Chip lead welding mechanism

Abstract

The utility model discloses a chip lead welding mechanism which comprises a first support capable of moving along a first horizontal direction, a second support capable of moving along a second horizontal direction perpendicular to the first horizontal direction, an installation base capable of moving along a vertical direction and an ultrasonic welding head vertically installed on the installation base. A heating module corresponding to the ultrasonic welding head is arranged, the heating module is installed on a piston rod of a horizontal air cylinder through a movable seat, and when the installation base is located at the highest position of the stroke of the installation base and the piston rod of the horizontal air cylinder is in an extension state, the heating module is located under the ultrasonic welding head. The horizontal air cylinder is installed on the second support through a connecting support. According to the utility model, the non-contact precise heating of the bonding area on the chip can be realized, and the situation that the bonding precision is influenced by the offset of the chip caused by the long-term heating deformation of the chip substrate is avoided.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of semiconductor device packaging, specifically to a chip lead wire welding mechanism. BACKGROUND

[0002] The lead wire bonding process equipment is mainly used for the lead wire interconnection process of semiconductor device manufacturing, and completes the lead wire interconnection bonding between chips and between the chip and the substrate. At present, the bonding is mainly carried out in a hot-pressing ultrasonic bonding mode, which needs to heat the bottom of the bonding area by a heating plate (about 200°C) and then bond the lead wire and the carrier. When heating, the heat of the heating plate is first transferred to the carrier and then to the chip through the carrier. After the chip and the carrier both reach the working temperature, the bonding can be carried out. However, the heating process in the prior art is to heat the whole chip carrier, which is easy to cause the problem of bonding point deviation when wire bonding due to local deformation caused by long-term heating of the chip substrate. SUMMARY

[0003] The utility model discloses a chip lead wire welding mechanism, which can realize non-contact precise heating of the bonding area on the chip, avoid the situation that the chip is deviated due to the deformation of the chip substrate caused by long-term heating, and affect the bonding precision.

[0004] To achieve the above-mentioned purpose, the utility model adopts the technical scheme of a chip lead wire welding mechanism, which comprises a first support movable along a first horizontal direction, a second support movable along a second horizontal direction perpendicular to the first horizontal direction, a mounting base movable along a vertical direction, and an ultrasonic welding head vertically mounted on the mounting base. The second support is movably mounted on the first support and connected with a horizontal drive module mounted on the first support. The mounting base is movably mounted on the second support and connected with a vertical drive module mounted on the second support. The welding mechanism further comprises a heating module corresponding to the ultrasonic welding head. The heating module is mounted on the piston rod of a horizontal cylinder through a movable seat. When the mounting base is at the highest position of its stroke and the piston rod of the horizontal cylinder is in the elongated state, the heating module is located directly below the ultrasonic welding head. The horizontal cylinder is mounted on the second support through a connecting support.

[0005] The further improved scheme in the above-mentioned technical scheme is as follows:

[0006] 1. In the above-mentioned scheme, the heating module is a non-contact heating module.

[0007] 2. In the above-mentioned scheme, the heat radiation surfaces of the heating module are respectively arranged towards the upper and lower sides.

[0008] 3. In the above-mentioned scheme, the horizontal drive module and the vertical drive module are cylinder, hydraulic cylinder or motor drive module.

[0009] 4. In the above scheme, the second bracket and the first bracket, as well as the mounting base and the second bracket, are slidably connected by at least one set of guide grooves and guide strips.

[0010] Due to the application of the above technical solution, this utility model has the following advantages compared with the prior art:

[0011] The chip lead bonding mechanism of this utility model has a heating module corresponding to the ultrasonic bonding head. This heating module is mounted on the piston rod of a horizontal cylinder via a movable base. When the mounting base is at its highest position and the piston rod of the horizontal cylinder is in the extended state, the heating module is located directly below the ultrasonic bonding head. The horizontal cylinder is mounted on a second bracket via a connecting bracket, which can realize non-contact precise heating of the bonding area on the chip, avoiding the situation where the chip substrate is deformed by heat for a long time, causing the chip to shift and affecting the bonding accuracy. Attached Figure Description

[0012] Appendix Figure 1 This is a schematic diagram of the overall structure of the chip lead welding mechanism of this utility model;

[0013] Appendix Figure 2 This is a rear view schematic diagram of the chip lead welding mechanism of this utility model.

[0014] In the above attached figures: 1. First bracket; 2. Second bracket; 3. Mounting base; 4. Ultrasonic welding head; 5. Horizontal drive module; 6. Vertical drive module; 7. Guide groove; 8. Guide bar; 11. Heating module; 12. Movable seat; 13. Horizontal cylinder; 14. Connecting bracket. Detailed Implementation

[0015] The present patent can be further understood through the specific embodiments given below, but they are not intended to limit the present patent.

[0016] Embodiment 1: a chip lead welding mechanism, comprising: a first support 1 movable along a first horizontal direction, a second support 2 movable along a second horizontal direction perpendicular to the first horizontal direction, a mounting base 3 movable along a vertical direction, and an ultrasonic welding head 4 vertically mounted on the mounting base 3, the second support 2 is movably mounted on the first support 1 and connected with a horizontal drive module 5 mounted on the first support 1, the mounting base 3 is movably mounted on the second support 2 and connected with a vertical drive module 6 mounted on the second support 2, and a heating module 11 corresponding to the ultrasonic welding head 4 is further provided, the heating module 11 is mounted on a piston rod of a horizontal cylinder 13 through a movable seat 12, when the mounting base 3 is at the highest position of its stroke and the piston rod of the horizontal cylinder 23 is in the elongated state, the heating module 11 is located directly below the ultrasonic welding head 4, and the horizontal cylinder 13 is mounted on the second support 2 through a connecting support 14.

[0017] The heating module 11 is a non-contact heating module, and the heat radiation surfaces of the heating module 11 are respectively arranged towards the upper and lower sides.

[0018] The horizontal drive module 5 and the vertical drive module 6 are cylinders.

[0019] Embodiment 2: a chip lead welding mechanism, comprising: a first support 1 movable along a first horizontal direction, a second support 2 movable along a second horizontal direction perpendicular to the first horizontal direction, a mounting base 3 movable along a vertical direction, and an ultrasonic welding head 4 vertically mounted on the mounting base 3, the second support 2 is movably mounted on the first support 1 and connected with a horizontal drive module 5 mounted on the first support 1, the mounting base 3 is movably mounted on the second support 2 and connected with a vertical drive module 6 mounted on the second support 2, and a heating module 11 corresponding to the ultrasonic welding head 4 is further provided, the heating module 11 is mounted on a piston rod of a horizontal cylinder 13 through a movable seat 12, when the mounting base 3 is at the highest position of its stroke and the piston rod of the horizontal cylinder 13 is in the elongated state, the heating module 11 is located directly below the ultrasonic welding head 4, and the horizontal cylinder 13 is mounted on the second support 2 through a connecting support 14.

[0020] The lower end of the connecting support 14 connected with the second support 2 is mounted with the horizontal cylinder 13 on the side opposite to the ultrasonic welding head 4.

[0021] The heat radiation surfaces of the heating module 11 are respectively arranged towards the upper and lower sides.

[0022] The second support 2 and the first support 1, and the mounting base 3 and the second support 2 are all connected through at least one set of guide grooves 7 and guide strips 8.

[0023] The horizontal driving module 5 and the vertical driving module 6 are motor driving modules.

[0024] Working principle:

[0025] In use, the plurality of chips to be bonded are each loaded on a chip substrate (generally a lead frame);

[0026] The gold wire for bonding is inserted into the ultrasonic welding head, which is obtained by outsourcing and belongs to the prior art, so it is not described in detail here;

[0027] After the chip substrate is loaded and fixed, the ultrasonic welding head is moved to the chip to be bonded by the combined movement of the first support and the second support in the horizontal direction, and then the horizontal cylinder is switched from the original retracted state to the elongated state, so that the heating module is moved to the chip to be bonded, thereby directly heating the bonding area of the chip below to avoid long-term excessive heating of the chip substrate, avoid the deformation of the chip substrate caused by long-term heating, and avoid the displacement of the chip position on the chip substrate. It can also heat the gold wire in the ultrasonic welding head. It should be noted that the power required to heat the gold wire should be much smaller than the power required to heat the bonding area;

[0028] After heating is completed, the horizontal cylinder is switched back to the retracted state, so that the heating module moves away from the ultrasonic welding head;

[0029] Finally, through the reciprocating movement of the mounting base in the vertical direction and the combined movement of the first support and the second support in the horizontal direction, the ultrasonic welding head and the gold wire thereon are used to achieve bonding.

[0030] When the above chip lead welding mechanism is used, it can achieve non-contact precise heating of the bonding area on the chip, avoiding the deformation of the chip substrate caused by long-term heating, which affects the bonding precision.

[0031] The above embodiments are only for illustrating the technical concept and characteristics of the present application, and the purpose is to enable those skilled in the art to understand the content of the present application and implement it, and it cannot limit the protection scope of the present application. Any equivalent changes or modifications made in accordance with the spirit and essence of the present application should be covered within the protection scope of the present application.

Claims

1. A mechanism for soldering chip leads, comprising a first support (1) movable in a first horizontal direction, a second support (2) movable in a second horizontal direction perpendicular to the first horizontal direction, a mounting base (3) movable in a vertical direction, and an ultrasonic soldering head (4) mounted vertically on the mounting base (3), characterized in that: The second support (2) is movably mounted on the first support (1) and connected with a horizontal driving module (5) mounted on the first support (1), the mounting base (3) is movably mounted on the second support (2) and connected with a vertical driving module (6) mounted on the second support (2), and a heating module (11) corresponding to the ultrasonic welding head (4) is further arranged, the heating module (11) is mounted on a piston rod of a horizontal cylinder (13) through a movable seat (12), when the mounting base (3) is located at the highest position of its stroke and the piston rod of the horizontal cylinder (13) is in the elongated state, the heating module (11) is located directly below the ultrasonic welding head (4), and the horizontal cylinder (13) is mounted on the second support (2) through a connecting support (14).

2. The chip lead bonding mechanism according to claim 1, characterized by: The heating module (11) is a non-contact heating module.

3. The chip lead bonding mechanism according to claim 1, wherein: The heat radiation surfaces of the heating module (11) are respectively arranged towards the upper and lower sides.

4. The chip lead bonding mechanism according to claim 1, wherein: The horizontal driving module (5) and the vertical driving module (6) are cylinder, hydraulic cylinder or motor driving modules.

5. The chip lead bonding mechanism according to claim 1, wherein: The second support (2) and the first support (1) and the mounting base (3) and the second support (2) are all slidably connected through at least one set of guide grooves (7) and guide strips (8).

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