Clamping mechanism and wafer cleaning device

Abstract

The application discloses a clamping mechanism and a wafer cleaning device. The clamping mechanism comprises a plurality of clamping assemblies for clamping wafers. Each clamping assembly comprises a driving part and a clamping part. The clamping part is arranged on a support table, and the driving part is arranged below the clamping part to drive the clamping jaw of the clamping part to swing. The plurality of clamping assemblies are uniformly distributed in the circumferential direction of the support table. Two clamping assemblies are arranged opposite to each other to form a plurality of clamping groups. The plurality of clamping groups have at least two clamping jaw swing angle ranges. The above technical scheme overcomes the defect that the wafer is easily pressed against the clamping jaw during the wafer feeding process by a mechanical hand in the prior art. The tolerance of the horizontal stroke error of the mechanical hand is significantly improved, so that the deviation in actual operation can be better adapted, the smoothness of the clamping process is ensured, and the work efficiency is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to a clamping mechanism and a wafer cleaning device, belonging to the field of chip manufacturing technology. BACKGROUND

[0002] Wafer cleaning is a very critical link in the chip manufacturing process, mainly used to remove contaminants and impurities on the surface of the wafer, to ensure the quality and reliability of the subsequent process. The wafer will undergo multiple cleaning during the manufacturing process, and the effect of cleaning directly affects the performance and yield of the chip. The purpose of wafer cleaning is to remove particles, organic contaminants and metal impurities on the surface of the wafer. There may be tiny particles on the surface of the wafer, if not removed, these particles may cause defects in the subsequent photolithography and etching process, affecting the formation of the circuit; photoresist residues, grease and other organic matter will affect the deposition of the film and the etching process, which need to be removed in the cleaning process; metal ion contamination may occur during the manufacturing process, and metal impurities may cause the electrical performance of the device to decline, which need to be removed during cleaning. Wet cleaning is the most common cleaning method, that is, using chemical solution to clean the wafer. In the wet cleaning process, the wafer needs to be clamped first to ensure the stability of the wafer during the cleaning process, to avoid mechanical stress or damage, and to ensure that the cleaning liquid can uniformly cover the surface of the wafer, so as to achieve the best cleaning effect. During the wafer cleaning process, clamping and fixing the wafer is crucial, which ensures the stability of the wafer during the cleaning process and avoids damage or contamination caused by movement or shaking. The common way to fix the wafer is to clamp it by mechanical clamps, usually using clamping jaws to clamp the wafer from the edge of the wafer. This method can fix the wafer and ensure that it does not shift during the cleaning process, and since the clamps only touch the edge of the wafer, it avoids contaminating the surface of the wafer.

[0003] Since the clamping process is carried out in an environment containing a large amount of chemical solution, the clamping parts and transmission parts are exposed to the chemical solution, which can cause some parts to be corroded by the chemical solution, resulting in a decline or failure of the clamps; at the same time, the parts may also be contaminated by contact with the cleaning liquid, and long-term use may cause residues to accumulate, thereby affecting the cleaning effect; the complex structure also increases the complexity and maintenance cost of the maintenance operation when maintaining the parts.

[0004] In addition, during the cleaning of the wafer, the entire cleaning device is placed in a closed cover, and before cleaning, the wafer is horizontally transported into the closed cover by a mechanical hand, and after reaching the position, the wafer is released downward, and the wafer is clamped and fixed by the clamping parts below. However, due to the frequent errors in the horizontal transportation of the wafer by the mechanical hand, the wafer cannot be clamped by the pair of clamping jaws in the transportation direction, that is, when the position of the wafer transported horizontally by the mechanical hand exceeds the standard position or does not reach the standard position, the wafer is likely to be stopped by the clamping jaw on one side when it is released downward, and cannot be placed between the pair of clamping jaws. SUMMARY

[0005] Therefore, the purpose of the present application is to overcome the above-mentioned defects in the prior art that the wafer is easily pressed by the clamping jaw during the wafer feeding process by the mechanical hand, so as to provide a clamping mechanism and a wafer cleaning device.

[0006] In order to achieve the above-mentioned purpose, a clamping mechanism of the present application comprises a plurality of clamping assemblies for clamping wafers, the clamping assembly comprising a driving part and a clamping part, the clamping part being arranged on a support table, and the driving part being located below the clamping part for driving the clamping jaw to swing; the plurality of clamping assemblies are uniformly distributed in the circumferential direction of the support table, and the plurality of clamping assemblies are arranged opposite to each other to form a plurality of clamping groups; wherein the plurality of clamping groups have at least two clamping jaw swing angle ranges, and the clamping assemblies in the same group have the same swing angle range.

[0007] The clamping part further comprises a lifting rod and a swing rod, the clamping jaw is fixedly connected to the swing rod and is installed on the support table through a rotating shaft, and the clamping jaw protrudes upward from the table surface of the support table; the lifting rod is connected to the swing rod through a linkage structure for driving the swing rod to swing around the rotating shaft.

[0008] The linkage structure comprises a guide shaft pin arranged on the lifting rod and a long hole opened on the swing rod, the guide shaft pin is inserted into the long hole and can move relatively in the long hole.

[0009] The length of the long hole in the clamping group with a larger clamping jaw swing angle range is greater than the length of the long hole in the other clamping groups.

[0010] The long direction of the long hole is arranged relatively inclined to the horizontal plane.

[0011] The swing rod is two, the two swing rods are arranged on the left and right sides of the lifting rod, and the clamping jaw is fixedly connected to one of the swing rods.

[0012] The two swing rods are symmetrically arranged on the left and right sides of the lifting rod.

[0013] The difference between the two clamping jaw swing angle ranges of the plurality of clamping groups is 3°-4.5°.

[0014] The clamping assembly is four, and the four clamping assemblies are arranged opposite to each other to form two clamping groups.

[0015] At least one supporting needle is further fixed on the inner side of each clamping jaw.

[0016] The clamping part further comprises a reset spring, the reset spring is located on the top end of the lifting rod; the driving part is used for moving upward and lifting the lifting rod, and is used for moving downward and disengaging the lifting rod.

[0017] A sealing sliding sleeve is arranged at the lower end surface of the support table, the top end of the lifting rod is inserted into the sealing sliding sleeve and can slide along the sealing sliding sleeve; the reset spring is arranged in the sealing sliding sleeve and abuts against the lifting rod and the support table.

[0018] The lifting rod comprises a sleeve portion at the top, the lower end of the reset spring is inserted into the sleeve portion, and the sleeve portion is in sliding sealing cooperation with the sealing sliding sleeve.

[0019] The driving portion comprises a jacking device and a jacking rod device, the jacking device is used for driving the jacking rod device to lift, the jacking rod device comprises a jacking rod portion and a cap portion at the top end of the jacking rod portion, and the cap portion is used for jacking up the lifting rod.

[0020] The cap portion comprises a connecting portion connected to the jacking rod portion and a jacking portion extending to the radial outer side of the support table, and the jacking portion is used for contacting the lifting rod.

[0021] A base table is arranged below the support table, the jacking device is arranged in the base table, the jacking rod portion passes through a through hole in the base table upwards, a first sealing assembly is arranged outside the through hole, and a second sealing assembly is arranged between the first sealing assembly and the cap portion.

[0022] The second sealing assembly comprises a bellows, the upper end of the bellows is connected to the upper portion of the jacking rod portion, and the lower end of the bellows is connected to the first sealing assembly.

[0023] The first sealing assembly comprises a guide sleeve and at least one sealing ring arranged outside the guide sleeve, and the guide sleeve is sleeved outside the jacking rod portion.

[0024] The second sealing assembly comprises a sealing sleeve, the upper portion of the sealing sleeve is sealingly connected to the jacking rod portion, the top portion of the guide sleeve is inserted into the lower end of the sealing sleeve and is in sliding sealing connection with the sealing sleeve.

[0025] The upper portion of the sealing sleeve is screwed on the jacking rod portion, and the top end of the sealing sleeve is sealed by a sealing ring.

[0026] The application further provides a wafer cleaning device, which comprises a cleaning portion and an enclosed cover, the cleaning portion comprises the clamping mechanism and a rotary driving mechanism arranged below the support table, the rotary driving mechanism is used for driving the support table to rotate, an upper feeding door is arranged on the enclosed cover and is used for feeding a wafer into the enclosed cover by a horizontal feeding robot, and the clamping group with a larger swing angle range of the clamping mechanism is arranged in the horizontal feeding direction of the feeding robot.

[0027] At least one check ring is arranged outside the cleaning portion in the radial direction, the check ring is used for blocking and recovering the cleaning liquid during the wafer cleaning process, and a check ring jacking mechanism is arranged below the check ring.

[0028] By adopting the technical scheme, the clamping mechanism and the wafer cleaning device have the following beneficial effects compared with the prior art:

[0029] 1. The swing angle of the clamping jaw in a clamping group is increased, so that a larger opening angle can be formed between the two clamping jaws in the direction in which the mechanical hand horizontally feeds the wafer, and the mechanical hand horizontal stroke error has higher tolerance, so that the wafer is not blocked due to the too small opening angle of the clamping jaw; meanwhile, the opening angle between the two clamping jaws of other clamping groups is small, so that the clamping jaws of other clamping groups can still form pre-support for the wafer when the wafer is lowered, then the mechanical hand releases the wafer, so that the wafer is kept at the pre-supporting height, and then the clamping jaw is reset to complete clamping of the wafer.

[0030] 2. The linkage mechanism formed by the cooperation of the guide shaft pin and the long hole is used to convert the lifting action of the lifting rod into the swing action of the swing rod and the clamping jaw, and different clamping jaw swing angles are realized by setting the long holes to different lengths, so that the structure is very simple and the operation is relatively stable.

[0031] 3. The support pin is fixedly arranged in the inner side of the clamping jaw, and the pre-support for the wafer is realized by the support pin when the wafer is placed, and when the clamping jaw is closed to clamp the wafer, the clamping jaw and the support pin synchronously rotate a small angle, so that the top of the support pin is separated from the wafer while the clamping jaw clamps the wafer, and damage to the surface of the wafer is avoided during the cleaning rotation.

[0032] 4. Two swing rods are arranged in a clamping part, and the two swing rods are arranged on the left and right sides of the lifting rod respectively, so that a symmetrical transmission structure is formed, the clamping part is more balanced when being lifted, the action of the part is smoother, and one-way wear caused by long-term uneven stress of the part is also avoided.

[0033] 5. The driving part and the clamping part are arranged as two separate parts, the lifting rod is subjected to upward force by the jacking rod device when being lifted, and the reset spring is arranged to reset the lifting rod, so that the mounting structure and the sealing structure of the clamping mechanism are simplified, the driving part and the clamping part can be independently installed, maintenance is more convenient, and better sealing effect can be achieved.

[0034] 6. The design of the multi-layer sealing assembly effectively prevents chemical solution leakage, and further protects the internal mechanical structure.

[0035] 7. The clamping mechanism and the wafer cleaning device have reasonable overall design structure, and the reliability of the clamping device under different operating conditions is enhanced. BRIEF DESCRIPTION OF DRAWINGS

[0036] Figure 1 It is a structure schematic view of the wafer cleaning device of the present application.

[0037] Figure 2 Figure 1 is a schematic view of the structure of the cleaning part.

[0038] Figure 3 Figure 2 is a schematic view of the distribution of the first and second clamping groups on the support table.

[0039] Figure 4 Figure 3 is a schematic view of the structure of the clamping part.

[0040] Figure 5 Figure 4 is a side view of the clamping part.

[0041] Figure 6 Figure 5 is a partial sectional view of the assembly structure of the clamping assembly embodiment one.

[0042] Figure 7 Figure 6 is a sectional view of the clamping assembly embodiment two.

[0043] Figure 8 Figure 7 is a schematic view of the distribution of the six clamping assemblies on the support table. DETAILED DESCRIPTION

[0044] In order to make the personnel in the art better understand the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art should belong to the scope of protection of the embodiments of the present application.

[0045] In the description of the present application, it should be understood that the terms "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0046] In addition, in the description of the present application, unless otherwise specified and limited, it should be noted that the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be mechanical connection or electrical connection, it can be the communication between the two elements, it can be direct connection, or indirect connection through intermediate medium, and those of ordinary skill in the art can understand the specific meaning of the above terms according to the specific circumstances.

[0047] The present application will be further described below through the drawings and specific embodiments.

[0048] Currently, in high-level process of wafer wet processing process (such as single wafer cleaning), the proportion of horizontal cleaning and double-side cleaning process of wafer is increasing. The cleaning process usually uses a wafer horizontal cleaning device, and the specific operation mode is as follows: the wafer is clamped horizontally by a jaw, the jaw is driven to rotate the wafer by a power assembly (such as a motor), and the cleaning process of the front surface of the wafer is completed by spraying chemical liquid on the front surface of the wafer during the rotation of the wafer. For back cleaning process, chemical liquid needs to be sprayed from the back of the wafer. In order to improve the capacity of the machine and speed up the spin-drying process of the wafer, a high-purity nitrogen blowing function is usually provided.

[0049] As shown in Figures 1-3 , the present application provides a specific wafer cleaning device, which comprises a cleaning part 1 and an enclosed cover 2, and the cleaning part 1 is arranged on the inner side of the enclosed cover 2.

[0050] The cleaning part 1 comprises a center rotating supporting mechanism 100 and a clamping mechanism 200, the center rotating supporting mechanism 100 comprises a support table 11, a base table 12 located below the support table 11, and a rotating driving mechanism 17 located in the base table 12, and the rotating driving mechanism is used to drive the support table 11 to rotate.

[0051] In this embodiment, the clamping mechanism 200 comprises four clamping assemblies 21 for clamping the wafer 90, and the clamping assembly 21 comprises a driving part 211 and a clamping part 212, the clamping part 212 is arranged on the support table 11, and the driving part 211 is located below the clamping part 212 for driving the jaw 201 of the clamping part 212 to swing. As shown in Figure 3 , the four clamping assemblies 21 are uniformly distributed in the circumferential direction of the support table 11, and the four clamping assemblies 21 are arranged opposite to each other to form two clamping groups, namely a first clamping group 21a and a second clamping group 21b. Of course, in other embodiments, the clamping assemblies 21 can also be other numbers, for example Figure 8 , the clamping assembly 21 is 6.

[0052] The plurality of clamping assemblies 21 are uniformly distributed in the circumferential direction of the support table 11, and the plurality of clamping assemblies 21 are arranged opposite to each other to form a plurality of clamping groups; wherein the plurality of clamping groups have at least two jaw swing angle ranges, the clamping assemblies in the same group have the same jaw swing angle range, and the two jaw swing angle ranges in the clamping group arranged in the transverse feeding direction of the feeding manipulator are larger.

[0053] The loading door 20 is arranged on the closed cover 2, and is used for a wafer loading robot (not shown in the figure) to horizontally send the wafer into the closed cover 2. In the embodiment, the first clamping group 21a is arranged in the horizontal sending direction F of the wafer loading robot, and the swing angle range of the clamping jaw 201 in the first clamping group 21a is greater than the swing angle range of the clamping jaw 201 in the second clamping group 21b, and most preferably, the swing angle range of the clamping jaw 201 in the first clamping group 21a is greater than the swing angle range of the clamping jaw 201 in the second clamping group 21b by 3°-4.5°, so that a greater opening angle can be formed between the two clamping jaws 201 in the horizontal sending direction of the wafer by the wafer loading robot, and the horizontal travel error of the wafer loading robot can be more tolerable, and the wafer can be prevented from being blocked due to the too small opening angle of the clamping jaw 201. At the same time, the opening angle between the two clamping jaws 201 of the second clamping group 21b is smaller than the opening angle between the two clamping jaws 201 of the first clamping group 21a, and when the wafer is lowered into the second clamping group 21b, the clamping jaw 201 of the second clamping group 21b can still pre-support the wafer, and then the wafer loading robot releases the wafer, so that the wafer is kept at the pre-supporting height, and then the clamping jaw 201 is reset to complete the clamping of the wafer.

[0054] As shown in Figure 4 , Figure 5 The clamping part 212 includes the clamping jaw 201, the lifting rod 202 and the swing rod 203, the clamping jaw 201 is fixedly connected to the swing rod 203 and is installed on the support table 11 through the rotating shaft 205, and the clamping jaw 201 protrudes upward from the table top of the support table 11. At least one support needle 204 is further fixed to the inner side of each clamping jaw 201, and in the embodiment, the support needle 204 is two, and the two support needles 204 are distributed at intervals. The lifting rod 202 is connected to the swing rod 203 through a linkage structure, and is used to drive the swing rod 203 to swing around the rotating shaft 205, so that the clamping jaw 201 and the support needle 204 swing synchronously. The support needle 204 can pre-support the wafer when the wafer is placed, that is, when the clamping jaw 201 is opened, the wafer is lowered onto the support needle 204, and in the subsequent closing process of the clamping jaw 201, the clamping jaw 201 and the support needle 204 synchronously rotate by a small angle, so that the top end of the support needle 204 is separated from the wafer while the clamping jaw 201 clamps the edge side wall of the wafer, and damage to the lower surface of the wafer during the cleaning rotation is avoided.

[0055] In the embodiment, the linkage structure comprises a guide shaft pin 202a arranged on the lifting rod 202, and a long hole 203a formed on the swing rod 203, the long direction of the long hole 203a is arranged to be inclined to the horizontal plane, and the guide shaft pin 202a is inserted into the long hole 203a and can relatively move in the long hole 203a. The relative movement of the guide shaft pin 202a in the long hole 203a helps to accurately control the swing angle of the clamping jaw 201, and improves the clamping precision. The long hole 203a arranged to be inclined has a better guiding effect on the guide shaft pin 202a, and reduces the friction loss in the use process, and the inclined structure design reduces the lateral deviation during swinging, and ensures the stability of the clamping part 212 during the operation process. The design reduces the complex mechanical connection, reduces the failure rate, and simplifies the maintenance work.

[0056] The two swing rods 203 are arranged on the left and right sides of the lifting rod 202 respectively, forming a symmetrical transmission structure, and the clamping jaw 201 is fixedly connected to one of the swing rods 203. The symmetrical transmission structure formed by the two swing rods 203 can make the clamping part 212 more balanced when being jacked up, make the action of the part more smooth, and also avoid the one-way wear caused by the long-term uneven force of the part.

[0057] The length of the long hole 203a in the first clamping group 21a is greater than the length of the long hole 203a in the second clamping group 21b. The relative movement stroke interval of the guide shaft pin 202a in the long hole 203a starts from one end of the long hole 203a to the other end of the long hole 203a, and the length of the long hole 203a can be changed to limit the relative movement stroke of the guide shaft pin 202a. Different long hole 203a lengths in the first clamping group 21a and the second clamping group 21b can finally realize different swing angles of the respective clamping jaws 201, so that the length of the long hole 203a in the first clamping group 21a is greater than the length of the long hole 203a in the second clamping group 21b, which can realize that the swing angle of the clamping jaw 201 in the first clamping group 21a is greater than the swing angle of the clamping jaw 201 in the second clamping group 21b. This structure is very simple to realize and stable to operate.

[0058] In order to improve the sealing performance of the structure, prevent the key parts from being corroded by chemical solutions or dirt, and also to realize more simple installation and maintenance structure, the clamping assembly 21 in the application sets the driving part 211 and the clamping part 212 as two independent separable parts.

[0059] As Figure 6As shown in the first embodiment of the clamping assembly 21, the clamping part 212 further comprises a reset spring 206, which is arranged on the top end of the lifting rod 202; the driving part 211 is used to move upward and lift the lifting rod 202, and is used to move downward and disengage the lifting rod 202. A sealing sleeve 207 is arranged on the lower end surface of the support table 11, the top end of the lifting rod 202 is inserted into the sealing sleeve 207 and can slide along the sealing sleeve 207; the reset spring 206 is arranged in the sealing sleeve 207 and is arranged between the lifting rod 202 and the support table 11. The lifting rod 202 comprises a sleeve part 202b at the top, the lower end of the reset spring 206 is inserted into the sleeve part 202b, and the sleeve part 202b and the sealing sleeve 207 are in sliding sealing cooperation with each other.

[0060] The driving part 211 comprises a lifting device 221a and a jacking rod device 221b, the lifting device 221a is used to drive the jacking rod device 221b to lift, which can be a linear driving device such as a cylinder or a motor push rod. The jacking rod device 221b comprises a jacking rod part 208 and a cap part 209 arranged on the top end of the jacking rod part 208, and the cap part 209 is used to lift the lifting rod 202 upward.

[0061] The reset spring 206 is designed to provide a reset force to the clamping part 212 and a clamping force to the wafer, which has high operability, efficiency and reliability. At the same time, the arrangement of the reset spring 206 also enhances the stability during clamping, ensures that the clamping jaw 201 will not loosen during clamping due to external force, and the elasticity of the reset spring 206 can effectively absorb external impact, improve the overall adaptability and reliability of the system. The mutual sliding sealing cooperation of the sealing sleeve 207 and the sleeve part 202b prevents the leakage of cleaning liquid, protects the reset spring 206 from chemical corrosion, and prolongs the service life of the component.

[0062] A base 12 is arranged below the support table 11, the lifting device 221a is arranged in the base 12, and the jacking rod part 208 passes through a through hole in the base 12 upward; a first sealing assembly is arranged outside the through hole, and a second sealing assembly is arranged between the first sealing assembly and the cap part 209.

[0063] In this embodiment, the first sealing assembly is a guide sealing ring 231, and the second sealing assembly comprises a bellows 232, the upper end of the bellows 232 is connected to the upper part of the jacking rod part 208, and the lower end is connected to the guide sealing ring 231.

[0064] As Figure 7As shown, in the second embodiment of the clamping assembly 21, the first sealing assembly comprises a guide sleeve 233 and a plurality of sealing rings 234 arranged outside the guide sleeve 233, the sealing rings 234 being used to form a seal between the guide sleeve 233 and the base 12; the guide sleeve 233 is sleeved outside the top rod portion 208. The second sealing assembly comprises a sealing sleeve 235, the upper portion of the sealing sleeve 235 being sealingly connected with the top rod portion 208, specifically, the upper portion of the sealing sleeve 235 being screwed on the top rod portion 208, the top end of the sealing sleeve 235 being sealingly connected with the top rod portion 208 through a sealing ring 236. The top portion of the guide sleeve 233 is inserted into the lower end of the sealing sleeve 235 and is sealingly connected with the sealing sleeve 235.

[0065] The driving portion 211 and the clamping portion 212 are arranged as two separate parts, the lifting rod device 221b is used to apply an upward force to the lifting rod 202 during the lifting, and the reset spring 206 is arranged to reset the lifting rod 202, which simplifies the mounting structure and the sealing structure of the clamping mechanism 200, allows the driving portion 211 and the clamping portion 212 to be independently mounted, is more convenient to maintain, and can achieve a better sealing effect. At the same time, the design of the multi-layer sealing assembly also effectively prevents the chemical solution from leaking, further protecting the internal mechanical structure.

[0066] The cap portion 209 comprises a connecting portion connected with the top rod portion 208 and a lifting portion 209a extending to the radial outside of the support table 11, the lifting portion 209a being used to contact the lifting rod 202. The large cap portion 209 structure arranged at the top end of the top rod portion 208 can realize the lifting function of the driving portion 211 and the clamping portion 212 under the condition of being eccentric, allows the driving portion 211 located at the lower portion to be arranged as close to the center of the cleaning portion 1 as possible, and makes the structure more compact.

[0067] The first stop ring 13 and the second stop ring 14 are arranged at the radial outside of the cleaning portion 1, and are used to block and recover the cleaning liquid during the wafer cleaning process. The first lifting mechanism 15 and the second lifting mechanism 16 are arranged below the first stop ring 13 and the second stop ring 14 respectively and are used to drive the first stop ring 13 and the second stop ring 14 to lift.

[0068] Obviously, the above embodiments are only examples for clearly illustrating, but not limiting the embodiments. Based on the above description, other different forms of changes or variations can be made by those skilled in the art. Here, all the embodiments do not need to be exhausted, and the obvious changes or variations derived therefrom are still within the protection scope of the present application.

Claims

1. A clamping mechanism, characterized by, The application relates to a wafer clamping assembly, which comprises a plurality of clamping components for clamping wafers, the clamping components comprising driving parts and clamping parts, the clamping parts being arranged on a support table, the driving parts being arranged below the clamping parts for driving the clamping jaws of the clamping parts to swing, the plurality of clamping components being uniformly distributed in the circumferential direction of the support table, and the plurality of clamping components being arranged oppositely in pairs to form a plurality of clamping groups, wherein the plurality of clamping groups have at least two clamping jaw swing angle ranges, and the clamping jaws of the clamping components in the same group have the same clamping jaw swing angle range.

2. The clamping mechanism of claim 1, wherein: The clamping part further comprises a lifting rod and a swing rod, the clamping jaws are fixedly connected to the swing rod and are arranged on the support table through a rotating shaft, and the clamping jaws protrude upward from the table surface of the support table; the lifting rod is connected to the swing rod through a linkage structure and is used for driving the swing rod to swing around the rotating shaft.

3. The clamping mechanism of claim 2, wherein: The linkage structure comprises a guide shaft pin arranged on the lifting rod and a long hole arranged on the swing rod, the guide shaft pin is inserted into the long hole and can relatively move in the long hole.

4. The clamping mechanism of claim 3, wherein: The long hole in the clamping group with a larger clamping jaw swing angle range has a length greater than that of the long hole in the other clamping groups.

5. The clamping mechanism of claim 3, wherein: The long direction of the long hole is relatively inclined to the horizontal plane.

6. The clamping mechanism of claim 3, wherein: The swing rod is two, and the two swing rods are arranged on the left and right sides of the lifting rod, respectively, and the clamping jaws are fixedly connected to one of the swing rods.

7. The clamping mechanism of claim 6, wherein: The two swing rods are symmetrically arranged on the left and right sides of the lifting rod.

8. The clamping mechanism of claim 1, wherein: The difference between the two clamping jaw swing angle ranges of the plurality of clamping groups is 3-4.5 degrees.

9. The clamping mechanism of claim 1, wherein: The clamping components are four, and the four clamping components are arranged oppositely in pairs to form two clamping groups.

10. The clamping mechanism of claim 1, wherein: At least one supporting needle is further fixed to the inner side of each clamping jaw.

11. A clamping mechanism according to any one of claims 2 to 7, wherein: The clamping part further comprises a reset spring, the reset spring is arranged on the top end of the lifting rod; the driving part is used for moving upward and lifting the lifting rod and is used for moving downward and separating from the lifting rod.

12. The clamping mechanism of claim 11, wherein: A sealing sliding sleeve is arranged on the lower end surface of the support table, the top end of the lifting rod is inserted into the sealing sliding sleeve and can slide along the sealing sliding sleeve; the reset spring is arranged in the sealing sliding sleeve and is arranged between the lifting rod and the support table.

13. The clamping mechanism of claim 12, wherein: The lifting rod comprises a sleeve part at the top, the lower end of the reset spring is inserted into the sleeve part, and the sleeve part and the sealing sliding sleeve are in sliding sealing cooperation.

14. The clamping mechanism of any one of claims 2-7, wherein: The driving part comprises a jacking device and a jacking rod device, the jacking device is used for driving the jacking rod device to lift and fall; the jacking rod device comprises a jacking rod part and a cap part at the top end of the jacking rod part, and the cap part is used for lifting the lifting rod upward.

15. The clamping mechanism of claim 14, wherein: The cap part comprises a connecting part connected to the jacking rod part and a jacking part extending to the radial outside of the support table, and the jacking part is used for contacting the lifting rod.

16. The clamping mechanism of claim 14, wherein: A base table is arranged below the support table, the jacking device is arranged in the base table, and the jacking rod part passes through a through hole in the base table upward; a first sealing assembly is arranged outside the through hole, and a second sealing assembly is arranged between the first sealing assembly and the cap part.

17. The clamping mechanism of claim 16, wherein: The second sealing assembly comprises a bellows, the upper end of the bellows is connected to the upper part of the jacking rod part, and the lower end is connected to the first sealing assembly.

18. The clamping mechanism of claim 16, wherein: The first sealing assembly comprises a guide sleeve and at least one sealing ring arranged outside the guide sleeve; the guide sleeve is sleeved outside the jacking rod part.

19. The clamping mechanism of claim 18, wherein: The second sealing assembly comprises a sealing sleeve, an upper portion of the sealing sleeve is sealingly connected with the top rod portion, and a top portion of the guide sleeve is inserted into a lower end of the sealing sleeve and is in sliding sealing connection with the sealing sleeve.

20. The clamping mechanism of claim 19, wherein: The upper portion of the sealing sleeve is screwed on the top rod portion, and the top end of the sealing sleeve is sealed with the top rod portion by a sealing ring.

21. A wafer cleaning apparatus, characterized by: The cleaning part comprises the clamping mechanism as claimed in any one of claims 1-20 and a rotary driving mechanism arranged below the support table, the rotary driving mechanism being used to drive the support table to rotate; the closed cover is provided with a feeding door, which is used for the wafer feeding robot to horizontally send the wafer into the closed cover; and the clamping group with a larger swing angle range of the clamping mechanism is arranged in the horizontal feeding direction of the wafer feeding robot.

22. The wafer cleaning apparatus of claim 21, wherein: At least one baffle ring is arranged on the radial outer side of the cleaning part, the baffle ring being used to block and recover the cleaning liquid; and a baffle ring jacking mechanism is arranged below the baffle ring.

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