Silicon light optical adhesive non-contact dispensing equipment

Abstract

The utility model relates to silicon optical cement non-contact dispensing equipment which comprises a control end, and a sound wave generator, an automatic dispensing machine and image acquisition equipment which are respectively and electrically connected with the control end, the sound wave generator is used for generating tunable standing waves, the automatic dispensing machine is used for dispensing preset optical cement on a standing wave surface generated by the sound wave generator, and the image acquisition equipment is used for acquiring the preset optical cement. And the image acquisition equipment is used for acquiring an optical cement moving image when the optical cement moves into the view field along the standing wave direction. The method has the beneficial effects that firstly, the optical cement dispensed by the automatic dispensing machine is suspended based on the sound wave technology, then the phase of the generated standing wave is adjusted, the standing wave can move, the frequency is discontinuously changed, and the optical cement can move in the direction of the standing wave, so that accurate dispensing is achieved; the dispensing mode is a non-contact dispensing mode, so that damage to the silicon optical chip caused by touching the silicon optical chip can be effectively avoided, the dispensing amount is controllable, the dispensing speed is controllable, and contamination of the silicon optical chip caused by optical cement splashing is avoided.

Description

TECHNICAL FIELD

[0001] The utility model relates to a silicon light optical module production technical field, specifically relates to a silicon light optical glue non -contact type point gum equipment. BACKGROUND

[0002] The optical device is coupled successfully in the silicon light optical module, and the optical glue is fixed, and the optical glue quantity and the point gum position precision requirement are very high, and the current market point gum scheme has two, respectively:

[0003] 1) by automatic point gum machine point gum, and the automatic point gum machine is equipped with small point gum needle, although the point gum needle adopted is small, but its size is still big relatively to the silicon light chip, and the silicon light chip is easily touched in the point gum process, and the silicon light chip is damaged;

[0004] 2) through high pressure gas mode injection point gum, the shortcoming is that the small optical glue cannot be sprayed, and the speed is too fast to form splash, and the silicon light chip is contaminated. INVENTION CONTENT

[0005] The utility model provides a silicon light optical glue non -contact type point gum equipment to overcome the above -mentioned prior art deficiencies.

[0006] The utility model solves the technical scheme as follows: a silicon light optical glue non -contact type point gum equipment, include: control end and respectively with control end electricity connection's acoustic wave generator, automatic point gum machine and image acquisition equipment, acoustic wave generator is used to produce adjustable standing wave, automatic point gum machine is used to to the standing wave surface produced by acoustic wave generator point predetermined optical glue, image acquisition equipment is used to gather optical glue movement image when optical glue moves to its field of vision along the standing wave direction.

[0007] On the basis of the above technical scheme, the utility model can also be improved as follows.

[0008] Further, the optical glue quantity that automatic point gum machine points out each time is 0.01ml~0.5ml, and the standing wave wavelength produced by acoustic wave generator is 0.1mm~1mm.

[0009] Further, the point gum needle head of automatic point gum machine is fixed below acoustic wave generator.

[0010] Further, the image acquisition equipment is industrial CCD camera.

[0011] Further, the control end adopts industrial computer.

[0012] The utility model discloses a beneficial effect is: first based on acoustic technology lets the optical glue that automatic point glue machine points suspends, and then through the phase of the standing wave that produces, the standing wave will move, and the frequency will change discontinuously, and the optical glue will move along the standing wave direction, to realize accurate point glue, and this point glue mode is the non -contact type point glue, and the silicon optical chip can be effectively avoided because of the touch and lead to the damage of silicon optical chip, and the point glue glue amount is controllable, and the point glue speed is controllable, to avoid because of the optical glue splash and lead to the silicon optical chip contamination. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 It is the structural diagram of the silicon light optical glue non -contact type point glue equipment in the utility model.

[0014] In the drawings, the component list that each sign represents is as follows:

[0015] 1, control end, 2, acoustic generator, 3, automatic point glue machine, 310, point glue needle head, 4, image acquisition equipment. DETAILED DESCRIPTION

[0016] The principles and characteristics of the utility model are described below in combination with the drawings, and the examples are only used to explain the utility model and not used to limit the scope of the utility model.

[0017] Example 1

[0018] As Figure 1 Shown, a kind of silicon light optical glue non -contact type point glue equipment, including: control end 1, acoustic generator 2, automatic point glue machine 3 and image acquisition equipment 4, wherein, the signal input end of acoustic generator 2 is electrically connected with the signal output end of control end 1, the signal input end of automatic point glue machine 3 is electrically connected with the signal output end of control end 1, the signal output end of image acquisition equipment 4 is electrically connected with the signal input end of control end 1;Acoustic generator 2 is used to generate tunable standing wave, automatic point glue machine 3 is used to point predetermined optical glue to the standing wave surface generated by acoustic generator 2, and the optical glue that automatic point glue machine 3 points can suspend on the standing wave surface, acoustic generator 2 adjusts the phase of the standing wave that produces, and the standing wave will move, and the frequency will change discontinuously, and the optical glue will move along the standing wave direction, image acquisition equipment 4 is used to collect optical glue movement image when optical glue moves to its field of view along the standing wave direction, and image acquisition equipment 4 uploads the optical glue movement image collected to control end 1, and the optical glue speed can be calculated by the optical glue imaging position change amount divided by time difference by control end 1, so the time that optical glue reaches target position on product can be determined, under the condition that other conditions are unchanged, generally set a fixed time can judge whether optical glue points on target position on product.

[0019] In the application process, the optical adhesive dispensing machine 3 is first suspended based on acoustic wave technology. Then, by adjusting the phase of the generated standing wave, the standing wave will move and the frequency will change discontinuously. The optical adhesive will move along the direction of the standing wave to achieve precise dispensing. This dispensing method is a non-contact dispensing method, which can effectively avoid damage to the silicon photonic chip due to contact. The amount of adhesive dispensed is controllable, and the dispensing speed is controllable to avoid contamination of the silicon photonic chip due to optical adhesive splashing.

[0020] Example 2

[0021] like Figure 1 As shown, this embodiment is a further improvement on embodiment 1, as detailed below:

[0022] The automatic dispensing machine 3 dispenses 0.01ml to 0.5ml of optical adhesive each time, and the acoustic wave generator 2 generates a standing wave with a wavelength of 0.1mm to 1mm. Changing the phase of the standing wave allows the optical adhesive to move along the direction of the standing wave.

[0023] Example 3

[0024] like Figure 1 As shown, this embodiment is a further improvement on embodiment 1 or 2, as detailed below:

[0025] The dispensing needle 310 of the automatic dispensing machine 3 is fixed below the sound wave generator 2.

[0026] Example 4

[0027] like Figure 1 As shown, this embodiment is a further improvement on any one of embodiments 1 to 3, as detailed below:

[0028] Image acquisition device 4 is an industrial CCD camera. The speed of the optical adhesive can be calculated by dividing the change in the imaging position of the optical adhesive on the industrial CCD camera by the time difference. The industrial CCD camera can be calibrated to calculate the center position of the optical adhesive relative to the industrial CCD camera. The control terminal 1 is preferably an industrial computer.

[0029] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A non-contact dispensing apparatus for silicon optical glue, characterized in that, The application relates to a device for testing the optical glue, which comprises a control terminal (1) and an acoustic wave generator (2), an automatic glue dispenser (3) and an image acquisition device (4) electrically connected with the control terminal (1) respectively, the acoustic wave generator (2) is used for generating a tunable standing wave, the automatic glue dispenser (3) is used for dispensing predetermined optical glue to a standing wave surface generated by the acoustic wave generator (2), and the image acquisition device (4) is used for acquiring an optical glue movement image when the optical glue moves to a visual field range along a standing wave direction, the optical glue glue amount dispensed by the automatic glue dispenser (3) is 0.01ml-0.5ml each time, and the standing wave wavelength generated by the acoustic wave generator (2) is 0.1mm-1mm. The glue dispensing needle (310) of the automatic glue dispenser (3) is fixed below the acoustic wave generator (2).

2. The non-contact dispensing apparatus of claim 1, wherein, The image acquisition device (4) is an industrial CCD camera.

3. The non-contact dispensing apparatus of claim 1, wherein the apparatus further comprises a light source configured to emit light toward the nozzle. The control terminal (1) adopts an industrial computer.

4. The non-contact dispensing apparatus of claim 1, wherein the apparatus further comprises a light source configured to emit light toward the nozzle. ​

Images