Vehicle-mounted power amplifier

Abstract

The vehicle-mounted power amplifier comprises a circuit board and a thermoelectric refrigerating unit, the circuit board is provided with a functional circuit, the functional circuit comprises a power amplifying circuit, the thermoelectric refrigerating unit is arranged on the first side, opposite to the functional circuit, of the circuit board, and the thermoelectric refrigerating unit is arranged on the first side, opposite to the functional circuit, of the circuit board. And a functional circuit of the circuit board is electrically connected with the thermoelectric refrigerating unit so as to supply power to the thermoelectric refrigerating unit. According to the scheme, the heat dissipation effect can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of automotive electronics, in particular to a vehicle-mounted power amplifier. BACKGROUND

[0002] The vehicle-mounted power amplifier is used to amplify the original audio signal and drive the loudspeaker. The greater the power of the vehicle-mounted power amplifier, the higher the requirement for heat dissipation. The lower cover of the existing vehicle-mounted power amplifier only plays a sealing role and does not consider the heat dissipation function, so it cannot effectively dissipate the heat generated by the circuit board and its surroundings. This leads to the accumulation of heat around the circuit board, which in turn leads to poor heat dissipation effect. CONTENT OF THE INVENTION

[0003] The technical problem solved by the present application is to provide a vehicle-mounted power amplifier that can improve the heat dissipation effect.

[0004] To solve the above technical problem, one technical solution adopted by the present application is to provide a vehicle-mounted power amplifier, which comprises a circuit board and a thermoelectric refrigerator. The circuit board is provided with a functional circuit, and the functional circuit comprises a power amplification circuit. The thermoelectric refrigerator is arranged on the first side of the circuit board away from the functional circuit, and the functional circuit of the circuit board is electrically connected to the thermoelectric refrigerator to supply power to the thermoelectric refrigerator.

[0005] The above-mentioned scheme, the vehicle-mounted power amplifier comprises a circuit board and a thermoelectric refrigerator, the circuit board is provided with a functional circuit, the functional circuit comprises a power amplification circuit, the thermoelectric refrigerator is arranged on the first side of the circuit board away from the functional circuit, and the functional circuit of the circuit board is electrically connected to the thermoelectric refrigerator to supply power to the thermoelectric refrigerator. The present application sets the thermoelectric refrigerator on the side of the circuit board away from the functional circuit, which means that it can directly dissipate heat from the circuit board, thereby effectively improving the heat dissipation effect. In addition, the thermoelectric refrigerator can be directly powered through the circuit board without the need for additional power supply circuit, reducing the circuit layout of the power amplifier, reducing the generation of heat of the power amplifier, and further improving the heat dissipation effect. BRIEF DESCRIPTION OF DRAWINGS

[0006] Figure 1 is an exploded view of an embodiment of the vehicle-mounted power amplifier of the present application;

[0007] Figure 2 is a front view of an embodiment of the protruding part in the vehicle-mounted power amplifier of the present application. DETAILED DESCRIPTION

[0008] To make the purpose, technical scheme and effect of the present application clearer and more explicit, the present application is further described in detail below with reference to the drawings and examples.

[0009] It should be noted that the term "several" herein represents at least one, and the terms "first", "second", and the like are used to distinguish similar objects, and do not necessarily describe a specific order or sequence. The term "and / or" is merely a description of the association relationship between the associated objects, which means that there can be three relationships, for example, A and / or B, which can represent the three cases of A alone, A and B together, and B alone. In addition, the character " / " herein generally represents an "or" relationship between the front and rear associated objects. In addition, the term "at least one" herein represents any one of a plurality or any combination of at least two of a plurality, for example, including at least one of A, B, and C, which can represent any one or more elements selected from the set consisting of A, B, and C.

[0010] Reference Figure 1 , Figure 1 is an exploded view of an embodiment of the vehicle-mounted power amplifier of the present application.

[0011] Reference Figure 2 , Figure 2 is a front view of an embodiment of the protruding part in the vehicle-mounted power amplifier of the present application.

[0012] As shown in Figure 1 , the vehicle-mounted power amplifier includes a circuit board 1 and a thermoelectric cooler 2. The circuit board 1 is provided with a functional circuit 11 (composed of electronic components in the figure), which includes a power amplification circuit (not explicitly shown in the figure), which is used to effectively amplify electrical signals. In this embodiment, the vehicle-mounted power amplifier can be a vehicle-mounted audio power amplifier, and the power amplification circuit described above is used to effectively amplify audio signals (audio signals exist and are transmitted in the form of electrical signals). The substrate 12 of the circuit board 1 can be a metal substrate, for example, an aluminum substrate, a copper substrate, a stainless steel substrate, an iron substrate, and a silicon steel substrate, etc. can also be used. Among them, the heat dissipation of the circuit board 1 is facilitated by using the heat conduction characteristics of the metal substrate.

[0013] The thermoelectric cooler 2 is arranged on the first side of the circuit board 1 away from the functional circuit 11, wherein the functional circuit 11 of the circuit board 1 is electrically connected with the thermoelectric cooler 2, thereby supplying power to the thermoelectric cooler 2. Specifically, the thermoelectric cooler 2 can be but not limited to Peltier.

[0014] In an embodiment, the thermoelectric cooler 2 comprises a power supply electrode 21, and the thermoelectric cooler 2 is electrically connected with the functional circuit 11 through the power supply electrode 21. Specifically, the connection between the circuit board 1 and the thermoelectric cooler 2 is considered to be convenient. In the present application, the bottom surface 13 of the circuit board 1 facing away from the functional circuit 11 is provided with an electrical connection terminal (not shown in the figure), which can electrically connect the functional circuit 11 in the circuit board 1 with the thermoelectric cooler 2 as a bridge, that is, the power supply electrode 21 of the thermoelectric cooler 2 is connected with the electrical connection terminal, and then the electrical connection terminal is electrically connected with the functional circuit 11. In some embodiments, the functional circuit 11 comprises a power supply circuit, and the electrical connection terminal is connected with the power supply circuit, so that the thermoelectric cooler 2 can be connected with the power supply circuit through the electrical connection terminal, and then the power supply circuit supplies power to the thermoelectric cooler 2. It can be understood that the power supply circuit can also supply power to the power amplifier circuit at the same time, that is, the thermoelectric cooler 2 and the power amplifier circuit share the power supply circuit, of course, in other embodiments, the functional circuit 11 can comprise a plurality of power supply circuits, and the thermoelectric cooler 2 and the power amplifier circuit use different power supply circuits respectively, so it is not limited here.

[0015] In some specific embodiments, the electrical connection terminal can be a plug-in terminal, a fixed terminal (such as a soldering type), a spring type terminal, etc. The required electrical connection terminal can be determined according to the actual needs of current size, installation method, connection reliability, etc., and the present application is not limited.

[0016] In some specific embodiments, the thermoelectric cooler 2 comprises a first end 22 and a second end 23, the first end 22 is close to the circuit board 1, and the second end 23 is away from the circuit board 1. Under the action of the first electrical signal, the thermoelectric cooler 2 can realize that the first end 22 is the cold end and the second end 23 is the hot end. For example, by loading a first voltage signal on the power supply electrode 21 of the thermoelectric cooler 2, the current flows from the first end 22 to the second end 23, so that the heat flows from the first end 22 to the second end 23. At this time, the temperature of the first end 22 of the thermoelectric cooler 2 will decrease, so as the cold end, the temperature of the second end 23 will rise, so as the hot end. Therefore, since the first end 22 as the cold end is close to the circuit board 1, the heat of the circuit board 1 can be absorbed and transferred to the second end 23, realizing heat dissipation of the circuit board 1.

[0017] In some embodiments, considering that the circuit board 1 is in a low temperature state for a long time in a cold environment, potential damage to the functional circuit 11 can be caused. To ensure the normal operation of the circuit board 1, the thermoelectric cooler 2 can also be used to heat the circuit board 1 to maintain the stable performance of the circuit board 1 in a cold environment. Specifically, a second electric signal can be applied to the thermoelectric cooler 2, and the thermoelectric cooler 2 can realize that the first end 22 is the hot end and the second end 23 is the cold end under the action of the second electric signal. For example, by loading a second voltage signal on the power supply electrode 21 of the thermoelectric cooler 2, the current flows from the second end 23 to the first end 22, and thus the heat flows from the second end 23 to the first end 22. At this time, the temperature of the second end 23 of the thermoelectric cooler 2 will decrease, and thus as the cold end, the temperature of the first end 22 will rise, and thus as the hot end. Therefore, since the first end 22 as the hot end is close to the circuit board 1, the heat absorbed can be transferred to the circuit board 1 to heat the circuit board 1. Wherein, the current directions corresponding to the first electric signal and the second electric signal are opposite. That is, by the first electric signal and the second electric signal, the heat dissipation and heating of the circuit board 1 can be realized.

[0018] As shown in Figure 1 In some embodiments, the vehicle-mounted power amplifier further comprises at least one of the following components: a frame 3 and an upper cover 4. For example, the vehicle-mounted power amplifier further comprises a bracket 3 and an upper cover 4. The bracket 3 is arranged on the first side of the circuit board 1 (the side of the circuit board 1 facing away from the functional circuit 11), and the thermoelectric cooler 2 is arranged between the circuit board 1 and the bracket 3. The bracket 3 is used to fix the vehicle-mounted power amplifier. The upper cover 4 is arranged on the second side of the circuit board 1 where the functional circuit 11 is arranged.

[0019] In the above scheme, the bracket 3 is provided with a protruding structure 31 on the side facing the circuit board 1. The protruding structure 31 supports the circuit board 1 to form a gap between the bracket 3 and the circuit board 1 as a containing space 32, and the thermoelectric cooler 2 is arranged in the containing space 32. The size of the containing space 32 can be adjusted according to the size and installation requirements of the thermoelectric cooler 2. In some embodiments, the height of the protruding structure 31 can match the thickness of the thermoelectric cooler 2, that is, the thermoelectric cooler 2 arranged in the containing space 32 can realize direct contact with the circuit board 1. In some embodiments, considering that additional heat dissipation space is provided for the thermoelectric cooler 2, or space is reserved for maintenance and other devices, the height of the protruding structure 31 can be greater than the thickness of the thermoelectric cooler 2, so that the thermoelectric cooler 2 does not directly contact the circuit board 1 after installation. This application does not make any limitation.

[0020] In some specific embodiments, the first side of the circuit board 1 facing away from the functional circuit 11 can be directly placed on the protruding part 310, so that the protruding part 310 of the bracket 3 provides stable support for the circuit board 1.

[0021] Considering that the vehicle may experience bumps during operation, which could cause the on-board power amplifier to shake, in some embodiments, the protruding structure 31 in the bracket 3 forms a receiving groove 32 with the bracket 3. The receiving groove 32 serves as the aforementioned receiving space 32, used to receive the thermoelectric cooler 2 and limit the thermoelectric cooler 2 to ensure that the thermoelectric cooler 2 will not shake or shift during vehicle operation, thereby ensuring that the heat dissipation effect is not affected.

[0022] In some embodiments, the protrusion structure 31 includes a plurality of protrusions 310. The plurality of protrusions 310 and the support 3 form a receiving groove 32 for placing the thermoelectric cooler 2.

[0023] like Figure 1 As shown, in a specific application scenario, the protruding structure 31 may include multiple protrusions 310. The multiple protrusions 310 and the bracket 3 form a receiving groove 32 that matches the shape of the thermoelectric cooler 2. These multiple protrusions 310 can support the circuit board 1 while simultaneously limiting the position of the thermoelectric cooler 2. Specifically, multiple corners 24 of the thermoelectric cooler 2 abut against the sidewalls 3100 of each protrusion 310. The shapes of the multiple corners 24 are complementary to the shapes of the sidewalls 3100 of the protrusions 310, ensuring close contact between the protrusions 310 and the corners 24, further ensuring that the thermoelectric cooler 2 is stable and does not wobble after installation.

[0024] In some embodiments, the shape of the protrusion 310 may be conical, cylindrical, frustum-shaped, square, hemispherical, etc., and can be selected according to actual needs. This application does not impose any restrictions.

[0025] In some embodiments, the sidewalls 3100 of the protrusions 310 have the same shape and size, and the multiple corners 24 in the thermoelectric cooler 2 have the same shape and size as the sidewalls 3100 of the protrusions 310. The shape of the multiple corners 24 in the thermoelectric cooler 2 is complementary to the shape of the sidewalls 3100 of the protrusions 310 in the bracket 3. Therefore, when the thermoelectric cooler 2 is inserted into the receiving groove 32 formed by the multiple protrusions 310, the multiple corners 24 of the thermoelectric cooler 2 abut against the sidewalls 3100 of each protrusion 310, thereby limiting the thermoelectric cooler 2, and the thermoelectric cooler 2 can directly contact the bracket 3. Considering that direct contact between the thermoelectric cooler 2 and the bracket 3 may cause unnecessary direct contact between the power supply electrode 21 and the bracket 3, thereby affecting power supply efficiency and safety, in some specific embodiments, an insulating layer can be provided at the corresponding positions of the bracket 3 and the power supply electrode 21 to effectively isolate the direct electrical connection between the power supply electrode 21 and the bracket 3.

[0026] In some embodiments, the thermoelectric refrigerator 2 can not be in direct contact with the bracket 3. For example, the side wall 3100 of the protruding part 310 can gradually increase in size from top to bottom, the shape of the plurality of corners 24 in the thermoelectric refrigerator 2 is between the minimum size and the maximum size of the side wall 3100 of the protruding part 310, the shape of the plurality of corners 24 in the thermoelectric refrigerator 2 is complementary to the shape of the side wall 3100 of the protruding part 310 in the bracket 3, so that when the thermoelectric refrigerator 2 is placed in the accommodating groove 32, the thermoelectric refrigerator 2 is fixed at a position matching the size of the side wall 3100, and the plurality of corners 24 of the thermoelectric refrigerator 2 abut the side wall 3100 of each protruding part 310, thereby limiting the thermoelectric refrigerator 2, and the thermoelectric refrigerator 2 is not in direct contact with the bracket 3, thereby forming a free space between the thermoelectric refrigerator 2 and the bracket 3. For another example, as shown in FIG. 6, the top of the protruding part 310 extends a stepped platform 3101 downward, the shape of the plurality of corners 24 in the thermoelectric refrigerator 2 is complementary to the shape of the side wall 3100 of the protruding part 310, so that when the thermoelectric refrigerator 2 is placed on the stepped platform 3101, the plurality of corners 24 of the thermoelectric refrigerator 2 abut the side wall 3100 of each protruding part 310, thereby limiting the thermoelectric refrigerator 2, and the thermoelectric refrigerator 2 is not in direct contact with the bracket 3, thereby forming a free space between the thermoelectric refrigerator 2 and the bracket 3. Figure 2

[0027] Considering that the vehicle may be jolted during operation, causing the circuit board 1 to shake in the vehicle-mounted power amplifier, thereby affecting the heat dissipation effect. In some embodiments, the circuit board 1 is fixed on the bracket 3. In some specific embodiments, the substrate 12 of the circuit board 1 can be provided with a mounting hole, and the bracket 3 can be provided with a recess hole relative to the position of the mounting hole of the circuit board 1. The fixing between the circuit board 1 and the bracket 3 can be achieved by using a screw to pass through the mounting hole and the recess hole. Of course, welding, pasting, notched clamping, pressure bonding and other methods can also be used to fix the circuit board 1 and the bracket 3, which is not limited here.

[0028] In some embodiments, in order to further improve the heat dissipation effect, the upper cover 4 can be a heat dissipation upper cover, and then the upper cover 4 and the thermoelectric refrigerator 2 are used to dissipate heat from both sides of the circuit board 1. The heat dissipation upper cover 4 can be provided with heat dissipation fins, and the material thereof is metal material. The upper cover 4 and the thermoelectric refrigerator 2 can achieve double-sided heat dissipation of the circuit board 1, effectively improving the heat dissipation effect. In some embodiments, the upper cover 4 can also be a flat heat dissipation upper cover, a heat dissipation fin type upper cover, a stepped heat dissipation upper cover, a corrugated heat dissipation upper cover, a spiral heat dissipation upper cover, etc.

[0029] ​In some embodiments, the upper cover 4 is fixed to the bracket 3, and a closed space is formed between the upper cover 4 and the bracket 3, and the circuit board 1 and the thermoelectric refrigerator 2 are arranged in the closed space. In some embodiments, the bracket 3 is provided with a groove matched with the profile of the upper cover 4, and the upper cover 4 is arranged in the groove. In some embodiments, a soft pad or other coupling material can be used to fix the bracket 3 and the upper cover 4 together. In some embodiments, screws, buckles or other mounting elements can be used to clamp the upper cover 4 on the bracket 3. In some embodiments, the upper cover 4 and the bracket 3 can be bonded together by using adhesive materials such as glass glue, so as to realize the fixation between the upper cover 4 and the bracket 3.

[0030] In some embodiments, the upper cover 4 is fixed to the bracket 3, and the bracket 3 is fixed to the vehicle, so as to realize the fixation of the vehicle-mounted power amplifier to the vehicle. In the present application, the bracket 3 can be fixed to the vehicle by using adhesive materials. Alternatively, mounting ears 33 can be provided on the bracket 3, mounting holes 330 are arranged in the mounting ears 33, and screws or other mounting elements can be used to fix the bracket 3 to the vehicle. In some embodiments, mounting holes 330 can be directly provided on the bracket 3, and screws or other mounting elements can be used to fix the bracket 3 to the vehicle, which is not limited herein. In some specific embodiments, the mounting ears 33 can be parallel or approximately parallel to the main body of the bracket 3. In some specific embodiments, the mounting ears 33 can have a stepped or multi-layer structure. The shape and size of the mounting ears 33 can be determined according to actual needs, which is not limited herein.

[0031] As shown in FIG. 1, Figure 1 In some embodiments, the bracket 3 includes three mounting ears 33, and each mounting ear 33 includes a corresponding mounting hole 330. Screws or other mounting elements can be used to fix the bracket 3 through the mounting holes 330. In addition, the distribution of the three mounting ears 33 on the bracket 3 can generally form a stable triangular structure, which can ensure that the bracket 3 remains balanced and stable when bearing weight.

[0032] In some embodiments, the upper cover 4 is fixed to the bracket 3, and the upper cover 4 is fixed to the vehicle, so as to realize the fixation of the vehicle-mounted power amplifier to the vehicle. In some specific embodiments, mounting ears can be provided on the upper cover 4, mounting holes are arranged in the mounting ears, and screws or other mounting elements can be used to fix the upper cover 4 to the vehicle through the mounting holes. In some specific embodiments, adhesive materials can be used to paste the mounting ears to the vehicle, so as to realize the fixation between the upper cover 4 and the vehicle. The shape and size of the mounting ears in the upper cover 4 can be selected according to actual needs, which is not limited herein.

[0033] It can be understood that in some embodiments, the vehicle-mounted power amplifier can selectively provide the bracket 3 and the upper cover 4. For example, in the case where the vehicle-mounted power amplifier is arranged in the internal space of the vehicle, the vehicle-mounted power amplifier can include the bracket 3, but does not provide the upper cover 4, so that the bracket 3 is fixed to the internal space of the vehicle. For another example, in the case where the vehicle-mounted power amplifier is directly and integrally arranged in the vehicle, the vehicle-mounted power amplifier can include the upper cover 4, but does not provide the bracket 3. Thus, the upper cover 4 is fixed between the vehicle, and a closed space is formed.

[0034] Although the present application is specifically shown and described with reference to the preferred embodiments, it is understood that various changes in form and details can be made without departing from the spirit and scope of the application as defined by the appended claims.

Claims

1. A vehicle-mounted power amplifier, characterized by comprising: The vehicle-mounted power amplifier comprises: a circuit board provided with a functional circuit, the functional circuit comprising a power amplifier circuit; a thermoelectric refrigerator arranged on a first side of the circuit board away from the functional circuit, wherein the functional circuit of the circuit board is electrically connected with the thermoelectric refrigerator to supply power to the thermoelectric refrigerator.

2. The vehicle-mounted power amplifier according to claim 1, characterized by, The thermoelectric refrigerator comprises a power supply electrode, and a bottom surface of the circuit board away from the functional circuit is provided with an electrical connection terminal, and the power supply electrode is electrically connected with the functional circuit through the electrical connection terminal. The thermoelectric refrigerator comprises a first end and a second end, the first end is close to the circuit board, and the second end is away from the circuit board, and the thermoelectric refrigerator can realize that the first end is a cold end and the second end is a hot end under the action of a first electrical signal.

3. The vehicle-mounted power amplifier of claim 1, wherein, The vehicle-mounted power amplifier further comprises at least one of the following components: a support arranged on the first side of the circuit board, the thermoelectric refrigerator is arranged between the circuit board and the support, and the support is used for fixing the vehicle-mounted power amplifier; an upper cover arranged on a second side of the circuit board provided with the functional circuit.

4. The vehicle-mounted power amplifier according to claim 3, characterized by, One surface of the support facing the circuit board is provided with a protruding structure, the protruding structure supports the circuit board, so that a containing space is formed between the support and the circuit board, and the thermoelectric refrigerator is arranged in the containing space.

5. The vehicle-mounted power amplifier according to claim 4, characterized by, The protruding structure comprises a plurality of protruding portions. The protruding structure and the support form a containing groove as the containing space for containing and limiting the thermoelectric refrigerator.

6. The vehicle-mounted power amplifier of claim 4, wherein, The protruding structure comprises a plurality of protruding portions, the plurality of protruding portions and the support form a containing groove matching the shape of the thermoelectric refrigerator as the containing space, wherein a plurality of corners of the thermoelectric refrigerator respectively abut the side walls of the protruding portions, and the shapes of the plurality of corners and the side walls of the protruding portions are complementary.

7. The vehicle-mounted power amplifier of claim 3, wherein, The circuit board is fixed to the support. The upper cover is fixed to the support, and a closed space is formed between the upper cover and the support, and the circuit board and the thermoelectric refrigerator are arranged in the closed space. The upper cover is a heat dissipation upper cover capable of dissipating heat of the circuit board.

8. The vehicle-mounted power amplifier of claim 1, wherein, The substrate of the circuit board is a metal substrate.

9. The vehicle-mounted power amplifier of claim 8, wherein, The metal substrate is an aluminum substrate.

10. The vehicle-mounted power amplifier of claim 1, wherein, The thermoelectric refrigerator is a Peltier element. The thermoelectric refrigerator comprises a first end and a second end, the first end is close to the circuit board, and the second end is away from the circuit board, and the thermoelectric refrigerator can realize that the first end is a hot end and the second end is a cold end under the action of a second electrical signal. The vehicle-mounted power amplifier is a vehicle-mounted audio power amplifier.

Images