Grinding pad machining device

Abstract

The utility model provides a grinding pad machining device which is applied to an operation scene of punching equipment and a to-be-punched object, the grinding pad machining device comprises a cover plate arranged on the to-be-punched object, the cover plate comprises a plurality of through holes, and the through holes are used for guiding a drill bit of the punching equipment to pass through; wherein a preset arrangement shape formed by the through holes meets the punching requirement of the to-be-punched object; the bottom plate is located below the cover plate, a groove structure is formed in the face, close to the cover plate, of the bottom plate, and the groove structure is used for bearing an object to be punched. A laser drilling mode is adopted in the prior art, although high drilling accuracy is achieved, burning traces can be formed on the edge of a hole site of an object through laser drilling, positioning drilling is conducted through cooperation of a through hole of a cover plate and a drill bit, the drilling accuracy is improved, and the drilling efficiency is improved. And burning of the edge of the hole site caused by laser drilling is effectively avoided, and the flatness and safety of the to-be-drilled object are ensured.

Description

Technical Field

[0001] This application relates to the field of semiconductor processing, and more particularly to an apparatus for processing polishing pads. Background Technology

[0002] CMP (Chemical Mechanical Polishing) is a widely used technique in semiconductor manufacturing to achieve a high degree of surface planarity on wafers. Combining chemical action and mechanical friction, CMP effectively improves surface inhomogeneities of wafer materials, ensuring wafer precision and performance.

[0003] In practical applications of CMP technology, the wafer is placed on a polishing pad, and a nozzle located above the polishing pad sprays polishing slurry onto the surface of the polishing pad. The wafer and polishing slurry undergo a chemical reaction, and the reaction products are removed by the mechanical polishing of the polishing pad, thereby achieving wafer planarization.

[0004] To maintain the cleanliness of the polishing pads, workers directly create several holes in the pads to allow impurities and waste polishing fluid to flow out. Currently, lasers are used to drill holes in the polishing pads. Although laser drilling is highly accurate, it leaves burn marks at the edges of the holes, affecting the surface flatness of the polishing pads and consequently impacting the planarization of the wafers in subsequent wafer polishing processes.

[0005] Therefore, ensuring the accuracy of drilling and the flatness of the grinding pad are technical problems that urgently need to be solved by those skilled in the art. Utility Model Content

[0006] This application aims to address at least one of the technical problems existing in the prior art. To this end, this application provides an abrasive pad processing apparatus to ensure the accuracy of drilling and the flatness and safety of the object to be drilled.

[0007] This application provides an abrasive pad processing apparatus, applied in a drilling operation scenario involving a drilling device and an object to be drilled. The abrasive pad processing apparatus includes:

[0008] A cover plate is placed on the object to be drilled, and the cover plate includes a plurality of through holes for guiding the drill bit of the drilling equipment through.

[0009] The preset arrangement shape of the through holes conforms to the drilling requirements of the object to be drilled.

[0010] Preferably, the abrasive pad processing apparatus further includes:

[0011] A bottom plate is arranged below the cover plate, and a groove structure is formed on one side of the bottom plate close to the cover plate, and the groove structure is used for supporting the object to be punched.

[0012] Preferably, the polishing pad processing device further comprises:

[0013] A backing plate is arranged in the groove structure and below the object to be punched, and the object to be punched, the backing plate and the groove structure are sequentially abutted and arranged.

[0014] Preferably, the depth of the groove structure is not less than the sum of the thickness of the backing plate and the thickness of the object to be punched.

[0015] Preferably, the cover plate further comprises:

[0016] A limiting structure is arranged on one side of the cover plate close to the object to be punched.

[0017] The upper end surface of the bottom plate abuts against the cover plate, and the limiting structure abuts against the object to be punched, so as to fix the object to be punched between the cover plate and the backing plate.

[0018] Preferably, the limiting structure is annular, and the projection of the through hole on the horizontal plane is distributed in the projection of the limiting structure on the horizontal plane.

[0019] Preferably, one of the cover plate and the bottom plate is provided with a connecting hole, and the other of the cover plate and the bottom plate is provided with a connecting piece, and the positions of the connecting piece and the connecting hole correspond to each other.

[0020] The connecting piece and the connecting hole are cooperatively arranged to make the upper end surface of the bottom plate abut against the cover plate.

[0021] The connecting piece and the connecting hole are disconnectively arranged to make the upper end surface of the bottom plate separate from the cover plate.

[0022] Preferably, the groove structure comprises a notch penetrating one side of the bottom plate.

[0023] Preferably, the polishing pad processing device further comprises:

[0024] A lifting piece is arranged on one side of the cover plate away from the object to be punched, and is used for lifting the cover plate to move the cover plate away from the bottom plate, or lowering the cover plate to move the cover plate close to the bottom plate.

[0025] According to the specific embodiments provided in the present application, the following technical effects are disclosed:

[0026] In the technical solution of the present application, a grinding pad processing device is provided, which is applied to the working scene of a punching device and an object to be punched. The grinding pad processing device comprises: a cover plate placed on the object to be punched, the cover plate comprising a plurality of through holes for guiding the drill bit of the punching device to pass through; wherein the preset arrangement shape formed by the plurality of through holes conforms to the punching requirement of the object to be punched; and a bottom plate located below the cover plate, one side of the bottom plate close to the cover plate forming a groove structure for supporting the object to be punched. In the prior art, although the laser punching method has high punching accuracy, the laser punching will form burning marks on the edge of the hole of the object. The present application cooperates with the through holes of the cover plate and the drill bit to position and drill, which not only improves the accuracy of punching, but also effectively avoids the burning of the edge of the hole caused by laser punching, ensuring the flatness and safety of the object to be punched. BRIEF DESCRIPTION OF DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0028] Figure 1 is the overall schematic diagram of the grinding pad processing device provided by the embodiment of the present application;

[0029] Figure 2 is the exploded view of the grinding pad processing device provided by the embodiment of the present application;

[0030] Figure 3 is the cover plate schematic diagram of the grinding pad processing device provided by the embodiment of the present application;

[0031] Figure 4 is the bottom plate schematic diagram of the grinding pad processing device provided by the embodiment of the present application;

[0032] Figure 5 is one of the cross-sectional schematic diagrams of the grinding pad processing device provided by the embodiment of the present application;

[0033] Figure 6 is the second cross-sectional schematic diagram of the grinding pad processing device provided by the embodiment of the present application.

[0034] BRIEF DESCRIPTION OF DRAWINGS: 10, cover plate; 20, bottom plate; 30, pad plate; 40, lifting piece; 100, through hole; 110, limiting structure; 120, connecting hole; 200, groove structure; 210, connecting piece; 2000, notch; 2100, hemispherical structure; 2110, clamping structure. DETAILED DESCRIPTION

[0035] Some embodiments of the present application will be described below with reference to the accompanying drawings. Those skilled in the art will understand that these embodiments are only used to explain the technical principles of the present application, and are not intended to limit the protection scope of the present application.

[0036] As described in the background, in order to maintain the cleanliness of the polishing pad, the workers directly drill a plurality of hole positions on the polishing pad to enable the impurity products and the waste polishing liquid to flow out of the hole positions of the polishing pad. At present, the polishing pad is drilled by using a laser. Although the accuracy of laser drilling is high, the laser drilling will form burning marks on the edges of the hole positions, thereby affecting the surface flatness of the polishing pad, and affecting the planarization degree of the wafer in the subsequent wafer polishing process.

[0037] The present application provides a polishing pad processing device, which is designed to ensure the positioning accuracy of drilling and the flatness and safety of the object to be drilled.

[0038] Referring to the overall schematic diagram and the exploded view of the polishing pad processing device shown in Figure 1 , Figure 2 , the polishing pad processing device is applied to the working scene of the drilling equipment (not shown in the figure) and the object to be drilled (not shown in the figure), and the polishing pad processing device comprises a cover plate 10 placed on the object to be drilled, the cover plate 10 comprising a plurality of through holes 100 for guiding the drill bit of the drilling equipment to pass through; wherein the preset arrangement shape formed by the plurality of through holes 100 conforms to the drilling requirement of the object to be drilled.

[0039] Since the object to be drilled has multiple types, different types of objects to be drilled have different drilling requirements, such as the hole positions arranged in regular patterns (rectangular, circular) or irregular patterns, etc., the preset arrangement shape of the plurality of through holes 100 can be arranged according to the drilling requirement of the object to be drilled, so as to realize accurate positioning when drilling on the object to be drilled, and thus the hole positions drilled on the object conform to the drilling requirement. In the prior art, the laser drilling method is used, which has high drilling accuracy, but the laser drilling will form burning marks on the edges of the hole positions of the object. The present application cooperates with the through holes 100 of the cover plate 10 and the drill bit to perform positioning drilling, which not only improves the drilling accuracy, but also effectively avoids the burning of the edges of the hole positions caused by laser drilling, thereby ensuring the safety of the object to be drilled.

[0040] In some embodiments of the present application, the cover plate 10 has a cuboid structure, and the projection area of the cover plate 10 on the horizontal plane is greater than the projection area of the object to be drilled on the horizontal plane, so as to completely cover the surface of the object to be drilled; the preset arrangement shape is determined according to the hole position distribution requirement of the surface of the object to be drilled, such as Figure 1 In one embodiment of the present application, the preset arrangement shape is circular, as shown in

[0041] In some embodiments of the present application, the object to be perforated is a polishing pad, the perforating device is an electric drill, and the through holes 100 arranged in different patterns form a circle. After the electric drill is used to perforate the polishing pad, the polishing pad forms a plurality of holes arranged in a circle, so that the waste impurities and waste polishing liquid generated in the subsequent wafer planarization process can flow out uniformly through the holes of the polishing pad.

[0042] In some embodiments of the present application, the object to be perforated is a polishing pad, the perforating device is a cylindrical drill bit with a tip and a rubber hammer, and the drill bit is inserted through the through hole of the cover plate to abut the tip of the drill bit against the polishing pad. The end of the drill bit is hammered with the rubber hammer to make the tip pierce the polishing pad under force. The through hole is switched and the operation is repeated several times to perforate all the holes.

[0043] Preferably, referring to the schematic diagram of the polishing pad processing device and the bottom plate of Figure 1 , Figure 2 and Figure 4 , the polishing pad processing device further comprises a bottom plate 20 located below the cover plate 10. One side of the bottom plate 20 close to the cover plate 10 forms a groove structure 200 for supporting the object to be perforated.

[0044] In this way, the object to be perforated placed in the groove structure 200 is fixed by the cover plate 10 and the bottom plate 20, so that the object to be perforated will not deviate from the position during the perforation operation, and the holes will not be perforated at an angle.

[0045] In some embodiments of the present application, the bottom plate 20 has a cuboid structure, and the size of the bottom plate 20 matches the size of the cover plate 10. The bottom plate 20 and the cover plate 10 can completely cover the object to be perforated.

[0046] In some embodiments of the present application, the object to be perforated is a U-shaped polishing pad, and the groove structure 200 is also U-shaped. The projection area of the groove structure 200 on the horizontal plane is not less than the projection area of the U-shaped polishing pad on the horizontal plane, so that the U-shaped polishing pad can be more conveniently placed in the groove structure 200.

[0047] Preferably, referring to Figures 1 to 4 , the polishing pad processing device further comprises a pad plate 30 arranged in the groove structure 200 and placed below the object to be perforated. The pad plate 30 cooperates with the groove structure 200, and the object to be perforated, the pad plate 30 and the groove structure 200 are sequentially abutted and installed.

[0048] In this way, the pad plate 30 can avoid direct contact with the bottom plate 20 when the perforating device perforates the object to be perforated, thereby preventing damage to the bottom plate 20. At the same time, the pad plate 30 can also provide a certain buffering protection for the drill bit of the perforating device, thereby prolonging the service life of the drill bit and maintaining the sharpness of the drill bit.

[0049] In some embodiments of the present application, the pad plate 30 is a replaceable component, which can be replaced directly after being consumed or worn to a certain extent; the pad plate 30 can be made of pp material, which is low in cost and convenient to manufacture, thereby saving manufacturing cost.

[0050] In some embodiments of the present application, the pad plate 30 is matched with the groove structure 200 in shape, as shown in Figure 2 The pad plate 30 and the groove structure 200 are both in U-shaped structure to adapt to the U-shaped grinding pad, as shown in

[0051] Preferably, referring to one of the cross-sectional views of the grinding pad processing device shown in Figure 5 The depth of the groove structure 200 is not less than the sum of the thickness of the pad plate 30 and the thickness of the object to be punched.

[0052] In this way, the object to be punched and the pad plate 30 can be stably placed in the groove structure 200, and even if shaking occurs, the placement position of the object to be punched can be stably limited by the edges around the groove structure 200.

[0053] Preferably, referring to the cover plate schematic diagram and one of the cross-sectional schematic views of the grinding pad processing device shown in Figure 3 and Figure 5 The cover plate 10 further comprises a limiting structure 110 arranged on the side of the cover plate 10 close to the object to be punched; the upper end surface of the bottom plate 20 abuts against the cover plate 10, and the limiting structure 110 abuts against the object to be punched, so as to fix the object to be punched between the cover plate 10 and the pad plate 30.

[0054] In this way, when the upper end surface of the bottom plate 20 abuts against the cover plate 10, the limiting structure 110 can abut against the object to be punched, the object to be punched is placed on the pad plate 30, the limiting structure 110 exerts pressure on the object to be punched, so that the object to be punched is tightly fixed between the cover plate 10 and the pad plate 30, thereby avoiding the position deviation of the object to be punched due to instability during the punching operation, and further avoiding the deviation of the punching.

[0055] Preferably, the limiting structure 110 is in ring shape, and the through holes 100 are distributed within the range framed by the limiting structure 110, and the projection of the through holes 100 on the horizontal plane is distributed in the projection of the limiting structure 110 on the horizontal plane.

[0056] The contact surface between the limiting structure 110 and the object to be punched is annular when the limiting structure 110 contacts the object to be punched, so that the pressure generated when the limiting structure 110 extrudes the object to be punched is uniformly dispersed, and meanwhile, the through holes 100 are distributed within the range defined by the annular structure, so that the through holes 100 are arranged closely and densely, and the holes punched on the object to be punched are more densely, thereby avoiding the dispersion of the through holes 100, which causes the object punched to be unable to efficiently discharge the liquid impurities on the surface in the subsequent process.

[0057] Preferably, one of the cover plate 10 and the bottom plate 20 is provided with a connecting hole 120, and the other of the cover plate 10 and the bottom plate 20 is provided with a connecting piece 210, the positions of the connecting piece 210 and the connecting hole 120 correspond to each other; the connecting piece 210 and the connecting hole 120 are installed in cooperation to make the upper end surface of the bottom plate 20 and the cover plate 10 abut; the connecting piece 210 and the connecting hole 120 are installed to be disconnected to make the upper end surface of the bottom plate 20 and the cover plate 10 separate.

[0058] In some embodiments of the present application, referring to Figures 1 to 6 , the connecting hole 120 is arranged at four corners of the cover plate 10, the connecting piece 210 is arranged at four corners of the upper end surface of the bottom plate 20, the positions of the connecting hole 120 and the connecting piece 210 correspond to each other, when the cover plate 10 is buckled on the bottom plate 20, the connecting piece 210 is engaged in the connecting hole 120, so that the cover plate 10 and the bottom plate 20 abut, when the cover plate 10 needs to be removed, the connecting piece 210 and the connecting hole 120 are disconnected, so that the cover plate 10 and the bottom plate 20 are separated.

[0059] In some embodiments of the present application, the connecting piece 210 is in the shape of a cylinder as a whole, one end of the connecting piece 210 is provided with a hemispherical structure 2100, so that the connecting piece 210 can smoothly pass through the connecting hole 120 by means of the structure, and the other end of the connecting piece 210 is provided with a clamping structure 2110, so that the connecting piece 210 can be stably clamped in the bottom plate 20.

[0060] Preferably, referring to Figures 1 to 6 , the groove structure 200 includes a notch 2000, and the notch 2000 penetrates one side surface of the bottom plate 20.

[0061] When the cover plate 10 and the bottom plate 20 abut, the notch 2000 and the cover plate 10 maintain a predetermined distance.

[0062] In some embodiments of the present application, both left and right sides of the groove structure 200 have the notch 2000, after the punching operation is completed, the staff member pries the cover plate 10 at the left and right notches 2000, then makes the connecting piece 210 and the connecting hole 120 installed to be disconnected, then lifts the cover plate 10 to separate the cover plate 10 and the bottom plate 20, and finally takes out the punched object.

[0063] Preferably, referring to Figures 1 to 3 , and Figure 5The grinding pad processing device further comprises a lifting member 40 arranged on the side of the cover plate 10 away from the object to be perforated, and used to lift the cover plate 10 to move the cover plate 10 away from the base plate 20, or to lower the cover plate 10 to move the cover plate 10 towards the base plate 20.

[0064] In some embodiments of the present application, before the perforation operation, the worker first places the pad 30 in the groove structure 200, then places the object to be perforated, then lifts the cover plate 10 by the lifting member 40 to move the cover plate 10 above the base plate 20, then aligns the connecting member 210 and the connecting hole 120, and finally connects the connecting member 210 and the connecting hole 120 to abut the cover plate 10 and the base plate 20, and fix the object to be perforated between the cover plate 10 and the base plate 20 by the limiting structure 110. After the perforation operation, the worker first slightly lifts the cover plate 10 by the gap 2000, or slightly lifts the cover plate 10 by the lifting member 40, then disconnects the connecting member 210 and the connecting hole 120, and finally separates the cover plate 10 and the base plate 20, and sequentially takes out the perforated object and the pad 30.

[0065] In some embodiments of the present application, the cover plate 10 and the base plate 20 are both made of 6061 aluminum material, which is not easy to deform during use, thereby improving the reliability of the grinding pad processing device.

[0066] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the description of the present application, the illustrative description of the above terms does not necessarily mean the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0067] In addition, the terms "first", "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise specifically limited.

[0068] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limiting the present application, and those skilled in the art can make changes, modifications, replacements and variations to the above embodiments within the scope of the present application.

Claims

1. A polishing pad processing apparatus applied to a working scene of a punching device and an object to be punched, characterized by, The polishing pad processing device comprises: a cover plate (10) arranged on the object to be punched, the cover plate (10) comprising a plurality of through holes (100) for guiding the drill bit of the punching device to pass through; wherein the preset arrangement shape formed by the plurality of through holes (100) is consistent with the punching requirement of the object to be punched; a bottom plate (20) located below the cover plate (10), one side of the bottom plate (20) close to the cover plate (10) forming a groove structure (200) for supporting the object to be punched.

2. The lapping pad processing apparatus of claim 1, wherein The polishing pad processing device further comprises: a pad plate (30) arranged in the groove structure (200) and below the object to be punched, the object to be punched, the pad plate (30) and the groove structure (200) being sequentially abutted and installed.

3. The polishing pad processing apparatus of claim 2, wherein The depth of the groove structure (200) is not less than the sum of the thickness of the pad plate (30) and the thickness of the object to be punched.

4. The polishing pad processing apparatus of claim 3, wherein The cover plate (10) further comprises: a limiting structure (110) arranged on the side of the cover plate (10) close to the object to be punched; the upper end surface of the bottom plate (20) abuts against the cover plate (10), and the limiting structure (110) abuts against the object to be punched, so as to fix the object to be punched between the cover plate (10) and the pad plate (30).

5. The polishing pad processing apparatus of claim 4, wherein The limiting structure (110) is annular, and the projection of the through hole (100) on the horizontal plane is distributed in the projection of the limiting structure (110) on the horizontal plane.

6. The lapping pad processing apparatus according to any one of claims 1 to 5, wherein One of the cover plate (10) and the bottom plate (20) is provided with a connecting hole (120), and the other of the cover plate (10) and the bottom plate (20) is provided with a connecting piece (210), the positions of the connecting piece (210) and the connecting hole (120) correspond to each other; the connecting piece (210) and the connecting hole (120) are cooperatively installed to make the upper end surface of the bottom plate (20) abut against the cover plate (10); the connecting piece (210) and the connecting hole (120) are disconnectively installed to make the upper end surface of the bottom plate (20) separate from the cover plate (10).

7. The lapping pad processing apparatus of claim 1, wherein The groove structure (200) comprises a notch (2000) penetrating one side of the bottom plate (20).

8. The lapping pad processing apparatus of claim 1, wherein The polishing pad processing device further comprises: a lifting piece (40) arranged on the side of the cover plate (10) away from the object to be punched, for lifting the cover plate (10) to move the cover plate (10) away from the bottom plate (20), or for lowering the cover plate (10) to move the cover plate (10) close to the bottom plate (20).

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