondary evaporator, a sub-gas pipe, a secondary condenser, and a second sub-liquid pipe connected in sequence. The first sub-liquid pipe is connected to the end of the liquid pipe near the condenser, and the second sub-liquid pipe is connected to the end of the liquid pipe near the compensation chamber.

5. The heat dissipation device according to claim 4, characterized in that, The secondary heat dissipation device is connected in parallel with the liquid pipe, or the secondary heat dissipation device is connected in series with the liquid pipe.

6. The heat dissipation device according to claim 4, characterized in that, There are multiple secondary heat dissipation devices, which are connected in sequence. The first sub-liquid pipe of an adjacent secondary heat dissipation device is connected to the second sub-liquid pipe of another secondary heat dissipation device.

7. The heat dissipation device according to claim 4, characterized in that, The number of secondary heat dissipation devices is multiple. The first sub-liquid pipe of each secondary heat dissipation device is connected to the end of the liquid pipe near the condenser, and the second sub-liquid pipe of each secondary heat dissipation device is connected to the end of the liquid pipe near the compensation chamber.

8. The heat dissipation device according to claim 1, characterized in that, The condenser has a plate-like structure.

9. The heat dissipation device according to claim 8, characterized in that, The sheet-like structure of the condenser comprises a multi-layered sub-sheet structure continuously bent.

10. The heat dissipation device according to claim 1, characterized in that, The condenser has multiple heat dissipation fins.

11. The heat dissipation device according to claim 10, characterized in that, The condenser also includes auxiliary heat sinks, which are welded onto the surface of the heat sinks in the direction of the liquid working fluid flow.

12. The heat dissipation device according to claim 1, characterized in that, The condenser also includes a liquid cooling plate that covers the outer surface of the cavity of the condenser.

13. The heat dissipation device according to claim 1, characterized in that, The compensation chamber and the evaporator are an integral structure, or the compensation chamber and the evaporator are separate structures.

14. The heat dissipation device according to claim 1, characterized in that, The contact angle between the liquid working fluid and the first capillary, the second capillary, or the liquid-absorbing core is less than 40°.

15. The heat dissipation device according to claim 1, characterized in that, Also includes: Multiple heat sources, each of which is in contact with the heat-conducting plate.

16. An electronic device, characterized in that, The heat dissipation device according to any one of claims 1 to 15 is used for heat dissipation.

Images