Ceramic package core board and package substrate

Abstract

The utility model provides a kind of ceramic packaging core plate and a kind of packaging substrate, ceramic packaging core plate includes ceramic graphic plate, through hole and ceramic support plate, ceramic graphic plate includes first connecting part and graphic part, first connecting part surrounds around graphic part, the lower surface of graphic part is projected on the lower surface of first connecting part;Through hole is through the graphic part of ceramic graphic plate, ceramic support plate includes second connecting part and support part, second connecting part is located below first connecting part and surrounds around the part of graphic part projected on the lower surface of first connecting part, support part surrounds around first connecting part and second connecting part four quarters.The ceramic packaging core plate of the utility model can avoid core plate warping after multilayer lamination, meet the manufacture of super-fine line, improve heat dissipation efficiency.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of semiconductor integrated circuit manufacturing, and relates to a ceramic packaging core plate and a packaging substrate. BACKGROUND

[0002] In order to pursue higher performance and lower power consumption, semiconductor integrated circuits are developing towards miniaturization and high integration, which promotes the innovation of primary packaging technology and puts forward higher requirements for the performance of packaging substrates. Traditional substrates use organic core plate materials (mainly composed of epoxy resin and glass fiber cloth) as rigid support, and stack dielectric layers and conductive layers on the organic core plate layer by layer to realize the electrical connection of zero-level packaging bodies and secondary packaging bodies. The integration of primary packaging is improved by increasing the number of stacked layers and improving the wiring density of conductive layer metal lines (i.e. reducing the line width).

[0003] In conventional consumer electronics, the number of stacked layers in the packaging substrate is 4-10, and the width of the conductive layer metal line is 15-40 μm. With the development of high-performance processors in the fields of artificial intelligence and servers, the demand for the number of stacked layers is increased to 14-20, and the width of the conductive layer metal line is increased to 2-8 μm to further improve the integration, but the increase in the number of stacked layers will cause the warping deformation problem of the packaging substrate to be more serious, and will also affect the production of ultra-fine lines. The height of the warped core plate is not uniform at all, and on the surface with a height difference of about ± 40 μm, the photolithography system will present a virtual image, which cannot provide enough energy and accurate line width information for photolithography, making it difficult to produce ultra-fine lines. Therefore, the packaging substrate with high integration requires higher rigidity and surface flatness of the core plate.

[0004] The traditional organic substrate increases the thickness of the core plate to enhance the overall rigidity, but this will cause the heat dissipation performance of the substrate to decrease, causing the processor frequency to drop suddenly during long-term high-speed operation, affecting the product performance.

[0005] Therefore, how to provide a ceramic packaging core plate to avoid warping of the core plate during the stacking of multiple dielectric layers and conductive layers, meet the production of ultra-fine lines, and improve the heat dissipation efficiency, has become an important problem to be solved by the technical personnel in the field.

[0006] It should be noted that the above introduction to the technical background is only for the convenience of clearly and completely describing the technical scheme of the present application, and for the convenience of understanding by the technical personnel in the field. The above technical scheme cannot be considered as known by the technical personnel in the field only because it is described in the background section of the present application. UTILITY MODEL CONTENT

[0007] In view of the above-mentioned prior art defects, the purpose of the present application is to provide a ceramic packaging core plate and a packaging substrate, which are used to solve the problem that the core plate warps during the stacking process of the multilayer dielectric layer and the conductive layer, cannot meet the production of ultra-fine lines, and the heat conduction performance is reduced.

[0008] To achieve the above-mentioned purpose and other related purposes, the present application provides a ceramic packaging core plate, which comprises:

[0009] The ceramic pattern plate comprises a first connecting part and a pattern part, the first connecting part surrounds the pattern part, and the lower surface of the pattern part protrudes from the lower surface of the first connecting part;

[0010] The through hole penetrates the pattern part;

[0011] The ceramic support plate comprises a second connecting part and a support part, the second connecting part is located below the first connecting part and surrounds the part of the pattern part protruding from the lower surface of the first connecting part, and the support part surrounds the first connecting part and the second connecting part.

[0012] Optionally, it further comprises a first adhesive layer, and the lower surface of the first connecting part and the upper surface of the second connecting part are connected through the first adhesive layer.

[0013] Optionally, the thickness of the pattern part ranges from 0.08mm to 0.8mm, the thickness of the first connecting part ranges from 0.02mm to 0.4mm, and the thickness ratio of the first connecting part to the pattern part ranges from 0.2 to 0.6.

[0014] Optionally, the upper surface of the pattern part protrudes from the upper surface of the first connecting part, and the ceramic packaging core plate further comprises a ceramic support cover plate, which is located above the support part and the first connecting part and surrounds the part of the pattern part protruding from the upper surface of the first connecting part.

[0015] Optionally, the upper surface of the ceramic support cover plate is flush with the upper surface of the pattern part.

[0016] Optionally, the ceramic packaging core plate further comprises a second adhesive layer, and the lower surface of the ceramic support cover plate and the upper surface of the first connecting part are connected through the second adhesive layer.

[0017] Optionally, the hole type of the through hole comprises at least one of a circle, a triangle and a rectangle, when the hole type of the through hole is a circle, the diameter of the through hole ranges from 80μm to 250μm.

[0018] Optionally, the lower surface of the second connecting portion is flush with the lower surface of the graphic portion, the upper surface of the supporting portion is flush with the upper surface of the first connecting portion, and the lower surface of the supporting portion is flush with the lower surface of the graphic portion.

[0019] The application further provides a packaging substrate, comprising the graphic portion according to any one of the above embodiments, and

[0020] A metal seed layer covers the opposite surfaces of the graphic portion and the inner wall of the through hole.

[0021] A metal layer covers the surface of the metal seed layer and fills the through hole.

[0022] A stack layer is located on the opposite surfaces of the graphic portion and covers the metal layer, wherein the stack layer comprises a dielectric layer and a conductive layer.

[0023] Optionally, the number of the stack layers on any one surface of the graphic portion is one or more.

[0024] As described above, the ceramic packaging core plate of the application comprises a ceramic graphic plate, a through hole and a ceramic supporting plate. The ceramic graphic plate comprises a first connecting portion and a graphic portion. The first connecting portion surrounds the graphic portion. The lower surface of the graphic portion protrudes from the lower surface of the first connecting portion. The through hole penetrates the graphic portion of the ceramic graphic plate. The ceramic supporting plate comprises a second connecting portion and a supporting portion. The second connecting portion is located below the first connecting portion and surrounds the portion of the graphic portion protruding from the lower surface of the first connecting portion. The supporting portion surrounds the first connecting portion and the second connecting portion. The ceramic packaging core plate of the application can avoid warping of the core plate after multi-layer stacking, meet the manufacturing of ultra-fine lines, and improve the heat dissipation efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 A structure schematic diagram of the ceramic packaging core plate of the application in an embodiment is shown.

[0026] Figure 2 A structure schematic diagram of the ceramic packaging core plate of the application in another embodiment is shown. Figure 1 A top view of the structure shown.

[0027] Figure 3 A structure schematic diagram of the ceramic packaging core plate of the application in an embodiment is shown.

[0028] Figure 4 A structure schematic diagram of the ceramic packaging core plate of the application in another embodiment is shown. Figure 3 A top view of the structure shown.

[0029] Figure 5 A top view of the ceramic graphic plate structure formed in a method for manufacturing the ceramic packaging core plate is shown.

[0030] Figure 6shown is a cross-sectional view of the structure shown. Figure 5

[0031] Figure 7 shown is a top view of a ceramic support plate structure formed in a method of making a ceramic package core plate.

[0032] Figure 8 shown is a cross-sectional view of the structure shown. Figure 7

[0033] Figure 9 shown is a schematic view of the structure after forming a first adhesion layer on the top surface of the first connecting portion in a method of making a ceramic package core plate.

[0034] Figure 10 shown is a schematic view of the structure after aligning and adhering the ceramic pattern plate to the ceramic support plate in a method of making a ceramic package core plate.

[0035] Figure 11 shown is a schematic view of the structure after grinding the top and bottom surfaces of the ceramic package core plate in a method of making a ceramic package core plate.

[0036] Figure 12 shown is a cross-sectional view of the structure shown.

[0037] Figure 13 shown is a top view of a ceramic support cover plate structure formed in a method of making a ceramic package core plate.

[0038] Figure 14 shown is a cross-sectional view of the structure shown. Figure 13

[0039] Figure 15 shown is a schematic view of the structure after adhering the ceramic pattern plate to the ceramic support cover plate in a method of making a ceramic package core plate.

[0040] Figure 16 shown is a schematic view of the structure after forming a second adhesion layer on the top surface of the first connecting portion in a method of making a ceramic package core plate.

[0041] Figure 17 shown is a schematic view of the structure after adhering the ceramic support cover plate to the ceramic pattern plate in a method of making a ceramic package core plate.

[0042] Figure 18 shown is a schematic view of the structure after grinding the top and bottom surfaces of the ceramic package core plate and cutting the left and right sides of the ceramic package core plate in a method of making a ceramic package core plate.

[0043] Figure 19 ​​​FIG. 1 shows a schematic diagram of a structure resulting from forming a metal seed layer, a metal layer, and a stack in a method of making a package substrate.

[0044] Figure 20 FIG. 2 shows a schematic diagram of a structure resulting from cutting along the outer edge of the patterned portion in a method of making a package substrate.

[0045] Figure 21 FIG. 3 shows a schematic diagram of another structure resulting from forming a metal seed layer, a metal layer, and a stack in a method of making a package substrate.

[0046] Figure 22 FIG. 4 shows a schematic diagram of another structure resulting from cutting along the outer edge of the patterned portion in a method of making a package substrate.

[0047] BRIEF DESCRIPTION OF DRAWINGS

[0048] 1 ceramic patterned plate

[0049] 101 first connecting portion

[0050] 102 patterned portion

[0051] 103 via

[0052] 2 ceramic support plate

[0053] 201 support portion

[0054] 202 second connecting portion

[0055] 203 first opening

[0056] 204 ceramic support cover plate

[0057] 205 second opening

[0058] 301 first adhesive layer

[0059] 302 second adhesive layer

[0060] 4, 5 ceramic package core plate

[0061] 6 metal seed layer

[0062] 7 metal layer

[0063] 8 dielectric layer

[0064] 9 conductive layer

[0065] W width of first connecting portion DETAILED DESCRIPTION

[0066] As a structural material, ceramics has high bending strength, good creep performance, high hardness and high temperature resistance, etc. The substrate core plate made of ceramics has higher hardness than organic core plate, and has smaller warping under high layer structure. In the integrated circuit lithography process, smaller warping means higher tolerance to the focal depth of the lithography system, which can avoid the out-of-focus of high-resolution lithography system caused by the surface relief of the substrate, and solve the problem of insufficient energy or size out-of-tolerance in super-fine line lithography. In addition, the thermal conductivity of the ceramic core plate is at least 40 times that of the organic core plate. In high-performance computing processors, excellent thermal conductivity can avoid the problem of processor performance degradation and application service interruption caused by temperature rise during long-time high-frequency operation. However, the ceramic core plate has the problem of fragility. The inventors of the present application use a local toughening and strengthening structure to enhance the brittle resistance of the ceramic core plate and ensure the strength of the ceramic core package substrate during the manufacturing process.

[0067] The emerging 3D printing technology, also known as additive manufacturing technology, is one of the rapid prototyping technologies. It is a technology that uses powder-like metal or plastic and other bondable materials as the basis, and constructs objects through layer-by-layer printing and layer-by-layer stacking. From the perspective of economy and environmental protection, using the additive manufacturing process can form a ceramic core plate with electrical connection through holes at one time, greatly simplifying the process flow of core plate manufacturing, while avoiding the use, treatment and discharge of a large amount of chemical reagents, and reducing environmental pollution.

[0068] The embodiments of the present application will be described in detail below with specific examples. Those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in the specification. The present application can also be implemented or applied in different specific embodiments, and various modifications or changes can be made to the details in the specification without departing from the spirit of the present application.

[0069] It should be emphasized that the term "comprising / comprising" as used herein refers to the presence of a feature, whole, step or component, but does not exclude the presence or addition of one or more other features, whole, step or component.

[0070] Features described and / or shown with respect to one embodiment can be used in the same or similar manner in one or more other embodiments, in combination with features in other embodiments, or instead of features in other embodiments.

[0071] As in the detailed description of the embodiments of the present application, for the convenience of description, the schematic diagram showing the structure of the device will be partially enlarged without general proportion, and the schematic diagram is only an example, which should not limit the scope of protection of the present application here. In addition, three-dimensional spatial dimensions including length, width and depth should be included in actual manufacturing.

[0072] For convenience of description, spatial relationship words such as "under", "below", "lower", "underneath", "above", "upper" and the like can be used herein to describe the relationship of one element or feature to another element or feature as shown in the drawings. It will be understood that these spatial relationship words are intended to encompass different orientations of the device in use or operation in addition to the orientations depicted in the drawings. Further, when a layer is referred to as being "between" two layers, it can be the only layer between the two layers or one or more intervening layers can also be present.

[0073] In the context of the present application, a structure described as having a first feature "on" a second feature can include embodiments in which the first and second features form direct contact, as well as embodiments in which additional features are formed between the first and second features such that the first and second features can not be in direct contact.

[0074] It should be noted that the diagrams provided in the embodiments only schematically illustrate the basic concept of the present application, and thus only the components related to the present application are shown in the diagrams, rather than being drawn according to the number, shape and size of the components in actual implementation. The shape, number and proportion of the components in actual implementation can be arbitrarily changed, and the layout pattern of the components can be more complex.

[0075] Embodiment one

[0076] The utility model provides a kind of ceramic packaging core plate, please refer to Figure 1 , it is shown as the structure schematic diagram of ceramic packaging core plate of this embodiment, including: ceramic graphic board 1, through hole 103 and ceramic support plate 2, wherein, the ceramic graphic board 1 includes first connecting portion 101 and graphic portion 102, the first connecting portion 101 surrounds the graphic portion 102 around, the lower surface of the graphic portion 102 is protruding from the lower surface of the first connecting portion 101, the through hole 103 is through the graphic portion 102 of the ceramic graphic board 1, the ceramic support plate 2 includes second connecting portion 202 and support portion 201, the second connecting portion 202 is located below the first connecting portion 101 and surrounds the graphic portion 102 around protruding from the lower surface of the first connecting portion 101 portion, the support portion 201 surrounds the first connecting portion 101 around and the second connecting portion 202 around, the ceramic graphic board 1 and the ceramic support plate 2 constitute the structure of local toughening reinforcement, can enhance the brittle resistance of ceramic core plate, guarantee the strength of ceramic core packaging substrate in manufacturing process.

[0077] As an example, the number of the ceramic graphic board 1 can be one or more, and the number of the ceramic support plate 2 is the same as the number of the ceramic graphic board 1.

[0078] As an example, the size of the ceramic graphic plate 1 ranges from 20x20mm to 350x410mm, and in the present embodiment, the size of the ceramic graphic plate 1 is 350x410mm, wherein the size of the graphic portion 102 is 340x400mm.

[0079] As an example, please refer to Figure 2 , which shows a top view of the structure of the ceramic graphic plate 1 of the present embodiment, the width W of the first connecting portion 101 ranges from 5mm to 10mm.

[0080] As an example, the size of the ceramic support plate 2 ranges from 414x516mm to 424x526mm, wherein the size of the second connecting portion 202 is consistent with the size of the first connecting portion 101 of the ceramic graphic plate 1.

[0081] As an example, the size of the ceramic support plate 2 can also range from 510x515mm to 520x525mm, wherein the size of the second connecting portion 202 is consistent with the size of the first connecting portion 101 of the ceramic graphic plate 1.

[0082] As an example, the first connecting portion 101 is connected to the second connecting portion 202 through the first adhesive layer 301.

[0083] As an example, the thickness of the graphic portion 102 ranges from 0.08mm to 0.8mm, the thickness of the first connecting portion 101 ranges from 0.02mm to 0.4mm, and the thickness ratio of the first connecting portion 101 to the graphic portion 102 ranges from 0.2 to 0.6, preferably one half, and in the present embodiment, the thickness of the graphic portion 102 is 0.3mm, and the thickness of the first connecting portion 101 is 0.1mm.

[0084] As an example, the thickness of the support portion 201 is consistent with the thickness of the graphic portion 102, and in the present embodiment, the thickness of the support portion 201 is 0.3mm, and the thickness of the second connecting portion 202 is 0.15mm.

[0085] As an example, the hole type of the through hole 103 includes at least one of a circle, a triangle, and a rectangle, and when the hole type of the through hole 103 is a circle, the diameter of the through hole 103 ranges from 80μm to 250μm, and in the present embodiment, the diameter of the through hole 103 is 150μm.

[0086] The ceramic packaging core plate of the embodiment adopts a 3D printing technology and a locally toughened and reinforced structure, enhances the brittle resistance of the ceramic core plate, ensures the strength of the ceramic core packaging substrate during the manufacturing process, avoids warping of the core plate during the stacking of the multi-layer dielectric layer and the conductive layer, can meet the manufacturing of ultra-fine lines, and improves the heat dissipation capacity of the packaging substrate.

[0087] Embodiment two

[0088] Another ceramic packaging core plate is provided in the utility model, please refer to Figure 2 , which is a structural schematic diagram of the ceramic packaging core plate of the embodiment, comprising: a ceramic pattern plate 1, a through hole 103, a ceramic support plate 2 and a ceramic support cover plate 204, wherein the ceramic pattern plate 1 comprises a first connecting part 101 and a pattern part 102, the first connecting part 101 surrounds the pattern part 102, the upper surface of the pattern part 102 is protruded from the upper surface of the first connecting part 101, the lower surface of the pattern part 102 is protruded from the lower surface of the first connecting part 101, the through hole 103 penetrates the pattern part 102 of the ceramic pattern plate 1, the ceramic support plate 2 comprises a second connecting part 202 and a support part 201, the second connecting part 202 is located below the first connecting part 101 and surrounds the part of the pattern part 102 protruded from the lower surface of the first connecting part 101, the support part 201 surrounds the first connecting part 101 and the second connecting part 202, and the ceramic support cover plate 204 is located above the support part 201 and the first connecting part 101 and surrounds the part of the pattern part 102 protruded from the upper surface of the first connecting part 101.

[0089] As an example, the lower surface of the second connecting part 202 is flush with the lower surface of the pattern part 102, the upper surface of the support part 201 is flush with the upper surface of the first connecting part 101, the lower surface of the support part 201 is flush with the lower surface of the pattern part 102, the upper surface of the ceramic support cover plate 204 is flush with the upper surface of the pattern part 102, the ceramic pattern plate 1, the ceramic support plate 2 and the ceramic support cover plate 204 constitute a locally toughened and reinforced structure, which can enhance the brittle resistance of the ceramic core plate and ensure the strength of the ceramic core packaging substrate during the manufacturing process.

[0090] As an example, the number of the ceramic pattern plate 1 can be one or more, and the number of the ceramic support plate 2 and the ceramic support cover plate 204 is the same as that of the ceramic pattern plate 1.

[0091] As an example, the size of the ceramic graphic plate 1 ranges from 20x20mm to 350x410mm, and in the present embodiment, the size of the ceramic graphic plate 1 is 350x410mm, wherein the size of the graphic portion 102 is 340x400mm.

[0092] As an example, please refer to Figure 4 , which is a top view showing the structure of the ceramic graphic plate 1 of the present embodiment, the width W of the first connecting portion 101 ranges from 5mm to 10mm.

[0093] As an example, the size of the ceramic support plate 2 ranges from 414x516mm to 424x526mm, wherein the size of the second connecting portion 202 is consistent with the size of the first connecting portion 101 of the ceramic graphic plate 1.

[0094] As an example, the first connecting portion 101 is connected to the second connecting portion 202 through a first adhesive layer 301.

[0095] As an example, the thickness of the graphic portion 102 ranges from 0.08mm to 0.8mm, the thickness of the first connecting portion 101 ranges from 0.02mm to 0.4mm, and the thickness ratio of the first connecting portion 101 to the graphic portion 102 ranges from 0.2 to 0.6, preferably one-third, and in the present embodiment, the thickness of the graphic portion 102 is 0.3mm, and the thickness of the first connecting portion 101 is 0.1mm.

[0096] As an example, the thickness of the support portion 201 is the sum of the thicknesses of the first connecting portion 101 and the second connecting portion 202, and in the present embodiment, the thickness of the support portion 201 is 0.2mm, and the thickness of the second connecting portion 202 is 0.1mm.

[0097] As an example, the thickness of the ceramic support cover plate 204 is greater than 0.02mm, and in the present embodiment, the thickness of the ceramic support cover plate 204 is 0.1mm.

[0098] As an example, the lower surface of the ceramic support cover plate 204 is connected to the upper surface of the first connecting portion 101 through a second adhesive layer 302.

[0099] As an example, the hole type of the through hole 103 includes at least one of a circle, a triangle, and a rectangle, and when the hole type of the through hole 103 is a circle, the diameter of the through hole 103 ranges from 80μm to 250μm, and in the present embodiment, the diameter of the through hole 103 is 150μm.

[0100] The ceramic encapsulation core board in this embodiment adopts 3D printing technology and a locally toughened and reinforced structure, which enhances the brittleness resistance of the ceramic core board, ensures the strength of the ceramic core encapsulation substrate during the manufacturing process, avoids warping of the core board during the stacking of multiple dielectric and conductive layers, can meet the requirements of ultra-fine circuit fabrication, and improves the heat dissipation capacity of the encapsulation substrate.

[0101] Example 3

[0102] This embodiment provides a method for manufacturing the ceramic encapsulation core board of this utility model, including the following steps:

[0103] Please see Figures 5-6 First, perform step S1: use 3D printing to form a ceramic graphic plate 1.

[0104] For details, please refer to [link / reference]. Figure 5 , Figure 5 The diagram shows a top view of the ceramic pattern plate 1 structure formed in the method of ceramic encapsulation core board of this embodiment. The ceramic pattern plate 1 includes a first connecting portion 101 and a pattern portion 102. Please refer to [further details omitted]. Figure 6 , Figure 6 Displayed as Figure 5 The cross-sectional view of the structure shown shows that the graphic portion 102 protrudes from one side of the first connecting portion 101, and a through hole 103 is provided in the graphic portion 102. The through hole 103 is used for electrical connection of the encapsulation substrate.

[0105] As an example, the ceramic pattern plate 1 may be made of one or more of ZTA (zirconia toughened alumina) ceramic, AlN ceramic, and Si3N4 ceramic. The size range of the ceramic pattern plate 1 is 20×20mm to 350×410mm. In this embodiment, the ceramic pattern plate 1 is made of Al2O3 ceramic, and the size of the ceramic pattern plate 1 is 350×410mm. The size of the pattern part 102 is 340×400mm.

[0106] For example, please refer to [link / reference]. Figure 5 The width W of the first connecting part 101 is in the range of 5mm to 10mm.

[0107] As an example, the thickness ratio of the first connecting portion 101 to the graphic portion 102 ranges from 0.2 to 0.6, preferably half. The cross-section resulting from the thickness difference between the first connecting portion 101 and the graphic portion 102 is the coupling surface (i.e., the upper surface) of the first connecting portion 101, used for coupling with... Figure 10 The coupling surface (i.e., the lower surface) of the second connecting plate is used for connection. In this embodiment, the thickness of the graphic part 102 is 0.3 mm, and the thickness of the first connecting part 101 is 0.15 mm.

[0108] As an example, the hole type of the through hole 103 includes at least one of a circle, a triangle and a rectangle, when the hole type of the through hole 103 is a circle, the diameter of the through hole 103 ranges from 80 μm to 250 μm, in the embodiment, the diameter of the through hole 103 is 150 μm.

[0109] Please refer to Figures 7-8 , the step S2 is performed: forming the ceramic support plate 2 using 3D printing.

[0110] Specifically, please refer to Figure 7 , Figure 7 A top view of the structure of the ceramic support plate 2 formed in the method of the ceramic packaging core plate of the embodiment is shown, the ceramic support plate 2 includes a second connecting part 202 and a support part 201, the support part 201 surrounds the second connecting part 202 and is connected with the second connecting part 202, please refer to Figure 8 , Figure 8 A cross-sectional view of the structure shown in Figure 7 , the second connecting part 202 is recessed on one side of the support part 201, and the second connecting part 202 is internally provided with a first opening 203 corresponding to the pattern part 102 of the ceramic pattern plate 1, the first opening 203 is used for embedding the pattern part 102 in the second connecting part 202.

[0111] As an example, the ceramic support plate 2 can adopt one or more of ZTA (zirconia toughened alumina) ceramic, AlN ceramic and Si3N4 ceramic, the size of the ceramic support plate 2 ranges from 414 × 516 mm to 424 × 526 mm, in the embodiment, the ceramic support plate 2 adopts ZTA ceramic, and the size of the ceramic support plate 2 is 414 × 516 mm.

[0112] As an example, the size of the second connecting part 202 is consistent with the size of the first connecting part 101.

[0113] As an example, the thickness of the support part 201 is consistent with the thickness of the pattern part 102, and the thickness ratio of the second connecting part 202 to the support part 201 ranges from 0.2 to 0.6, preferably one half, in the embodiment, the thickness of the support part 201 is 0.3 mm, and the thickness of the second connecting part 202 is 0.15 mm.

[0114] Please refer to Figure 9 , the step S3 is performed: forming a first adhesion layer 301 on the upper surface of the first connecting part 101.

[0115] As an example, the coating method of the first adhesion layer 301 can adopt one of dispensing, screen printing, and spraying, and in this embodiment, the first adhesion layer 301 adopts the coating method of screen printing.

[0116] As an example, the adhesive adopted by the first adhesion layer 301 can be one of solvent type adhesive, reaction type adhesive, and thermosetting adhesive.

[0117] As an example, the thickness of the first adhesion layer 301 ranges from 5 μm to 10 μm.

[0118] Referring to Figure 10 , the step S4 of aligning and adhering the lower surface of the ceramic pattern plate 1 to the upper surface of the ceramic support plate 2 is performed to obtain the ceramic packaging core plate 4.

[0119] Specifically, the adhesive of the first adhesion layer 301 is cured at room temperature for about 5 min to 10 min to connect the ceramic pattern plate 1 and the ceramic support plate 2, and the ceramic pattern plate 1 and the ceramic support plate 2 form a locally toughened and strengthened structure, which can enhance the anti-brittleness of the core plate and ensure the strength of the ceramic core packaging substrate during the manufacturing process.

[0120] As an example, referring to Figure 11 , the step of grinding the upper and lower surfaces of the connected ceramic packaging core plate 4 is further included to remove the adhesive overflowing from the ceramic packaging core plate 4.

[0121] As an example, the grinding method adopted in the grinding step is one of mechanical grinding and chemical mechanical grinding, and the depth of the grinding ranges from 1 μm to 5 μm, and in this embodiment, the upper and lower surfaces of the ceramic packaging core plate 4 are each ground by 10 μm.

[0122] At this point, the manufacturing of the ceramic packaging core plate 4 is completed. The above method of manufacturing the ceramic packaging core plate of the present application greatly simplifies the process flow of core plate manufacturing, avoids the use, treatment, and discharge of a large amount of chemical reagents, and reduces environmental pollution.

[0123] Embodiment Four

[0124] This embodiment provides another method of manufacturing the ceramic packaging core plate of the present application, including the following steps:

[0125] Referring to Figure 12 , first, the step S1 of forming a ceramic pattern plate 1 using 3D printing is performed.

[0126] Specifically, the ceramic graphic plate 1 comprises a first connecting part 101 and a graphic part 102, the graphic part 102 protrudes from the front and back of the first connecting part 101, and the graphic part 102 is provided with a through hole 103, which is used for electrical connection of the packaging substrate.

[0127] As an example, the ceramic graphic plate 1 can adopt one or more of ZTA (zirconia toughened alumina), AlN ceramic, Si3N4 ceramic, the size of the ceramic graphic plate 1 ranges from 20x20mm to 350x410mm, in this embodiment, the ceramic graphic plate 1 adopts Al2O3 ceramic, the size of the ceramic graphic plate 1 is 350x410mm, wherein the size of the graphic part 102 is 340x400mm.

[0128] As an example, referring back to Figure 5 , the width W of the first connecting part 101 ranges from 5mm to 10mm,

[0129] As an example, the thickness ratio of the first connecting part 101 and the graphic part 102 ranges from 0.2 to 0.6, preferably one third, the cross section generated by the thickness difference between the first connecting part 101 and the graphic part 102 is the coupling surface (i.e. the upper surface) of the first connecting part 101, which is used for connection with the coupling surface (i.e. the lower surface) of the second connecting plate. In this embodiment, the thickness of the graphic part 102 is 0.3mm, and the thickness of the first connecting part 101 is 0.1mm. Figure 10

[0130] As an example, the hole type of the through hole 103 includes at least one of a circle, a triangle and a rectangle, when the hole type of the through hole 103 is a circle, the diameter of the through hole 103 ranges from 80μm to 250μm, in this embodiment, the diameter of the through hole 103 is 150μm.

[0131] Referring back to Figure 8 , the step S2 of using 3D printing to form a ceramic support plate 2 is performed.

[0132] Specifically, the ceramic support plate 2 comprises a second connecting part 202 and a support part 201, the support part 201 surrounds the second connecting part 202 and is connected with the second connecting part 202, the second connecting part 202 is recessed on one side of the support part 201, and the second connecting part 202 is internally provided with an opening corresponding to the graphic part 102 of the ceramic graphic plate 1, the opening is used for embedding the graphic part 102 into the second connecting part 202.

[0133] ​As an example, the ceramic support plate 2 may be made of one or more of ZTA (zirconia toughened alumina) ceramic, AlN ceramic, and Si3N4 ceramic. The size range of the ceramic support plate 2 is 414×516mm to 424×526mm. In this embodiment, the ceramic support plate 2 is made of ZTA ceramic and the size of the ceramic support plate 2 is 414×516mm.

[0134] As an example, the size of the second connecting portion 202 is the same as the size of the first connecting portion 101.

[0135] As an example, the thickness ratio of the second connecting portion 202 to the support portion 201 is in the range of 0.2 to 0.6. In this embodiment, the thickness of the support portion 201 is 0.2 mm and the thickness of the second connecting portion 202 is 0.1 mm.

[0136] Please see Figures 13-14 Perform step S3: Use 3D printing to form a ceramic support cover plate 204.

[0137] For details, please refer to [link / reference]. Figure 13 , Figure 13 The diagram shows a top view of the ceramic support cover plate 204 structure formed in the method of ceramic encapsulation core plate of this embodiment. The ceramic support cover plate 204 has the second opening 205. The size of the ceramic support cover plate 204 is the same as the size of the ceramic graphic plate 1. Please refer to [further details omitted]. Figure 14 , Figure 14 Displayed as Figure 13 The cross-sectional view of the structure shown shows that the size of the second opening 205 is the same as the size of the first opening 203, and the second opening 205 is used to embed the graphic part 102 into the ceramic support cover plate 204.

[0138] As an example, the ceramic support cover plate 204 may be made of one or more of ZTA (zirconia toughened alumina) ceramic, AlN ceramic, and Si3N4 ceramic. The size of the ceramic support cover plate 204 is the same as that of the ceramic support plate 2. In this embodiment, the ceramic support cover plate 204 is made of ZTA ceramic and the size of the ceramic support cover plate 204 is 424×526mm.

[0139] As an example, the thickness of the ceramic support cover plate 204 is greater than 0.02 mm, and the thickness of the ceramic support cover plate 204 is consistent with the height of the side of the graphic part 102 protruding from the first connecting part 101, in order to eliminate the height difference between the graphic part 102 and the first connecting part 101. In this embodiment, the thickness of the ceramic support cover plate 204 is 0.1 mm.

[0140] Please see againFigure 9 The step S4 is performed to form a first adhesive layer 301 on the upper surface of the first connecting part 101.

[0141] For example, the first adhesive layer 301 can be applied by dispensing, screen printing, spraying, etc. In this embodiment, the first adhesive layer 301 is applied by screen printing.

[0142] For example, the adhesive used in the first adhesive layer 301 can be solvent-based, reactive, or thermosetting.

[0143] For example, the thickness of the first adhesive layer 301 is in the range of 5-10 μm.

[0144] Referring to Figure 15 The step S5 is performed to align and adhere the lower surface of the ceramic pattern plate 1 to the upper surface of the ceramic support plate 2.

[0145] Specifically, the adhesive of the first adhesive layer 301 is cured at room temperature for about 5-10 min to connect the ceramic pattern plate 1 and the ceramic support plate 2.

[0146] Referring to Figure 16 The step S6 is performed to form a second adhesive layer 302 on the upper surface of the first connecting part 101.

[0147] For example, the second adhesive layer 302 can be applied by dispensing, screen printing, spraying, etc. In this embodiment, the second adhesive layer 302 is applied by screen printing.

[0148] For example, the adhesive used in the second adhesive layer 302 can be solvent-based, reactive, or thermosetting.

[0149] For example, the thickness of the second adhesive layer 302 is in the range of 5-10 μm.

[0150] Referring to Figure 17 The step S7 is performed to align and adhere the lower surface of the ceramic support cover plate 204 to the upper surface of the ceramic pattern plate 1 to obtain a ceramic package core plate 5.

[0151] Specifically, the adhesive of the second adhesive layer 302 is cured at room temperature for about 5-10 min to connect the ceramic pattern plate 1 and the ceramic support cover plate 204. The ceramic pattern plate 1, the ceramic support plate 2, and the ceramic support cover plate 204 form a locally toughened and reinforced structure, which can enhance the anti-brittleness of the core plate and ensure the strength of the ceramic core package substrate during the manufacturing process.

[0152] As an example, please refer to Figure 18 It also includes the steps of grinding the upper and lower surfaces of the ceramic packaging core board 5 after the connection is completed and cutting the edges of the ceramic packaging core board 5 to remove the adhesive overflowing the ceramic packaging core board 5.

[0153] As an example, the grinding method used in the grinding step is one of mechanical grinding or chemical mechanical grinding, and the depth of the grinding ranges from 1 μm to 5 μm. In this embodiment, the upper and lower surfaces of the ceramic packaging core board 5 are each ground by 10 μm.

[0154] As an example, the cutting method used in the cutting step is one of mechanical cutting or laser cutting, and the width of the cutting ranges from 5 mm to 10 mm. In this embodiment, the left and right sides of the ceramic packaging core board 5 are each cut by 10 mm.

[0155] At this point, the manufacturing of the ceramic packaging core board 5 is completed. The method of manufacturing the ceramic packaging core board of the present application greatly simplifies the process flow of core board manufacturing, while avoiding the use, treatment and discharge of a large amount of chemical reagents, reducing environmental pollution.

[0156] Example Five

[0157] This embodiment provides a method of manufacturing the packaging substrate of the present application, comprising the following steps:

[0158] (1) Please refer to Figure 19 , which shows the intention of a structure obtained after forming a metal seed layer, a metal layer and a stack in the method of manufacturing a packaging substrate, forming a metal seed layer 6 and a metal layer 7 in the through hole 103, and forming a stack on the opposite surfaces of the ceramic packaging core board (the packaging substrate uses the ceramic packaging core board 4 described in the above-mentioned embodiment one);

[0159] (2) Please refer to Figure 20 , which shows a schematic diagram of a structure obtained after cutting along the outer edge of the patterned portion in the method of manufacturing a packaging substrate, cutting along the outer edge of the patterned portion 102 (i.e. along the dashed line shown in Figure 19 and Figure 21 , to obtain a packaging substrate.

[0160] Specifically, the stack includes a dielectric layer 8 and a conductive layer 9.

[0161] As an example, the number of the stack on any one surface of the patterned portion 102 is one or more layers.

[0162] As an example, please refer to Figures 21-22 , wherein Figure 21FIG. 6 shows another structure of the method for manufacturing a packaging substrate after forming a metal seed layer, a metal layer and a laminated layer, Figure 22 FIG. 7 shows another structure of the method for manufacturing a packaging substrate after cutting along the outer edge of the patterned portion, and in another embodiment, the ceramic packaging core board can also be the ceramic packaging core board 5 described in Embodiment 2.

[0163] The packaging substrate of the embodiment can avoid warping, meet the manufacturing of ultra-fine lines and have good heat dissipation capacity due to the use of the ceramic packaging core board.

[0164] In summary, the ceramic packaging core board includes a ceramic patterned board, a through hole and a ceramic support board, the ceramic patterned board includes a first connecting portion and a patterned portion, the first connecting portion surrounds the patterned portion, and the lower surface of the patterned portion protrudes from the lower surface of the first connecting portion; the through hole penetrates the patterned portion of the ceramic patterned board, the ceramic support board includes a second connecting portion and a support portion, the second connecting portion is located below the first connecting portion and surrounds the portion of the patterned portion protruding from the lower surface of the first connecting portion, and the support portion surrounds the first connecting portion and the second connecting portion. The ceramic packaging core board can avoid warping after multi-layer lamination, meet the manufacturing of ultra-fine lines, and improve the heat dissipation efficiency. Therefore, the ceramic packaging core board effectively overcomes the shortcomings of the prior art and has high industrial utilization value.

[0165] The above embodiments only exemplarily illustrate the principles and effects of the present application, and are not used to limit the present application. Any person skilled in the art can modify or change the above embodiments without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes completed by those skilled in the art without departing from the spirit and technical thought of the present application should be covered by the claims of the present application.

Claims

1. A ceramic package core board, characterized by, The ceramic package core board comprises: a ceramic pattern plate comprising a first connecting part and a pattern part, the first connecting part surrounding the pattern part, and a lower surface of the pattern part protruding from a lower surface of the first connecting part; a through hole penetrating the pattern part; a ceramic support plate comprising a second connecting part and a support part, the second connecting part being located below the first connecting part and surrounding a part of the pattern part protruding from the lower surface of the first connecting part, and the support part surrounding the first connecting part and the second connecting part.

2. The ceramic package core board of claim 1, wherein: The ceramic package core board further comprises a first adhesive layer, and a lower surface of the first connecting part is connected to an upper surface of the second connecting part through the first adhesive layer.

3. The ceramic package core panel of claim 1, wherein: A thickness of the pattern part ranges from 0.08 mm to 0.8 mm, a thickness of the first connecting part ranges from 0.02 mm to 0.4 mm, and a thickness ratio of the first connecting part to the pattern part ranges from 0.2 to 0.

6.

4. The ceramic package core panel of claim 1, wherein: An upper surface of the pattern part protrudes from an upper surface of the first connecting part, and the ceramic package core board further comprises a ceramic support cover plate, the ceramic support cover plate being located above the support part and the first connecting part and surrounding a part of the pattern part protruding from the upper surface of the first connecting part.

5. The ceramic package core panel of claim 4, wherein: An upper surface of the ceramic support cover plate is flush with an upper surface of the pattern part.

6. The ceramic package core panel of claim 4, wherein: The ceramic package core board further comprises a second adhesive layer, and a lower surface of the ceramic support cover plate is connected to an upper surface of the first connecting part through the second adhesive layer.

7. The ceramic package core panel of claim 1, wherein: A hole type of the through hole comprises at least one of a circle, a triangle and a rectangle, and when the hole type of the through hole is a circle, a diameter of the through hole ranges from 80 μm to 250 μm.

8. The ceramic package core panel of claim 1, wherein: A lower surface of the second connecting part is flush with a lower surface of the pattern part, an upper surface of the support part is flush with an upper surface of the first connecting part, and a lower surface of the support part is flush with a lower surface of the pattern part.

9. A package substrate, characterized by, The ceramic package core board comprises: the ceramic package core board according to any one of claims 1-8, and a metal seed layer covering opposite surfaces of the ceramic package core board and an inner wall of the through hole; a metal layer covering a surface of the metal seed layer and filling the through hole; a laminate layer located on the opposite surfaces of the ceramic package core board and covering the metal layer, wherein the laminate layer comprises a dielectric layer and a conductive layer.

10. The package substrate of claim 9, wherein: The laminate layer on any one surface of the pattern part is one layer or more layers.

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